JPH0951029A - Semiconductor manufacturing method and apparatus and carrier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing method and device and a carrier device with which carrying position precision and throughput of a to-be-carried material such as a semiconductor integrated circuit device, etc., are improved. SOLUTION: Consists of a cylindrical top member 2 moving in an evacuation direction 16 under the condition that a semiconductor integrated circuit device 1 is initial-absorbed by suction force, a cylindrical guide block 3 which is provided with a taper part 3b guiding an external lead 1a of the semiconductor integrated circuit device 1, on the inner side of its tip, and vacuum-absorbs the semiconductor integrated circuit device 1, a cylindrical cover block member 4 stopping movement of the top member 2, and an evacuation system 6 provided with an evacuation pump 5 performing suction force through the top member 2. And, when the semiconductor integrated circuit device 1 is vacuum-absorbed with a absorption block 9 consisting of the top member 2, the guide block member 3 and the cover block member 4, the semiconductor integrated circuit device 1 is positioned, while the external lead 1a is guided with the taper part 3 with movement of the top member 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing technology or a transportation technology for transporting an object to be transported such as an electronic component, and more particularly to a semiconductor manufacturing method and apparatus and a transportation apparatus for vacuum suctioning and transporting a semiconductor integrated circuit device. It is a thing.

[0002]

2. Description of the Related Art The technology described below studies the present invention,
The present invention was studied by the present inventors upon completion, and its outline is as follows.

Regarding a semiconductor manufacturing apparatus that conveys a semiconductor integrated circuit device which is an example of an object to be conveyed, for example, an IC handler device, a semiconductor integrated circuit device is accommodated by a suction block from a storage member such as a tray in which the semiconductor integrated circuit device is stored. It is known that a semiconductor integrated circuit device is suction-held and taken out, and then the semiconductor integrated circuit device is suction-held and conveyed.

That is, the IC handler device is for carrying the semiconductor integrated circuit device to a predetermined carrying place, for example, another accommodating member such as a socket of a mounting board, and further, an inserter (inserting the semiconductor integrated circuit device). Device)
Also, it is suction-held and inserted into a socket such as an aging board.

Here, the positioning when the suction block holds the semiconductor integrated circuit device by suction is performed by supporting the main body portion (for example, the mold portion) of the semiconductor integrated circuit device by the claw portions driven by the cams from four directions. It is being appreciated.

An IC for carrying the semiconductor integrated circuit device
Regarding the handler device, for example, November 2, 1992
It is described on pages 210 to 214, "Electronic Materials November Issue, Separate Volume, VLSI Manufacturing / Testing Equipment Guidebook <1993 Edition>," published by the Industrial Research Institute Co., Ltd.

[0007]

However, in the above-mentioned technique, when the semiconductor integrated circuit device is inserted into the socket on the substrate in the aging process or the like, the positional accuracy of the semiconductor integrated circuit device is improved when the inserter is used. To be a problem.

Here, the position accuracy of the semiconductor integrated circuit device in the tray is ± 0.2 mm, the mounting position accuracy of the socket is ± 0.3 mm, and the position accuracy of the transfer device such as a robot is ± 0.05 mm. Is.

That is, the total is ± 0.55 mm, and as a result, it is possible to insert the semiconductor integrated circuit device into a socket or the like from a position displaced by a maximum of 1.1 mm.

This amount of deviation is QFP (Quad Flat Packag
In the case of e) and the like, there is a problem in that the lead bending occurs because the external lead pitch is 0.5 mm.

Some of the inserters try to improve the processing time by double handling, but in this case, the shape of the handling member becomes large, and as a result, a large number of processing cannot be performed.

As a result, even if a double-handling inserter is used, there is a problem that the overall processing capacity is lowered.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor manufacturing method and apparatus and a carrying apparatus for improving the carrying position accuracy and processing ability of a carried object such as a semiconductor integrated circuit device.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0015]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, in the semiconductor manufacturing method according to the present invention, the suction block for vacuum-sucking the semiconductor integrated circuit device is moved, and the guide portion at the tip of the suction block is moved into the opening of the first housing member for housing the semiconductor integrated circuit device. And sucking vacuum through the suction block to initially suck the semiconductor integrated circuit device by the frame member of the suction block, and by moving the frame member in the vacuum exhaust direction by the vacuuming, the suction block The semiconductor integrated circuit device is positioned by guiding the external leads of the semiconductor integrated circuit device by the taper portion of the tip of the semiconductor integrated circuit device, and the semiconductor integrated circuit device is sucked and held by the suction block to be conveyed. After the guide portion of the suction block is inserted into the opening of the second containing member for containing, the second containing member is inserted. It is intended for accommodating the semiconductor integrated circuit device in wood.

Further, the semiconductor manufacturing apparatus according to the present invention has a cylindrical shape having a taper portion for vacuum-sucking the semiconductor integrated circuit device at the tip and for guiding the external lead of the semiconductor integrated circuit device inside the tip. The semiconductor integrated circuit includes a guide block member, a tubular cover block member that holds the guide block member, and a vacuum exhaust system that is provided with a vacuum exhaust unit that performs vacuuming through the guide block member. When the device is vacuum-sucked, the semiconductor integrated circuit device is positioned and vacuum-sucked while guiding the external leads by the taper portion.

Further, the semiconductor manufacturing apparatus according to the present invention is
A cylindrical top member that initially sucks the semiconductor integrated circuit device by vacuuming and moves in the vacuum exhaust direction by the vacuuming; and a taper portion that guides an external lead of the semiconductor integrated circuit device inside the tip end portion, A cylindrical guide block member for vacuum-sucking the semiconductor integrated circuit device initially sucked, a cylindrical cover block member for guiding the top member and stopping the movement of the top member, and the top member through the top member. A vacuum exhaust system provided with a vacuum exhaust means for performing vacuuming, and when the semiconductor integrated circuit device is vacuum-sucked, the semiconductor integrated circuit device is guided by the taper portion along with the movement of the top member. The vacuum suction is performed by positioning the circuit device.

In the semiconductor manufacturing apparatus according to the present invention, a guide portion is provided at the tip of the guide block member so as to enter into the opening of each of the first and second housing members for housing the semiconductor integrated circuit device. It is what has been.

Further, the semiconductor manufacturing apparatus according to the present invention is
A fixing member for preventing rotation of the cover block member is arranged inside the cover block member, and the cover block member is detachably attached to the shaft member via the two ball plungers and one fixing member. It is what has been.

Further, the transfer device according to the present invention accommodates the transferred object such as an electronic component and the like, and a cylindrical top member that initially adsorbs the transferred object by vacuuming and moves in the vacuum exhaust direction by the vacuuming. A guide part for entering the opening of each of the first or second accommodating members is provided at a tip end part, and a taper part for guiding a main body part or an external terminal of the transferred object is provided inside the tip end part. A cylindrical guide block member that vacuum-sucks the sucked semiconductor integrated circuit device, a cylindrical cover block member that guides the top member and stops the movement of the top member, and a vacuum via the top member. A vacuum evacuation system provided with a vacuum evacuation means for pulling, and when the object to be conveyed is vacuum-adsorbed, the taper part moves with the body part or the external part. And performs vacuum suction to the positioning of the objects to be conveyed while guiding the child.

[0022]

According to the above-mentioned means, the tubular guide block member is provided with the taper portion for guiding the external lead of the semiconductor integrated circuit device at the tip end thereof, and the coma member is in the state of initially sucking the semiconductor integrated circuit device. By moving in the vacuum evacuation direction, the external lead moves while being guided by the tapered portion, so that the semiconductor integrated circuit device can be positioned.

Thus, even if the position of the semiconductor integrated circuit device is deviated during vacuum suction, the positions of the guide block member and the semiconductor integrated circuit device can be corrected with high accuracy, and as a result, the structure is simplified. The semiconductor integrated circuit device can be accurately positioned during suction or transportation.

Further, when the semiconductor integrated circuit device is initially sucked by the top member, by weakening the suction force, the load applied to the outer lead of the semiconductor integrated circuit device when it is guided by the taper portion is reduced. Can be made smaller.

As a result, it is possible to prevent the occurrence of lead bending in the external leads.

The tip of the guide block member is provided with a guide portion that enters into the opening of each of the first and second accommodating members, so that the semiconductor integrated circuit device is accommodated in the first or second accommodating member. It can be directly carried out when it is housed or taken out, and the positioning between the guide block member and the first or second housing member can be carried out with high accuracy.

Since the cover block member holding the guide block member is detachably attached to the shaft member via the ball plunger, the cover block member can be easily attached and detached.

Furthermore, since the guide block member can be used for various sockets and trays without using image processing, the processing time during transportation can be reduced.

Further, since the cover block member is attached to the shaft member via the ball plunger, it is generated when the tip end portion of the guide block member is guided to each opening of the first or second accommodating member. The amount of movement of the guide block member in the rotation direction can be absorbed by the ball plunger.

[0030]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a partial sectional view showing an embodiment of the structure of the semiconductor manufacturing apparatus of the present invention, and FIG. 2 is a front view showing an embodiment of the structure of a top member in the semiconductor manufacturing apparatus of the present invention with a part thereof cut away. 3 and 4 are partially cutaway views showing an embodiment of the structure of the cover block member in the semiconductor manufacturing apparatus of the present invention, in which (a) is a partial sectional view, (b) is a plan view, and FIG. It is a figure which fractures | ruptures and shows one Example of the structure of the guide block member in the semiconductor manufacturing apparatus of this invention, (a) is a partial cross section figure, (b) is a bottom view, FIG. 5: The guide shown in FIG. Partially enlarged cross-sectional view of the structure of the block member, FIG.
FIG. 7B is a partial cross-sectional view showing an example of an attached state of each member in the semiconductor manufacturing apparatus of the present invention, FIG.
8B and 8C are partial cross-sectional views showing an example of the basic operation of the semiconductor manufacturing method of the present invention, and FIGS. 8A and 8B are examples of the basic operation of the semiconductor manufacturing method of the present invention. FIG. 9 is a partial cross-sectional view showing the structure of the first accommodating member used in the semiconductor manufacturing method of the present invention.
(A) is a front view, (b) is a plan view, and (c) is a partially enlarged sectional view.

The semiconductor manufacturing apparatus according to the present embodiment vacuum-sucks and conveys the semiconductor integrated circuit device 1 which is an example of the object to be processed. The structure of the semiconductor integrated circuit device 1 will be described below. The cylindrical top member 2 that moves in the vacuum evacuation direction 16 by the evacuation with the surface 1c initially sucked by vacuum suction and the semiconductor integrated circuit device 1 initially sucked, and the semiconductor integrated circuit inside the tip portion 3a. Tapered portion 3b for guiding the outer lead 1a of the device 1
And a cylindrical guide block member 3 for vacuum-sucking the initially integrated semiconductor integrated circuit device 1, a cylindrical cover block member 4 for guiding the top member 2 and stopping the movement of the top member 2, and a top member. It is composed of a vacuum exhaust system 6 provided with a vacuum exhaust pump 5 which is a vacuum exhaust means for performing vacuuming through the member 2.

That is, the semiconductor manufacturing apparatus guides the top member 2 for initially sucking the semiconductor integrated circuit device 1, the guide block member 3 for vacuum holding the semiconductor integrated circuit device 1 after the initial suction, and the top member 2. The semiconductor integrated circuit device 1 is vacuum-sucked and conveyed by the suction block 9 composed of the cover block member 4 and the taper portion 3 is moved along with the upward movement (movement) of the top member 2 which has been initially sucked.
The semiconductor integrated circuit device 1 is positioned while guiding the external leads 1a by b.

Here, as shown in FIG. 2, the top member 2 is made of stainless steel or the like and has a cylindrical shape having open ends 2a on both sides thereof, and one of the open ends 2a is a semiconductor manufacturing apparatus. The adsorption end 2e initially adsorbs 1. That is, the open ends 2a on both sides communicate with each other through the inside 2b.

Further, a predetermined portion of the outer peripheral surface 2c (for example,
A collar portion 2d is provided at a position slightly near the opening end 2a from the center).

As shown in FIGS. 1 and 3 (a) and 3 (b), the cover block member 4 is formed of stainless steel or the like and has a cylindrical shape having open ends 4a on both sides thereof. That is, the open ends 4a on both sides communicate with each other through the inside 4b. Furthermore, the screw hole 4c used when fixing to the cylindrical shaft member 10 communicating with the vacuum exhaust system 6 is formed from three directions or four directions toward the center thereof (four directions in this embodiment). ).

The inside 4b of the cover block member 4
Has a size that covers the top member 2 and allows the top member 2 to slide at least freely.

Further, FIG. 1, FIG. 4 (a), (b) and FIG.
As shown in FIG. 3, the guide block member 3 is formed of stainless steel or the like, and has a tubular shape having open ends 3d on both sides thereof. That is, the open ends 3d on both sides are inside 3
It communicates via e. Furthermore, the screw hole 3f used when fixing to the cover block member 4 is formed in three or four directions toward the center (in this embodiment, it is formed from three directions).

The tip portion 3a of the guide block member 3
Inside the opening 7a (see FIG. 9) or the opening 8a of the socket 7 (see FIG. 9) that is the first containing member or the tray 8 that is the second containing member that contains the semiconductor integrated circuit device 1. A guide portion 3c is provided for entering the.

Further, the inside 3e of the guide block member 3
Has a size that covers the top member 2 and at least allows the collar portion 2d of the top member 2 to slide freely at a predetermined position of the inside 3e.

Here, referring to FIGS. 1 to 6, the top member 2
The method of attaching each of the guide block member 3 and the cover block member 4 will be described.

First, the cover block member 4 is, for example,
A ball plunger 11 having a spherical tip is arranged in the screw hole 4c of the interior 4b and is detachably attached to the cylindrical shaft member 10 via the ball plunger 11, but in particular, the cover block according to the present embodiment. The member 4 is provided with a first screw member 12 and a ball plunger 11 which are fixing members for preventing the cover block member 4 from rotating with respect to the shaft member 10, and are arranged in a screw hole 4c of an inside 4b thereof.

That is, the cover block member 4 is detachably held and attached to the shaft member 10 at three points via the two ball plungers 11 and the one first screw member 12.

At this time, the first screw member 12 is joined to the key groove 10a formed on the shaft member 10 in the key groove 10
a Only for a.

The guide block member 3 has a screw hole 3
It is attached to the cover block member 4 by three or four second screw members 13 arranged at f.

Further, the top member 2 is housed in a hollow portion 9a formed by the inside 4b of the cover block member 4 and the inside 3e of the guide block member 3.

Here, near the center of the hollow portion 9a, there is a space portion 9b formed by one open end 4a of the cover block member 4 and the step portion 3g of the inside 3e of the guide block member 3, The open end 4a stops the rise (movement) of the top member 2, and the stepped portion 3g stops the fall (movement) of the top member 2.

Therefore, in the space 9b of the suction block 9 composed of the top member 2, the guide block member 3, and the cover block member 4, the top member 2 slides freely.

Next, the semiconductor manufacturing method of this embodiment will be described with reference to FIGS.

First, as an example of the transported object, QF
When vacuum-sucking the P type semiconductor integrated circuit device 1,
The basic operation of the suction block 9 will be described.

First, when the vacuum evacuation pump 5, which is a vacuum evacuation unit, evacuates through the suction block 9, the air in the interior 3e of the guide block member 3 is drawn.

At this time, since the area of the suction end 2e of the top member 2 is smaller than the cross-sectional area of the hollow portion 9a (being smaller than the area or resistance that is sucked up by vacuum suction), the inside of the top member 2b is vacuumed. The air in the vicinity of the adsorption end 2e is sucked through.

As a result, the suction end 2e of the top member 2 and the surface 1c of the main body 1b of the semiconductor integrated circuit device 1 are brought into close contact with each other, and the initial suction by the top member 2 is performed.

As a result, the vacuum exhaust path 14 in the inside 2b of the top member 2 is cut off, so that the air outside the top member 2 in the inside 3e of the guide block member 3 is sucked up.

That is, since the air outside the top member 2 is sucked up, the top member 2 initially sucking the semiconductor integrated circuit device 1 is sucked up and moved in the vacuum evacuation direction 16.

Thereafter, the surface 1c of the semiconductor integrated circuit device 1
However, since it comes into close contact with the open end 3d of the tip end portion 3a of the guide block member 3 and the top member 2 is sucked up, the top member 2 is separated from the semiconductor integrated circuit device 1 and the semiconductor integrated circuit device 1 is guided by the guide block member 3 Open end 3d
Is adsorbed on.

Further, the top member 2 separated from the semiconductor integrated circuit device 1 is further sucked up and moved, and its flange portion 2 is moved.
d hits the open end 4a of the cover block member 4 and stops.

At this time, since the top member 2 is still sucked up, the flange portion 2d and the opening end 4a are in close contact with each other.

As a result, the inside 3e of the guide block member 3 is sealed by the main body portion 1b of the semiconductor integrated circuit device 1, the guide block member 3 itself and the flange portion 2d of the top member 2, so that the guide block member 3 is used. The semiconductor integrated circuit device 1 can be held by suction.

For the positioning of the semiconductor integrated circuit device 1 during vacuum suction, the outer lead 1a of the semiconductor integrated circuit device 1 is attached to the tip of the guide block member 3 by using the stroke 15 in which the top member 2 moves in the space 9b. This is performed by moving the top member 2 while guiding it by the tapered portion 3b of the portion 3a.

That is, since the external lead 1a is traced along the tapered portion 3b, the semiconductor integrated circuit device 1 can be positioned. The semiconductor integrated circuit device 1 moves up by the amount of movement 19.

At this time, if the close contact between the top member 2 and the semiconductor integrated circuit device 1 is too strong, the friction between the external lead 1a and the taper portion 3b becomes large when the taper portion 3b is formed to have a gentle inclination. The lead 1a may be deformed.

Therefore, if the close contact between the top member 2 and the semiconductor integrated circuit device 1 is too strong, the taper portion 3b cannot be formed with a gentle inclination, and the allowable range for the positional deviation becomes narrow.

As one of the countermeasures, for example, the hollow portion 9
By providing a predetermined amount of clearance in the gap 9c formed by the top member 2 and the inner wall 3h of the guide block member 3 in the space 9a or the space 9b, the top member 2
X direction 17 and Y direction 18 (X direction 17 and Y direction 1 in a plane perpendicular to the evacuation direction 16)
8) I am able to move freely.

As an example of actual dimensions, if the clearance is set to 0.5 mm or less, the top member 2 can be sucked up, and if it exceeds 0.5 mm, the amount of air passing through the gap 9c increases. Therefore, the top member 2 cannot be sucked up.

As a result, the clearance needs to be 0.5 mm or less.

Further, the main body portion 1b of the semiconductor integrated circuit device 1
Since the surface 1c of the above is mainly satin, the adhesive force to the semiconductor integrated circuit device 1 can be weakened when the material of the top member 2 has a predetermined hardness or higher (other than elastic rubber or the like).

Further, while the top member 2 moves to the opening 4a of the cover block member 4, there is a vacuum leak in the gap 9c, so the vacuum force (suction force) for sucking up the semiconductor integrated circuit device 1 is weak.

Therefore, even when the semiconductor integrated circuit device 1 has a large resistance due to the tapered portion 3b, the contact surface between the top member 2 and the surface 1c of the semiconductor integrated circuit device 1 can easily move even if there is a large resistance. The tapered portion 3b for guiding can be formed large (with a gentle inclination).

The correction of the rotation direction necessary for positioning the semiconductor integrated circuit device 1 is performed by the taper of the guide block member 3 similarly to the positioning in the X direction 17 and the Y direction 18 because the top member 2 is cylindrical. The portion 3b can be used for tracing and positioning.

Further, the stroke 15 when the top member 2 is moved is determined by the socket 7 for housing the semiconductor integrated circuit device 1.
(See FIG. 9) Or, by changing the position of the step portion 3g of the guide block member 3 according to the depth of the tray 8,
Can be adjusted.

A method of carrying the semiconductor integrated circuit device 1 by the suction block 9 of this embodiment, that is, a method of manufacturing a semiconductor will be described with reference to FIGS.

Here, the case where the semiconductor integrated circuit device 1 accommodated in the tray 8 which is the second accommodating member is inserted into the socket 7 which is the first accommodating member will be described.

The shape of the guide portion 3c of the tip portion 3a of the guide block member 3 of the suction block 9 described here is of the type shown in FIG. 5, that is, when the socket 7 is the ZIF type shown in FIG. Is.

Therefore, a stopper portion 3i matching the shape of the opening 7a of the ZIF type socket 7 is provided outside the guide portion 3c of the tip end portion 3a of the guide block member 3.

First, the suction block 9 is moved onto the tray 8 accommodating the semiconductor integrated circuit device 1, and then the suction block 9 is lowered (see FIG. 7).

After that, the suction block 9 is placed in the opening 8a of the tray 8, that is, the tip 3a of the guide block member 3.
The guide portion 3c of is entered.

Further, a vacuum is drawn through the suction block 9, and the semiconductor integrated circuit device 1 is initially sucked by the top member 2 of the suction block 9 (see FIG. 7).

Subsequently, while the top member 2 is moved in the vacuum evacuation direction 16 by evacuation, the outer lead 1a of the semiconductor integrated circuit device 1 is guided, that is, tapered by the taper portion 3b of the tip end portion 3a of the guide block member 3. Part 3b
Then, the semiconductor integrated circuit device 1 is positioned.

After that, the semiconductor integrated circuit device 1 is sucked and held by the suction block 9 and conveyed.

Further, the suction block 9 is placed in the opening 7a of the socket 7 for accommodating (inserting) the semiconductor integrated circuit device 1.
That is, the guide portion 3c of the tip portion 3a of the guide block member 3 is inserted.

At this time, the tip portion 3 of the guide block member 3
When the stopper portion 3i of a contacts the opening 7a of the socket 7, the suction block 9 is stopped from descending.

After that, the semiconductor integrated circuit device 1 can be housed (inserted) in the socket 7 by stopping or weakening the evacuation.

When the suction block 9 is replaced by changing the type of the semiconductor integrated circuit device 1 or the like, as shown in FIG.
As shown in (b), by removing the suction block 9 from the shaft member 10 and exchanging the guide block member 3, it can be applied to change the type of the semiconductor integrated circuit device 1.

When the suction block 9 follows the shape of the opening 8a of the tray 8 or the opening 7a of the socket 7, the movement of the suction block 9 in the X direction 17 and the Y direction 18 is the shaft member 1
Absorbed by the rigidity of the entire handling part including 0,
The rotation direction is absorbed by the ball plunger 11 provided on the cover block member 4.

Further, the tip portion 3a of the guide block member 3
When a foreign object such as a resin burr is sandwiched between and the surface 1c of the main body 1b of the semiconductor integrated circuit device 1, it is presumed that a vacuum leak occurs and the vacuum sensor or the like does not operate.

As a countermeasure against this, the area of the tip portion 3a is made as small as possible.

Further, as a similar measure, it is preferable that the suction end 2e of the top member 2 is also separated from the surface 1c of the semiconductor integrated circuit device 1 by about 0.1 mm at the highest position.

Furthermore, when the semiconductor integrated circuit device 1 is sucked, the surface 1c thereof is not always perpendicular to the central axis of the suction block 9.

Therefore, if the space 9c of the suction block 9 is narrowed, the movement accuracy of the top member 2 during movement is improved, but the suction end 2e of the top member 2 and the surface 1c of the semiconductor integrated circuit device 1 are parallel to each other. It is presumed that the semiconductor integrated circuit device 1 cannot be adsorbed because the degree of vacuum deteriorates and the amount of vacuum leak increases.

Therefore, it is preferable that the space 9c be as wide as possible.

Further, by forming the side surface of the flange portion 2d of the top member 2 into a curved shape, the degree of freedom of operation of the top member 2 can be increased, and the external lead 1a of the semiconductor integrated circuit device 1 that has been sucked can be copied. Can be made easier.

Further, when the diameter (inner diameter) of the inside 2b of the top member 2 is small, only the top member 2 is sucked up before the semiconductor integrated circuit device 1 is sucked up. Further, when the vacuum suction is stopped, the semiconductor integrated circuit device 1 that has been adsorbed falls due to its own weight, but since the load of the top member 2 on it is also added, a large load is applied to the semiconductor integrated circuit device 1. .

As a countermeasure against these, it is preferable to make the thickness of the top member 2 as thin as possible.

Next, the function and effect obtained by the semiconductor manufacturing method and apparatus of this embodiment will be described.

That is, the cylindrical guide block member 3 is provided with a taper portion 3b inside the tip portion 3a for guiding the external lead 1a of the semiconductor integrated circuit device 1, and further a frame for initially sucking the semiconductor integrated circuit device 1. When the member 2 initially sucks the semiconductor integrated circuit device 1, the vacuum evacuation direction 16
To the taper portion 3b by moving the external lead 1a
Since the semiconductor integrated circuit device 1 moves while being guided by
Can be positioned.

As a result, even if the position of the semiconductor integrated circuit device 1 is displaced during vacuum suction, the guide block member 3
The positions of the semiconductor integrated circuit device 1 and the semiconductor integrated circuit device 1 can be corrected with high accuracy, and as a result, the semiconductor integrated circuit device 1 can be positioned with high accuracy with suction or during transportation (rotation direction). It can be corrected even if it is deviated by about 30 °).

Further, the semiconductor integrated circuit device 1 is positioned by the external lead 1a, so that the main body 1b
Even if the semiconductor integrated circuit device 1 has a small thickness (for example, a thickness of about 1 mm), the external lead 1a can be sufficiently moved, and therefore highly accurate positioning can be performed.

Further, the semiconductor integrated circuit device 1 is attached to the top member 2
By weakening the suction force at the time of initial suction by, the load applied to the outer lead 1a when the outer lead 1a of the semiconductor integrated circuit device 1 is guided by the tapered portion 3b can be reduced.

As a result, the occurrence of lead bending in the external leads 1a can be prevented, so that the yield of the semiconductor integrated circuit device 1 can be improved.

The tip portion 3a of the guide block member 3
The opening 7a of the socket 7 or the opening 8 of the tray 8
Since the guide portion 3c for entering the a is provided,
This can be performed directly when the semiconductor integrated circuit device 1 is housed in or taken out from the socket 7 or the tray 8, and the positioning between the guide block member 3 and the socket 7 or the tray 8 can be performed with high accuracy.

As a result, it is possible to improve the insertion rate when the semiconductor integrated circuit device 1 is housed, so that it is possible to reduce damage at the time of insertion.

Since the cover block member 4 holding the guide block member 3 is detachably held by the shaft member 10 via the ball plunger 11, the cover block member 4 can be easily attached and detached. .

As a result, the guide block member 3 can be easily replaced without using a tool.
Openings 7a of various sockets 7 and openings 8a of tray 8
It is possible to use the guide block member 3 matching the shape of the above, and it is possible to shorten the work time when the product type of the semiconductor integrated circuit device 1 is replaced.

Since the guide block member 3 can be applied to various sockets 7 and trays 8 without using image processing or the like, the processing time during transportation can be reduced.

As a result, the processing capacity during transportation can be improved and the cost of the semiconductor manufacturing apparatus can be reduced.

Further, since the cover block member 4 is held by the shaft member 10 via the ball plunger 11, it is generated when the tip 3a of the guide block member 3 is guided to the opening 8a of the tray 8 or the like. The moving amount of the guide block member 3 in the rotating direction can be absorbed by the ball plunger 11.

As a result, the insertion rate when the semiconductor integrated circuit device 1 is housed can be improved, and damage during insertion can be reduced.

The amount by which the tip end portion 3a of the guide block member 3 of the suction block 9 enters the tray 8 or the like can be changed depending on the size of the top member 2 or the like.
The suction block 9 can be applied to the socket 7 and the tray 8 having various depths.

Since the constituent members of the adsorption block 9 can be made of metal, it is possible to improve measures against static electricity when adsorbing.

Although the invention made by the present inventor has been concretely described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the semiconductor manufacturing apparatus of the above embodiment is
Although the external lead of the semiconductor integrated circuit device is guided, when the main body portion of the semiconductor integrated circuit device has an appropriate thickness, the taper portion of the tip end portion of the guide block member guides the main body portion. It may be one.

The object to be transferred by vacuum suction may be not only a semiconductor integrated circuit device but also an electronic part such as a resistor or a capacitor having a main body part or an external terminal. However, the present invention is not limited to this, and may be a transfer device that transfers the electronic component or other object to be transferred.

In the semiconductor manufacturing apparatus described in the above embodiment, the guide block member sucks and conveys the semiconductor integrated circuit device after the frame member initially sucks the semiconductor integrated circuit device. As shown in the semiconductor manufacturing apparatus of this embodiment, the guide block member 3 may vacuum-suck and convey the semiconductor integrated circuit device 1 from the beginning without providing the top member.

In this case, it is preferable that the tip portion 3a of the guide block member 3 has a shape that seals the surface 1c of the semiconductor integrated circuit device 1 to be sucked as much as possible, and the taper portion 3b of the tip portion 3a of the guide block member 3 is used. The semiconductor integrated circuit device 1 is sucked up and positioned while guiding the external leads 1a.

Since the suction block 9 of the semiconductor manufacturing apparatus shown in FIG. 13 forms a hermetically sealed state on the surface 1c of the semiconductor integrated circuit device 1 by the open end 3d of the guide block member 3, the suction block 9 in the above embodiment is different from that shown in FIG. ZI explained
It cannot be used in sockets where the contact terminals overhang on the leads, such as F-shaped sockets.

Therefore, the suction block 9 shown in FIG.
When using, the socket with lid 7 shown in FIGS. 10 and 11 is used.

In this case, the openings 7a of the guide posts 7b provided at the four corners of the socket 7 are used as guides, and further the guide posts 7b stop the lowering of the suction block 9.

FIG. 12 shows the relationship between the suction block 9 and the socket 7 in the suction block 9 applied to the socket 7 with a lid, and FIG. 13 shows the relationship between the suction block 9 and the tray 8 in the suction block 9. Indicates.

It should be noted that the suction block 9 shown in FIGS. 12 to 15 can also obtain substantially the same effect as that of the above embodiment.

Further, although the suction operation of the suction block in the above-described embodiment is a two-step motion using the initial suction of the top member, it may be modified to be an n-step motion having more than two steps.

Further, the guide block member of the suction block in the above embodiment is a block in which the four corners of the tip end are independent, and the guide block member is formed by combining machinable blocks such as cutting work. The manufacturing cost of the four blocks can be reduced.

As a result, the cost of the guide block member can be reduced.

Further, in the above-described embodiment, the first accommodating member for accommodating the semiconductor integrated circuit device is the socket, and the second
Although the storage member has been described as a tray, the case where the both are reversed may be used. That is, the first storage member is a tray,
The second accommodating member may be a socket, and the first or second accommodating member may be an accommodating member other than the socket and the tray.

[0125]

The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows.

(1). The cylindrical guide block member is provided with a taper portion at its tip portion, and further, by moving the external leads of the semiconductor integrated circuit device while guiding the taper portion, the semiconductor integrated circuit device can be positioned and vacuum-adsorbed. it can. As a result, the positions of the guide block member and the semiconductor integrated circuit device can be corrected with high accuracy during vacuum suction, and as a result, the positioning of the semiconductor integrated circuit device during suction or transportation can be performed with high accuracy with a simple structure. Can be done.

(2). By positioning the semiconductor integrated circuit device with the external leads, the external leads can be sufficiently moved even if the semiconductor integrated circuit device has a thin main body (thickness of about 1 mm). Highly accurate positioning is possible.

(3). By weakening the suction force when the semiconductor integrated circuit device is initially sucked by the top member, the load applied to the outer leads of the semiconductor integrated circuit device when guided by the tapered portion can be reduced. .

As a result, it is possible to prevent the occurrence of lead bending in the external leads, so that it is possible to improve the yield of the transported object such as the semiconductor integrated circuit device.

(4). At the tip of the guide block member,
By providing the guide portion that enters into the opening of each of the first or second accommodating member, the semiconductor integrated circuit device can be directly accommodated in or extracted from the first or second accommodating member, Furthermore, the positioning between the guide block member and the first or second housing member can be performed with high accuracy.

As a result, it is possible to improve the insertion rate when the semiconductor integrated circuit device is housed, so that it is possible to reduce damage at the time of insertion.

(5). Since the cover block member is detachably held by the shaft member via the ball plunger, the cover block member can be easily attached and detached. As a result, the guide block member can be easily replaced without using a tool or the like, so that the guide block member can be used according to the shape of various sockets or the opening of the tray. It is possible to shorten the work time when the device type is changed.

(6). Since the guide block member can be applied to various sockets and trays without using image processing or the like, it is possible to reduce processing time during transportation. As a result, the processing capacity during transportation can be improved and the cost of the semiconductor manufacturing apparatus can be reduced.

(7). Since the cover block member is attached to the shaft member via the ball plunger, the tip end portion of the guide block member has the first or second end.
The amount of movement in the rotation direction of the guide block member that occurs when being guided to each opening of the housing member can be absorbed by the ball plunger.

As a result, it is possible to improve the insertion rate when the semiconductor integrated circuit device is housed, so that it is possible to reduce damage at the time of insertion.

(8). The amount by which the tip of the suction block can enter the first or second storage member can be changed according to the size of the top member, etc., so that the suction block has the first or second storage member having various depths. It can be applied to members.

(9). Since the constituent members of the adsorption block can be formed of metal, it is possible to improve the countermeasure against static electricity when adsorbing.

(10). The cost of the guide block member can be reduced by forming the guide block member by making the four corners of the tip end of the guide block member independent and combining the blocks that can be machined such as cutting work.

[Brief description of drawings]

FIG. 1 is a partial sectional view showing an embodiment of the structure of a semiconductor manufacturing apparatus of the present invention.

FIG. 2 is a partially cutaway front view showing an embodiment of the structure of the top member in the semiconductor manufacturing apparatus of the present invention.

FIG. 3 is a partially cutaway view showing an embodiment of the structure of a cover block member in the semiconductor manufacturing apparatus of the present invention,
(A) is a partial sectional view and (b) is a plan view.

FIG. 4 is a partially cutaway view showing an embodiment of the structure of a guide block member in the semiconductor manufacturing apparatus of the present invention,
(A) is a partial cross-sectional view and (b) is a bottom view.

FIG. 5 is a partially enlarged sectional view showing an embodiment of the structure of the guide block member in the semiconductor manufacturing apparatus of the present invention.

6 (a) and 6 (b) are partial cross-sectional views showing an example of an attached state of each member in the semiconductor manufacturing apparatus of the present invention.

7 (a), (b) and (c) are partial cross-sectional views showing an example of the basic operation in the semiconductor manufacturing method of the present invention.

8A and 8B are partial cross-sectional views showing an example of the basic operation in the semiconductor manufacturing method of the present invention.

9A and 9B are views showing an embodiment of the structure of the first housing member used in the semiconductor manufacturing method of the present invention, where FIG. 9A is a front view, FIG. 9B is a plan view, and FIG. Is.

FIG. 10 is a diagram showing an example of the structure of a first housing member used in a semiconductor manufacturing method according to another embodiment of the present invention, (a) is a front view and (b) is a plan view.

FIG. 11 is a partially enlarged cross-sectional view showing an example of the structure of the first housing member used in the semiconductor manufacturing method which is another embodiment of the present invention.

12A and 12B are views showing an example of a relationship between a guide block member and a first housing member in a semiconductor manufacturing apparatus according to another embodiment of the present invention, FIG. 12A is a partially enlarged plan view, and FIG. FIG.

FIG. 13 is a partially enlarged cross-sectional view showing an example of the relationship between the guide block member and the second accommodating member in the semiconductor manufacturing apparatus which is another embodiment of the present invention.

14A and 14B are diagrams showing an example of the structure of a guide block member in a semiconductor manufacturing apparatus according to another embodiment of the present invention, FIG. 14A is a partially enlarged sectional view, and FIG. 14B is a bottom view.

FIG. 15 is a partial enlarged cross-sectional view showing an example of the relationship between the guide block member and the second accommodating member in the semiconductor manufacturing apparatus according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor integrated circuit device (object to be transported) 1a External lead 1b Main body 1c Surface 2 Top member 2a Opening end 2b Inside 2c Outer peripheral surface 2d Collar part 2e Adsorption end 3 Guide block member 3a Tip part 3b Taper part 3c Guide part 3d Opening End 3e Inside 3f Screw hole 3g Step 3h Inner wall 3i Stopper 4 Cover block member 4a Opening end 4b Inside 4c Screw hole 5 Vacuum exhaust pump (vacuum exhaust means) 6 Vacuum exhaust system 7 Socket (first housing member) 7a Opening 7b Guide post 8 Tray (second housing member) 8a Opening portion 9 Adsorption block 9a Hollow portion 9b Space portion 9c Gap 10 Shaft member 10a Key groove 11 Ball plunger 12 First screw member (fixing member) 13 Second screw member 14 Vacuum Exhaust path 15 Stroke 16 Vacuum exhaust direction 17 X direction 18 Y Directed 19 movement amount

Claims (8)

[Claims] 1. A semiconductor manufacturing method in which a semiconductor integrated circuit device is vacuum-sucked by a suction block and conveyed, wherein the suction block is moved and the semiconductor integrated circuit device is accommodated in an opening of a first housing member for housing the semiconductor integrated circuit device. The guide portion at the tip of the suction block is introduced, and vacuum suction is performed through the suction block, the semiconductor integrated circuit device is initially sucked by the piece member of the suction block, and the piece member is vacuum-exhausted by the vacuum suction. While advancing, the taper portion at the tip of the suction block guides the external leads of the semiconductor integrated circuit device to position the semiconductor integrated circuit device, and the semiconductor block is sucked and held by the suction block and conveyed. Then, the guide portion of the suction block is advanced into the opening of the second housing member that houses the semiconductor integrated circuit device. After the semiconductor manufacturing process, characterized in that for accommodating the semiconductor integrated circuit device to the second housing member. 2. A semiconductor manufacturing apparatus for carrying a semiconductor integrated circuit device by vacuum suction, wherein the semiconductor integrated circuit device is vacuum-sucked at a tip portion and the inside of the tip portion is outside the semiconductor integrated circuit device. A tubular guide block member having a taper portion for guiding the lead, a tubular cover block member holding the guide block member, and a vacuum evacuation unit for evacuating through the guide block member were provided. A vacuum exhaust system, wherein when the semiconductor integrated circuit device is vacuum-sucked, the semiconductor integrated circuit device is positioned and vacuum-sucked while guiding the external leads by the taper portion. Manufacturing equipment. 3. A semiconductor manufacturing apparatus for carrying a semiconductor integrated circuit device by vacuum suction, wherein the semiconductor integrated circuit device is initially sucked by vacuuming.
The semiconductor integrated circuit device is provided with a cylindrical top member that moves in the vacuum exhaust direction by evacuation, and a taper portion that guides external leads of the semiconductor integrated circuit device inside the tip portion, and that is initially attracted. A cylindrical guide block member for vacuum suction, a cylindrical cover block member for guiding the top member and stopping the movement of the top member, and a vacuum evacuation means for performing vacuuming through the top member are provided. When the semiconductor integrated circuit device is vacuum-sucked, the semiconductor integrated circuit device is positioned and vacuum-sucked while the outer lead is guided by the taper portion as the top member moves. A semiconductor manufacturing apparatus characterized by performing. 4. A semiconductor manufacturing apparatus for carrying a semiconductor integrated circuit device by vacuum suction, wherein the semiconductor integrated circuit device is initially sucked by vacuuming.
In addition, the semiconductor integrated circuit device is provided with a cylindrical top member that moves in the vacuum exhaust direction by the evacuation, and a taper portion that guides the main body of the semiconductor integrated circuit device inside the tip portion, and that is initially adsorbed. A cylindrical guide block member for vacuum suction, a cylindrical cover block member for guiding the top member and stopping the movement of the top member, and a vacuum evacuation means for performing vacuuming through the top member are provided. And vacuum suction of the semiconductor integrated circuit device, the semiconductor integrated circuit device is positioned and vacuum sucked while guiding the main body portion by the taper portion as the top member moves. A semiconductor manufacturing apparatus characterized by performing. 5. The semiconductor manufacturing apparatus according to claim 2, 3 or 4, wherein an opening of each of the first or second accommodating member in which the semiconductor integrated circuit device is accommodated is provided at a tip end portion of the guide block member. A semiconductor manufacturing apparatus, characterized in that a guide part is provided to enter the inside of the part. 6. The semiconductor manufacturing apparatus according to claim 5, wherein a ball plunger having a spherical tip is arranged inside the cover block member, and the cover block member communicates with the vacuum exhaust system. A semiconductor manufacturing apparatus, which is detachably attached to a member via the ball plunger. 7. The semiconductor manufacturing apparatus according to claim 6, wherein a fixing member that prevents rotation of the cover block member is arranged inside the cover block member, and the cover block member includes two ball plungers. A semiconductor manufacturing apparatus, which is detachably attached to the shaft member via one of the fixing members. 8. A transport device for transporting a transported object such as an electronic component by vacuum suction, the tubular shape being capable of initially sucking the transported object by vacuuming and moving in a vacuum exhaust direction by the vacuuming. Of the top member and a guide portion that enters into the opening of each of the first or second accommodating members for accommodating the transported object, and the main body portion of the transported object is provided inside the distal end portion. A cylindrical guide block member that has a taper portion that guides an external terminal and that vacuum-sucks the semiconductor integrated circuit device that has been initially sucked, and a cylindrical guide block member that guides the top member and stops the movement of the top member. A cover block member and a vacuum evacuation system provided with a vacuum evacuation means for performing vacuuming through the top member are provided. Wherein while guiding the main body portion or the external terminals by part by the positioning of the transport conveying device and performs vacuum suction.