JPH09320715A - Semiconductor device package socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device package socket in which a terminal of a semiconductor device package is not deformed, when the semiconductor device package is mounted. SOLUTION: A BGA(ball grid array) package socket 100 is filled with a socket mainbody 101 at which a through-hole is formed and in that through hole, one end face has a curved face through face contact with an exposed end face of a solder ball terminal 804, and there are provided a conductive rubber 104 for conductive connection between one end face thereof and the other end face on the opposite side and a lead pin 102 conductive connected to the other end face of the conductive rubber 104.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device package socket, and more particularly to a semiconductor device package (Ball Grid Ar) in which solder balls are formed in contact portions.
ray package, hereinafter referred to as BGA package. )
The present invention relates to a semiconductor device package socket for mounting and demounting.

[0002]

2. Description of the Related Art Various semiconductor device packages are known, but a BGA package is often used as a package mounted on a mother board using solder.

When such a BGA package is manufactured, it is first mounted in a socket and inspected for proper operation.

If the inspection shows that the BGA package operates correctly, the BGA package is transferred onto the mother board, and the solder ball terminals are melted and fixed to the mother board.

A conventional BGA package socket used in the above inspection will be described with reference to the drawings.

FIG. 6 shows a BGA package and a conventional BG.
It is sectional drawing of the socket for A packages. Referring to FIG. 6, the BGA package socket 700 includes a socket body 701, a lead pin 702, a spring 703, and a contact pin 704. Socket body 701
The lead pin 702 is fixed to the. Lead pin 70
A spring 703 is attached to one end of the No. 2. A contact pin 704 is attached to the end of the spring 703. Therefore, the lead pin 702 and the contact pin 7
Conductive connection with 04. Contact pin 704
Can be moved up and down with respect to the socket 701 via the spring 703.

The BGA package 800 includes the semiconductor element 8
01, the package substrate 802, and the solder ball terminal 80
4 is provided. A semiconductor element 801 is provided on the package substrate 802. A solder ball terminal 804 is provided below the package substrate 802. The semiconductor element 801 and the solder ball terminal 804 are conductively connected. The solder ball terminal 804 has a substantially hemispherical shape.

Here, the BGA package socket 70
When mounting the BGA package 800 on 0, a force is applied in the direction indicated by arrow 900. Then, the contact pin 704 and the solder ball terminal 804 are in contact with each other, and the contact pin 704 moves in a direction of compressing the spring 703. At this time, the magnitude of the force applied in the direction indicated by the arrow 900 is adjusted so that the spring 703 contracts slightly. Then, the contact pin 704 always receives an upward force from the spring 703, and therefore the solder ball terminal 804.
Will always be in contact with. Therefore, the lead pin 702
Are conductively connected to the semiconductor element 801 via the spring 703, the contact pin 704, and the solder ball terminal 804.
In this state, an electric signal is sent from the lead pin 702 to inspect whether the semiconductor element 801 operates normally.

Next, if it is found that the semiconductor device 801 operates normally, the BGA package 800 is transferred onto a motherboard (not shown). At this time, the BGA package 800 is positioned such that the copper electrodes on the mother board surface are in contact with the solder ball terminals 804. And
By melting the solder ball terminals 804, the solder ball terminals 804 are semi-permanently connected to the copper electrodes of the motherboard, and the BGA package 800 is fixed on the motherboard.

[0010]

In recent years, with the high integration of semiconductor devices, the number of electric signals input to and output from the semiconductor devices has increased significantly. Therefore, also in the BGA package, the number of solder ball terminals for inputting and outputting electric signals is increasing.

Here, as shown in FIG. 6, a certain force is required to bring one solder ball terminal 804 into contact with one contact pin 704.

Here, in the BGA package 800, the force can be applied in the direction indicated by the arrow 900 at the portion where the semiconductor element 801 is not present. No force can be applied to the portion where the semiconductor element 801 is present. That is, a small force is applied to the solder ball terminal 804 located under the semiconductor element 801, in other words, located in the central portion, and the solder ball terminal 804 is not located under the semiconductor element 801, that is, the solder located in the end portion. A large force is applied to the ball terminal 804.

Therefore, when a sufficient force is applied to the solder ball terminal 804 located at the central portion for connection, a greater force is applied to the solder ball terminal 804 located at the end portion. become.

Here, if the number of solder ball terminals 804 is small, the difference in force between the central portion and the end portions is small as described above, but if the number of solder ball terminals 804 is large, the central portion and the end portions are large. The difference in the force between the
More power is applied to 04 than necessary. At this time, since the solder ball terminal 804 and the contact pin 704 are in point contact with each other, the solder ball terminal 804 at the end portion is deformed.

If the solder ball terminals 804 are deformed, the solder ball terminals 804 will not come into contact with the copper electrodes on the motherboard even when the BGA package 800 is placed on the motherboard. In this way, the solder ball terminal 80
4 does not contact the copper electrode, even if the solder ball terminal 804 is melted, the solder does not contact the copper electrode, resulting in poor contact.

Therefore, an object of the present invention is to provide a BGA package socket in which the solder ball terminals are not deformed when the BGA package is mounted.

[0017]

A semiconductor device package socket of the present invention includes a substrate on which a semiconductor element is mounted, and a terminal which is electrically conductively connected to the semiconductor element and has an exposed end surface which is a curved surface. A semiconductor device package socket for mounting and demounting, including a main body, a contact member, and a lead pin. A through hole is formed in the main body. The contact member is
It is filled in the through hole and has elasticity. Further, one end surface of the contact member has a curved surface that makes surface contact with the exposed end surface of the terminal. Further, one end face of the contact member and the other end face on the opposite side are conductively connected. Further, the lead pin is conductively connected to the other end surface of the contact member.

It is preferable that the contact member is made of conductive rubber, and one end surface of the contact member is made of conductive rubber.

Further, the contact member includes a metal contact member and a conductive rubber member in contact with the metal contact member, one end surface of the contact member is formed on the metal contact member, and the other end surface thereof is the conductive rubber member. Are preferably formed.

Further, the contact member includes an insulating rubber filled in the through hole and a conductive wire formed in the insulating rubber, the conductive wire connecting one end face and the other end face of the contact member. Conductive connection is preferred. It is preferable that a metal member that is in surface contact with the exposed end surface of the terminal is provided on one end surface of the contact member.

Further, the contact member includes a conductive rubber and an insulating rubber which extend along the through hole and are alternately laminated, and the conductive rubber can conductively connect one end surface and the other end surface of the contact member. preferable.

Furthermore, it is preferable that the lead pin is conductively connected to the other end surface of the contact member via a conductive lead contact.

In the semiconductor device package mounting socket configured as described above, the contact members that come into contact with the terminals of the semiconductor device package have elasticity. Further, one end surface of the contact member has a curved surface that makes surface contact with the exposed end surface of the terminal of the semiconductor device package. Therefore, the exposed end surface of the terminal of the semiconductor device package and the contact member are in contact with each other over a wide area, and the exposed end surface is not crushed even when a large force is applied to the terminal of the semiconductor device package.

As a result, even when the semiconductor device package is transferred onto the mother board, the copper electrodes of the mother board and the exposed end faces of the terminals of the semiconductor device package are surely brought into contact with each other, and the exposed end faces are melted to form the semiconductor device package. The motherboard is securely connected.

Further, if the contact member is made of conductive rubber and one end surface of the contact member is made of conductive rubber, the contact member can be made of general-purpose conductive rubber.

Further, the contact member includes a metal contact member and a conductive rubber member in contact with the metal contact member, and one end surface of the contact member is formed on the metal contact member and the other end surface is formed on the conductive rubber member. Then, the exposed end surface of the terminal of the semiconductor device package and the metal contact member come into contact with each other.
Here, since the metal contact member is excellent in conductivity and wear resistance, it does not cause poor contact and does not lack a contact portion, so that the semiconductor device package socket can be used for a long period of time.

Further, the contact member includes an insulating rubber filled in the through hole and a conductive wire formed in the insulating rubber, and the conductive wire conducts one end surface and the other end surface of the contact member. When connected, the conductive wire generally has a lower electric resistance than the conductive rubber, so that the electric resistance between one end surface and the other end surface of the contact member can be reduced.

Further, if one end surface of the contact member is provided with a metal member that comes into surface contact with the exposed end surface of the terminal, the exposed end surface of the terminal of the semiconductor device package socket comes into contact with the metal member. Here, the metal member is
Since it has excellent conductivity and abrasion resistance, it does not cause a contact failure and does not lack a contact portion, so that the semiconductor device package socket can be used for a long period of time.

Further, the contact member includes a conductive rubber and an insulating rubber which extend along the through hole and are alternately laminated.
When the conductive rubber conductively connects the one end surface and the other end surface, the contact member can be configured using general-purpose conductive rubber and insulating rubber, and the contact member can be easily manufactured.

Furthermore, if the lead pin is conductively connected to the other end surface of the contact member via the conductive lead contact, the lead pin can be reliably connected to the contact member.

[0031]

Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 is a sectional view showing a BGA package and a BGA package socket according to a first embodiment of the present invention. Referring to FIG. 1, a BGA package socket 100 includes a socket body 101,
A lead pin 102, a lead pad 103, and a conductive rubber 104 are provided.

Polycarbonate (PC), polysulfone (PS) are used as materials for the socket body 101.
F), polyether sulfone (PES), polyetherimide (PEI), polyphenylene sulfide (PP)
S) or polyoxypentylene (POB).

A conductive rubber 104 as a contact member is fixed in the hole penetrating the socket body 101. Examples of the material forming the conductive rubber 104 include a material in which silicone rubber and copper foil are laminated, or a material in which silicone rubber and metal powder are mixed.

A recess 105 is formed in the conductive rubber 104. The curvature of the recess 105 is substantially equal to the curvature of the solder ball terminal 804.

The recess 10 on the end face of the conductive rubber 104.
A lead pad 103 as a lead contact is fixed to an end surface opposite to the end surface on which the 5 is formed. Examples of the material forming the lead pad 103 include beryllium copper alloy (BeCu), spinodal (spinodal) alloy (CuNiSn), copper titanium alloy (CuTi), and nickel beryllium alloy (NiBe).
The lead pin 102 is connected to the lead pad 103. The lead pin 102 is made of the same material as the lead pad 103.

The BGA package 800 includes the semiconductor element 8
01, the package substrate 802, and the solder ball terminal 80
4 is provided. A semiconductor element 801 is provided on the package substrate 802. A solder ball terminal 804 is provided below the package substrate 802. The semiconductor element 801 and the solder ball terminal 804 are conductively connected. The solder ball terminal 804 has a substantially hemispherical shape.

When the BGA package 800 is mounted on the BGA package socket 100 thus configured, the recess 105 formed in the conductive rubber 104 and the solder ball terminal 804 have substantially the same curvature.
05 and the solder ball terminal 804 are in contact with each other over a wide area. Therefore, even if a strong force is applied to the BGA package 800, the force is applied to the entire surface of the solder ball terminal 804, so that the solder ball terminal 804 does not deform. Therefore, even when the BGA package 800 is mounted on the motherboard, the solder ball terminals 804 and the copper electrodes of the motherboard are surely brought into contact with each other, and the solder ball terminals 804 are melted to reliably connect the motherboard and the BGA package 800. be able to.

(Second Embodiment) FIG. 2 is a sectional view showing a BGA package and a BGA package socket according to a second embodiment of the present invention. Referring to FIG. 2, the BGA package socket 200 includes a socket body 201,
It includes a lead pin 202, a lead pad 203, a conductive rubber 204, and a metal terminal 206.

A conductive rubber 204 is fixed to a hole penetrating the socket body 201. As the material forming the socket body 201, the same material as the material forming the socket body 101 in FIG. 1 can be mentioned. A part of the metal terminal 206 as a metal contact member is embedded in the conductive rubber 204.

As the material forming the conductive rubber 204,
The same material as that of the conductive rubber 104 in FIG. 1 can be used. As a material forming the metal terminal 206, the same material as the material forming the lead pad 103 in FIG.

A recess 205 is formed in the metal terminal 206. The curvature of the recess 205 is substantially equal to the curvature of the solder ball terminal 804.

A lead pad 203 as a lead contact is fixed so as to be in contact with the conductive rubber 204.
The lead pin 202 is fixed so as to be in contact with the lead pad 203. As a material for forming the lead pad 203 and the lead pin 202, the lead pad 1 shown in FIG.
The same material as that of 03 is included.

The BGA package 800 is the B shown in FIG.
It is the same as the GA package 800.

When the BGA package 800 is mounted on the BGA package socket 200 having the above-described structure, the curvature of the recess 205 and the curvature of the solder ball terminal 804 are substantially equal to each other. It is in contact with 804 over a wide area. Therefore, even if a large force is applied to the BGA package 800, the solder ball terminals 8
Since force is applied to the entire surface of 04, the solder ball terminal 80
4 does not transform. Therefore, the BGA package 800
Solder ball terminal 80
4 makes sure contact with the copper electrode of the motherboard. As a result, by melting the solder ball terminals 804, the BGA
The package 800 and the mother board can be reliably connected.

Further, since the metal terminal 206 is hard, the solder ball terminal 804 can be shaped by the recess 205.

Further, since the metal terminal 206 has excellent wear resistance, the recess 205 is not chipped and the BGA package socket 200 can be used for a long period of time.

(Third Embodiment) FIG. 3 is a sectional view showing a BGA package and a BGA package socket according to a third embodiment of the present invention. Referring to FIG. 3, the BGA package socket 300 includes a socket body 301,
It includes a lead pin 302, a lead pad 303, an insulating rubber 307, and a conductive wire 308.

As the material of the socket body 301, the same material as that of the socket body 101 of FIG. 1 can be used. An insulating rubber 307 is fixed in the hole penetrating the socket body 301. Silicon rubber is mentioned as a material which comprises insulating rubber.

A conductive wire 308 is embedded in the insulating rubber 307. A recess 305 is formed in the insulating rubber 307. The curvature of the recess 305 is substantially equal to the curvature of the solder ball terminal 804. The conductive wire 308 reaches the surface of the recess 305.

A lead pad 303 as a lead contact is fixed to the insulating rubber 307 and the conductive wire 308. The lead pin 302 is fixed to the lead pad 303.

Lead pad 303 and lead pin 30
The material forming the lead 2 is the lead pad 103 of FIG.
The same materials as those constituting the above can be used. Conductive wire 30
Examples of the material forming 8 include brass wires plated with gold.

The BGA package 800 is the B shown in FIG.
It is the same as the GA package 800.

When the BGA package 800 is mounted on the BGA package socket 300 having the above-described structure, since the curvature of the recess 305 and the curvature of the solder ball terminal 804 are substantially the same, the recess 305 and the solder ball terminal 804.
Touches a large area. Therefore, even if a large force is applied to the BGA package 800, the force is applied to the entire surface of the solder ball terminal 804, so that the solder ball terminal 804 does not deform. Therefore, when the BGA package 800 is mounted on the motherboard, the solder ball terminals 804 surely contact the copper electrodes on the motherboard. As a result, by melting the solder ball terminal 804,
The GA package 800 can be reliably connected.

Further, since the conductive wire 308 is provided between the lead pad 303 and the solder ball terminal 804, the electric resistance is smaller than that in the case where only conductive rubber is provided between the solder ball terminal 804 and the lead pad 303. can do.

(Fourth Embodiment) FIG. 4 is a sectional view showing a BGA package and a BGA package socket according to a fourth embodiment of the present invention. Referring to FIG. 4, the BGA package socket 400 includes a socket body 401,
A lead pin 402, a lead pad 403, an insulating rubber 407, a conductive wire 408, and a contact dish 409 are provided.

As the material of the socket body 401, the same material as that of the socket body 101 of FIG. 1 can be used. An insulating rubber 407 is fixed to a hole penetrating the socket body 401. A contact tray 409 as a metal member is fixed to the surface of the insulating rubber 407.

A recess 405 is formed in the contact plate 409. The curvature of the recess 405 is substantially equal to the curvature of the solder ball terminal 804. A conductive wire 408 is embedded in the insulating rubber 407 so as to contact the contact tray 409. The material forming the conductive line 408 is the conductive line 308 of FIG.
The same materials as those constituting the above can be used.

A lead pad 403 as a lead contact is fixed to the conductive wire 408 and the insulating rubber 407. The lead pin 402 is fixed to the lead pad 403. As the material forming the lead pin 402, the lead pad 403, and the contact dish 409, the same material as the material forming the lead pad 103 in FIG.

The BGA package 800 is the BGA of FIG.
It is the same as the package 800.

When the BGA package 800 is mounted on the BGA package socket 400 thus configured, the curvature of the recess 405 and the curvature of the solder ball terminal 804 are substantially equal, so that the recess 405 and the solder ball terminal 8 are formed.
04 will come into contact with a wide area. Therefore, BG
Even if a large force is applied to the A package 800, since the force is applied to the entire surface of the solder ball terminal 804, the solder ball terminal 804 does not deform. Therefore, even when the BGA package 800 is mounted on the motherboard, the solder ball terminals 804 surely contact the copper electrodes on the motherboard. As a result, by melting the solder ball terminals 804, the mother board and the BGA package 800 can be reliably connected.

Since the conductive wire 408 is provided between the lead pad 403 and the solder ball terminal 804, the electric resistance is smaller than that in the case where only conductive rubber is provided between the solder ball terminal 804 and the lead pad 403. can do.

Further, since the contact plate 409 has excellent wear resistance, the contact plate 409 is not chipped. Therefore, the BGA package socket 400 can be used for a long time.

(Fifth Embodiment) FIG. 5 is a sectional view showing a BGA package and a BGA package socket according to a fifth embodiment of the present invention. Referring to FIG. 5, the BGA package socket 500 includes a socket body 501,
A lead pin 502, a lead pad 503, a conductive rubber 504, and an insulating rubber 507 are provided.

As the material of the socket body 501, the same material as that of the socket body 101 of FIG. 1 can be used. Conductive rubber 5 in the socket body 501
04 and insulating rubber 507 are fixed so as to alternately form a laminated shape. The conductive rubber 504 is the conductive rubber 10 of FIG.
4 and the insulating rubber 507 are made of the same material as the insulating rubber 307 of FIG.

A recess 505 is formed on the surfaces of the conductive rubber 504 and the insulating rubber 507. The curvature of the recess 505 is substantially equal to the curvature of the solder ball terminal 804. A part of the conductive rubber 504 and the insulating rubber 507 extends into a hole penetrating the socket body 501 so as to reach the lead pad 503.

A lead pad 503 as a lead contact is fixed to a part of the conductive rubber 504 and the insulating rubber 507. Lead pad 503 and lead pin 502
Is in contact. Lead pin 502 and lead pad 5
The material of 03 is the same as the material of the lead pad 103 of FIG.

The BGA package 800 is the BGA of FIG.
It is the same as the package 800.

When the BGA package 800 is mounted on the BGA package socket 500 having the above-described structure, since the curvature of the recess 505 and the curvature of the solder ball terminal 804 are substantially equal to each other, the recess 505 and the solder ball terminal 80 are the same.
Contact with 4 in a large area. Therefore, even when a large force is applied to the BGA package 800, the force is applied to the entire surface of the solder ball terminal 804, and the solder ball terminal 80
4 does not deform. Therefore, the BGA package 800
Solder ball terminal 80
Make sure that 4 is in contact with the copper electrode on the motherboard. as a result,
By melting the solder ball terminals 804, the BGA package 800 and the mother board can be reliably connected.

The embodiments disclosed this time are to be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

[0071]

According to the present invention, the contact member of the socket for a semiconductor device package has elasticity, and one end surface of the contact member has a curved surface that comes into surface contact with the exposed end surface of the terminal of the semiconductor device package. The semiconductor device package can be attached without deforming the exposed end surface of the.

Further, according to the semiconductor device package socket according to another aspect of the present invention, the contact member can be formed of a general-purpose conductive rubber.

Further, according to the semiconductor device package socket according to another aspect of the present invention, the semiconductor device package socket can be used for a long period of time without causing a contact failure and without missing a contact portion. it can.

Further, in the semiconductor device package socket according to another aspect of the present invention, the electric resistance between one end face and the other end face of the contact member can be reduced.

Further, in the semiconductor device package socket according to another aspect of the present invention, the contact member can be formed by using general-purpose conductive rubber and insulating rubber.
The connecting member can be easily manufactured.

Further, in the semiconductor device package socket according to another aspect of the present invention, the lead pin can be reliably connected to the contact member.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a BGA package and a BGA package socket according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a BGA package and a BGA package socket according to a second embodiment of the present invention.

FIG. 3 is a sectional view showing a BGA package and a BGA package socket according to a third embodiment of the present invention.

FIG. 4 is a sectional view showing a BGA package and a BGA package socket according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view showing a BGA package and a BGA package socket according to a fifth embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a BGA package and a conventional socket for a BGA package.

[Explanation of symbols]

100, 200, 300, 400, 500 BGA package sockets, 101, 201, 301, 401,
501 socket body, 102, 202, 302, 40
2,502 lead pins, 103, 203, 303, 4
03, 503 lead pad, 104, 204, 504
Conductive rubber, 105, 205, 305, 405, 505
Recesses, 206 metal terminals, 307, 407, 507 insulating rubber, 308, 408 conductive wires, 409 contact tray.

Claims (7)

[Claims] 1. A semiconductor device package socket for attaching and detaching a semiconductor device package, comprising: a substrate on which a semiconductor element is mounted; and a terminal electrically conductively connected to the semiconductor element and having an exposed end surface having a curved surface. A body having a through hole formed therein, and a curved surface that is filled in the through hole and has one end surface in surface contact with the exposed end surface of the terminal, and the one end surface and the other end surface on the opposite side. A semiconductor device package socket, comprising: an elastic contact member for conductively connecting the above; and a lead pin conductively connected to the other end surface of the contact member. 2. The contact member is made of conductive rubber, and the one end surface is formed of the conductive rubber.
A socket for a semiconductor device package as described in. 3. The contact member includes a metal contact member and a conductive rubber member in contact with the metal contact member, wherein the one end surface is formed on the metal contact member and the other end surface is formed of the conductive material. The semiconductor device package socket according to claim 1, which is formed on a rubber member. 4. The contact member includes an insulating rubber with which the through hole is filled, and a conductive wire formed in the insulating rubber, the conductive wire having the one end surface and the other end surface. The semiconductor device package socket according to claim 1, wherein the socket is electrically connected. 5. The socket for a semiconductor device package according to claim 4, wherein a metal member that is in surface contact with the exposed end surface of the terminal is provided on the one end surface of the contact member. 6. The contact member includes conductive rubber and insulating rubber that extend along the through hole and are alternately laminated, and the conductive rubber conductively connects the one end surface and the other end surface. The semiconductor device package socket according to claim 1. 7. The semiconductor device package socket according to claim 1, wherein the lead pin is conductively connected to the other end surface of the contact member through a conductive lead contact.