JPH09292542A - Substrate for mounting optical parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily provide an optical module which is high in reliability with high productivity with respect to the stability of optical characteristics of mounted optical parts. SOLUTION: A substrate 1 for mounting the optical parts is obtained by securing member 3 for fixing the optical parts, which consists of an optical fiber-mounted region 4 formed with an engaged part for fixing optical fibers, an optical part-mounted region 5 formed with a mounting surface, on which the optical parts are mounted, and a glass press-formed article having a mounting reference plane to be used as a reference of the mounting position at the time of mounting the optical parts, on a base material 2 constituted of a solid having a higher coefficient of thermal conductivity than that of the member 3 or on a base material 2 constituted of a solid having a smaller coefficient of thermal conductivity than that of the member 3 and having a thickness thicker than the maximum thickness of the optical part-mounted region 5 in the member 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate (hereinafter referred to as "optical component mounting substrate") for mounting an optical component and an optical fiber which are necessary for transmitting and receiving light and relaying them while optically connecting them. ), And a semiconductor laser, a light emitting element such as a light emitting diode, a light receiving element such as a photodiode, an optical element such as a microlens, a wavelength plate, a thin plate filter, an optical amplifier, an optical waveguide, etc. on the optical component mounting substrate. The present invention relates to an optical module in which the optical component of 1. is mounted.

[0002]

2. Description of the Related Art Optical components (for example, a semiconductor laser, a light emitting element such as a light emitting diode, a light receiving element such as a photodiode, a microlens, etc.) are used for transmitting and receiving light and relaying light.
While optically connecting an optical element such as an optical element such as a wave plate and a thin plate filter, an optical amplifier, and an optical waveguide (hereinafter,
“Optical connection” is referred to as “optical connection”. ), It is necessary to mount these on the board.

Optical fibers used for optical communication are generally thin fibers made of glass. For example, a silica-based single mode optical fiber used for long-distance optical communication has an outer diameter of 10 μm.
m core and an outer diameter of 125 μm that covers the core
And the clad portion of the. Therefore,
For example, when optically connecting silica-based single-mode optical fibers, or when optically connecting a silica-based single-mode optical fiber and a silica-based single-mode optical waveguide, a connection loss due to an optical axis shift at the optical connection portion is caused. The optical axis shift amount is ± 1.
High alignment accuracy within about μm is required.

Optical connection between an optical fiber and an optical component has heretofore been performed by active alignment using a precision stage. When optically connecting an optical fiber and an optical component by active alignment, the light emitted from the optical fiber is made incident on the optical component to be optically connected, or the light emitted from the optical component is optically connected. The precision stage is driven over a wide range so that the amount of incident light is maximized, and the two are aligned. Therefore, it takes a long time to perform optical connection by active alignment. For this reason, in recent years, it has been attempted to optically connect an optical fiber and an optical component by passive alignment, which enables optical connection in a shorter time.

Passive alignment is a method of performing alignment (optical connection) only by mechanical positioning between members to be optically connected. For example, when optically connecting an optical fiber and an optical component by passive alignment, a fixing member for fixing the optical fiber or the optical component or the optical component itself has a reference surface or an alignment mark that serves as a reference for alignment of these. Etc. are formed with high precision, and the fixing member or the optical component is simply arranged at a predetermined position based on the reference plane or the alignment mark to optically connect the optical fiber and the optical component.

As an optical component mounting substrate capable of passively aligning an optical fiber and an optical waveguide, an optical fiber fixing engaging portion (optical fiber positioning) is formed by etching an Si substrate after the optical waveguide is formed.・ It refers to the engaging portion for fixing. The same shall apply hereinafter.), The one in which the optical fiber fixing engaging portion is formed by mechanical processing on the glass substrate after forming the optical waveguide, and the one by press molding. The optical waveguide is directly formed on the glass substrate after the optical fiber fixing engaging portion is formed (Japanese Patent Laid-Open No. Sho 61-61
No. 145511, JP-A-7-113924 and JP-A-7-218739), or one in which an optical fiber fixing engagement portion is formed by press molding on a glass substrate on which an optical waveguide has been formed (see FIG. JP-A-7-113924). Optical connection between the optical fiber and the optical waveguide using these optical component mounting substrates can be performed by fixing the optical fiber to the optical fiber fixing engaging portion.

By the way, in order to perform transmission / reception and relay of light, in addition to optical fibers and optical waveguides, semiconductor lasers, light emitting elements such as light emitting diodes, light receiving elements such as photodiodes, microlenses, wave plates, thin plate filters, etc. In many cases, it is desired to mount optical components such as the optical element and the optical amplifier on the substrate, and for that purpose, the substrate is more complicated than the case where only the passive alignment between the optical fiber and the optical waveguide is intended. Must be processed to obtain an optical component mounting substrate for mounting an optical fiber and various optical components.

As such an optical component mounting substrate, an optical waveguide is formed on a Si substrate after a marker or the like for positioning an optical component such as an optical fiber or a semiconductor optical component is formed by etching. JP-A-6-347
(See Japanese Patent No. 665), or a Si substrate in which a guide groove for an optical fiber and a position adjusting groove for positioning and fixing a light emitting element, an optical waveguide or a lens are formed by etching (Japanese Patent Laid-Open No. 7-120638). (See the official gazette) is known.

Generally, in order to perform passive alignment between an optical fiber and an optical component or passive alignment between optical components on an optical component mounting board, the optical fiber fixing engaging portion and the mounting surface for the optical component are respectively provided. In addition to extremely high dimensional and shape accuracy,
Position accuracy of each of the optical fiber fixing engagement portion and the optical component mounting surface with respect to a predetermined reference surface on the optical component mounting substrate, the position of the optical fiber fixing engagement portion and the alignment mark for optical component mounting It is necessary to make the degree of precision, the degree of precision of the position of the alignment marks between two or more optical components, etc. extremely high. For example, the positional accuracy of the engagement portion for fixing the optical fiber and the alignment mark for the light emitting element, which is required when mounting the single mode optical fiber and the light emitting element, is an extremely high value of about 2 μm or less.

It is relatively easy to form the optical fiber fixing engaging portion and the mounting surface for the optical component on the glass substrate with high precision by mechanical processing, but in the case of mechanical processing, the optical component mounting surface is used. Position accuracy of each of the optical fiber fixing engagement portion and the mounting surface for the optical component with respect to a predetermined reference surface on the substrate, position accuracy of the optical fiber fixing engagement portion and the optical component mounting alignment mark, 2 It is extremely difficult to set the positional accuracy of alignment marks between two or more optical components to a high value, for example, within 2 μm.

Further, the Si substrate can be processed with relatively high precision by etching using the photolithography technique. However, when the above-mentioned optical component mounting substrate is obtained, the optical fiber fixing engaging portion and the optical component are used. The processing depth for forming the mounting surface for use is in the wide range of sub-μm to mm order. When various portions having different processing depths are formed on the Si substrate by etching, these portions cannot be formed by one etching processing. Therefore, it is necessary to perform etching processing a plurality of times for each processing depth. is there. Further, when the Si substrate is subjected to etching processing, if the processing depth becomes approximately 100 μm or more,
Processing will take a long time. Furthermore, when etching is performed by utilizing the crystal anisotropy of Si, the orientation flat of the Si wafer and the crystal orientation do not exactly match, so that the crystal orientation of Si and the mask pattern do not exactly match. It is difficult to do so, and as a result, the machining accuracy of the groove is limited to ± 2 to 3 μm. Therefore, it is difficult to obtain a substrate for optical component mounting with a processing accuracy of, for example, ± 1 μm or less by etching the Si substrate, and even if an optical component mounting substrate with a lower processing accuracy is obtained, its productivity is low. .

On the other hand, when glass is press-molded, it is relatively easy to obtain a substrate for mounting an optical component having a desired processing accuracy by a single press-molding process. When an optical component mounting substrate on which a current injection type optical component such as a semiconductor laser, a light emitting diode, a semiconductor optical amplifier is mounted is manufactured by press molding glass, the same optical component mounting substrate is used as a Si substrate. The following advantages can be obtained as compared with the case of manufacturing using.

That is, when the current injection type optical component is mounted on the optical component mounting substrate, it is necessary to form the electrodes and the electrical wiring on the optical component mounting substrate, which is manufactured by using the Si substrate. In order to mount a current injection type optical component on the optical component mounting substrate, in order to reduce the electric capacitance generated between the optical component mounting substrate and the electrode or the electric capacitance generated between the electric wiring, It is necessary to form a silicon oxide film (electrical insulating film) having a film thickness of several tens of μm or more on a predetermined portion of the component mounting substrate by a method such as sputtering. On the other hand, when a substrate for optical component mounting is manufactured by press molding glass, the above-mentioned electric capacity can be obtained only by making the thickness of a portion where an electrode or electric wiring is to be formed several tens of μm or more. Since the size can be made sufficiently small, the work of forming an electric insulating film becomes unnecessary.

Therefore, from the viewpoint of productivity, it is preferable to press-mold glass to obtain a substrate for mounting optical components.

[0015]

However, the glass which can be press-formed is a multi-component glass having a yield point of about 600 ° C. or less, and the thermal expansion coefficient of the multi-component glass is quartz which is often used as an optical waveguide. The thermal expansion coefficient of the silica glass used in the optical waveguide is about 10 times or more. Therefore, when a glass optical component mounting substrate is obtained by press molding and a quartz optical waveguide is mounted on this optical component mounting substrate, the coefficient of thermal expansion of the silica optical waveguide (the thermal expansion coefficient of quartz glass Coefficient) and the thermal expansion coefficient of the optical component mounting board as described above, thermal stress is generated between the silica-based optical waveguide and the optical component mounting board due to the environmental temperature change after mounting. As a result of fluctuations in the refractive index of the silica-based optical waveguide due to this thermal stress, fluctuations and deterioration of the optical waveguide characteristics such as insertion loss and branching ratio occur. Therefore,
When a silica-based optical waveguide is mounted on a glass optical component mounting substrate obtained by press molding, the stability of optical characteristics (optical waveguide characteristics) with respect to environmental temperature changes tends to decrease Sex decreases.

Further, the glass substrate has a lower thermal conductivity, that is, heat dissipation than the Si substrate, and is not suitable as a heat sink for an optical component of a type that generates heat during operation. Therefore, a glass optical component mounting substrate is obtained by press molding, and when a current injection type optical component such as a semiconductor laser, a light emitting diode, or a semiconductor optical amplifier is mounted on the optical component mounting substrate, it is driven. Since heat generated by the current injection is more likely to be accumulated in the current injection type optical component than when it is mounted on the Si substrate, stability of light output, light emission efficiency, gain characteristics and the like of the current injection type optical component are deteriorated. . Therefore, when a current injection type optical component is mounted on a glass optical component mounting substrate obtained by press molding, the driving stability of the current injection type optical component is likely to be reduced, resulting in a decrease in its reliability. To do.

A first object of the present invention is that it can be obtained with high productivity, and that the stability of the optical characteristics of the optical component is high even after mounting the optical component. It is to provide a substrate for mounting an optical component, which is easy to obtain.

A second object of the present invention is to provide an optical module which can be obtained with high productivity and which is highly reliable in terms of stability of optical characteristics of mounted optical components. To do.

[0019]

In the optical component mounting substrate of the present invention which achieves the first object, an optical fiber mounting region in which an optical fiber fixing engaging portion is formed and an optical component are mounted. An optical component fixing member made of a glass press molded product having an optical component mounting area in which a mounting surface is formed and a mounting reference surface serving as a reference of a mounting position when mounting an optical component, and the optical component fixing member. Also has a base material made of a solid having high thermal conductivity, and the optical component fixing member is fixed on the base material (hereinafter, this optical component mounting substrate "Optical component mounting board I".).

Another optical component mounting board of the present invention that achieves the first object is an optical fiber mounting area in which an optical fiber fixing engaging portion is formed, and a mounting surface on which an optical component is mounted. An optical component fixing member made of a glass press-molded product having an optical component mounting area in which the optical component mounting area and a mounting reference surface that serves as a reference for the mounting position when mounting the optical component, and a heat A solid base material having a small expansion coefficient, wherein the thickness of the base material is thicker than the maximum thickness of the optical component mounting region of the optical component fixing member, and the optical component is fixed on the base material. It is characterized in that members are fixed (hereinafter, this optical component mounting substrate is referred to as "optical component mounting substrate II").

An optical module of the present invention that achieves the second object has the above-described optical component mounting substrate of the present invention and an optical component mounted on the optical component mounting substrate. It is what

[0022]

Embodiments of the present invention will be described below in detail. First, the optical component mounting substrate I of the present invention
The optical component mounting substrate I is, as described above, the optical component mounting area in which the optical fiber fixing engaging portion is formed, and the optical component in which the mounting surface on which the optical component is mounted is formed. An optical component fixing member made of a glass press-molded product having a mounting reference surface that serves as a reference for a mounting region and a mounting position when mounting an optical component.

An optical fiber fixing engagement portion is formed in the optical fiber mounting area provided on the optical component fixing member, and a desired optical fiber is mounted on the optical fiber fixing engagement portion. It The number of the engaging portions for fixing the optical fibers and the size of each engaging portion are appropriately determined according to the number of optical fibers to be mounted on the target optical component mounting board I and the outer diameter of each optical fiber. It is selectable. Also,
The vertical cross-sectional shape (vertical cross-sectional shape in the direction orthogonal to the longitudinal direction) is not particularly limited, and can be appropriately selected from V-shaped, substantially V-shaped, U-shaped, arc-shaped, rectangular, and the like. However, considering the releasability and transferability at the time of press molding, the fixing accuracy of the optical fiber, the positional stability, etc., the V-shape or the substantially V-shape is preferable.

The optical fiber fixing engaging portion may engage with the optical fiber such that the outer peripheral surface of the optical fiber is at the same height as or lower than the upper end surface of the engaging portion. In order to fix the apex of the outer peripheral surface of the optical fiber by the pressing member, the outer peripheral surface of the optical fiber may be engaged with the optical fiber so as to slightly project from the upper end surface of the engaging portion. preferable.

The dimensional accuracy, shape accuracy, and positional accuracy are determined by the type of optical fiber to be mounted (single-mode optical fiber or multimode optical fiber) so that passive alignment between the optical fiber and the optical component is possible. It is appropriately set depending on the type of the optical component to be optically connected to the optical fiber).

In the optical component mounting area provided on the optical component fixing member together with the optical fiber mounting area, the optical component to be optically connected to one end of the optical fiber (the end on the side where the optical component is to be optically connected). A mounting surface is formed on which other optical components to be optically connected to this optical component are mounted.

The type of the optical component mounted on the mounting surface formed in the optical component mounting area is appropriately selected according to the intended use of the optical component mounting substrate I and the like. However, as will be described later, the optical component mounting substrate I of the present invention, even when a current injection type optical component such as a semiconductor laser, a light emitting diode, or a semiconductor optical amplifier is mounted, has stable driving of the current injection type optical component after mounting. Since it is suitable as a substrate for mounting optical components that provides high reliability,
It is desirable that the optical component fixing member can mount at least a current injection type optical component as an optical component. That is, it is preferable that a mounting surface for mounting the current injection type optical component is formed in the optical component mounting region of the optical component fixing member.

The mounting surface on which the optical component is mounted may be formed vertically below the upper end surface of the optical fiber fixing engaging portion, or may be formed at the same height as the upper end surface. It may be formed, or may be formed vertically above the upper end surface. The position of the mounting surface to be formed in the optical component mounting area can be appropriately selected according to the type of optical component to be mounted, the intended use of the optical component mounting substrate I, and the like.

The contour shape of the mounting surface, the size in plan view, the number and the forming position depend on the type, the size and the number of optical components to be mounted, the intended use of the optical component mounting substrate I, and the like. It is selected as appropriate. This mounting surface may also serve as a mounting reference surface that serves as a reference for the mounting position of the optical component when it is mounted, or may not serve as the aforementioned mounting reference surface.

Here, the "mounting reference plane" in the present invention means the optical axis of the optical component and the optical axis of the optical fiber or the optical axis of the optical component when a predetermined surface of the optical component is brought into contact. At least one of the horizontal position and the vertical position is set so that the optical axes of the other optical components are three-dimensionally aligned, that is, the optical components and the optical fibers or the optical components are optically connected. Means an aspect that can be defined.

When the mounting surface on which the optical component is mounted does not also serve as the mounting reference surface, the mounting reference surface is provided at a desired position of the optical component fixing member. In this case, the formation position, contour shape, size and number of the mounting reference plane are
The type, size and number of optical components to be mounted,
It is appropriately selected depending on the intended use of the optical component mounting substrate I and the like. Further, the flatness and position accuracy are appropriately determined according to the types of the optical component and the optical fiber to be mounted so that passive alignment between the optical component and the optical fiber or passive alignment between the optical components can be performed. Is set.

The optical component fixing member constituting the optical component mounting board I of the present invention is provided with an optical fiber mounting area in which an optical fiber fixing engaging portion is formed and a mounting surface on which an optical component is mounted. The optical component mounting area and the mounting reference surface that serves as a reference for the mounting position when mounting the optical component should be used.However, for easier mounting of the optical component, it is necessary to position the optical component. It is also preferable to have the alignment mark of. The shape of the alignment mark in plan view is not particularly limited, and may be a cross, a circle, two circles arranged concentrically, a triangle, a line, a strip, etc.
The alignment mark may have various shapes, and may have a convex shape or a concave shape. However, the positional accuracy is preferably within 10 μm,
In particular, the positional accuracy of the alignment mark for the optical component to be optically connected to the silica single mode optical fiber is preferably within 2 μm.

The position where the alignment mark is formed is not particularly limited as long as it can position (mount) the optical component. However, the positioning (mounting) of the optical component using the alignment mark is performed using visible light or near infrared rays having a wavelength of 0.7 to 2.5 μm and the alignment mark provided on the optical component fixing member. The alignment mark is formed by detecting the alignment mark provided on each optical component. Therefore, the alignment mark formation position is the wavelength of the light (electromagnetic wave) used to detect the alignment mark, and the optical component for fixing the light (electromagnetic wave). It is appropriately selected in consideration of the transparency of the member, the transparency of the light (electromagnetic wave) to the substrate described later, and the like.

Further, an optical component that requires electrical wiring, for example, a current injection type optical component such as a semiconductor laser, a light emitting diode, a semiconductor optical amplifier, or a light receiving element such as a photodiode is mounted on a target optical component mounting substrate I. In this case, since it is necessary to form an electrode pattern for a current injection type optical component or a light receiving element on the optical component mounting substrate I, the above optical component fixing member is provided at a predetermined position (usually the optical component is fixed). It is preferable to have a recess for electrode pattern formation in the mounting area). By forming the electrode pattern forming recess in advance, the electrode pattern can be easily formed at a predetermined position.

The optical component fixing member described above is made of a glass press-molded product as described above. The glass material as the material for the optical component fixing member is not particularly limited as long as it can be press-molded, but the optical characteristics of the optical component with respect to the environmental temperature change after mounting the optical component From the viewpoint of obtaining a highly stable optical component mounting substrate, it is preferable that the optical component fixing member described above has a small thermal expansion coefficient.

For example, in order to obtain a substrate for mounting an optical component in which the temperature fluctuation of the connection loss does not pose a practical problem when the optical component and the silica single mode optical fiber are optically connected, the thermal expansion coefficient thereof is 70. It is preferable that the temperature is not more than × 10 ^-7 / ° C, and the average thermal expansion coefficient at -40 to + 85 ° C, which is expected as the operating environment temperature of the optical component mounting substrate, is 70 × 10 ^-7 / ° C or less. Preferably there is.

Therefore, it is preferable that the glass material also has a coefficient of thermal expansion of 70 × 10 ⁻⁷ / ° C. or less,
Average thermal expansion coefficient at 40 to + 85 ° C is 70 × 10 ^-7
It is preferably below / ° C. Further, the average coefficient of thermal expansion of the above glass material at room temperature to 400 ° C. is preferably small, and particularly preferably 70 × 10 ⁻⁷ / ° C. or less. Press molding is possible and room temperature to 400
Specific examples of the glass having an average coefficient of thermal expansion at 70 ° C. of 70 × 10 ⁻⁷ / ° C. or less include the glass having the following composition.

That is, as glass components, SiO ₂ is ₁ to 30 wt%, B ₂ O ₃ is 15 to 40 wt%, and ZnO is 4 wt%.
0 to 60 wt% (excluding 40 wt%), MgO 0
-15 wt%, CaO 0-10 wt%, SrO 0-10
wt%, BaO 0 to 10 wt%, PbO 0 to 20 wt%, the total amount of ZnO, MgO, CaO, SrO, BaO and PbO is 40 to 60 wt% (excluding 40 wt%), and , Al ₂ O ₃ in an amount of 0 to 10 wt% (excluding 0 wt%), and the total amount of the glass components is 7
Glass that is 5 wt% or more (hereinafter, this glass is referred to as "first glass") can be used.

This first glass contains SiO _{2 in an amount} of 3 to 30.
wt%, B ₂ O ₃ and 20 to 40 wt%, the ZnO 40～55W
t% (excluding 40 wt%), 0-15 wt% MgO
%, 0-10 wt% CaO, 0-10 wt% SrO, B
aO 0-10 wt%, PbO 0-20 wt%, Z
The total amount of nO, MgO, CaO, SrO, BaO and PbO is 40 to 55 wt% (but not including 40 wt%), and further, 0.5 to 10 wt% of Al ₂ O ₃ and 0 to 0 of Li ₂ O. It is particularly preferred that the content be 7 wt% (hereinafter, this glass is referred to as “second glass”).

The above-mentioned first glass and second glass are
Further, 0-10 wt% of GeO ₂ (however, SiO ₂ and Ge
The total amount with O ₂ is ₃ to 30 wt%), and La ₂ O ₃ is 0 to 20 w
t%, 0-10 wt% of Y ₂ O _3, 0~10wt the Gd ₂ O ₃
% (However, the total amount of La ₂ O ₃ , Y ₂ O ₃ and Gd ₂ O ₃ is 0%
~20wt%), Nb ₂ O ₅ and 0-10 wt%, the total amount of Ta ₂ O ₅ and 0-10 wt% (provided that Nb ₂ O ₅ and Ta ₂ O ₅ 0
10 wt%), a ZrO ₂ 0-5 wt%, the TiO ₂ 0 to
It may contain 3 wt%. Further, for the purpose of improving defoaming and coloring, As ₂ O ₃ , Sb ₂ O ₃ ,
One or more of SnO and SnO ₂ may be added. However, As ₂ O ₃ , Sb ₂ O ₃ , SnO, S
Even if nO ₂ is added in a total amount exceeding 4 wt%, the effect of improving defoaming and coloring is not improved. Therefore, it is desirable to use these components in a total amount of 0 to 4 wt%. further,
In addition to the above-mentioned components, F, Bi ₂ O ₃ , Yb ₂ O ₃ , WO _{3 and the} like are appropriately added to the extent that the properties of the glass are not deteriorated, and trace amounts of Na ₂ O and K ₂ O are added. There may be.

The glass of each composition described above is a glass having a sag point of 600 ° C. or less and a thermal conductivity of about 1.
0 W · K ⁻¹ · m ⁻¹ or less, the visible light transmittance is approximately 90% or more at a thickness of 2 mm, and the near infrared ray having a wavelength of 0.7 to 2.5 μm is approximately 60% or more at a thickness of 2 mm.

The optical component mounting board I of the present invention has, in addition to the above-mentioned optical component fixing member, a solid base material having a higher thermal conductivity than the optical component fixing member. The thermal conductivity of the base material is preferably approximately 20 times or more higher than that of the optical component fixing member, and particularly preferably approximately 100 times or higher.

The material of the base material can be appropriately selected according to the material (thermal conductivity) of the optical component fixing member. For example, if the thermal conductivity of the optical component fixing member was 1.0W · K ^-1 · m ^-1, silicon as the material of the base material (Si; thermal conductivity 148W · K ^-1 · m ^-1 ), Aluminum nitride (Al
N; thermal conductivity 63 to 260 W · K ⁻¹ · m ⁻¹ ), silicon carbide (SiC; thermal conductivity 270 to 490 W · K ⁻¹ ·
m ⁻¹ ), gallium phosphide (GaP; thermal conductivity 110 W ・ K
^-1 · m ^-1 ), indium phosphide (InP; thermal conductivity 70W
・ K ^-1 · m ^-1 ), germanium (Ge; thermal conductivity 60 W
・ K ^-1 · m ^-1 ), gallium arsenide (GaAs; thermal conductivity 5
4W · K ⁻¹ · m ⁻¹ ), alumina (Al ₂ O ₃ ; thermal conductivity 3
6 W · K ⁻¹ · m ⁻¹ ), glassy carbon and the like can be used.

When the current injection type optical component is mounted on the optical component fixing member, the base material generates heat generated by driving the current injection type optical component outside the optical component mounting substrate I. The surface area is preferably as large as possible, since it is for facilitating the emission. When the shape and size of the base material in plan view are the same as the shape and size of the optical component fixing member in plan view, increase the thickness of the base material. By providing irregularities on the surface of the base material, the surface area can be increased.

Generally, the maximum thickness of the optical component mounting substrate is
Although it depends on the application, it is generally within the range of 0.5 to 5 mm, and therefore, the maximum thickness of the optical component mounting substrate I of the present invention is also preferably within the above range. Therefore, the wall thickness of the above-mentioned base material also takes into consideration the heat dissipation effect of the base material,
It can be appropriately selected so that the optical component mounting substrate I having a desired thickness can be obtained.

In the optical component mounting substrate I of the present invention, the above-mentioned optical component fixing member is fixed on the above-mentioned base material.
To fix the optical component fixing member on the base material,
A resin adhesive such as a photo-curing type, a thermosetting type, a thermoplastic type, a heat melting type, a low melting point glass, a metal solder, or the like can be used.

Further, when the optical component fixing member is obtained by press molding, the glass material (glass molding preliminary body) for the optical component fixing member and the base material are arranged in series in the pressurizing direction at the time of press molding. It is also possible to fix the optical component fixing member on the base material by press molding with a press. In this case, forming the optical component fixing member and fixing the optical component fixing member on the base material are one step. Can be done at.

In order to manufacture the target optical component mounting substrate I with high productivity, press forming for molding the optical component fixing member and fixing of the optical component fixing member on the base material are performed. Is more preferably performed in one step, for that purpose, in addition to having a higher thermal conductivity than the optical component fixing member, higher heat resistance than the optical component fixing member, that is,
Glass material for glass parts (glass preform)
It is preferable to use a substrate having heat resistance that does not substantially deform when subjected to press molding together with.

When the press forming for molding the optical component fixing member and the fixing of the optical component fixing member on the base material are performed in one step, the optical component mounting substrate obtained by the press molding is pressed. In the process of cooling from the molding temperature to room temperature, a stress due to a difference in thermal expansion occurs between the optical component fixing member and the base material, and in some cases, the stress causes the optical component fixing member to crack. In order to prevent such cracking, stress relaxation should be performed in whole or in part between the bottom surface of the optical component fixing member (surface on the base material side) and the top surface of the base material (surface on the optical component fixing member side). It is preferable to perform press molding so that the film acting as a film is finally interposed. Specific examples of the material of the film acting as the stress relaxation film include aluminum, chromium, tantalum and alloys thereof. Further, instead of the film acting as the stress relaxation film, a film that does not adhere to glass may be provided. Specific examples of this film include silicon carbide,
Examples thereof include a metal carbide film such as titanium carbide, a metal nitride film such as titanium nitride, and a platinum alloy film.

In the optical component mounting board I of the present invention, which has an optical component fixing member and a base material and which are fixed to each other as described above, the optical component fixing member is a glass press. Since it is a molded product, it is relatively easy to obtain a product having a processing accuracy that enables passive alignment between an optical fiber and an optical component or passive alignment between optical components with high productivity. Further, the optical component mounting substrate I of the present invention can be used for mounting optical components that require electrical wiring, for example, current injection type optical components such as semiconductor lasers, light emitting diodes, semiconductor optical amplifiers, and light receiving elements such as photodiodes. Since it is not necessary to form an electric insulating film, high productivity can be obtained from this point as well.

Furthermore, since the above-mentioned optical component fixing member is fixed on a solid base material having a higher thermal conductivity than the optical component fixing member, semiconductor lasers, light emitting diodes, semiconductor optical amplifiers, etc. When the current injection type optical component of (1) is mounted, the base material functions as a heat sink, and the heat generated by the driving of the current injection type optical component after mounting is easily generated outside the optical component mounting substrate I. It is possible to dissipate. By easily dissipating the heat generated by the driving of the current injection type optical component after mounting to the outside of the optical component mounting substrate I, it is possible to suppress the accumulation of heat in the current injection type optical component. As a result, the deterioration of the optical output stability, light emission efficiency, gain characteristics, etc. of the current injection type optical component is suppressed. The driving stability of the current injection type optical component is improved as compared with the case where the optical component is mounted. That is, it is possible to obtain high reliability of the optical characteristics of the current injection type optical component after mounting.

The reliability can be further enhanced by adding a material having a higher thermal conductivity than the optical component fixing member as a heat sink separately from the base material to the optical component fixing member. The optical component mounting board I of the present invention also includes such a heat sink separately added to the optical component fixing member. Regarding the method for manufacturing the optical component mounting substrate I of the present invention having the above advantages, the manufacturing method of the optical component mounting substrate II of the present invention described in detail below,
It will be described later.

Next, the optical component mounting substrate II of the present invention will be described. As described above, the optical component mounting substrate II of the present invention includes the optical fiber mounting region in which the optical fiber fixing engagement portion is formed and the optical component mounting region in which the mounting surface on which the optical component is mounted is formed. And an optical component fixing member made of a glass press-molded product having a mounting reference surface that serves as a reference for a mounting position when mounting an optical component.

The above-mentioned optical component fixing member is the same as the optical component fixing member in the optical component mounting substrate I of the present invention which has already been described, and therefore the description thereof is omitted here, but the optical component of the present invention is omitted. The mounting substrate II is an optical component mounting substrate that provides high reliability in terms of the stability of the optical characteristics (optical waveguide characteristics) of the optical waveguide with respect to environmental temperature changes after mounting even when the optical waveguide element is mounted. Since it is suitable, it is desirable to mount at least an optical waveguide element, particularly a silica optical waveguide element, as an optical component. Therefore, it is preferable that a mounting surface for mounting the optical waveguide element is formed in the optical component mounting region. Of course, the optical component mounting substrate II of the present invention provides high reliability of the stability of the optical characteristics of the optical component with respect to the environmental temperature change after mounting even when the optical component other than the optical waveguide element is mounted. Therefore, what kind of mounting surface for the optical component is formed in the optical component mounting region can be appropriately selected according to the intended use of the optical component mounting substrate II and the like.

The term "mounting the optical waveguide element" as used in the present invention does not mean that the optical waveguide element is directly formed on the optical component fixing member, but a separately prepared optical waveguide element is used as the optical fixing member. It means to be arranged at a predetermined position so that passive alignment is possible.

The optical component mounting substrate II of the present invention has, in addition to the above-mentioned optical component fixing member, a solid base material having a thermal expansion coefficient smaller than that of the optical component fixing member. The thermal expansion coefficient of this base material is preferably about 50 × 10 ⁻⁷ / ° C. or less, and the material thereof can be appropriately selected according to the material (coefficient of thermal expansion) of the optical component fixing member.

For example, when the thermal expansion coefficient of the optical component fixing member is 70 × 10 ⁻⁷ / ° C., the material of the base material is quartz glass (thermal expansion coefficient 5 × 10 ⁻⁷ / ° C.), Pyrex glass. (Coefficient of thermal expansion: 30 × 10 ⁻⁷ / ° C., “Pyrex” is the product name of low thermal expansion glass manufactured by Corning Incorporated),
Silicon (Si, coefficient of thermal expansion: 30 × 10 ⁻⁷ / ° C.), crystallized glass (coefficient of thermal expansion: approximately 4 × 10 ⁻⁷ to 50 × 10)
^-7 / ℃, aluminum nitride (AlN, coefficient of thermal expansion: 2
5 × 10 ⁻⁷ / ° C.), silicon carbide (SiC, coefficient of thermal expansion:
33 × 10 ^-7 / ° C), glassy carbon (coefficient of thermal expansion:
20 × 10 ⁻⁷ to 40 × 10 ⁻⁷ / ° C.) or the like can be used.

The wall thickness of the base material is thicker than the maximum wall thickness of the optical component mounting region of the above-mentioned optical component fixing member. As described above, the maximum thickness of the optical component mounting board is generally in the range of 0.5 to 5 mm, depending on its application, so the maximum thickness of the optical component mounting board II of the present invention is also It is preferably within the above range. Therefore, the thickness of the base material is thicker than the maximum thickness of the optical component mounting region in the optical component fixing member described above, so that the optical component mounting substrate II having a desired thickness can be obtained. It can be appropriately selected.

The optical component mounting substrate II of the present invention is one in which the above-mentioned optical component fixing member is fixed onto the above-mentioned base material, and the thickness of the base material is the optical component fixing member. Since it is thicker than the maximum thickness of the component mounting area, the thermal expansion coefficient due to thermal expansion and contraction due to environmental temperature changes, the deformation that occurs in the optical component fixing member has a coefficient of thermal expansion larger than that of the optical component fixing member. Small, in other words, deformation caused by thermal expansion and thermal contraction is suppressed by the small base material.

The effect of suppressing the deformation of the optical component fixing member due to thermal expansion or thermal contraction becomes more remarkable as the difference between the thickness of the base material and the maximum thickness of the optical component mounting region becomes larger. It is practical that the thickness of the optical component mounting substrate is within the above range. Therefore, the optical component mounting substrate of the present invention
In II, the maximum thickness of the optical component mounting region in the above-described optical component fixing member is preferably 1/2 or less of the thickness of the base material, and particularly preferably 1/10 or less.

The optical component fixing member can be fixed on the base material in the same manner as in the optical component mounting substrate I of the present invention described above. Similar to the case of obtaining the optical component mounting substrate I, in order to manufacture the desired optical component mounting substrate II with high productivity, press forming and base material for molding the optical component fixing member are performed. It is more preferable that the fixing of the optical component fixing member to the upper part is performed in one step. Therefore, in addition to having a smaller thermal expansion coefficient than the optical component fixing member, It is preferable to use a substrate having high heat resistance, that is, a heat resistance that does not substantially deform when press-molded together with a glass material (glass molding preliminary body) for a member for fixing an optical component. At this time, as described in the description of the optical component mounting substrate I of the present invention, the film acting as the stress relaxation film and the film that is not adhered to the glass finally become the optical component fixing member. You may press-form so that it may intervene in whole or in part between the bottom face (face on the base material side) and the top face of the base material (face on the optical component fixing member side).

In the optical component mounting board II of the present invention, which has an optical component fixing member and a base material and which are fixed to each other as described above, the optical component fixing member is a glass press. Since it is a molded product, it is relatively easy to obtain a product having a processing accuracy that enables passive alignment between an optical fiber and an optical component or passive alignment between optical components with high productivity. Further, since the optical component mounting substrate II of the present invention does not need to form an electric insulating film even when mounting an optical component that requires electrical wiring, high productivity can be obtained from this point as well.

The optical component fixing member is fixed on a solid base material having a thermal expansion coefficient smaller than that of the optical component fixing member, and the thickness of the base material is for fixing the optical component. Since the thickness is larger than the maximum thickness of the optical component mounting area in the member, the deformation that occurs in the optical component fixing member due to thermal expansion and contraction due to environmental temperature change after mounting the optical component is Deformation due to thermal expansion or thermal contraction is suppressed by the base material that is smaller than the optical component fixing member. As a result, the optical characteristics of the optical component due to the thermal stress generated between the optical component fixing member and the optical component mounted on the optical component fixing member due to the environmental temperature change, The fluctuation or deterioration is suppressed, and the stability of the optical characteristics of the optical component with respect to the environmental temperature change is improved as compared with the case where the optical component is mounted on the optical component mounting substrate made of only the glass press molded product. That is, it is possible to obtain high reliability of the optical characteristics of the optical component after mounting.

Further, in the optical component mounting substrate II of the present invention, an optical waveguide element separately manufactured as a member different from the above-mentioned optical component fixing member can be easily mounted. As a result, there is a problem caused by forming an optical waveguide directly on a glass substrate after forming an optical fiber fixing engaging portion as in the conventional case, that is, the optical waveguide is press-molded, FHD method (flame hydrolysis deposition). Method), CVD
Method, sputtering method, ion exchange method, or any other method, the optical waveguide has a processing accuracy that enables passive alignment with the optical fiber according to the position of the already formed engaging portion for fixing the optical fiber. The problem that it is difficult to obtain the desired alignment accuracy because it is difficult to form the core part is solved.

Further, if an optical waveguide is to be formed directly on the glass substrate after the optical fiber fixing engagement portion is formed as in the conventional case, if a press molding method is applied to form the optical waveguide, the glass substrate is Inevitably, there is no choice but to form an optical waveguide with glass having a low yield point.
Further, since it is not possible to apply an optical waveguide forming method that requires a high temperature process such as FHD method, CVD method, and sputtering method, it is substantially necessary to form a silica optical waveguide suitable as an optical waveguide for optical communication. However, in the optical component mounting substrate II of the present invention, a silica-based optical waveguide device can be easily mounted.

Then, another conventional method,
That is, in the method in which the optical waveguide is directly formed on the glass substrate and then the groove for fixing the optical component is formed in the glass substrate by press molding, the glass substrate after forming the optical waveguide is heated to fix the optical component. Since it is necessary to make it possible to press-mold grooves such as those described above, when obtaining a substrate for mounting optical components by this method, it is possible to obtain a relative refractive index difference between the core portion and the clad portion of the optical waveguide by the above heating. There is a concern that the characteristics of the already formed optical waveguide may deteriorate due to fluctuations and thermal deformation of the glass substrate surface.
In the optical component mounting substrate II of the present invention, such a concern does not occur.

A material having a higher thermal conductivity than that of the optical component fixing member is added to the optical component fixing member constituting the optical component mounting substrate II of the present invention as a heat sink separately from the base material. Thereby, for the same reason as in the optical component mounting substrate I of the present invention described above, it becomes possible to improve the driving stability of the current injection type optical component even when the current injection type optical component is mounted. This makes it possible to improve its reliability. The optical component mounting substrate II of the present invention also includes such a heat sink separately added to the optical component fixing member.

Silicon (S
i), aluminum nitride (AlN), silicon carbide (Si
C), when glassy carbon or the like is used, the thermal conductivity of these substances is higher than that of glass which can be press-molded, and the thermal expansion coefficient of these substances is press-moldable. Since it is smaller than the thermal expansion coefficient of glass, the optical component mounting substrate I and the optical component mounting substrate II according to the present invention have the respective advantages. Of the optical component mounting board). This optical component mounting substrate is particularly suitable for practical use.

The substrate I for mounting an optical component of the present invention described above
The optical component mounting substrate II and the optical component mounting substrate II can be manufactured in the same manner as described above, except that a predetermined base material is used, for example. That is, as a glass molding preliminary body that is a material of the optical component fixing member, a glass molding preliminary body for an optical fiber mounting area and a glass molding preliminary body for an optical component mounting area are used, and the glass molding preliminary body and the glass molding preliminary body A base material to which an optical component fixing member molded by press molding from a glass molding preliminary body is fixed, is placed in a molding die having a cavity having a predetermined shape according to the shape of the target optical component mounting substrate. Then, it can be produced by heating to a temperature at which each of the above glass preforms can be press-formed, that is, a temperature at which the viscosity of the glass becomes about 10 ^8.5 to 10 ^9.5 poise, and press-molding. . At this time, each of the above glass molding preform and the base material,
They are arranged in series in the pressing direction at the time of press molding (however, the above-mentioned glass molding preliminary bodies are parallel to each other).

Of the above-mentioned glass preforms, at least the glass preform for the optical fiber mounting area has a plane located in the pressing direction at the time of press molding or a curved surface convex outward, It is preferable to use one whose ridge has a curved surface or is chamfered and whose shape in plan view approximates the shape of the target optical fiber mounting region in plan view. In the present specification, "a surface located in the pressing direction during press molding" means a mold element (upper mold or lower mold) that moves in the pressing direction during press molding.
Hereinafter referred to as "movable type". ) Means a surface in contact with the molding surface and a surface facing the surface.

On the other hand, the glass molding preliminary body for the optical component mounting area may be a plate-shaped object, but when the target optical component mounting area has a rugged shape, it is used for the optical fiber mounting area. Similar to the glass molding preform, the surface located in the pressing direction during press molding has a flat surface or an outwardly convex curved surface, and the ridge has a curved surface or is chamfered, and in plan view. It is preferable to use a shape whose shape is similar to the shape of the intended optical fiber mounting area in plan view.

By using the above-mentioned glass forming preliminary body having a curved edge or chamfering, even when the glass forming preliminary body is press-formed into a complicated shape, it is possible to form a corner portion of the forming die during press forming The glass filling becomes slower than the other portions, and it becomes possible to easily control the corner portion so that the glass is not completely filled. As a result, it becomes possible to effectively prevent the formation of molding burrs at the corners of the molding die. When mass-producing molded products by press molding, the volume of the glass molding preform used in each press molding is not always constant, and some fluctuations inevitably exist, but the glass is completely in the corners of the mold. By press-molding the molded product so that it is not filled, it is possible to absorb the fluctuation of the volume of each glass molding preparatory body depending on the degree of glass filling into the corner of the molding die. In addition to effectively preventing the formation of molding burrs at the portion, it is possible to suppress fluctuations in the dimensional accuracy and shape accuracy of the molded product due to the volume fluctuation of the glass molding preform.

In addition, by making the shape of the glass molding preliminary body approximate to the shape of the intended area (optical fiber mounting area or optical component mounting area) in plan view, the space between the molding die and the inner side surface is formed. It becomes possible to arrange the glass molding preform in a molding die and press-mold it so that a gap is formed substantially evenly on the glass. It makes it possible to spread it substantially uniformly in the mold.
As a result, it is possible to effectively prevent the occurrence of local molding burrs and insufficient transfer accuracy.

However, in both the glass molding preliminary body for the optical fiber mounting area and the glass molding preliminary body for the optical component mounting area, the thickness is within the target area (optical fiber mounting area or optical component mounting area). Maximum thickness 1.
If it exceeds 4 times, the amount of deformation of the glass molding preform during press molding increases, and as a result, it becomes difficult to spread the glass substantially uniformly in the mold during press molding,
Local molding burrs are likely to occur. Further, if the thickness of the glass preform is less than 1.1 times the maximum thickness of the intended region, the amount of deformation of the glass preform in the pressurizing direction at the time of press molding will be small, and the transferability will deteriorate. easy. Therefore, the thickness of each of the above glass preforms is 1.1 to 1.
It is preferably 4 times, and particularly preferably 1.2 to 1.3 times.

Each of the above-mentioned glass preforms is preferably made of glass having a deformation point of 600 ° C. or lower in order to prevent deterioration of the release film and the mold material during press molding. In addition, as described above, from the viewpoint of obtaining an optical component mounting substrate having high stability of the optical characteristics of the optical component with respect to the environmental temperature change after mounting the optical component, as described above, the coefficient of thermal expansion of the glass molding preliminary body is used. Is preferably 70 × 10 ⁻⁷ / ° C. or less.

It is preferable that the base material placed in the mold together with the glass molding preform has heat resistance that does not substantially deform during press molding. If the base material is deformed during press molding, molding with high transfer accuracy becomes difficult. The material and shape of the base material are appropriately selected depending on whether the target optical component mounting substrate is the optical component mounting substrate I or the optical component mounting substrate II of the present invention.

On the other hand, it is preferable to use, as the above-mentioned molding die, one whose dimensional accuracy and shape accuracy are higher than the desired dimensional accuracy and shape accuracy of the molded product. The mold may be composed of two molds, an upper mold and a lower mold, as long as it has a cavity having a predetermined shape corresponding to the shape of the target molded product. Body type 3
Although it may consist of three parts, from the standpoint of molding a member for fixing optical components with the highest possible dimensional accuracy and shape accuracy, there are three types: an upper mold, a lower mold, and a body mold with an integral structure without moving parts. Those consisting of are preferred. Further, it is preferable to have a stopper for stopping the movement of the movable die at a predetermined position so that the optical component fixing member having a desired thickness is molded.

The molding die is a mold element (in the case where the molding die is composed of an upper die and a lower die, the upper die and the lower die are referred to respectively. In this case, these mold elements are combined so that a predetermined clearance (gap) is formed between these upper mold, lower mold, and body mold. The "mold having a cavity of a predetermined shape" in the description means a mold capable of forming a closed space according to the shape of a target molded product, excluding a clearance portion between mold elements.

The mold material of each mold element is preferably one that has an oxidation resistance that can be used for press molding of glass and is non-reactive with glass, and that does not cause structural change or plastic deformation in a high temperature environment. Specific examples thereof include silicon carbide, silicon nitride, tungsten carbide, alumina, zirconia, crystallized glass, silicon, cermet of titanium carbide and titanium nitride, and the like. Each mold element can be obtained by forming a desired mold material into a predetermined shape, and then coating the surface with a release film of carbon or platinum alloy for release.

However, a mold element having a molding surface for forming the side surface of the optical component fixing member (in the case of a mold composed of two mold elements, an upper mold and a lower mold, either the upper mold or the lower mold) One (usually lower mold), upper mold, lower mold, and body mold 3
In case of a mold consisting of two mold elements,
The average coefficient of thermal expansion at 400 ° C. is 5 × 10 ⁻⁷ / ° C. to 70 × 10 than the average coefficient of thermal expansion of the glass molding preform.
It is preferably made of a mold material that is smaller by ^-7 / ° C.

When the average thermal expansion coefficient at room temperature to 400 ° C. of the mold element having the molding surface for forming the side surface of the optical component fixing member is larger than the average thermal expansion coefficient of the glass preform, or However, if the difference is less than 5 × 10 ⁻⁷ / ° C. even if it is smaller than the average coefficient of thermal expansion of the glass molding preform, it becomes difficult to release the molded product from the mold element. On the other hand, even if the average coefficient of thermal expansion of the mold element at room temperature to 400 ° C. is smaller than the average coefficient of thermal expansion of the glass molding preform, if the difference is larger than 70 × 10 ⁻⁷ / ° C., the glass deformation is caused. In the process of cooling the press-formed product after passing through a high temperature range where it is possible, the press-formed product is pulled on the inner wall surface of the mold element, and as a result, the dimensional accuracy and shape accuracy of the obtained optical component fixing member deteriorate. . As the mold material of the mold element, one having an average coefficient of thermal expansion at room temperature to 400 ° C. smaller than the average coefficient of thermal expansion of the glass preform by 7 × 10 ⁻⁷ / ° C. to 40 × 10 ⁻⁷ / ° C. is used. Particularly preferred.

Further, among the mold elements (upper mold or lower mold, usually the upper mold) having the molding surface for forming the optical fiber mounting region and the optical component mounting region of the optical component fixing member. As for the portion having the molding surface for molding the optical fiber fixing engaging portion (hereinafter referred to as “first molding portion”), the average thermal expansion coefficient at room temperature to 400 ° C. as in other mold elements. Is 5 × 10 ⁻⁷ / ° C. higher than the average thermal expansion coefficient of the glass molding preform for the optical fiber mounting area.
It is preferably composed of a mold material having a size smaller by about 70 × 10 ⁻⁷ / ° C. On the other hand, regarding a portion having a molding surface for molding the mounting surface on which the optical component is mounted (hereinafter referred to as “second molding portion”), particularly when the mounting surface has a concave shape, room temperature to It is made of a mold material having an average coefficient of thermal expansion at 400 ° C. that is 5 × 10 ⁻⁷ / ° C. to 70 × 10 ⁻⁷ / ° C. higher than the average thermal expansion coefficient of the glass molding preform for the optical component mounting area. Is preferred.

When the average coefficient of thermal expansion of the second molding portion at room temperature to 400 ° C. is smaller than the average coefficient of thermal expansion of the glass molding preform for the optical component mounting area, or when the glass molding for the optical component mounting area is performed. Even if it is larger than the average coefficient of thermal expansion of the spare body, the difference is 5 × 10 ⁻⁷ /
When the temperature is lower than 0 ° C, the mold release becomes difficult. On the other hand, even if the average thermal expansion coefficient of the second molding portion at room temperature to 400 ° C. is larger than the average thermal expansion coefficient of the glass molding preform for the optical component mounting area, the difference is 70 × 10 ⁻⁷ / If the temperature is higher than 0 ° C, the press-formed product is pulled by the wall surface of the second molding part in the process of cooling the press-formed product through the high temperature range where the glass can be deformed, and as a result, the obtained optical component is obtained. The dimensional accuracy and shape accuracy of the fixing member deteriorate. As the mold material of the second molding part, the average thermal expansion coefficient at room temperature to 400 ° C. is 7 × 10 ⁻⁷ than the average thermal expansion coefficient of the glass molding preform for the optical component mounting area.
Those having a large value of -40 × 10 ^-7 / ° C. are particularly preferable.

The mold element (upper mold or lower mold) having the first molding part and the second molding part may be obtained by processing a block of mold material, but as described above. When a member having a different average thermal expansion coefficient is to be obtained between the first molding portion and the second molding portion, a member having the first molding portion and a member having the second molding portion are formed. Are obtained by integrating them with an adhesive such as a heat-resistant adhesive, or by mechanically integrating the two members with a fixing member such as a fixing frame, or fixing with an adhesive. It is preferable to obtain it by using a member together and integrating the two members. When the above-mentioned mold element is obtained by mechanically integrating the member in which the first molding portion is formed and the member in which the second molding portion is formed, high dimensional accuracy and shape accuracy It becomes easy to obtain the optical component fixing member having the above by press molding, and the mold element becomes easy to maintain.

Further, when the glass molding preliminary body for the optical fiber mounting area and the glass molding preliminary body for the optical component mounting area are press-molded in a state of being in contact with each other, the optical component fixing member having a desired processing accuracy. Because it will be difficult to get
A partition is preferably provided at the boundary between the first molding part and the second molding part so that the two glass molding preforms are not press-molded in contact with each other. The partition may be a state in which the optical fiber mounting region and the optical component mounting region are separated in the finally obtained optical component fixing member, but a press-molded optical component fixing member is desired. From the point of fixing on the base material, the optical fiber mounting area and the optical component mounting area in the finally obtained optical component fixing member are connected to each other at their lower parts (base material side). It may be. The shape of the partition portion can be appropriately selected.

The optical component mounting substrate I and the optical component mounting substrate II of the present invention are not limited to the above-described method, and after the optical component fixing member alone is obtained by press molding,
It can also be obtained by a method of fixing the above-mentioned optical component fixing member on a desired base material using a resin adhesive such as a thermosetting type, a thermoplastic type, a heat melting type, low melting point glass or metal solder. be able to.

Next, the optical module of the present invention will be described. As described above, the optical module of the present invention includes the optical component mounting substrate (optical component mounting substrate I or optical component mounting substrate II) of the present invention described above, and an optical component mounted on the optical component mounting substrate. And parts.

The optical component mounting substrates constituting the optical module are the optical component mounting substrate I and the optical component mounting substrate II.
Which optical component mounting substrate is used can be appropriately selected according to the type of the optical component mounted on the target optical module and the intended use of the optical module. . Also, the types of optical components that make up the optical module can be appropriately selected according to the intended use of the optical module and the like.

The optical module of the present invention may or may not have an optical fiber as its constituent member. Whether to use the optical fiber as a constituent member can be appropriately selected according to the intended use of the optical module and the like. Further, what kind of optical fiber is used when the optical fiber is used as a constituent member can be appropriately selected according to the intended use of the optical module and the like.

In the optical module of the present invention, the optical component is mounted on the above-mentioned optical component mounting substrate I or optical component mounting substrate II of the present invention. Therefore, the optical component mounting substrate I of the present invention is used. Alternatively, as described in the explanation of the explanation of the optical component mounting substrate II, it can be obtained with high productivity, and the reliability of the optical characteristic stability of the optical component after mounting is not reliable. It is expensive.

[0091]

Embodiments of the present invention will be described below with reference to the drawings. Example 1 (Optical Component Mounting Substrate I) FIG. 1 is a perspective view showing an outline of an example of the optical component mounting substrate I of the present invention. The optical component mounting substrate 1 shown in FIG.
The shape in plan view is a 7 × 4 mm rectangle. In this optical component mounting substrate 1, an optical component fixing member 3 made of a glass press molded product is fixed on a base material 2 made of silicon, and the optical component fixing member 3 is an optical fiber mounting region. 4. It has an optical component mounting area 5 and a mounting reference surface 6 which serves as a reference for a mounting position when mounting an optical component.

In the above-mentioned optical fiber mounting area 4, the length 3
mm, a depth of 170 μm, and two parallel optical fiber fixing engaging portions 4a formed of V grooves having a width of 250 μm at the upper end. The dimensional accuracy (dimensional accuracy in terms of pitch and depth) of these two optical fiber fixing engaging portions 4a is within ± 0.3 μm. The maximum thickness of the optical fiber mounting area 4 is 0.25 mm.

On the other hand, in the above-mentioned optical component mounting region 5, electrode pattern forming recesses 5a, 5b having a horizontal cross section of a rectangle of 3 × 0.1 mm and a depth of 10 μm are provided in parallel with each other. Electrode pattern forming recesses 5a, 5b
Two alignment marks 5c and 5d each having a depth of 10 μm and having a horizontal cross section of a circle having a diameter of 20 μm are provided in front of each of them (on the side of the optical fiber mounting region 4). The electrode pattern forming recesses 5a and 5b and the alignment marks 5c and 5d are used when the current injection type optical component is mounted. The positional accuracy of each optical fiber fixing engagement portion 4a with respect to each alignment mark 5c, 5d is within 2 μm.

In the upper surface of the optical component mounting area 5,
The portions excluding the electrode pattern forming recesses 5a and 5b and the alignment marks 5c and 5d are not only the mounting surface on which the optical component is mounted but also the mounting reference surface 6 of the optical component. The flatness of the mounting reference surface 6 which also serves as a mounting surface is within 1.0 μm, and the degree of position with respect to the center of the vertical section of the optical fiber when the optical fiber is engaged with the optical fiber fixing engaging portion 4a. The accuracy is within 2 μm,
The mounting reference surface 6 functions as a reference surface for defining the vertical mounting position of the optical component when the optical fiber and the optical component are optically connected by passive alignment. The horizontal mounting position of the optical component is defined by the alignment marks 5c and 5d and the alignment mark provided on the optical component to be mounted.

The maximum thickness of the optical component mounting area 5 is 0.185.
Therefore, the height difference between the upper surface of the optical component mounting area 5 (mounting reference surface 6) and the upper surface of the optical fiber mounting area 4 is 65 μm. A groove 7 having a depth of 0.1 mm from the upper surface of the optical component mounting area 5 and a width of 0.1 mm is formed between the optical fiber mounting area 4 and the optical component mounting area 5. The fiber mounting area 4 and the optical component mounting area 5 are connected to each other at the bottom of the groove 7.

The above-described optical component mounting substrate 1 is manufactured by press molding as follows, for example. First,
A glass molding preliminary body for an optical fiber mounting area, a glass molding preliminary body for an optical component mounting area, a base material to which a member for fixing an optical component is fixed, and a molding die for press molding are prepared.

As the glass molding preform for the optical fiber mounting area, for example, SiO ₂ is 13.3 wt%, B _{2 is}
32.2 wt% O ₃ , 44.5 wt% ZnO, Al ₂ O
Glass material containing 5.5 wt% of ₃ and 4.5 wt% of Li ₂ O, and 0.1 wt% of SnO _{2 in} an added amount (glass transition point 477 ° C., yield point 51
Average thermal expansion coefficient 66.5 at 1 ° C and room temperature to 400 ° C
× 10 ⁻⁷ / ° C., thermal conductivity 1.0 W · K ⁻¹ · m ⁻¹ . Visible light transmittance is 90% or more at 2 mm thickness, wavelength 0.7-2.5
The transmittance of near-infrared rays of μm is approximately 60% or more at a thickness of 2 mm. ) Is obtained by hot preforming, and a block having a curved edge and a width of 3.2 mm, a length of 3.2 mm, and a thickness of 0.3 mm is used. The vertical cross-sectional shape of this glass forming preform has a rectangular shape except that the corners are rounded, and the shape in plan view also has a rectangular shape except for the points where the corners are rounded. .

Further, as a glass forming preliminary body for the optical component mounting area, for example, a glass material having the same composition as the above glass material is machined to obtain a width of 3.4 mm and a length of 3.
A plate-shaped material having a thickness of 4 mm and a thickness of 0.25 mm is used. The base material to which the optical component fixing member is fixed has, for example, a width of 4
A silicon plate of mm, length 7 mm, and thickness 2 mm is used.

As shown in FIG. 2, as the molding die 10 for press molding, for example, an upper die 11, a body die 16 and a lower die 18 are used. Each mold element (upper mold 11, body mold 16 and lower mold 18) uses, for example, tungsten carbide (average thermal expansion coefficient at room temperature to 400 ° C .; 55 × 10 ⁻⁷ / ° C.) as a mold material, On the molding surface of each of these mold elements, a platinum alloy-based release film (not shown) having a thickness of 500 angstrom is provided by, for example, a sputtering method. Further, the clearance between the upper die 11 and the body die 16 and the clearance between the body die 16 and the lower die 18 are, for example, 4 μm or less.

As shown in FIGS. 2 and 3 (a) and 3 (b), the upper die 11 constituting the above-mentioned forming die 10 is provided with a V-shaped groove on the lower surface when the upper die 11 is used. A convex first molding portion 12 having a molding surface for forming two mating portions and a convex second molding portion 13 having a molding surface for forming a mounting surface on which an optical component is mounted. Are provided, and the first molding portion and the second molding portion are connected to each other.

The first molding portion 12 is in the shape of a quadrangular prism, and the two V-shaped members to be formed are formed at the lower end portion during use.
Corresponding to the shape of the groove (engaging portion for fixing the optical fiber), the vertical cross-sectional shape in the longitudinal direction is rectangular, and the vertical cross-sectional shape in the lateral direction is isosceles triangle Length 3 mm, height 170 μ
m, two projections 12a having a base width of 250 μm, 250 μm
They are formed in parallel with each other at a pitch of m. The dimensional accuracy of these two convex portions 12a (the dimensional accuracy in terms of pitch and height) is within ± 0.3 μm. First molding part 1
The flatness of the portion of the lower surface of No. 2 excluding the two convex portions 12a is 1.0 μm or less.

On the other hand, the second molding portion 13 also has a quadrangular prism shape, but a glass molding preliminary body for the optical fiber mounting area and a glass molding preliminary body for the optical component mounting area are provided on the first molding portion 12 side. Are provided with plate-shaped partitioning portions 13a for preventing them from being press-molded in a state of being in contact with each other. The partition 13a is formed so that the optical fiber mounting region and the optical component mounting region of the finally obtained optical component fixing member are connected to each other at their lower portions (base material side). Further, on the lower surface when the second molding portion 13 is used, square columnar protrusions 13b and 13c for forming the electrode pattern forming recesses are provided in parallel with each other, and these protrusions 13b and 13c are provided. Both have a length of 3 mm, a width of 0.1 mm, and a height of 10 μm. Front of the convex portions 13b and 13c (on the side of the first molding portion 12)
Is a cylindrical protrusion 13d for forming an alignment mark used when mounting the current injection type optical component,
Two 13e are provided for each of the protrusions 1
3d and 13e also have a diameter of 20 μm and a height of 10 μm.
It is. Of the lower surface when the second molding portion 13 is used, the partition portion 13a, the convex portions 13b, 13c, 13
A portion excluding d and 13e is a flat surface 13f. The flatness of the flat surface 13f is within 1.0 μm.
By 3f, the mounting surface that also serves as the mounting reference surface of the optical component is molded.

A collar portion 14 is formed on the outer periphery of the upper end portion when the first molding portion 12 and the second molding portion 13 are used, and this collar portion 14 is the upper surface of the body mold 16 during press molding. Locked in. Therefore, the above-mentioned collar portion 1
4 functions as a stopper during press molding.

The barrel die 16 forms the side surface of the optical component fixing member by its inner side surface, and is composed of a tubular body having a rectangular frame-like horizontal cross section. The inner size of the barrel die 16 in plan view is 7 × 4 mm. During press molding, the upper mold 11 is inserted from above during use of the barrel mold 16 to a predetermined depth, that is, until the flange portion 14 of the upper mold 11 is locked by the upper surface of the barrel mold 16. It

The lower mold 18 is composed of a plate-like member having a rectangular shape in a plan view, and has a horizontal cross section of 7 × 4 mm in order to fix the base material at the central portion of the upper surface during use.
A recess 19 having a depth of 0.5 mm and having a rectangular shape is provided. The flatness of the bottom surface of the recess 19 is 1.0 μm or less.

In press molding using the above-mentioned molding die 10, first, one end of the base material 20 (see FIG. 2) is fitted into the recess 19 of the lower mold 18, and the base material 20 is fixedly arranged. After placing the barrel mold 16 on the lower mold 18, a glass molding preliminary body 21 for the optical fiber mounting area (see FIG. 2) and a glass molding preliminary body 22 for the optical component mounting area are provided at predetermined positions on the upper surface of the base material 20. (See Figure 2). Next, the glass molding preforms 21 and 22 arranged on the base material 20 as described above.
Are heated in a nitrogen atmosphere together with the barrel mold 16, the lower mold 18, and the base material 20 so that their viscosities are about 10 ^8.5 to 10 ^9.5 poises. Under this condition, the upper mold 11 is The collar portion 14 is inserted into the barrel die 16 with a molding pressure of 50 to 350 kgf / cm ² until it is locked by the upper surface of the barrel die 16, and press-molded for 20 to 500 seconds. After this,
After cooling to room temperature, the molded product (optical component mounting substrate) is taken out from the molding die 10.

The optical component mounting substrate 1 that can be manufactured as described above is suitable for mounting an optical component such as a current injection type optical component that requires electrical wiring and an optical fiber. The optical fiber and the optical component are mounted on the optical component mounting substrate 1 in the following manner, for example.

First, the electrode pattern forming recesses 5a and 5b.
An electrode pattern is formed by loading solder on each of the electrodes. Next, a current injection type optical component having an alignment mark at a predetermined position on the lower surface, for example, an edge emitting semiconductor laser 30 (see FIG. 4) is prepared. In addition, a photodiode 31 (see FIG. 4) is separately prepared. Then, a set of alignment marks 30a provided on the lower surface of the edge-emitting semiconductor laser 30 and an alignment mark 5c provided in the optical component mounting region 5 of the optical component fixing member 3 have wavelengths of 0.7 to 2. The edge emitting semiconductor laser 30 is mounted at a predetermined position in the optical component mounting region 5 using solder, a conductive adhesive, or the like while detecting using near infrared rays of 0.5 μm. Similarly, the photodiode 3
1 set of alignment marks 3 provided on the lower surface of 1
1a and the alignment mark 5d provided in the optical component mounting area 5 of the optical component fixing member 3 have wavelengths of 0.7 to 2.
The photodiode 31 is mounted at a predetermined position in the optical component mounting area 5 using solder, a conductive adhesive, or the like while detecting using near infrared rays of 5 μm.

Thereafter, the single mode optical fiber 32 having an outer diameter of 125 μm is attached to each of the optical fiber fixing engaging portions 4a.
The single mode optical fiber 32 is mounted by engaging (see FIG. 4) and fixing with an adhesive.
At this time, the optical component (the edge-emitting semiconductor laser 30 or the photodiode 3) to be optically connected to one end of the single mode optical fiber 32 (the end on the side of the current injection type optical component).
A predetermined air gap is formed between 1).

By mounting the edge emitting semiconductor laser 30, the photodiode 31, and the single mode optical fiber 32 on the optical component mounting substrate 1 as described above, these can be optically connected by passive alignment. The one in which the edge emitting semiconductor laser 30 and the photodiode 31 are mounted, and the one in which the edge emitting semiconductor laser 30, the photodiode 31 and the single mode optical fiber 32 are mounted correspond to the optical module in the present invention.

The coupling loss between the edge emitting semiconductor laser 30 optically connected as described above and the single mode optical fiber 32 is about 10 dB. In addition, the edge emitting semiconductor laser 30 and the single mode optical fiber 3
The loss due to the deviation of the optical axis from 2 is 0.1d in consideration of the coupling loss due to the difference in the mode fields of the edge emitting semiconductor laser 30 and the single mode optical fiber 32.
It can be estimated as B or less. Therefore, it is possible to make a low-loss connection in which the amount of axis deviation is within ± 1 μm.

Further, the material of the optical component fixing member 3 is multi-component glass, but the material of the substrate 2 to which the optical component fixing member 3 is fixed has a thermal conductivity of 148 W · K ⁻¹ · m ^−. since ¹ silicon, the substrate 2 acts as a heat sink, heat generated by the actuation of the edge emitting semiconductor laser 30 after mounting is easily dissipated to the outside of the optical component mounting substrate 1. As a result, when the stability of the light output of the edge-emitting semiconductor laser 30 and the reduction of the luminous efficiency are suppressed, respectively, and the edge-emitting semiconductor laser 30 is mounted on the optical component mounting substrate made of only the glass press-molded product. The driving stability of the edge emitting semiconductor laser 30 is improved, and the reliability of the stability of its optical characteristics is improved.

Embodiment 2 (Optical Component Mounting Substrate II) FIG. 5 is a perspective view showing an outline of an example of the optical component mounting substrate II of the present invention. Optical component mounting substrate 40 shown in FIG.
Shows a rectangle of 30 × 5 mm in plan view. In this optical component mounting substrate 40, an adhesive 42 is formed on a substrate 41 made of quartz glass and having a thickness of 2.5 mm.
The optical component fixing member 43 made of a glass press-molded product is fixed by the above, and the thermal expansion coefficient of the base material 41 is smaller than the thermal expansion coefficient of the optical component fixing member 43.

The optical component fixing member 43 has an optical fiber mounting region 44, an optical component mounting region 45, a mounting reference surface 46 serving as a mounting position reference when mounting an optical component, and a submount mounting region 47. And optical fiber mounting area 44
Has a length of 3 mm, a depth of 170 μm, and a top width of 250 μm.
Two parallel optical fiber fixing engaging portions 44a formed of m-shaped V grooves are provided. The dimensional accuracy (dimensional accuracy in terms of pitch and depth) of these two optical fiber fixing engaging portions 44a is within ± 0.3 μm, and the maximum thickness of the optical fiber mounting region 44 is 1.06 mm.

At a predetermined position of the edge portion of the optical component mounting area 45 on the optical fiber mounting area 44 side, a depth of 10 μ having a rectangular horizontal cross section of 0.1 × 0.05 mm is provided.
Alignment marks 45a and 45b, which are concave portions of m, are formed, and alignment marks 45a and 45b having the same shape as the alignment marks 45a and 45b are formed at predetermined locations on the edge of the optical component mounting area 45 on the side of the submount mounting area 47. 45c and 45d are formed. The positional accuracy of each optical fiber fixing engaging portion 44a with respect to each alignment mark 45a, 45b, 45c, 45d is within 2 μm.

On the upper surface of the optical component mounting area 45, the above alignment marks 45a, 45b, 45c, 45d.
The part excluding is not only the mounting surface on which the optical component is mounted, but also the mounting reference surface 46 of the optical component. The flatness of the mounting reference surface 46, which also serves as the mounting surface, is within 1.0 μm, and the degree of position with respect to the center of the vertical cross section of the optical fiber when the optical fiber is engaged with the optical fiber fixing engaging portion 44a. The precision is within 2 μm, and the mounting reference surface 46 functions as a reference surface for defining the vertical mounting position of the optical component when optically connecting the optical fiber and the optical component by passive alignment. The mounting position of the optical component in the horizontal direction is determined by the alignment marks 45a, 45 described above.
b, 45c, 45d and the alignment mark provided on the optical component to be mounted.

The maximum thickness of the optical component mounting area 45 is 0.95.
Therefore, the height difference between the upper surface of the optical component mounting area 45 (mounting reference surface 46) and the upper surface of the optical fiber mounting area 44 is 110 μm. In addition, between the optical fiber mounting area 44 and the optical component mounting area 45, the depth from the upper surface of the optical component mounting area 45 is 0.1 mm and the width is 0.1 mm.
The groove 48 is formed, and the optical fiber mounting area 44 and the optical component mounting area 45 are connected to each other at the bottom of the groove 48.

The submount mounting area 47 is formed in contact with the edge of the optical component mounting area 45 on the side where the alignment marks 45c and 45d are formed. In the submount mounting area 47, the optical component fixing member 4
3 is formed with a submount mounting surface 47a for mounting a submount made of a material having a thermal conductivity higher than 3, and the submount mounting surface 47a is 775 μm lower than the upper surface of the optical component mounting area 45. The formed flatness is within 1.0 μm. Optical components are mounted on the submount as needed, and the submount mounting surface 47a optically connects the optical components mounted on the submount and the optical components mounted on the optical component mounting area 45 by passive alignment. In doing so, it can also serve as a mounting reference surface for defining the vertical mounting position of the optical component mounted on the submount.

The above-described optical component mounting substrate 40, for example, changes the shape of the molding surface of the upper mold to a predetermined shape, and
In consideration of the fact that the base material 41 is not inserted and the shape of the optical component fixing member in plan view is different from that of the first embodiment, a forming die in which the shape of the body die and the lower die is changed is used, and the other embodiment After the optical component fixing member 43 is manufactured by press-molding a predetermined glass molding preform in the same manner as in 1,
It is produced by fixing the optical component fixing member 43 on the base material 41 using an adhesive. At this time, a total of three glass molding spare bodies are used, one for the optical fiber mounting area, one for the optical component mounting area, and one for the submount mounting area.

The optical component mounting substrate 40 which can be manufactured as described above is suitable for mounting an optical fiber, an optical waveguide element and a submount, and the optical component mounting substrate 40 is provided with the optical component mounting substrate 40. Mounting of the fiber, the optical waveguide element and the submount is performed as follows, for example.

First, the alignment marks 50a, 50
An optical waveguide element 51 (see FIG. 5) having b, 50c and 50d is prepared. The optical waveguide element 51 is, for example, an optical waveguide substrate 52 made of quartz glass, and an optical waveguide clad 54 made of silica glass in which an optical waveguide 53 made of silica glass of a predetermined shape is formed inside. .
Each of the alignment marks 50a, 50b, 50c, 50d formed on the optical waveguide element 51 is
Two strip-shaped metal films or dielectrics (of the optical waveguide clad 54 of the optical waveguide clad 54, which are formed in parallel with each other and separated by the width of each alignment mark 45a, 45b, 45c, 45d formed on the optical component fixing member 43. A film having a refractive index different from that of the material).

Further, for example, a submount 57 having a predetermined thickness and made of a silicon plate on which the photodiode 55 and the edge emitting semiconductor laser 56 are mounted (see FIG. 5).
Prepare A strip-shaped alignment mark 58 made of a metal film, which is used for positioning the photodiode 55 and for passive alignment between the photodiode 55 and the optical waveguide element 51, is provided at a predetermined position on the edge of the upper surface of the submount 57. Edge emitting semiconductor laser 5
6 and positioning of the edge emitting semiconductor laser 56
A strip-shaped alignment mark 59 made of a metal film used for passive alignment between the optical waveguide element 51 and the optical waveguide element 51 is formed. The width of the alignment mark 58 is the same as the distance between the two strip-shaped metal films or dielectric films forming the alignment mark 50c formed on the optical waveguide element 51, and the width of the alignment mark 59 is Alignment mark 50 formed on the waveguide element 51
The distance is the same as the distance between the two strip-shaped metal films or dielectric films forming d.

Next, the alignment marks 50a, 50b, 50c, 50d formed on the optical waveguide element 51 and the alignment marks 45a, 45b, 45c, formed on the optical component mounting area 45 of the optical component fixing member 43, are formed. Four
5d is detected using visible light, and the optical waveguide element 51 is mounted at a predetermined position in the optical component mounting region 45 using solder, resin adhesive, or the like. At this time, the alignment mark 45a provided in the optical component mounting area 45 is
In a plan view, it is located between the two metal films or the dielectric film forming the alignment mark 50a formed on the optical waveguide element 51. Other alignment marks 45
The same applies to b, 45c, and 45d.

Next, the alignment marks 50c and 50d formed on the optical waveguide device 51 and the submount 5 are formed.
The alignment marks 58, 59 formed on the sub-mount 57 are detected by using visible light.
Is mounted on the submount mounting region 47 of the optical component fixing member 43 using solder, resin adhesive, or the like. At this time, the alignment mark 5 formed on the submount 57
8 is located on the extension between the two metal films or between the dielectric films forming the alignment mark 50c formed on the optical waveguide device 51, and the alignment mark 59 formed on the submount 57 is It is located on the extension between the two metal films or the dielectric film forming the alignment mark 50d formed on the optical waveguide element 51.

Thereafter, a single mode optical fiber 60 having an outer diameter of 125 μm is attached to each of the optical fiber fixing engaging portions 44a.
The single mode optical fiber 60 is mounted by engaging (see FIG. 5) and fixing with an adhesive.
At this time, a predetermined gap is formed between one end (the end on the optical waveguide element 51 side) of the single mode optical fiber 60 and the optical waveguide element 51 to be optically connected.

As described above, the optical waveguide device 51, the photodiode 55, and the edge emitting semiconductor laser 56.
By mounting the submount 57 and the single-mode optical fiber 60 on which is mounted on the optical component mounting substrate 40, these can be optically connected by passive alignment. Optical waveguide element 51, photodiode 55, and edge emitting semiconductor laser 56
A sub-mount 57 mounted on the optical waveguide element 51 corresponds to an optical module according to the present invention.
The sub-mount 57 on which the photodiode 55 and the edge emitting semiconductor laser 56 are mounted and the one on which the single mode optical fiber 60 is mounted also correspond to the optical module in the present invention.

The loss due to the deviation of the optical axes of the optical waveguide device 51 and the single mode optical fiber 60 optically connected as described above can be estimated to be 0.1 dB or less,
Photodiode 55 and single mode optical fiber 60
It can be estimated that the loss due to the deviation of the optical axis from the edge laser diode is less than 0.1 dB.
The loss due to the deviation of the optical axis between the optical waveguide element 51 and the optical waveguide element 51 can be estimated to be 0.1 dB or less. Therefore, it is possible to make a low-loss connection in which the amount of axis deviation is within ± 1 μm.

Further, the material of the optical component fixing member 43 is multi-component glass, but the material of the base material 41 to which the optical component fixing member 43 is fixed has a thermal expansion coefficient of 5 × 10 ⁻⁷ / ° C.
And the maximum thickness of the optical component mounting region of the optical component fixing member 43 is 1 / thick of the thickness of the base material 41.
Since it is 2 or less, the stability of the optical waveguide characteristics of the optical waveguide element 51 with respect to the environmental temperature change after mounting is higher than that in the case where the optical waveguide element 51 is mounted on the optical component mounting substrate made of only a glass press molded product. And its reliability is improved.
Also, regarding the edge-emitting semiconductor laser 56 mounted on the submount 57, the submount 57 acts as a heat sink, and the heat generated by the driving of the edge-emitting semiconductor laser 56 after mounting is used for optical component mounting. Since the light is easily diffused to the outside of the substrate 40, the edge emitting semiconductor laser 56 which is an edge emitting semiconductor laser 56 which is a current injection type optical component is mounted on the optical component mounting substrate made of only a glass press molded product. Drive stability is improved, and the reliability of the stability of its optical characteristics is improved.

Although the optical component mounting substrate I, the optical component mounting substrate II, and the optical module of the present invention have been described above with reference to the embodiments, as will be apparent from the description of the embodiment of the invention, The present invention is based on the above-mentioned first and second embodiments.
However, the present invention is not limited to this. For example, the shape of the optical component fixing member can be variously changed, such as the shapes shown in FIGS. 6 to 8 according to the intended use of the optical component mounting substrate I or the optical component mounting substrate II.

The optical component mounting substrate 70 shown in FIG. 6 includes an optical fiber (not shown) and a surface emitting semiconductor laser 7.
1 and a mirror unit 7 for guiding the laser light emitted from the surface-emitting type semiconductor laser 71 to an optical fiber.
2 is a substrate for mounting an optical component, which is suitable for mounting the optical components 2 and 2. In this optical component mounting substrate 70, an optical component fixing member 73 made of a glass press-molded product is made of a solid base material 7 having a higher thermal conductivity than the optical component fixing member 73.
It is fixed on the 4th. That is, the optical component mounting board 70 is one of the optical component mounting boards I of the present invention.

The optical component fixing member 73 is mounted on the optical fiber mounting area 75, the optical component mounting area 76 and the mounting reference planes 77a, 7 which serve as a reference for the mounting position when the optical component is mounted.
7b. In the optical fiber mounting area 75, two optical fiber fixing engagement portions 75a, which are V-grooves and are parallel to each other, are provided as in the optical component mounting substrate 1 of the first embodiment. On the other hand, in the optical component mounting region 76, the electrode pattern forming recess 76 for the surface emitting semiconductor laser 71 is formed.
a, two alignment marks 76b for the surface emitting semiconductor laser 71 and two alignment marks 76c for the mirror unit 72 are provided respectively, and the mounting reference surface 77a is the mounting surface of the surface emitting semiconductor laser 71. The mounting reference surface 77b also serves as the mounting surface of the mirror unit 72. The alignment marks 76b and 76c are each formed of a recess.

Between the optical fiber mounting area 75 and the optical component mounting area 76, the optical component mounting substrate 1 of the first embodiment is provided.
A groove 78 is formed similarly to the above, and the optical fiber mounting area 75 and the optical component mounting area 76 are connected to each other at the bottom of the groove 78.

The surface emitting semiconductor laser 71, the mirror unit 72 and the optical fiber are mounted on the optical component mounting substrate 70 by, for example, forming an electrode pattern using the electrode pattern forming recess 76a, or a surface emitting semiconductor. Laser 7
Surface emission using the alignment mark 71a provided on the lower surface of No. 1, the alignment mark 76b provided in the optical component mounting area 76 of the optical component fixing member 73, and near infrared rays having a wavelength of 0.7 to 2.5 μm. Type semiconductor laser 71 mounting, alignment mark 72a provided on the lower surface of mirror unit 72, and optical component mounting area 7 of optical component fixing member 73
6 in the same order as the mounting of the mirror unit 72 and the mounting of the optical fiber by using the alignment mark 76c provided in 6 and the near infrared ray having a wavelength of 0.7 to 2.5 μm. You can A surface-emitting type semiconductor laser 71 and a mirror unit 72 mounted,
In addition, the surface emitting semiconductor laser 71, the mirror unit 72, and the optical fiber mounted correspond to the optical module in the present invention.

The optical component mounting substrate 70 is made of a base material 74.
Since the thermal conductivity of the surface emitting semiconductor is higher than that of the optical component fixing member 73, the surface emitting semiconductor after mounting the surface emitting semiconductor laser 71 is similar to the optical component mounting substrate 1 of the first embodiment. The driving stability of the laser 71 is high, and the reliability of the stability of its optical characteristics is also high.

The optical component mounting substrate 80 shown in FIG. 7 is an optical component mounting substrate suitable for mounting an optical fiber (not shown) and a thin plate filter 81. In this optical component mounting substrate 80, the optical component fixing member 82 made of a glass press-molded product is the optical component fixing member 82.
It is fixed on a base material 83 made of a solid having a smaller thermal expansion coefficient. That is, this optical component mounting substrate 80 is one of the optical component mounting substrates II of the present invention.

The above-mentioned optical component fixing member 82 has a mounting reference surface 86 which serves as a reference for the horizontal mounting position when the optical fiber mounting region 84, the optical component mounting region 85 and the thin plate filter 81 are mounted. There is. Optical fiber mounting area 84
In the same manner as the optical component mounting substrate 1 of the first embodiment, two parallel optical fiber fixing engaging portions 84a formed of V grooves are provided.
Is provided. On the other hand, the optical component mounting area 85 is provided with a groove 85a into which one end of the thin plate filter 81 is inserted and an alignment mark 85b formed of a linear recess. The longitudinal direction of the groove 85a is orthogonal to the longitudinal direction of the optical fiber fixing engaging portion 84a. The bottom surface of the groove 85a is a mounting surface 85c for the thin plate filter 81.
And the inner side surface thereof serves as the mounting reference surface 86.

Between the optical fiber mounting area 84 and the optical component mounting area 85, the optical component mounting substrate 1 of the first embodiment is provided.
The groove 87 is formed similarly to the above, and the optical fiber mounting area 84 and the optical component mounting area 85 are connected to each other at the bottom of the groove 87.

Thin Plate Filter 8 for Optical Component Mounting Substrate 80
1 and the optical fiber are mounted by, for example, a thin plate filter 8
No. 1 linear alignment mark 81 provided on the filter surface
a, the alignment mark 85b provided in the optical component mounting area 85 of the optical component fixing member 82, and the mounting of the thin plate filter 81 using the visible light, and the mounting of the optical fiber in the same order as in the first embodiment. Can be done. The optical module of the present invention includes the thin plate filter 81 mounted and the thin plate filter 81 and the optical fiber mounted.

The optical component mounting board 80 described above has a maximum thickness of 0.25 mm in the optical component mounting area 85 and has a base material 8
Since the thickness of 3 is 3 mm, the stability of the optical characteristics of the thin plate filter 81 against the environmental temperature change after mounting the thin plate filter 81 is high, like the optical component mounting substrate 40 of the second embodiment. Its reliability is high.

The optical component mounting substrate 90 shown in FIG. 8 is an optical component mounting substrate for mounting an optical fiber (not shown) and a wave plate 91. This optical component mounting substrate 90
Then, the optical component fixing member 9 made of a glass press molded product
2 is fixed on a base material 93 made of solid whose thermal expansion coefficient is smaller than that of the optical component fixing member 92. That is, the optical component mounting board 90 is one of the optical component mounting boards II of the present invention.

The optical component fixing member 92 has the optical fiber mounting region 94, the optical component mounting region 95 and the wave plate 91.
Mounting reference plane 96 that serves as a reference for the mounting position when mounting the
a and 96b. The optical fiber mounting area 94 is provided with two parallel optical fiber fixing engaging portions 94a formed of V grooves as in the optical component mounting substrate 1 of the first embodiment. On the other hand, in the optical component mounting area 95, an alignment mark 95 including a flat portion 95a, a shield-like portion 95b located at a side edge portion of the flat portion 95a, and a groove is formed.
c is formed. The upper surface of the flat portion 95a is a horizontal surface, and this horizontal surface is the mounting reference surface 96a. The mounting reference surface 96a also serves as the mounting surface of the wave plate 91. Further, the inner side surface of the shield portion 95b is a vertical surface, and this vertical surface is the mounting reference surface 96b. The mounting reference surface 96b also serves as the mounting surface of the wave plate 91. The mounting reference surface 96a is for defining the vertical position of the wave plate 91, and the mounting reference surface 96b is for defining the horizontal position of the wave plate 91.

The optical component mounting substrate 1 of the first embodiment is provided between the optical fiber mounting area 94 and the optical component mounting area 95.
A groove 97 is formed similarly to the above, and the optical fiber mounting area 94 and the optical component mounting area 95 are connected to each other at the bottom of the groove 97.

The mounting of the wave plate 91 and the optical fiber on the optical component mounting substrate 90 is performed, for example, by the ridge 91a on the upper surface and the alignment mark 95c formed on the shield 95b when the wave plate 91 is used. The mounting of the wave plate 91 using visible light and the mounting of the optical fiber can be performed in the same order as in the first embodiment. The optical module of the present invention includes the one having the wave plate 91 mounted thereon and the one having the wave plate 91 and the optical fiber mounted thereon.

In the optical component mounting substrate 90, the thickness of the portion where the mounting reference surface 96a is provided in the optical component mounting area 95 is 0.2 mm, and the thickness of the base material 93 is 2 mm. Similarly to the optical component mounting substrate 40 of the second embodiment, the stability of the optical characteristics of the wave plate 91 with respect to the environmental temperature change after mounting the wave plate 91 is high and its reliability is high.

[0145]

As described above, according to the present invention,
While it becomes possible to easily provide a highly reliable optical component mounting substrate for the stability of the optical characteristics of the optical component after mounting the optical component under high productivity,
It becomes possible to easily provide an optical module having high reliability regarding the stability of optical characteristics of mounted optical components with high productivity.

[Brief description of drawings]

FIG. 1 is a perspective view showing an outline of an optical component mounting substrate I obtained in Example 1. FIG.

FIG. 2 is an exploded perspective view showing an outline of a molding die used in Example 1.

3 (a) is a side view showing an outline of an upper mold constituting the molding die used in Example 1, and FIG. 2 (b) is a molding die used in Example 1. FIG. It is a front view which shows the outline of the upper mold which is doing.

FIG. 4 is a perspective view showing an outline of an optical component mounting board I obtained in Example 1, and an outline of an optical fiber and an optical component mounted on the optical component mounting board I.

5 is a perspective view showing an outline of an optical component mounting substrate II obtained in Example 2, and an outline of an optical fiber and an optical component mounted on the optical component mounting substrate II. FIG.

FIG. 6 is a perspective view showing an outline of an example of an optical component mounting substrate I of the present invention and an optical component mounted on the optical component mounting substrate I.

FIG. 7 is a perspective view showing an outline of an example of an optical component mounting board II of the present invention and an optical component mounted on the optical component mounting board I.

FIG. 8 is a perspective view schematically showing another example of the optical component mounting board II of the present invention and an optical component mounted on the optical component mounting board I.

[Explanation of symbols]

1, 70 ... Optical component mounting substrate (optical component mounting substrate I),
2, 20, 74 ... Base material, 3, 73 ... Optical component fixing member, 4, 75 ... Optical fiber mounting area, 5, 76 ... Optical component mounting area, 5a, 5b, 76a ... Electrode pattern forming concave portion, 5c , 5d, 76b, 76c ... Alignment mark, 6, 77a, 77b ... Mounting reference surface that also serves as the mounting surface of the optical component, 10 ... Mold, 11 ... Upper mold, 1
6 ... Body type, 18 ... Lower type, 30 ... Edge emitting semiconductor laser, 31 ... Photodiode, 32 ... Optical fiber, 40, 80, 90 ... Optical component mounting substrate (optical component mounting substrate II), 41, 83, 93 ... Base material, 43, 8
2, 92 ... Optical component fixing member, 44, 84, 94 ... Optical fiber mounting area, 45, 85, 95 ... Optical component mounting area, 45a, 45b, 45c, 45d, 85b, 95
c ... Alignment mark, 46, 86, 96a, 96
b ... Mounting reference surface that also serves as the mounting surface of the optical component, 47 ... Submount mounting area, 47a ... Submount mounting surface,
51 ... Optical waveguide element, 55 ... Photodiode, 5
6 ... Edge emitting semiconductor laser, 57 ... Submount, 60 ... Optical fiber, 71 ... Surface emitting semiconductor laser, 72 ... Mirror unit, 81 ... Thin plate filter,
85c ... Mounting surface of thin plate filter, 86 ... Mounting reference surface of thin plate filter, 91 ... Wave plate.

Claims (10)

[Claims] 1. An optical fiber mounting area in which an optical fiber fixing engaging portion is formed, an optical component mounting area in which a mounting surface on which an optical component is mounted is formed, and a mounting position when mounting an optical component. An optical component fixing member made of a glass press-molded product having a mounting reference surface as a reference, and a solid base material having a higher thermal conductivity than the optical component fixing member, and the above-mentioned base material A substrate for mounting an optical component, wherein an optical component fixing member is fixed. 2. The optical component mounting board according to claim 1, wherein a mounting surface for mounting a current injection type optical component is formed in an optical component mounting region of the optical component fixing member. 3. An optical fiber mounting area in which an optical fiber fixing engagement portion is formed, an optical component mounting area in which a mounting surface on which an optical component is mounted is formed, and a mounting position when mounting an optical component. An optical component fixing member made of a glass press-molded product having a reference mounting reference surface, and a solid base material having a thermal expansion coefficient smaller than that of the optical component fixing member, and the thickness of the base material. Is thicker than the maximum thickness of the optical component mounting region of the optical component fixing member, and the optical component fixing member is fixed on the base material. 4. A mounting surface for mounting an optical waveguide device is formed in an optical component mounting region of an optical component fixing member.
The optical component mounting substrate according to claim 3. 5. The optical component mounting substrate according to claim 3, wherein the maximum thickness of the optical component mounting region of the optical component fixing member is ½ or less of the thickness of the base material. 6. The optical component according to claim 1, wherein the optical component fixing member has an alignment mark used for positioning the optical component when mounting the optical component. Mounting board. 7. The optical component mounting substrate according to claim 1, wherein the optical component fixing member has an electrode pattern forming recess. 8. A member for fixing an optical component has a coefficient of thermal expansion of 70 ×
Claims 1 to 7 consisting of glass at 10 ^-7 / ° C or less.
The optical component mounting substrate according to any one of 1. 9. The substrate according to claim 1, wherein the base material is made of a solid having a higher heat resistance than the optical component fixing member.
The optical component mounting substrate according to item. 10. An optical module comprising the optical component mounting board according to claim 1 and an optical component mounted on the optical component mounting board.