JPH09280756A - Multi-temperature control system and reaction processor to which same is applied - Google Patents

Abstract

PROBLEM TO BE SOLVED: To precisely control the temperature of individual parts and decrease the amount of working fluid to be used in a small multi-temperature control system for controlling the temperature of a plurality of process chambers of a reaction processor by circulating the working fluid. SOLUTION: A semiconductor processor is provided with a plurality of process chambers 2a, 2b and 2c. The respective process chambers have a plurality of parts 7a, 7b and 7c whose temperature is to be controlled. Temperature control mechanisms 15a, 15b and 15c exclusively assigned to the respective parts 7a, 7b and 7c are provided in the vicinity of the respective parts 7a, 7b and 7c of the process chambers 2a, 2b and 2c. The respective temperature control mechanisms 15a, 15b and 15c independently supply working fluid to the parts 7a, 7b and 7c to which they are respectively assigned and individually control the temperature of the working fluid. Cooling water for cooling the working fluid is supplied to all the temperature control mechanisms 15a, 15b and 15c from a common cooling water source 30.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-temperature control system for controlling the temperature of a plurality of places by circulating a working fluid. The temperature control system of the present invention is suitable for use in controlling the temperature of various parts in a plurality of process chambers (reaction processing chambers) in a semiconductor processing apparatus,
Not only the semiconductor processing apparatus but also various other reaction processing apparatuses can be applied.

[0002]

2. Description of the Related Art A conventional semiconductor processing apparatus is constructed, for example, as shown in FIG. That is, a plurality of process chambers 2a, 2b, 2c are arranged around the transfer chamber 1. A transfer robot (not shown) provided in the transfer chamber 1 transfers a wafer to be processed (not shown) from one process chamber to another process chamber via the transfer chamber 1.
In each of the process chambers 2a, 2b, 2c, a reaction process unique to each is performed on the wafer.

FIG. 2 shows the construction of one process chamber. The process chamber comprises a chamber wall 3, a chamber cover 4 that functions as an anode, and a wafer support 6 that functions as a cathode. Chamber wall 3, chamber cover 4
Each of the wafer support bases 6 has pipelines 7a, 7b, 7c through which a working fluid for temperature control flows. Then, the temperature of each of the chamber wall 3, the chamber cover 4, and the wafer support table 6 is controlled to a target temperature T1, T2, T3 peculiar to each by the fluid flowing in each of the pipelines 7a, 7b, 7c.

As shown in FIG. 1, the temperature control system applied to this semiconductor processing apparatus includes three temperature controllers 8a,
8b and 8c, and the target temperatures T1, T2 and T3 are set in the temperature controllers 8a, 8b and 8c, respectively. Each of the temperature controllers 8a, 8b, 8c supplies a temperature-controlled working fluid to all the process chambers 2a, 2b, 2c in the semiconductor processing apparatus. For example, the first temperature controller 8
a is the circulation flow paths 9a, 9b, 9a, 9b, 9 for the chamber walls 3 of all the process chambers 2a, 2b, 2c.
A working fluid is supplied through a and 9b. Similarly, the second temperature controller 8b is used for all process chambers 2a, 2b, 2c.
The chamber cover 4 of the third temperature controller 8
c supplies the working fluid to the wafer supports 6 of all the process chambers 2a, 2b and 2c.

Each temperature controller is, for example, as shown in FIG.
A heat exchanger 11 for cooling the working fluid, a heating device 13 for heating, and a pump 14 for circulating the working fluid, the temperature of which is controlled by these, through the circulation flow paths 9a and 9b are provided. The heat exchanger 11 cools the working fluid with the cooling water flowing through the cooling water pipe 10. The heating device 13 is the tank 1
The working fluid is stored in 3a, and the working fluid is heated by the electric heater 12 in the tank 13a.

[0006]

As described above, in the conventional temperature control system for a semiconductor processing apparatus, one temperature controller is commonly provided for a plurality of process chambers, and one temperature controller is provided. A temperature controller centrally controls the temperature of a specific portion of the process chambers.

Therefore, as a general rule, it is impossible to make the target temperature of the common temperature controlled portion different for each process chamber. Conversely, it is also difficult to control the temperature of those parts of all process chambers exactly and exactly. This is because the shape and operating state of the chamber and the length and pressure loss of each circulation flow path are slightly different for each chamber, so that the temperature of the working fluid is slightly different for each chamber.

In order to realize the above, a method of controlling the flow velocity of the working fluid for each chamber is conceivable. However, this makes the structure considerably complicated and
Flow rate control interference between chambers will also occur,
After all, accurate temperature control is difficult.

Further, in the conventional system, since the centralized control is performed, the location of the temperature controller is inevitably a location distant from the semiconductor processing apparatus as shown in FIG. As a result, the circulation flow path becomes long and the amount of working fluid used increases. Although it is desirable to use an inert liquid such as Garten (registered trademark) or Fluorinert (registered trademark) as the working fluid, they are not suitable for large-scale use because they are considerably expensive. Therefore, in conventional systems, inexpensive liquids such as ethylene glycol and water are used unless there are special circumstances. However, since these inexpensive liquids generate ions that cause corrosion due to the influence of plasma in the process chamber, it is necessary to separately provide a deionization device. This deionizer is quite large and costly.

In the conventional system, since the circulation passage of the fluid is long, the heat loss in the circulation passage is large. Therefore, the heat capacity of each temperature controller must be large to some extent. Due to this and the circumstances such as the above-mentioned arrangement location, the temperature control system becomes quite large.

Therefore, an object of the present invention is to provide a multi-temperature control system for controlling the temperature of a plurality of places by circulating the working fluid, whereby the temperature of each place can be accurately controlled, and the size is small and the working fluid consumption is small. It's about providing what you do.

[0012]

A multi-temperature control system according to the present invention controls the temperature at a plurality of locations by circulating a working fluid, and comprises a plurality of temperature controllers each localized at each location. . And, the temperature controller at each location has a dedicated working fluid circulation channel at each location,
The temperature of the working fluid in this dedicated circulation channel is individually controlled.

According to this system, at each location where the temperature is to be controlled, a temperature controller for circulating a working fluid dedicated to that location is localized. Inevitably, the working fluid circulation path will be short, and the amount of working fluid used will be small. Therefore, it is possible to use a high-performance working fluid such as Garten and Fluorinert, which is expensive but does not require a deionization device.

Further, since each temperature controller individually controls the working fluid dedicated to each place, and the circulation passage of the working fluid is short, the heat loss is small, and the temperature control response is fast.
Accurate temperature control is possible.

Further, each temperature controller requires only a small thermal capacity and a small amount of power for circulation,
Since the power consumption can be reduced, it can be made small. Further, since the small temperature controllers are distributed in a plurality of places, the individual circulation flow paths are short, and it is easy to eliminate the need for a deionization device, the overall size of the system can be easily reduced. it can.

Where the temperature control device uses a cooling liquid to cool the working fluid, the plurality of temperature control devices may share the same source of cooling liquid. By doing so, the configuration of the cooling liquid system becomes simple.

A preferred configuration example of the temperature controller includes an inner container having an inner space for flowing a working fluid, a heater arranged in the inner space, and cooling water outside the inner container surrounding the inner container. And an outer container forming an outer space for flowing the liquid. Such a temperature controller is relatively small in size because it can both heat and cool the working fluid inside a single container. More preferably, an infrared lamp is used for the heater. If an infrared lamp is used, a large amount of heating can be obtained even if it is small, so that it is easier to make the temperature controller smaller. The small size of the temperature controllers is convenient for localizing each temperature controller at each location.

The system of the present invention can be applied to a reaction processing apparatus having a plurality of process chambers, such as a semiconductor processing apparatus. In that case, a temperature controller dedicated to the process chamber is arranged in the vicinity of each process chamber. When one process chamber has a plurality of parts to be temperature controlled, it is desirable to arrange a plurality of temperature controllers dedicated to the plurality of parts in the vicinity of the one process chamber. In that case, it is more desirable that each temperature controller dedicated to each part is arranged at a position close to each part.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 4 shows the overall structure of a multi-temperature control system according to an embodiment of the present invention applied to a semiconductor processing apparatus. Here, since the semiconductor processing device itself has substantially the same configuration as that of the conventional semiconductor device shown in FIGS. 1 and 2, the same elements as those of the conventional device are designated by the same reference numerals, and a duplicate description will be given. Is omitted.

As shown in FIG. 4, for each of the process chambers 2a, 2b, 2c of the semiconductor processing apparatus, 3
Small-sized temperature controllers 15a, 15b, 15c are provided. That is, three temperature controllers 15a, 15b, 15c are provided for the first process chamber 2a, and three temperature controllers 15a, 15b, 15c are also provided for the second process chamber 2b. , The third process chamber 2c also includes three temperature controllers 15a, 15b,
15c is provided.

Each temperature controller 15a, 15b, 15c is
It has its own circulation flow path (not shown in FIG. 4) that is independent of the other temperature controllers to independently supply working fluid such as Fluorinert to each process chamber 2a, 2b, 2c. Each temperature controller 15a, 15b, 15c
The working fluid is supplied only to the process chamber in which it is provided, and not supplied to the other process chambers. And
Three temperature controllers 15a provided in one chamber,
Of the 15b and 15c, the first unit 15a is the conduit 7a of the chamber wall 3 shown in FIG. 2, the second unit 15b is the conduit 7b of the chamber cover 4, and the third unit is the pipe of the wafer support table 6. A working fluid is supplied to each of the passages 7c. In short, one for each temperature control target part in the semiconductor processing equipment.
The temperature controller of each unit is exclusively assigned.

These temperature controllers 15a, 15b, 15
c is attached to, for example, the outer wall surface of the process chamber, but is not necessarily the outer wall surface, and in short, provided that the circulation flow path is sufficiently short as close to the process chamber as possible. Good. From the same point of view, it is preferable that the individual temperature controllers 15a, 15b, 15c are arranged at locations where they can be connected as close as possible to the pipe lines 7a, 7b, 7c of the portions assigned to them.

These nine temperature controllers 15a, 15b,
15c is provided through the individual cooling liquid circulation flow paths 10, 10.
It is connected to a common cooling liquid source 30. For example, water is used as the cooling liquid, but other substances may of course be used.

All temperature controllers 15a, 15b, 15c
Have substantially the same configuration. As shown in FIG. 5, each temperature controller has a heating / cooling device 16 for the working fluid, and a pump 14 for circulating the working fluid through the circulation flow paths 9a, 9b. The heating / cooling device 16 includes a cooling unit 16a that cools the working fluid with cooling water and a heating unit 1 that heats the working fluid.
6b. When ethylene glycol or water is used as the working fluid, the deionization device 17 is connected between the supply pipe 9a and the return pipe 9b in the circulation channel. However, the deionization device 17 is not necessary when used as a working fluid of a non-active substance such as Fluorinert.

FIG. 6 and FIG. 7 show a concrete configuration example of the heating / cooling device 16 shown in FIG. 6 is a vertical cross-sectional view of the heating / cooling device, and FIG. 7 is a horizontal cross-sectional view taken along the line AA of FIG.

As shown in these figures, the heating / cooling device has two large and small cylindrical containers 20, 22 arranged coaxially.
Having. The inner container 20 has a space 21 inside and has both closed end surfaces. The outer container 22 also has both closed end faces, and surrounds the inner container 20 to surround the inner container 2
There is a space 23 outside 0. The inner container 20 has an inlet 20a for the working fluid at a position near one end of its peripheral wall, and operates at a position near the other end of the peripheral wall and symmetrical to the inlet 20a with respect to the central axis. Fluid outlet 20b
Having. The outer container 22 has an inlet 22a for the cooling liquid at a position near one end of its peripheral wall, and at a position near the other end of the peripheral wall and symmetrical to the inlet 22a with respect to the central axis. , With a coolant outlet 22b.

The inner container 20 is made of a material having good thermal conductivity, corrosion resistance, and moldability, such as aluminum, copper, or stainless steel. The outer container 22 may be made of a similar material, or may be made of another material having good corrosion resistance and moldability but not high thermal conductivity, such as plastic, vinyl chloride, and ceramics. The joint between the inner container 20 and the outer container 22 is sealed by welding, brazing, or any other suitable method so as not to leak liquid.

In the inner space 21 of the inner container 20, a transparent cylinder 24 is arranged along the central axis, and the transparent cylinder 24 penetrates the walls 26, 26 at both ends of the inner container 20. A heating lamp 25 is inserted into the transparent tube 24. The transparent tube 24 is made of a heat-resistant material having a very high light transmittance, such as quartz glass. The heating lamp 25 preferably emits a large amount of infrared light. For example, a halogen lamp for a heater is used. The lamp 25 is supported by a bush 29 at a central axis position in the transparent tube 24 so as not to contact the transparent tube 24.

The walls 26, 26 at both ends of the inner container 20 are made of a material having appropriate elasticity and sufficient heat resistance such as hard rubber, plastic or metal. End wall 2
A seal ring 27 such as an O-ring is fitted to the outer peripheral surface and the inner peripheral surface of the end walls 26 and 26, respectively, in order to seal the gap between the inner wall 20 and the transparent cylinder 24. There is.

A large number of inner fins 28a extending parallel to the central axis of the container 20 are fixed to the inner peripheral surface of the inner container 20, and a large number of outer fins extending parallel to the central axis also on the outer peripheral surface. The fin 28b is fixed. Inner fin 28a
Is in the radial direction of the inner space 21, that is, the ramp 25
Stands straight in the direction of infrared radiation from. Outer fins 28b likewise stand radially upright in the radial direction, but need not be. The inner fins 28a and the outer fins 28b are arranged in a distributed manner over substantially the entire region of the inner space 21 and the outer space 23, and have a substantially uniform density (that is, a substantially uniform density) over the entire region. Are arranged at intervals). These fins 28a, 28b are made of a material having high thermal conductivity, good corrosion resistance and good formability, such as aluminum, copper, and stainless steel. Further, it is desirable that the material has a good infrared absorptance.

There is a slight gap between the tip of the inner fin 28a and the outer peripheral surface of the transparent cylinder 24. There is also a slight gap between the tip of the outer fin 28b and the inner peripheral surface of the outer container 22.

In the thus constructed heating / cooling device, the working fluid flows into the inner space 21 from the inlet 20a, passes through the inner space 21 and flows out from the outlet 20b. Further, the cooling liquid flows into the outer space 23 from the inlet 22a, passes through the outer space 23, and flows out from the outlet 22b.

The temperature of the working fluid at the inlet 20a (for example, 2
When the target temperature is higher than 5 ° C (for example, 100 ° C), the lamp 25 is turned on. In this case, the flow of cooling liquid is in principle stopped. The infrared rays emitted from the lamp 25 pass through the transparent tube 24 and enter the inner space 21. if,
If the working fluid is a substance having a very low light absorption property (for example, Fluorinert), most of the infrared rays are absorbed by the fins 28a, and the radiant heat generated there is transferred from the fins 28a to the fluid to heat the working fluid. It If the working fluid is a substance having an appropriate light absorption property (for example, water, ethylene glycol, etc.), the infrared rays are directly absorbed not only by the fin 28a but also by the working fluid itself, and the temperature of the fluid rises due to the radiant heat. To do.

The control of the heating amount is performed by adjusting the duty ratio of the lighting time of the lamp 25 and the light emission amount by a temperature sensor and a controller (neither shown) arranged at the outlet 20b. For example, the electric power supplied to the lamp 25 is feedback-controlled so that the outlet temperature matches the target temperature. If the fluid outlet temperature exceeds the target temperature due to overheating or external causes, the lamp 2
5 is turned off. Further, when it is not enough to turn off the lamp, the cooling liquid is flown.

Further, the inlet temperature of the working fluid (for example, 80
When the target temperature is lower than (.degree. C.) (for example, 30.degree. C.), the cooling liquid is flown and the lamp 25 is normally turned off. The heat contained in the working fluid is transferred to the cooling liquid through the inner fin 28a, the inner container 20 and the outer fin 28b, and the fluid is cooled. The controller described above adjusts the flow rate of the cooling liquid to match the outlet temperature of the fluid with the target temperature.
When the outlet temperature of the fluid falls below the target temperature due to supercooling, the lamp 25 is turned on or the flow rate of the cooling liquid is reduced.

In this way, the controller controls the lighting of the lamp 25 and the flow rate of the cooling liquid, and controls the temperature of the working fluid to the target temperature by selectively using the heating and the cooling or using them in combination.

As can be seen from the above description, heating is mainly performed by radiant heat of infrared rays. Radiant heat is, due to its original nature, irrespective of the distance from the lamp 25, the inner space 2
It is evenly distributed to the light absorbing material anywhere in 1. In addition, since the fins 28a stand in the inner space 21 in the direction of the infrared rays emitted from the lamp 25, the infrared rays are not blocked by the fins 28a and the inner space 21 is not blocked.
Can be equally incident on all places. As a result, if the fluid is a substance that absorbs light moderately, such as water, the fluid will receive radiant heat substantially uniformly in all locations within the inner space 21 and will rise in temperature uniformly. If the fluid is a substance that hardly absorbs light like Fluorinert,
Since the large number of fins 28a existing in the entire region of the inner space 21 at a substantially uniform density receive the radiant heat evenly at all the places and transfer it to the fluid, the fluid is also in a nearly uniform manner. Be heated.

As described above, most of the output of the lamp 25 is
Since radiant heat is supplied almost evenly to the entire working fluid in the inner space 21, heat does not concentrate in a specific local area. In addition, since there is a space between the lamp 25 and the transparent tube 24, only the fluid passing through the transparent tube 24 and its vicinity does not reach a high temperature due to heat conduction. From these facts, it is possible to considerably increase the amount of heat output from the lamp 25, and as a result, it is possible to exert a large heating capacity even if the size is small.

Further, since there is a gap between the outer fin 28b and the outer container 22, radiant heat in the inner container 20 does not escape directly from the outer fin 28b to the outer container 22 during heating. This is preferable from the viewpoint of heating efficiency. From the same viewpoint, it is also preferable that the outer container 22 is made of a material having poor thermal conductivity such as ceramics or plastic. However, if there is no particular problem in heating efficiency, even if the outer fins 28b and the outer container 22 are in contact with each other, or the outer container 22 is made of a material having high thermal conductivity (for example, the same material as the inner container 20). It doesn't matter.

Cooling is performed by utilizing heat conduction through the fins 28a and 28b. Since the fins 28a, 28b are dispersed and arranged at a substantially uniform density over the entire area of the inner and outer spaces 21, 23, the cooling efficiency is good and the temperature unevenness due to the use of heat conduction is small. It is preferable from the viewpoint of cooling efficiency that there is a gap between the outer fin 28b and the outer container 22, because the outer fin 28b is less likely to be affected by the outside air temperature.

When the heating / cooling device 16 is assembled, the transparent tube 24 is inserted into the inner space 21. Also,
Even during maintenance, the transparent tube 24 is pulled out from the inner space 21 or inserted again. In this insertion / drawing operation, the clearance between the transparent tube 24 and the inner fin 28a serves as a clearance, which allows this operation to be performed smoothly. Of course, if there is no hindrance to the work, the inner fin 28a
And the transparent tube 24 may be in contact with each other.

As can be seen from the above description, the heating / cooling device 16 can exhibit a large heating / cooling capacity for its size. Therefore, the size can be made quite small. Further, since the working fluid can be uniformly brought to the target temperature without temperature unevenness, the temperature control accuracy is high. As a result, each temperature controller 15a, 15b, 1
5c is also quite small, and its temperature control accuracy is high. Such small temperature controllers 15a, 15b, 15
c is the individual process chamber 2 as shown in FIG.
It is easy to individually attach a, 2b, and 2c.

Various variations other than those described above can be adopted as the specific configuration of the heating / cooling device 16. For example, as the fins 28a and 28b, in addition to the above-mentioned fins, various well-known fins such as one in which a large number of elongated pins are provided upright and one in which a thin plate is bent in a wave shape can be adopted. However, fins that block infrared rays, such as fins formed by bending a thin plate into a corrugated shape, should be used only when using a working fluid with extremely low light absorption, such as Fluorinert. When a working fluid having a certain degree of absorption is used, a fin that allows infrared rays to reach the entire inner space 21 without blocking the infrared rays much like the fins and the fins in which pins are provided upright as shown in FIGS. Should be adopted. Further, if there is no problem even if the heating efficiency is somewhat low, an electric heater can be used instead of the heating lamp.

FIG. 8 shows the temperature controllers 15a, 15b, 1
One mode in which 5c is attached to each process chamber 2a, 2b, 2c is shown.

As shown, each temperature controller 15a, 15
b, 15c are fixed to the outer surface of the side wall of the process chamber, and the circulation flow paths 9a, 9b for the fluid exiting from the respective temperature controllers 15a, 15b, 15c are guided into the side wall of the process chamber and are shown in FIG. To the conduits 7a, 7b, 7c.

Further, each temperature controller 15a, 15b, 15
A cooling liquid circulation flow passage 10 exits from c, and the cooling liquid circulation flow passage 10 for each temperature controller is integrated into a pair of cooling liquid circulation flow passages 10 for each chamber as shown in FIG. And then connected to the common cooling liquid source 30. In addition, the cooling liquid circulation passage 10 for each temperature controller is directly connected to the common cooling liquid source 30.
May be connected. Alternatively, for example, in the process chamber 2a, the three temperature controllers 15a, 15b, 15
When the target temperatures of c are different, the cooling water from the cooling liquid source 30 is first passed through the temperature controller having the lowest target temperature, and then the cooling water passing through this is controlled by the temperature controller having the intermediate target temperature. Then, the cooling water passing therethrough is fed to the temperature controller having the highest target temperature and returned to the cooling water source, and the cooling liquid circulation 10 of the temperature controllers 15a, 15b, 15c is connected in series. Then, a method of circulating the cooling liquid in order is also possible.

In this way, the cooling liquid is supplied to a plurality of temperature controllers 15
Even if it is shared by a, 15b, and 15c, unless the flow rate of the cooling liquid is too slow, the temperature fluctuation of the cooling liquid is small, and
Even if the temperature of the cooling liquid fluctuates to some extent, the temperature of the working fluid can be accurately controlled because the controller optimally controls the temperature controllers 15a, 15b, 15c accordingly.

The location of the temperature controllers 15a, 15b, 15c is not limited to the side wall of the process chamber, and the fluid circulation flow path is sufficiently short whether it is under the bottom wall, the ceiling wall or a nearby floor. It may be any suitable place near the chamber.

Further, in the above-described embodiment, the temperature of all parts of all process chambers is controlled by the circulation of the working fluid, but it is not always necessary to do so, and it is not necessary to use another part of the working fluid. It is also possible to carry out temperature control according to the principle. For example, when there is a chamber or part controlled to a high temperature such as 100 ° C. or higher, an infrared lamp is provided in the chamber or part instead of the temperature controller, and the chamber or part is directly heated by the infrared lamp. You may do it.

The above description of the embodiments is for understanding the present invention, and is not intended to limit the scope of the present invention to only those embodiments. The present invention can be embodied in various other forms in which changes, corrections, improvements, and the like are added to the above-described embodiments without departing from the gist thereof.

[Brief description of drawings]

FIG. 1 is a plan view showing a semiconductor processing apparatus using a conventional temperature control system.

FIG. 2 is a sectional view showing a schematic configuration of a process chamber.

FIG. 3 is a circuit diagram of a conventional temperature controller.

FIG. 4 is a plan view showing a semiconductor processing apparatus using a temperature control system according to an embodiment of the present invention.

FIG. 5 is a circuit diagram of a temperature controller used in the same embodiment.

6 is a longitudinal sectional view of a heating / cooling device used in the temperature control device of FIG.

7 is a cross-sectional view taken along the line AA of FIG.

FIG. 8 is a perspective view showing an attachment mode of the temperature controller in the same embodiment.

[Explanation of symbols]

 1 Transfer Chamber 2a, 2b, 2c Process Chamber 3 Chamber Wall 4 Chamber Cover 5 Wafer 6 Wafer Support 7a, 7b, 7c Pipeline 9a, 9b Fluid Circulation Channel 10 Coolant Circulation Channel 15a, 15b, 15c Temperature Controller 16 Heating / Cooling device 20 Inner container 21 Inner space 22 Outer container 25 Heating lamp 24 Transparent tube 28a Inner fin 28b Outer fin

Claims (10)

[Claims] 1. A multi-temperature control system for controlling the temperature of a plurality of places by circulating a working fluid, comprising a plurality of temperature controllers localized at each place, each temperature controller being dedicated to each place. A multi-temperature control system having a working fluid circulation passage and individually controlling the temperature of the working fluid in the dedicated circulation passage. 2. The system according to claim 1, further comprising a common cooling liquid source shared by the plurality of temperature controllers. 3. The system according to claim 1, wherein each temperature controller has an inner container having an inner space for flowing a working fluid, a heater arranged in the inner space, and surrounding the inner container. And an outer container that forms an outer space for flowing cooling water outside the inner container. 4. The multi-temperature control system according to claim 3, wherein the heater is a lamp that emits infrared rays. 5. The multi-temperature control system according to claim 1, wherein the plurality of locations are a plurality of process chambers included in a reaction processing apparatus. 6. The multi-temperature control system of claim 1, wherein the plurality of locations are portions of individual process chambers of a reaction processor. 7. The multi-temperature control system according to claim 5, wherein each temperature controller is arranged in the vicinity of each process chamber. 8. The multi-temperature control system of claim 6, wherein each temperature controller is located proximate each of a plurality of portions of an individual process chamber. 9. A reaction treatment apparatus comprising a plurality of process chambers, each process chamber having at least one part to be temperature controlled, comprising a plurality of temperature controllers each localized in each process chamber. A multi-temperature control system characterized in that each temperature controller has a dedicated working fluid circulation passage in each process chamber and individually controls the temperature of the working fluid in the dedicated circulation passage. Is applied to the reaction processing device. 10. A reaction treatment apparatus comprising at least one process chamber, each process chamber having a plurality of parts to be temperature controlled, comprising a plurality of temperature controllers each localized in each process chamber. , Each temperature controller has a dedicated working fluid circulation passage in each part of each process chamber, and individually controls the temperature of the working fluid in this dedicated circulation passage. A reaction processing device to which a temperature control system is applied.