JPH09275127A - Substrate treatment equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively use a clean room by vertically laminating a treatment area in which substrate processing parts are arranged and a carriage area wherein a substrate carrying means carries the substrate, and reducing the installation sectional area of equipment. SOLUTION: An equipment 1 has a three floors structure. An accommodation area is arranged on the first floor part, a carriage area 12 is arranged on the second floor part, a processing area 13 is arranged on the third floor, and the carriage area 12 and the processing area 13 are vertically laminated. The carriage area 12 is made an area which is used for carrying a substrate carrying equipment 10 to a board W in the equipment 1, and an aperture 14 through which the substrate carrying equipment 10 carries the substrate W between the carriage area 12 and the processing area 13 is formed in a ceiling part. The processing area 13 is made an area which is used for arranging substrate processing parts such as a thermal treatment part 3, a spin coater 4, a spin developer 5, an edge exposure part 6. Thereby the sectional area of the equipment can be reduced, and a clean room can be effectively used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for performing a predetermined substrate processing on a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, a photomask, a substrate for an optical disk, and more particularly, The present invention relates to a substrate processing apparatus including a substrate processing unit and a substrate transfer unit that transfers a substrate in the apparatus and carries the substrate in and out of the substrate processing unit.

[0002]

2. Description of the Related Art An example of this type of substrate processing apparatus is an apparatus for performing a series of substrate processing in a photography process such as a photoresist coating process, various baking processes, and a developing process.

An apparatus of this type is disclosed in, for example, Japanese Unexamined Patent Publication No. 5-90387.
As shown in the publication, conventionally, a substrate processing unit (a heat treatment unit, a spin coater, a spin developer, etc.) is arranged in a plane so that the substrate processing unit and the substrate transfer path sandwich a substrate transfer path of a substrate transfer apparatus. Has been done.

[0004]

However, the prior art having such a structure has the following problems. That is, in the conventional general substrate processing apparatus, since the substrate processing unit and the substrate transfer path are arranged in a plane, the installation area of the entire substrate processing apparatus is the horizontal area of the substrate processing section and the horizontal direction of the substrate transfer path. This is the sum of the area in the direction and the installation area of the device increases. Since this type of substrate processing apparatus is installed in a clean room where the running cost is high, there is a problem in that a substrate processing apparatus having a large installation area occupies a large area in the clean room and cannot effectively use the clean room. In particular, in a substrate processing apparatus such as a semiconductor wafer which is becoming larger, the horizontal area of the substrate processing section and the horizontal area of the substrate transfer path are increased according to the size of the substrate, and the installation area of the apparatus is further increased. The problem of not being able to effectively use the clean room is becoming more serious.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing apparatus capable of effectively utilizing a clean room by reducing the installation area of the apparatus.

[0006]

The present invention has the following configuration in order to achieve the above object. That is, the invention according to claim 1 is a substrate processing apparatus comprising: a substrate processing section; and a substrate transfer means for transferring a substrate in the apparatus and for carrying the substrate in and out of the substrate processing section. It is characterized in that a processing area for arranging the substrate processing section and a transfer area for transferring the substrate by the substrate transfer means are vertically stacked.

According to a second aspect of the invention, in the substrate processing apparatus according to the first aspect, the transfer area is arranged below the processing area.

According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect, the substrate transfer means transfers the substrate between the transfer area and the processing area. It is characterized in that the substrate is erected in a vertical direction when being transported.

[0009]

The operation of the first aspect of the invention is as follows. That is, the substrate transport means transports the substrate in the transport area, transports the substrate to the processing area stacked above or below the transport area, and loads the substrate into the substrate processing section. Further, when the substrate processing in the substrate processing unit is completed, the substrate transfer means carries out the substrate from the substrate processing unit, transfers the substrate to a transfer area which is stacked below or above the processing area, and transfers the substrate. The substrate is transported in the area. In this way, the substrate carrying means carries the substrate within the apparatus in the carrying area, and the substrate processing is carried out in the substrate processing section arranged in the processing area stacked above or below the carrying area.

According to the second aspect of the present invention, it becomes possible to reduce the contamination of the substrate in the apparatus. That is, particles (dust) are generated from the drive mechanism that drives the substrate transfer means due to friction of the members. Since the drive mechanism is provided in the transfer area, if the transfer area is above the processing area, particles from the drive mechanism will fall and adhere to the substrate in the processing area to contaminate the substrate. On the other hand, when the transport area is below the processing area, even if particles from the drive mechanism fall, the particles do not flow into the processing area, and substrate contamination due to the particles is reduced.

According to the third aspect of the present invention, the substrate transfer means vertically stands the substrate when transferring the substrate from the transfer area to the processing area or from the processing area to the transfer area. .

[0012]

Embodiments of the present invention will be described below with reference to the drawings.

<First Embodiment> FIG. 1 is a vertical sectional view of a substrate processing apparatus according to a first embodiment of the present invention.
FIG. 2 is a plan view of the processing area of the apparatus. In addition,
In order to clarify the positional relationship between the drawings, XYZ Cartesian coordinates indicating the same direction are attached to the drawings in FIG. 1 and the subsequent drawings.

In the first embodiment, a heat treatment section 3 for bake processing, a spin coater 4 for photoresist coating, a spin developer 5 for development processing, and an edge exposure section for exposing the peripheral portion of the substrate W. 6, a substrate transfer table 9, a substrate transfer device 10 as a substrate transfer means, and the like. Further, in the present device 1, the loading / unloading section 2
Also, an interface (IF) unit 8 for transferring the substrate W between the exposure unit 7 for exposure processing and the present apparatus 1, which is installed near the present apparatus 1, is also provided.

The device 1 has a three-story structure,
Storage area 11 on the first floor and transport area 1 on the second floor
A processing area 13 is provided on the second and third floors, and the transfer area 12 and the processing area 13 are stacked vertically (in this embodiment, the transfer area 12 is on the lower side).

The storage area 11 is for storing various chemicals such as a photoresist solution, a developing solution and a rinse solution, a chemical temperature control mechanism for maintaining the chemicals at a predetermined temperature, a spin coater 4 and a spin developer 5 for each chemical. It is an area for accommodating a chemical liquid supply mechanism for supplying to the above, a controller for controlling the entire apparatus 1, and the like.

The transfer area 12 is an area for the substrate transfer apparatus 10 to transfer the substrate W in the apparatus 1.

The processing area 13 is an area for disposing the substrate processing section such as the heat treatment section 3, the spin coater 4, the spin developer 5, the edge exposure section 6, and the like.

Further, in the ceiling portion (floor surface of the processing area 13) of the transfer area 12, an opening for transferring the substrate W between the transfer area 12 and the processing area 13 by the substrate transfer apparatus 10 (see FIG. 2). (A hatched portion) 14 is provided.

Next, the structure of each part will be described. The loading / unloading section 2 is configured to include a carrier mounting table 21 on which the carrier C is mounted. As shown in FIG. 5A, the carrier C is configured so that a plurality of substrates W can be stacked and stored in a storage shelf CT. The substrate transfer device 10 takes out and stores the substrate W from the carrier C, as described later. The carrier mounting table 21 is provided on the same third floor as the processing area 13.

The heat treatment unit 3 includes a heat treatment unit 31 having a hot plate HP for heating the substrate W to a predetermined temperature, and a cool plate CP for cooling the substrate W heated by the heat treatment unit 31 to a predetermined temperature near room temperature. And a cooling processing unit 32 having a multi-layer structure. Further, the hot plate HP and the cool plate CP (hereinafter, when these plates are collectively referred to as “heat plate”),
A plurality of substrate support pins 33 (FIG. 6) for transferring the substrate W between the substrate transfer device 10 and the heat plate.
(See (a)) is provided so as to be able to move up and down through the heat plate. Further, the heating processing unit 31 and the cooling processing unit 32 are provided with a loading / unloading port 34 for loading / unloading the substrate W supported by the arm 100 of the substrate transfer apparatus 10, and loading / unloading the substrate W into / from the loading / unloading port 34. There is also a shutter (not shown) that opens and closes only when the shutter is opened.

The spin coater 4 holds the substrate W in a horizontal posture and rotates it about a vertical axis by a spin chuck 41.
Also, a scattering prevention cup 42, which is disposed around the spin chuck 41 and prevents the photoresist liquid or rinse liquid (used for edge rinse or back rinse) during the photoresist coating process from scattering to the surroundings, The substrate W held by the chuck 41 is provided with a nozzle 43 or the like for ejecting a photoresist liquid, and a thin film of photoresist is applied to the surface of the substrate W by a so-called spin coating method. In addition, the spin chuck 41 and the scattering prevention cup 4
2 is configured to be capable of moving up and down relative to each other, and as will be described later, when the substrate W is carried in and out of the spin coater 4 (spin chuck 41), the spin chuck 41 moves to the scattering prevention cup 42. The cup 4 is located above the anti-scattering cup during the photoresist coating process.
The spin chuck 41 and the anti-scattering cup 42 are driven to move up and down relative to each other so that 2 is arranged around the spin chuck 41. Furthermore, spin coater 4
Is surrounded by a cover (not shown), and an air flow whose greenhouse degree is adjusted flows down into the cover. Further, the arm 100 of the substrate transfer apparatus 10 is provided on one side surface of the cover.
A loading / unloading port 44 for loading / unloading the substrate W supported by the substrate W is provided, and the loading / unloading port 44 is also provided with an openable / closable shutter (not shown) that opens only when loading / unloading the substrate W.

The spin developer 5 is a spin chuck 5 that holds the substrate W in a horizontal posture and rotates it about a vertical axis.
1 or the spin chuck 51, which is disposed around the spin chuck 51 and prevents the developing solution during development processing, pure water (used for washing with water after development), etc. from scattering to the surroundings. The substrate W held is provided with nozzles 53 for ejecting a developing solution and the like. Further, the spin chuck 51 and the scattering prevention cup 52 are configured to be able to move up and down relatively for the same purpose as the spin coater 4. Furthermore, the side surface of the spin developer 5 is covered with a cover (not shown), and an airflow is allowed to flow inside the cover. In addition, the substrate transfer device 1 is provided on one side surface of the cover.
A loading / unloading port 54 for loading / unloading the substrate W supported by the zero arm 100 is provided. Further, in this embodiment, the spin developers 5 are vertically stacked in two stages.

The edge exposure unit 6 holds the substrate W in a horizontal posture and rotates it about a vertical axis, and a spin chuck 61,
A sensor 52 that detects the position information of the outer peripheral edge of the substrate W held by the spin chuck 61, and a light source that exposes the peripheral edge of the substrate W while shifting in the radial direction of the substrate W based on the position information detected by the sensor 52. It is equipped with 63 and the like. It should be noted that when the substrate W is carried in and out of the edge exposure unit 6 (spin chuck 61) by the substrate transfer device 10, the sensor 62 is used.
The light source 63 is retracted to the standby position outside the outer periphery of the substrate W. The periphery of the edge exposure unit 6 is covered with a cover (not shown), and a loading / unloading port 64 for loading / unloading the substrate W supported by the arm 100 of the substrate transporting device 10 is provided on one side surface of the cover. Has been.
Furthermore, in this embodiment, two edge exposure units 6 are stacked and arranged.

The IF unit 8 has a substrate transfer device 81.
The substrate transfer device 81 transfers an unexposed substrate W from the device 1 (substrate transfer table 9) to the exposure unit 7 (substrate loading table 71) and also exposes the exposed substrate W to the exposure unit 7 From (substrate unloading table 72) to this device 1
It is configured to be transferred to the (substrate transfer table 9). Although only one substrate transfer device 81 is shown in the drawing, a plurality of substrate transfer devices 81 are provided, and the plurality of substrate transfer devices 81 work in cooperation with the present device 1.
The substrate W may be transferred between the exposure unit 7 and the exposure unit 7. Further, in order to prevent the transfer operation of the substrate W by the substrate transfer apparatus 81 from being delayed due to a difference between the processing time of the apparatus 1 and the processing time of the exposure unit 7, a buffer for temporarily storing the transfer substrate W. The unit may be provided in the IF unit 8.

In the substrate transfer device 81, an arm 82 for mounting and supporting the substrate W is supported so as to be able to move in and out of an arm support base 83, the arm support base 82 is rotatable (swirl) around a vertical axis, and is raised and lowered. (Movable in the Z-axis direction) and movable in the X-axis direction. It should be noted that the withdrawal of the arm 82 and the movement of the arm support base 83 in the Z-axis and X-axis directions are each configured by a well-known uniaxial movement mechanism such as a screw shaft. In addition, the arm 82 is located outside the outer peripheral edge of the substrate W supported by the pin 82a and the pin 82a that partially supports the lower surface of the substrate W to move the substrate W horizontally. A regulating member 82b for regulating is provided to prevent the substrate W from falling off during the transfer operation of the substrate W.

A plurality of pins 91 for partially placing and supporting the lower surface of the substrate W are fixedly erected on the substrate transfer table 9 provided on the same third floor as the processing area 13. The substrate transfer device 81 sends out the arm 82, inserts it slightly below the pre-exposure substrate W placed and supported on the pin 91 of the substrate transfer table 9, raises the arm support table 83 by a predetermined amount, and then from the pin 91. After transferring the substrate W to the arm 82, the arm 82 is retracted. Then, the arm support base 83 is appropriately rotated and moved in the X-axis and Z-axis directions, and the arm 82 is placed in front of the substrate loading base 71 of the exposure unit 7.
Position. In the substrate loading table 71 and the substrate unloading table 72, a plurality of pins 73 for partially mounting and supporting the lower surface of the substrate W are fixedly provided. The substrate transfer device 81 is an arm 8
2, the pre-exposure substrate W conveyed from the substrate transfer table 9 is positioned slightly above the pins 73 of the substrate loading table 71, and the arm support table 83 is lowered by a predetermined amount.
After the substrate W is transferred from the arm 82 to the pin 73, the arm 82 is retracted. As a result, the device 1
The pre-exposure substrate W is transferred from the exposure unit 7 to the exposure unit 7.

The pre-exposure substrate W placed on the substrate carry-in table 71 is taken out by a substrate transfer device (not shown) in the exposure unit 7 and a reduction projection exposure machine () provided in the exposure unit 7 ( It is conveyed to an exposure device such as a stepper) and subjected to exposure processing. The substrate W after exposure is placed on the substrate unloading table 72 by the substrate transfer device in the exposure unit 7.

The substrate transfer device 81 includes a substrate unloading table 72.
The exposed substrate W is taken out from the substrate transfer table 9
The operation is the same as the operation of transferring from the substrate transfer table 9 to the substrate loading table 71. Note that one substrate transfer table 9 in the figure is for mounting the substrate W before exposure, and the other substrate transfer table 9 is for mounting the substrate W after exposure. Then, the placement of the pre-exposure substrate W on the one substrate transfer table 9 and the removal of the post-exposure substrate W from the other substrate transfer table 9 are performed by the substrate transfer device 10 as described later. .

Next, the structure of the substrate transfer device 10 will be described with reference to FIGS. FIG. 3 is a perspective view showing a schematic configuration of the entire substrate transfer apparatus of the first embodiment, and FIG. 4 is a plan view and a front view showing a configuration of an arm portion thereof.

The substrate transfer device 10 according to the first embodiment
Is attached to an X-axis direction moving mechanism 102 such as a screw shaft on a Y-axis direction moving mechanism 101 such as a screw shaft.
A pedestal 103 is attached to the X-axis direction moving mechanism 102, and the pedestal 103 and the following members supported by the pedestal 103 are appropriately movable in the X-axis and Y-axis directions. The pedestal 103 has a lift mechanism 1 such as a pantograph.
04 is provided, and the swing drive unit 1 is provided above the lifting mechanism 104.
An arm support 106 is provided so as to be rotatable by 05. The arm support 106 has two arms 100.
Are individually supported by the arm support 106 so as to be able to move in and out. Each arm 100 is formed in a horseshoe shape, and a pin 1 that supports the lower surface of the substrate W by partially making point contact with it.
00a and a regulating member 100b that is located outside the outer peripheral edge of the substrate W supported by the pins 100a and that regulates the horizontal movement of the substrate W. To prevent.

The substrate transfer apparatus 10 transfers the substrate W in the apparatus 1, transfers the substrate W into and out of the substrate processing units 3 to 6, takes out and stores the substrate W from the carrier C, and transfers the substrate W to the substrate transfer table 9. Place and remove W.

The transfer of the substrate W in the apparatus 1 is performed in the processing area 1
In the transfer area 12 below 3, the substrate W is supported in a horizontal posture and moved in the X-axis and Y-axis directions. At this time, the elevating mechanism 104 lowers the arm support 106 to the lowest position (state of FIG. 1).

The substrate W for each of the substrate processing units 3 to 6 is also provided.
For loading / unloading of the substrate W, loading / unloading of the substrate W to / from the carrier C, and loading / unloading of the substrate W to / from the substrate delivery table 9, the pedestal 103 is positioned below the appropriate opening 14, and the lift mechanism 104 is used to move the arm support 106 and the like. Is raised and the arm 100 is moved back and forth. Operations such as loading and unloading of the substrate W will be described below.

First, the operation of taking out and storing the substrate W with respect to the carrier C will be described with reference to FIG.

The substrate transfer device 10 moves in the Y-axis direction and is positioned below the opening 14 on the carrier mounting table 21 side, and moves in the X-axis direction to correspond to the front surface of the carrier C to be taken out and stored. Move to. And the arm support 10
6 is moved up to position the arm 100 in front of the storage shelf CT to be taken out and stored in the carrier C, and the arm support base 106 is rotated to direct the arm 100 toward and away from the carrier C. Make it The heat treatment unit 3
Has an empty space formed below the cooling processing unit 32,
When the substrates W are taken out and stored in the carriers C at both ends, the arm support 106 is raised into the empty space.

When the substrate W is taken out from the carrier C,
The arm 100 is sent out and the arm 100 is inserted slightly below the substrate W to be taken out (FIG. 5B), and the arm support 106 is raised by a predetermined amount to transfer the substrate W from the storage shelf CT to the arm 100. This is performed by retracting the arm 100. When the substrate W is stored in the carrier C, the arm 100 is sent out, and the substrate W supported by the arm 100 is inserted slightly above the storage shelf CT to be stored.
This is performed by lowering the arm support 106 by a predetermined amount, transferring the substrate W from the arm 100 to the storage shelf CT, and retracting the arm 100.

Next, the loading / unloading operation of the substrate W with respect to the thermal processing section 3 (heating processing section 31, cooling processing section 32) will be described with reference to FIG.
This will be described with reference to (a) and the like.

Similar to the operation of taking out / storing the substrate W from / to the carrier C, the substrate transfer apparatus 10 moves in the X-axis and Y-axis directions to carry in / out the heating processing section 31 and the cooling processing section 32 which are objects to be carried in / out. Under the opening 14 facing 34, the heating processing section 31 and the cooling processing section 32 are moved to a position corresponding to the front surface of the loading / unloading port 34. And the arm support 1
06 is moved up to position the arm 100 in front of the loading / unloading target heat processing unit 31 and the loading / unloading port 34 of the cooling processing unit 32, and the arm support 106 is swung to heat the moving direction of the arm 100. Processing unit 31, cooling processing unit 3
Turn to side 2. The operation up to this point is the same as the loading / unloading of the substrate W to / from the other substrate processing units 4 to 6 and the loading / unloading of the substrate W to / from the substrate transfer table 9, which will be omitted in the following description of the operation. To do.

When the substrate W is carried in with the height and the moving direction of the arm 100 matched,
And the substrate W supported by the arm 100 is inserted above the heat plate (FIG. 6A), and in this state, the substrate support pin 33 penetrates the heat plate to support the substrate W supported by the arm 100. Ascend to the bottom. Then, the substrate support pin 33 rises above the arm 100 as it is, or the arm 100 descends by a predetermined amount with the upper end of the substrate support pin 3 stopped slightly below the arm 100, so that the substrate support pin 33 moves from the arm 100. Substrate W to 33
And the arm 100 retreats,
The substrate W is carried into the thermal plate by the substrate support pins 33 descending and retracting into the thermal plate to support the substrate W on the upper surface of the thermal plate. The heat treatment (heat treatment or cooling treatment) on the substrate W is performed while the substrate W is supported on the upper surface of the heat plate.

When the substrate W is unloaded, the substrate support pins 33 are lifted from the inside of the heat plate and the substrate W supported by the heat plate is transferred to the substrate support pins 33 and lifted above the heat plate. Let Next, the substrate transfer apparatus 10 sends out the arm 100 and inserts it slightly below the substrate W supported by the substrate support pins 33. And the substrate support pin 3
3 is lowered or the arm 100 is raised to transfer the substrate W from the substrate support pin 33 to the arm 100. The arm 100 is retracted and the substrate support pin 33 is lowered, so that the substrate W is Unloaded from the heat plate.

Next, the spin coater 4, the spin developer 5, the edge exposure section 6 (each spin chuck 41, 5).
Loading / unloading operation of the substrate W with respect to 1, 61) FIG.
This will be described with reference to (b) and the like.

The substrate transfer apparatus 10 matches the height and the withdrawal direction of the arm 100, while the spin coater 4 and the spin developer 5 have spin chucks 41, 51.
And the anti-scattering cups 42 and 52 are relatively moved up and down to position the spin chucks 41 and 51 above the anti-scattering cups 42 and 52, and in the edge exposure unit 6, the sensor 62 and the light source 63 are retracted.

In the above-mentioned state, the substrate transfer device 10 has the arm 1
00, and the substrate W supported by the arm 100 is positioned above the spin chucks 41, 51, 61 (see FIG.
(B)), the arm 100 is lowered by a predetermined amount, and the arm 10
The substrate W is transferred from 0 to the spin chucks 41, 51 and 61, and the arm 100 is retracted to carry the substrate W into the spin chucks 42, 51 and 61. Further, the substrate W is unloaded from the spin chucks 42, 51, 61 by sending out the arm 100 and inserting the arm 100 slightly below the substrate W supported by the spin chucks 41, 51, 61 to move the arm 100 by a predetermined amount. Substrate W raised from spin chucks 41, 51, 61 to arm 100
Is performed and the arm 100 is retracted.

Placement of the substrate W on the substrate transfer table 9.
Similar to the placement and removal of the substrate W with respect to the substrate delivery table 9, the substrate loading platform 71, and the substrate unloading platform 72 by the substrate delivery device 81 described above, the substrate W supporting the arm 100 is pinned on the substrate delivery platform 9. The substrate W is placed on the substrate transfer table 9 by descending from above 91 and transferring the arm 100 to the pin 91, and also raising the arm 100 from below the substrate W supported by the pin 91. Then, the substrate W is taken out from the substrate transfer table 9 (FIG. 6C).

The device 1 is installed in a clean room. In this clean room, there is an airflow from the ceiling to the floor. The device 1 takes in the downflow airflow in the clean room from the ceiling part of the device 1 and causes the airflow to flow down into the device 1 (from the processing area 13 to the transfer area 12 to the storage area 11) and is generated in the device 1. Particles (for example, particles generated from driving portions such as the X-axis and Y-axis direction driving mechanisms 101 and 102 of the substrate transfer device 10) flow down below the device 1. In addition, depending on the device 1, a fan and a filter (a filter for removing particles, a filter for removing chemical components such as alkali components as necessary) are provided in the ceiling part of the device 1 from the ceiling part of the device 1. In some cases, the air is taken in by a fan, the air taken in by the filter is cleaned, and the cleaned air is made to flow down into the device 1. The photoresist coating process is preferably performed in an atmosphere of a predetermined temperature and humidity. Therefore, as described above, the periphery of the spin coater 4 is covered with a cover, and the downflow air flow in the device 1 is reduced. Separately, an air flow whose temperature and humidity are adjusted is made to flow downward from above the cover to specially manage the temperature and humidity atmosphere in the cover including the spin coater 4.

In the apparatus 1, the substrate W is sequentially subjected to the substrate processing in the predetermined processing order, and the substrate transfer apparatus 10 is operated.
Is the carrier C and each substrate processing unit 3 according to the processing procedure.
˜6, the substrate W is transferred between the substrate transfer pedestals 9 (inside the apparatus 1), the substrate W is taken out / stored in / from the carrier C, and the substrate W is loaded / unloaded to / from each substrate processing unit 3 to 6.
The substrate W is placed on and taken out from the substrate transfer table 9.

As an example of this processing procedure, for example, heating processing in the heating processing section 31, cooling processing in the cooling processing section 32, photoresist coating processing in the spin coater 34,
The heat treatment in the heat treatment unit 31, the cooling treatment in the cooling treatment unit 32, the peripheral edge exposure treatment in the edge exposure unit 6, the exposure treatment in the exposure unit 7, the heat treatment in the heat treatment unit 31, the cooling treatment unit Cooling process at 32, development process at the spin developer 5, heating process at the heat processing unit 31, cooling process unit 3
There is a processing procedure called cooling processing in 2.

When the substrate W is processed according to the above-mentioned processing procedure, the substrate transfer apparatus 10 uses the carrier C for one substrate W.
Removal of the substrate W from the substrate, transfer of the substrate W, heat treatment unit 3
1, the substrate W is carried in (heat treatment in the heat treatment section 31), the substrate W is carried out from the heat treatment section 31, the substrate W is conveyed, the substrate W is carried in the cooling treatment section 31, (cooling treatment section). Three
Cooling process in step 1), unloading the substrate W from the cooling process unit 31, transporting the substrate W, loading the substrate W into the spin coater 4, (photoresist coating process in the spin coater 4), from the spin coater 4 Unloading the substrate W, transporting the substrate W, loading the substrate W into the heat treatment unit 31, (heat treatment in the heat treatment unit 31), unloading the substrate W from the heat treatment unit 31, transporting the substrate W, cooling treatment Carrying in the substrate W to the unit 31,
(Cooling process in the cooling processing unit 31), unloading of the substrate W from the cooling processing unit 31, transport of the substrate W, loading of the substrate W into the edge exposure unit 6, (exposure processing of the peripheral portion in the edge exposure unit 6) ), Unloading the substrate W from the edge exposure unit 6, transporting the substrate W, placing the substrate W on the substrate transfer table 9, (passing the substrate W to the exposure unit 7 in the substrate transfer device 81,
Exposure processing in the exposure unit 7, transfer of the substrate W to the substrate transfer table 9 in the substrate transfer device 81), removal of the substrate W from the substrate transfer table 9, transfer of the substrate W, substrate W to the heat processing unit 31 Carry-in, (heat treatment in heat treatment section 31), carry-out of substrate W from heat treatment section 31, substrate W
Transfer of the substrate W to the cooling processing unit 31, (cooling process in the cooling processing unit 31), transfer of the substrate W from the cooling processing unit 31, transfer of the substrate W, substrate W to the spin developer 5.
Loading (development processing by the spin developer 5), unloading the substrate W from the spin developer 5, transporting the substrate W,
The substrate W is loaded into the heat treatment unit 31, (heat treatment in the heat treatment unit 31), the substrate W is unloaded from the heat treatment unit 31, the substrate W is transported, the substrate W is loaded into the cooling treatment unit 31, ( The cooling processing in the cooling processing unit 31), the unloading of the substrate W from the cooling processing unit 31, the transportation of the substrate W, and the storage of the substrate W in the carrier C are performed.

It should be noted that a plurality of substrates W are loaded into the apparatus 1, and the respective processes in the substrate processing units 3 to 6 and the exposure unit 7 are simultaneously performed on the plurality of substrates W in parallel. Cage,
The substrate transfer apparatus 10 includes the substrate processing units 3 for the respective substrates W.
It operates in the device 1 so as to efficiently carry in and out to and from.

Further, the substrate transfer apparatus 10 continuously takes out the substrate W from the carrier C, carries in the substrate W to the heat processing section 31 adjacent to the carrier mounting table 21, or transfers it to the carrier mounting table 21, for example. Two or more substrate processing units having a loading / unloading port facing the same opening 14, such as carrying out the substrate W from the adjacent cooling processing unit 32 and carrying in the substrate W to the spin coater 4 successively. When the substrate W is continuously carried in and out of the substrate W, the arm support 106 is moved up and down (not temporarily lowered to the transfer area 12) while the arm support 106 is being raised to the transfer area 12, and the arm is rotated. Loading and unloading of the substrate W is continuously performed by adjusting the height of 100 and the direction of withdrawal.

According to the first embodiment described above, since the processing area 13 and the transfer area 12 are vertically stacked,
At least a part of the horizontal area of the substrate processing unit and the horizontal area of the area (corresponding to the substrate transfer path of the conventional apparatus) in which the substrate transfer apparatus 10 transfers the substrate W in the apparatus 1 overlap each other. The installation area of the device 1 can be made smaller than that of the device, and the clean room can be effectively used. Also, as the size of the substrate W increases,
In the configuration of the conventional apparatus, since the horizontal area of the substrate processing unit and the horizontal area of the substrate transfer path increase in proportion to the substrate size, the installation area of the apparatus also increases in proportion to the substrate size. On the other hand, in the first embodiment described above,
As the size of the substrate W increases, the area of the horizontal direction of the substrate processing unit and the horizontal area of the area in which the substrate transfer apparatus 10 transfers the substrate W in the apparatus 1 increase in proportion to the increase. Therefore, the ratio of the installation area of the device 1 can be increased as compared with the conventional device. Further, in the first embodiment, the transfer area 12 is provided below the processing area 13, so the substrate transfer apparatus 1
Particles and the like generated in the 0 drive mechanism (101 to 105, etc.) are less likely to be mixed in the processing area 13, and substrate contamination in the apparatus 1 can be reduced.

The elevating mechanism 104 of the substrate transfer apparatus 10 according to the first embodiment described above is not limited to a pantograph and can be realized by an appropriate mechanism. For example,
As shown in FIG. 7, the lifting mechanism 104 may be configured by the rodless cylinder 104a. Further, in the configuration of FIG. 7, the Y-axis direction moving mechanism 101 and the X-axis direction moving mechanism 1 are utilized by utilizing the empty space below the arm 100 indicated by the dotted line in the figure.
The movement of the arm 100 in the respective axial directions can replace the movement of the arm 100, and the arm support 106 can be omitted.

<Second Embodiment> Next, the second embodiment of the present invention will be described.
An embodiment will be described with reference to FIGS. 8 to 13. 8 is a vertical cross-sectional view of a substrate processing apparatus according to a second embodiment of the present invention, FIG. 9 is a plan view of a processing area of the apparatus, and FIG. 10 is a substrate of the second embodiment. FIG. 11 is a plan view showing a configuration of main parts of the transfer device, and FIG. 11 is a front view for explaining a substrate loading / unloading operation with respect to a substrate transfer part by a substrate loading / unloading device. FIG. FIG. 13 is a plan view for explaining a substrate loading / unloading operation with respect to a substrate transfer part by the substrate transfer device of the third embodiment, and FIG. 13 shows a substrate loading / unloading operation with respect to a heat treatment part by the substrate transfer device of the second embodiment. It is a plane sectional view for explaining. It should be noted that the same components as those in the first embodiment are designated by the same reference numerals as those in FIGS. 1 to 6 and their detailed description is omitted. It has the same configuration.

The substrate processing apparatus 1 according to the second embodiment also has a three-story structure, and the storage area 1 is provided on the first floor.
The transfer area 12 is provided on the first and second floors, and the processing area 13 is provided on the third floor. In the second embodiment,
When the substrate transfer apparatus 10 transfers (elevates) the substrate W between the transfer area 12 and the processing area 13, it is configured to stand the substrate W in the vertical direction. Therefore, the substrate transfer apparatus 10 according to the second embodiment is provided with a mechanism for changing the posture of the arm 100 between the horizontal posture and the vertical posture.

A specific example of the substrate transfer device 10 will be described with reference to FIGS. Y-axis direction moving mechanism 10
1, the X-axis direction moving mechanism 102, and the structure up to the pedestal 103 are the same as those of the substrate transfer apparatus 10 of the first embodiment. An elevating mechanism 104 such as a pantograph is provided on the pedestal 103.
Is provided so that the base end side of the arm 100 in a horizontal posture is cantilevered. A swivel drive unit 105 is provided on the upper part of the elevating mechanism 104, and a posture changing unit 107 is provided by the swivel drive unit 105 so as to be able to swivel around the J1 axis in the drawing. The arm 100 is supported by the posture changing unit 107 via the opening / closing drive unit 108 so that the posture can be changed between the horizontal posture and the vertical posture. This posture change is performed by rotating the opening / closing drive unit 108 and the arm 100 by 90 ° around the J2 axis in FIG. 10B.

The arm 100 is separated into two pieces and is opened / closed by the opening / closing drive section 108. The arm 100 has pins 100a for supporting the lower surface of the substrate W.
Alternatively, a holding member 100c that holds the substrate W by pressing the outer peripheral edge of the substrate W from the outside is provided. Holding member 10
0c has, for example, a cylindrical shape. Of the four holding members 100c, the holding member 100c provided on the tip side of the arm 100 is fixed to the arm 100, and the holding member on the base end side. 100c is adapted to be rotated around the J3 axis in FIG. In FIG. 10, the substrate W is held by the holding member 100c when the holding member 100c on the base end side is indicated by a solid line, and the holding of the substrate W by the holding member 100c is released when indicated by a two-dot chain line. It The holding of the substrate W and the release thereof are switched by rotating the holding member 100c on the base end side of the arm 10 around the J3 axis.

The substrate transfer device 10 has a transfer area 12
In the horizontal posture, the substrate W is set to the horizontal posture,
The arm 100 is conveyed in the Y-axis direction, the posture of the arm 100 is changed from the horizontal posture to the vertical posture, and the arm 100 is passed through the appropriate opening 14.
The substrate W held in the processing area 13 is transferred from the transfer area 12 to the processing area 13, and the substrate W is transferred to the substrate processing units 3 to 6 in the processing area 13 and the substrate processing of the substrate W is performed in the processing area 13. The substrate W held by the arm 100 through the opening 14 is carried out through the opening 14 by carrying out from the parts 3 to 6 or the like.
3 is transferred to the transfer area 12, and in the transfer area 12, the substrate W that holds the arm 100 by changing its posture from the vertical posture to the horizontal posture is conveyed in the X-axis and Y-axis directions.

When the substrate W is conveyed with the arm 100 in the vertical posture, the substrate W is held by the holding member 100c on the arm 100 in order to prevent the substrate W from falling off from the arm 100. Further, when the substrate W is transported in the transport area 12, the tip end side of the horizontal arm 100 is supported by the support shaft 109 provided upright on the pedestal 103.

A substrate loading / unloading device 22 for exclusively loading / unloading the substrate W to / from the carrier C, and this substrate loading / unloading device 22 are installed in the loading / unloading unit 2 of the substrate processing apparatus 1 according to the second embodiment. A substrate transfer unit 23 for transferring the substrate W between the substrate transfer device 10 and the substrate transfer device 10 is also provided.

The substrate loading / unloading device 22 is provided with an arm 24 for supporting the substrate W (provided with pins for supporting the substrate, a regulating member, etc.), and this arm 24 is used for selecting the carrier C. In addition to being configured to be movable in the X-axis direction, selection of storage shelf CT and arm 24 and storage shelf CT
It is configured to be able to move up and down for transferring the substrate W between and, and to be movable in the Y-axis direction for inserting and removing the arm 24 with respect to the carrier C. The substrate loading / unloading device 22 takes out / stores the substrate W from / into the carrier C by the substrate transfer device 10 of the first embodiment.
The operation is similar to the operation of taking out and storing the substrate W with respect to the carrier C by.

The substrate transfer part 23 includes two support pieces 25.
The pins 26 for supporting the substrate are fixedly provided upright.

The substrate loading / unloading device 22 transfers the substrate W to / from the substrate transporting device 10 so as to transfer the substrate W to the pins 26.
Place and remove the. When the substrate W is placed on (taken out of) the pin 26 by the substrate loading / unloading device 22, the substrate W (arm 24) supported by the arm 24 is positioned above (below) the pin 26, and the arm 24 is lowered (raised). Then, the substrate W is transferred from the arm 24 to the pin 26 (the substrate W is transferred from the pin 26 to the arm 24).
At this time, the arm 24 is moved up and down so as to pass through the gap between the support pieces 25 (see FIG. 11).

By the way, the substrate transfer section 23 and the substrate transfer table 9 support the substrate W in a horizontal attitude, and the substrate processing sections 3 to 6 support or hold the substrate W in a horizontal attitude to process the substrate. On the other hand, the arm 100 is in the transfer area 1.
2 when moving between the processing area 13 and the processing area 13.
00 is performed in a vertical posture. Therefore, the arm 10
In 0, the substrate W is placed on the pins 26 and 91 so that the substrate W is supported or held in the horizontal posture from the vertical posture, is loaded into each of the substrate processing units 3 to 6, and is changed from the vertical posture to the horizontal posture. The substrate W that is supported or held must be taken out and carried out.

The operation of loading and unloading the substrate W with respect to the pins 26 and 91 by the arm 100 and the loading and unloading of the substrate W with respect to the substrate processing units 3 to 6 will be described below.

Since the loading / unloading operation of the substrate W with respect to the pins 26 and 91 is substantially the same, here, the loading / unloading operation of the substrate W with respect to the pin 26 is taken as an example, and FIG.
This will be described with reference to FIG.

The mounting of the substrate W on the pin 26 is performed as follows. From a state in which the arm 100 stands upright in front of the pin 26 in a vertical posture, the posture of the arm 100 is changed to a horizontal posture and the substrate W held by the arm 100 is positioned above the pin 26 in a horizontal posture ( FIG. 12A).
At this time, the back surface direction of the substrate W held by the arm 100 whose posture is changed from the horizontal posture to the vertical posture in the transfer area 12 so that the back surface of the substrate W faces downward (the pin 26 side). By rotating around the J1 axis, pin 26
I try to match the direction. And the arm 100
The holding of the substrate W by the above is released, the arm 100 is lowered, and the substrate W is transferred from the arm 100 to the pin 26. Next, the arm 100 is opened to eliminate interference between the substrate W supported by the pin 26 and the arm 100 (supporting piece 100d supporting the pin 100a) (FIG. 12B).
The arm 100 is lifted above the substrate W supported by the pins 26, and the posture of the arm 100 is changed from the horizontal posture to the vertical posture. As a result, the substrate W is placed on the pins 26.

The removal of the substrate W from the pin 26 is carried out by an operation substantially opposite to the operation of placing the substrate W on the pin 26. That is, the arm 100 is opened in a state where the arm 100 is erected in front of the pin 26 in the vertical posture, and the posture of the arm 100 is changed to the horizontal posture to move the arm 1 to the horizontal position.
00 in a horizontal position above the pin 26 (see FIG. 12).
(B)). Then, the arm 100 is lowered below the substrate W supported by the pin 26, the arm 100 is closed, and then the arm 100 is raised to move the pin 26 to the arm 10.
The substrate W is transferred to 0. And the holding member 10
The substrate W is held on the arm 100 by 0c and the posture of the arm 100 is changed from the horizontal posture to the vertical posture. As a result, the substrate W is taken out from the pin 26.

Spin coater 4, spin developer 5, edge exposure section 6 (each spin chuck 41, 51, 6)
The loading of the substrate W into 1) is equivalent to the pin 26 (91) replacing the spin chucks 41, 51, 61, and therefore can be carried out by the same operation as the placement of the substrate W on the pin 26. To carry out the substrate W from the substrate processing units 4 to 6,
The same operation as that of taking out the substrate W from the pin 26 can be performed.

Since the heating processing section 31 and the cooling processing section 32 are stacked in multiple stages, the arm 100 is tilted above the heat plate (vertical posture) as in the loading / unloading operation of the substrate W with respect to the pin 26. It is difficult to change the posture from horizontal to horizontal). Therefore, as shown in FIG. 13A, the arm 100 is changed in posture between the vertical posture and the horizontal posture outside the heat treatment unit 3, and the arm 100 in the horizontal posture is heat-treated by rotating about the J1 axis. The substrate W is carried in and out of the heat treatment unit 31 and the cooling treatment unit 32 by displacing between the outside of the unit 3 and the upper side of the heat plate. It should be noted that when the arm 100 is in a horizontal posture and is positioned above the heat plate, the substrate W is transferred to and from the heat plate by the substrate support pin 33 and the arm 100 as in the first embodiment. It is done by working. Further, since the arm 100 is rotated about the J1 axis, the heating processing section 31 and the cooling processing section 32 are provided with the loading / unloading port 34 (or shutter) on the corresponding two side surfaces.

Further, when there is an obstacle or the like at a position where the arm 100 is tilted outside the heat treatment section 3, for example, as shown in FIG.
As shown in 3 (b) and 3 (c), the posture of the arm 100 is changed at a position where there is no obstacle, and in addition to the rotation around the J1 axis, the arm 100 is moved in the X-axis or Y-axis direction to obtain a horizontal posture. The arm 100 may be moved between above the heat plate and the position of the posture change. Note that FIG.
In (b) and (c), the drawings are simplified.

In the apparatus 1 shown in FIGS. 8 and 9, the spin developers 5 and the edge exposure portions 6 are also laminated, but the height dimensions of the spin developers 5 and the edge exposure portions 6 are sufficiently large. , The substrate 100 is placed on and taken out of the pins 26, the arm 100 is attached to the spin chuck 51,
It is designed to fall directly above 61. In addition, as for the loading / unloading of the substrate to / from the spin developer 5 and the edge exposure unit 6, the rotation around the J1 axis and the like are used similarly to the loading / unloading of the substrate W to / from the heat processing unit 31 and the cooling processing unit 32. Good. In addition, the loading / unloading and loading / unloading of the substrate W with respect to the pins 26 and 91 and the spin coater 4 may also be performed by using the rotation around the J1 axis. How to carry in / out the substrate W may be determined according to the layout of each substrate processing unit in the processing area 13.

According to the second embodiment, the transfer of the substrate W between the transfer area 12 and the processing area 13 is carried out with the arm 100 (substrate W) standing vertically. 2. As can be seen by comparing FIG. 9, the first
The area of the opening 14 can be made smaller than that of the above embodiment, and accordingly, the installation area of the device 1 can be made further smaller.

In the second embodiment, if each substrate processing unit is configured to hold the substrate W in the vertical direction and process the substrate, the arm 100 carries the substrate W in the vertical posture. And so on.

Further, in the second embodiment, the substrate loading / unloading device 22 and the substrate transfer part 23 are provided in the loading / unloading part 2. However, the substrate transfer device 10 directly takes out / stores the substrate W into / from the carrier C. It may be performed.

Further, the lifting mechanism 104 of the substrate transfer apparatus 10 of the second embodiment may also be constructed by using a rodless cylinder 104a or the like as shown in FIG. In the case of the apparatus 10 of FIG. 14, the elevating mechanism 104 is configured to be rotatable about the J4 axis with respect to the pedestal 103 in order to match the direction of the back surface of the substrate W.

Further, the substrate transfer apparatus 1 of the second embodiment
0 and the modified example of FIG. 14 described above are configured to include only one arm 100, but two arms 1 may be provided if necessary.
00 may be provided.

Next, some modifications common to each of the above embodiments will be introduced. In each of the above embodiments, the transfer area 12 is provided below the processing area 13, but the transfer area 12 may be provided above the processing area 13. Further, if the transfer area 12 and the processing area 13 are vertically stacked, for example, another area may be provided between the transfer area 12 and the processing area 13, and the upper side and the lower side of the transfer area 12 may be provided. May be provided, or conversely, transfer areas 12 above and below the processing area 13 may be provided, and further, a plurality of transfer areas 1 may be provided.
2 and a plurality of processing areas 13 may be stacked in multiple stages.

The type, number and layout of the substrate processing units arranged in the processing area 13 are not limited to the configuration of each of the above-mentioned embodiments. Further, the present invention can be similarly applied to a substrate processing apparatus that does not include the loading / unloading unit 2 and the IF unit 8 and a substrate processing apparatus that performs substrate processing other than the photolithography process.

The movement of the substrate transfer device 10 in the X-axis and Y-axis directions may be realized by the structure shown in FIG. 15, for example. That is, the self-propelled wheels 200 and the sensors 201 are provided on the pedestal 103, and the tapes (indicated by diagonal lines) 300 are laid in a grid pattern in the transport area 12. Move in the direction. At this time, position information is provided at the intersection of the tape 300, and while the position information is read by the sensor 201, the substrate transfer device 10 recognizes its own position within the transfer area 12, and the device 10 determines its own. Transport area 1
Move within 2. The pedestal 103 has a built-in microcomputer that controls such driving. Further, the instruction to start or stop the operation may be given wirelessly.

In the structure of FIG. 15A, the tape 3
Although it is difficult to bend at a right angle at the intersection of 00, the tape 300 is laid as shown in FIG. 15B, and the substrate processing apparatus 10 changes the tape 300 from one to two. When the fact is identified, it is determined whether to proceed to the left or right, and the wheels 200 may be controlled to be steered so as to move the pedestal 103 along the tape 300 in that direction. Further, for example, when the sensor 201 detects the three tape portions 301 of FIG. 15B and stops them, the substrate transfer device 10 can be stopped at a predetermined position. Although not shown in FIG. 15, each component from the lifting mechanism 104 to the arm 100 is stacked on the pedestal 103.

Although only one substrate transfer device 10 may be provided, a plurality of substrate transfer devices 10 are provided, and the substrate transfer devices 10 cooperate to transfer the substrate W in the device 1 and each substrate. The substrate W may be carried in and out of the processing section. At this time, when the substrate W is transferred between the substrate transfer devices 10 having the arms 100 of the same shape, the substrate W can be transferred via a transfer table such as the substrate transfer table 9.

[0083]

As is apparent from the above description, according to the invention described in claim 1, the processing area in which the substrate processing section is arranged and the transfer area in which the substrate transfer means transfers the substrate are vertically stacked. Therefore, part of the horizontal area occupied by the substrate processing unit and the horizontal area occupied by the transfer area for transferring the substrate in the device overlap vertically, making it possible to reduce the installation area of the device compared to conventional devices. , So that it is possible to effectively utilize the clean room. Further, as the size of the substrate increases, the proportion of the reduction in the installation area of the device relative to the conventional device increases in proportion to the increase in the size of the substrate, which is an effective technique for effectively utilizing the clean room for the substrate processing device of the size-increasing substrate. Was realized.

According to the second aspect of the present invention, since the transfer area is arranged below the processing area, it is possible to reduce the contamination of the substrate due to the adhesion of particles in the apparatus.

According to the third aspect of the present invention, the substrate transfer means is configured to vertically stand the substrate when transferring the substrate between the transfer area and the processing area. The horizontal area of the opening for transporting the substrate between the processing area and the processing area can be reduced, and accordingly, the horizontal area of the processing area and the transportation area can be further reduced, and the installation area of the device can be further reduced. It can be made smaller.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of a substrate processing apparatus according to a first embodiment of the present invention.

2 is a plan view of a processing area of the apparatus of FIG.

FIG. 3 is a perspective view showing a schematic configuration of the entire substrate transfer apparatus according to the first embodiment.

4A and 4B are a plan view and a front view showing a configuration of an arm portion of the substrate transfer device according to the first embodiment.

FIG. 5 is a diagram for explaining a substrate taking-out / accommodating operation with respect to a carrier by the substrate carrying device according to the first embodiment.

FIG. 6 is a plan view for explaining a substrate loading / unloading operation with respect to each substrate processing unit and a substrate loading / unloading operation with respect to a substrate transfer table according to the first embodiment.

FIG. 7 is a front view showing a schematic configuration of a modified example of the substrate transfer device according to the first embodiment.

FIG. 8 is a vertical sectional view of a substrate processing apparatus according to a second embodiment of the present invention.

9 is a plan view of a processing area of the apparatus of FIG.

10A and 10B are a plan view and a front view showing a configuration of a main part of a substrate transfer device according to a second embodiment.

FIG. 11 is a plan view for explaining a substrate loading / unloading operation with respect to a substrate delivery unit by the substrate loading / unloading device.

FIG. 12 is a plan view for explaining a substrate loading / unloading operation with respect to a substrate transfer unit by the substrate transfer device according to the second embodiment.

FIG. 13 is a plan cross-sectional view for explaining a substrate loading / unloading operation with respect to a heat treatment unit by the substrate transport apparatus according to the second embodiment.

FIG. 14 is a perspective view showing a schematic configuration of a modified example of the substrate transfer device according to the second embodiment.

FIG. 15 is a diagram showing a main configuration of a modified example of the substrate transfer apparatus according to each embodiment.

[Explanation of reference numerals] 1 ... Substrate processing apparatus 3 ... Heat treatment section 4 ... Spin coater 5 ... Spin developer 6 ... Edge exposure section 10 ... Substrate transfer apparatus 12 ... Transfer area 13 ... Processing area 31 ... Heat processing section 32 ... Cooling section 100 ... Arm of substrate transfer device W ... Substrate

Claims (3)

[Claims] 1. A substrate processing apparatus, comprising: a substrate processing unit; and a substrate transfer unit that transfers a substrate in the apparatus and carries the substrate in and out of the substrate processing unit. A substrate processing apparatus, wherein a processing area and a transfer area for transferring the substrate by the substrate transfer means are vertically stacked. 2. The substrate processing apparatus according to claim 1, wherein the transfer area is arranged below the processing area. 3. The substrate processing apparatus according to claim 1, wherein the substrate transfer unit moves the substrate vertically when the substrate is transferred between the transfer area and the processing area. A substrate processing apparatus characterized in that it is performed upright.