JPH09260851A - Multilayered flex rigid wiring board manufacturing method - Google Patents
Multilayered flex rigid wiring board manufacturing methodInfo
- Publication number
- JPH09260851A JPH09260851A JP8876996A JP8876996A JPH09260851A JP H09260851 A JPH09260851 A JP H09260851A JP 8876996 A JP8876996 A JP 8876996A JP 8876996 A JP8876996 A JP 8876996A JP H09260851 A JPH09260851 A JP H09260851A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- rigid
- board
- circuit board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000000853 adhesive Substances 0.000 claims abstract description 48
- 230000001070 adhesive effect Effects 0.000 claims abstract description 48
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229920001721 polyimide Polymers 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 7
- 239000004642 Polyimide Substances 0.000 claims abstract description 5
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 claims description 10
- 229910015900 BF3 Inorganic materials 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000012787 coverlay film Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 238000012805 post-processing Methods 0.000 claims description 3
- 230000010354 integration Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000011229 interlayer Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000005553 drilling Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- -1 glycidyl ester Chemical class 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- NXIHMZUXSZKKBX-UHFFFAOYSA-N 1h-imidazole;trifluoroborane Chemical compound FB(F)F.C1=CNC=N1 NXIHMZUXSZKKBX-UHFFFAOYSA-N 0.000 description 1
- DRQFBCMQBWNTNV-UHFFFAOYSA-N 2-[bis(2-hydroxyethyl)amino]ethanol;trifluoroborane Chemical compound FB(F)F.OCCN(CCO)CCO DRQFBCMQBWNTNV-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- YRZFHTRSHNGOSR-UHFFFAOYSA-N phenylmethanamine;trifluoroborane Chemical compound FB(F)F.NCC1=CC=CC=C1 YRZFHTRSHNGOSR-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- DBIWHDFLQHGOCS-UHFFFAOYSA-N piperidine;trifluoroborane Chemical compound FB(F)F.C1CCNCC1 DBIWHDFLQHGOCS-UHFFFAOYSA-N 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子機器等に用い
るドリル加工性、生産性に優れた多層フレックスリジッ
ド配線板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multi-layer flex-rigid wiring board which is excellent in drilling workability and productivity used in electronic equipment and the like.
【０００２】[0002]
【従来の技術】従来、多層フレックスリジッド配線板
は、例えば、フレキシブル回路板の回路面にカバーレイ
フィルムをラミネートして得られたカバーレイ付きフレ
キシブル回路板と、片面のみに回路形成した銅張積層板
とを、リジッド回路面を内側にし層間接着シートを介し
て重ね合わせ、加熱・加圧一体化して多層フレックスリ
ジッド積層板をつくる。その後、穴明け、メッキ、外層
回路加工等の後加工を行い、多層フレックスリジッド配
線板を製造していた。2. Description of the Related Art Conventionally, a multilayer flex-rigid wiring board includes, for example, a flexible circuit board with a coverlay obtained by laminating a coverlay film on the circuit surface of a flexible circuit board, and a copper clad laminated circuit formed on only one side. The board and the rigid circuit surface are placed on the inside with an interlayer adhesive sheet in between, and heat and pressure are integrated to form a multilayer flex-rigid laminated board. Thereafter, post-processing such as drilling, plating, and outer layer circuit processing was performed to produce a multilayer flex-rigid wiring board.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記し
たレックスリジッド配線板の製造工程は、層間接着シー
トを製造し、そのシートを銅張積層板の回路面に配置・
固定する仮付け工程等があるために長く、生産性が悪い
という欠点があった。また、層間接着シートは、接着剤
をフィルム化するためにゴム等の可とう性成分を含み、
それに起因して通常のエポキシ樹脂に比べてガラス転移
点が低く、ドリル加工条件を制約するという欠点があっ
た。However, in the manufacturing process of the above-described Rex-rigid wiring board, an interlayer adhesive sheet is manufactured and the sheet is placed on the circuit surface of the copper clad laminate.
Since there is a temporary fixing process for fixing, there is a drawback that it is long and the productivity is poor. In addition, the interlayer adhesive sheet contains a flexible component such as rubber to form an adhesive film,
Due to this, the glass transition point is lower than that of ordinary epoxy resins, and there is a drawback that drill processing conditions are restricted.
【０００４】本発明は、上記の欠点を解消するためにな
されたもので、製造工程を短縮するとともに、ドリル加
工性などの生産性に優れたフレックスリジッド配線板を
提供しようとするものである。The present invention has been made in order to solve the above-mentioned drawbacks, and an object of the present invention is to provide a flex-rigid wiring board which shortens the manufacturing process and is excellent in productivity such as drill workability.
【０００５】[0005]
【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意研究を重ねた結果、後述する特定の
成分を含有する接着剤をリジッド回路板の回路面に塗布
・乾燥・半硬化状態にした接着剤付きリジッド回路板
を、カバーレイ付きフレキシブル回路板と加熱・加圧一
体化することにより、上記の目的を達成できることを見
いだし、本発明を完成したものである。Means for Solving the Problems As a result of intensive studies aimed at achieving the above object, the present inventor has applied an adhesive containing a specific component described below to the circuit surface of a rigid circuit board The inventors have found that the above-mentioned object can be achieved by integrating a semi-cured rigid circuit board with an adhesive with a flexible circuit board with a coverlay by heating and pressurizing, and have completed the present invention.
【０００６】即ち、本発明は、回路形成してポリイミド
カバーレイフィルムをラミネートしたカバーレイ付きフ
レキシブル回路板に、前記カバーレイ付きフレキシブル
回路板との接着面に回路形成したリジッド回路板の回路
面上に接着剤を塗布、乾燥、半硬化させた接着剤付きリ
ジッド回路板を配置して、加熱加圧一体化して多層フレ
ックスリジッド積層板を成形した後、後加工する多層フ
レックスリジッド配線板の製造方法であって、接着剤付
きリジッド回路板における接着剤が、（Ａ）エポキシ樹
脂、（Ｂ）硬化剤として 4,4′−ジアミノジフェニルス
ルホン、（Ｃ）硬化促進剤として三フッ化ホウ素錯化合
物を必須成分とするエポキシ樹脂組成物であることを特
徴とする多層フレックスリジッド配線板の製造方法であ
る。また、特に、160 ℃，40ｋｇｆ／ｃｍ2 の条件で加
熱・加圧する際の、接着剤のフローが 0.5ｍｍ以下であ
る多層フレックスリジッド配線板の製造方法である。That is, according to the present invention, a flexible circuit board with a cover lay, in which a circuit is formed and laminated with a polyimide cover lay film, is formed on a circuit surface of a rigid circuit board having a circuit formed on an adhesive surface to the flexible circuit board with the cover lay. A method of manufacturing a multilayer flex-rigid wiring board, in which a rigid circuit board with an adhesive is applied, dried, and semi-cured on the The adhesive in the rigid circuit board with the adhesive is (A) epoxy resin, (B) 4,4′-diaminodiphenyl sulfone as a curing agent, and (C) boron trifluoride complex compound as a curing accelerator. A method for producing a multilayer flex-rigid wiring board, which is an epoxy resin composition as an essential component. Further, in particular, it is a method for producing a multilayer flex-rigid wiring board in which the flow of the adhesive is 0.5 mm or less when heated and pressed under the conditions of 160 ° C. and 40 kgf / cm 2 .
【０００７】以下、本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.
【０００８】本発明に用いるカバーレイフィルムとして
は、ポリイミド系フィルムを基材としたものが使用で
き、例えば、ポリピロメリット酸イミド系フィルム、ポ
リビフェニルイミド系フィルム、ポリケトンイミド系フ
ィルム、ポリアミドイミド系フィルム、ポリエーテルイ
ミド系フィルム等が挙げられる。As the coverlay film used in the present invention, a film based on a polyimide film can be used, and examples thereof include polypyromellitic imide film, polybiphenylimide film, polyketone imide film, and polyamide imide film. Examples thereof include films and polyetherimide type films.
【０００９】本発明に用いるフレキシブル回路板として
は、カバーレイにおけると同様なポリイミド系フィルム
を基材としたものが使用できる。フレキシブル回路板に
カバーレイをプレス成形してカバーレイ付きフレキシブ
ル回路板を得る。As the flexible circuit board used in the present invention, the same polyimide-based film as that used in the coverlay can be used. A cover lay is press-molded on the flexible circuit board to obtain a flexible circuit board with a cover lay.
【００１０】本発明に用いる接着剤としては、（Ａ）エ
ポキシ樹脂、（Ｂ）硬化剤として 4,4′−ジアミノジフ
ェニルスルホン、（Ｃ）硬化促進剤として三フッ化ホウ
素錯化合物を必須成分とするエポキシ樹脂組成物が使用
できる。As the adhesive used in the present invention, (A) an epoxy resin, (B) a curing agent, 4,4'-diaminodiphenyl sulfone, and (C) a boron trifluoride complex compound as a curing accelerator are essential components. The epoxy resin composition can be used.
【００１１】（Ａ）エポキシ樹脂としては、1 分子中に
2個以上のエポキシ基を有するエポキシ樹脂が使用可能
であり、例えば、ビスフェノールＡ型エポキシ樹脂、ビ
スフェノールＦ型エポキシ樹脂、ノボラック型エポキシ
樹脂、またはこれらの臭素化物などのグリシジルエーテ
ル型エポキシ樹脂、グリシジルエステル型エポキシ樹
脂、グリシジルアミン型エポキシ樹脂、脂環式エポキシ
樹脂、複素環式エポキシ樹脂等が挙げられ、これらは単
独又は 2種以上混合して使用することができる。 （Ｂ） 4,4′−ジアミノジフェニルスルホンとしては、
通常エポキシ樹脂の硬化剤として用いられるもので、特
に制限なく使用できる。この硬化剤の配合割合は、
（Ａ）エポキシ樹脂のエポキシ基（ｘ）と（Ｂ） 4,4′
−ジアミノジフェニルスルホンのアミノ基（ｙ）との当
量比［（ｘ）／（ｙ）］が 0.3〜 1.5の範囲内であるこ
とが望ましい。当量比が 0.3未満では硬化が不十分とな
り、また、当量比が 1.5を超えると未反応の官能基が多
く残り、多層フレックスリジッド配線板の特性を低下さ
せ好ましくない。また、本発明の目的に反しない限りこ
の 4,4′−ジアミノジフェニルスルホンの他に、他の硬
化剤を併用することができる。 （Ｃ）三フッ化ホウ素錯化合物としては、通常の硬化促
進剤として用いられるものが使用できる。例えば、三フ
ッ化ホウ素モノエチルアミン錯体、三フッ化ホウ素ピペ
リジン錯体、三フッ化ホウ素トリエタノールアミン錯
体、三フッ化ホウ素ベンジルアミン錯体、三フッ化ホウ
素イミダゾール錯体等が挙げられ、これらは単独又は 2
種以上混合して使用することができる。(A) Epoxy resin has one molecule
An epoxy resin having two or more epoxy groups can be used, and examples thereof include bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, or glycidyl ether type epoxy resin such as bromide thereof, glycidyl ester. Type epoxy resin, glycidyl amine type epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, and the like. These can be used alone or in combination of two or more. (B) 4,4′-diaminodiphenyl sulfone includes
It is usually used as a curing agent for epoxy resins and can be used without particular limitation. The mixing ratio of this curing agent is
(A) Epoxy group of epoxy resin (x) and (B) 4,4 '
-The equivalent ratio [(x) / (y)] of diaminodiphenyl sulfone to the amino group (y) is preferably in the range of 0.3 to 1.5. If the equivalence ratio is less than 0.3, curing will be insufficient, and if the equivalence ratio exceeds 1.5, many unreacted functional groups will remain and the characteristics of the multilayer flex-rigid wiring board will be deteriorated, such being undesirable. In addition to the 4,4'-diaminodiphenyl sulfone, other curing agent can be used in combination unless it is against the object of the present invention. As the boron trifluoride complex compound (C), those used as usual curing accelerators can be used. Examples thereof include boron trifluoride monoethylamine complex, boron trifluoride piperidine complex, boron trifluoride triethanolamine complex, boron trifluoride benzylamine complex, boron trifluoride imidazole complex, etc., which may be used alone or 2
A mixture of more than one species can be used.
【００１２】本発明に用いる層間接着剤は、エポキシ樹
脂、 4,4′−ジアミノジフェニルスルホン、三フッ化ホ
ウ素錯化合物を必須成分とするが、本発明の目的に反し
ない限度において、また、必要に応じて、微粉末の無機
質又は有機質の充填剤、顔料及び劣化防止剤等を添加配
合することができる。The interlayer adhesive used in the present invention contains an epoxy resin, 4,4'-diaminodiphenyl sulfone, and a boron trifluoride complex compound as essential components, but is necessary as long as it does not violate the object of the present invention. According to the requirement, finely powdered inorganic or organic fillers, pigments, deterioration inhibitors and the like can be added and blended.
【００１３】本発明に用いる銅張積層板としては、特に
制限はないが多層フレックスリジッド配線板の特性上、
ガラス基材エポキシ銅張積層板、ガラス基材ポリイミド
銅張積層板等が特に好ましく使用できる。そしてこれら
の銅張積層板は回路形成してリジッド回路板とし、その
表面に上記の接着剤を塗布し乾燥工程によって、160
℃，40ｋｇｆ／ｃｍ2 の条件で加熱・加圧する際の、接
着剤のフローが 0.5ｍｍ以下となるような半硬化状態に
調整する。この接着剤のフロー調整は、多層フレックス
リジッド配線板の不要銅張積層板部分の削除工程を容易
にする目的で行うものである。また、接着剤の塗布方法
については、特に制限はなく、ロールコーター、カーテ
ンコーター、スクリーン印刷等のいずれでもよい。接着
剤の厚さについては、回路埋め込み性、トータル厚さ等
を満足する厚さにすることが必要であり、銅張積層板の
銅箔厚さ、トータル厚さ等に応じて調整を行うことがで
きる。The copper clad laminate used in the present invention is not particularly limited, but due to the characteristics of the multilayer flex-rigid wiring board,
A glass-based epoxy copper-clad laminate and a glass-based polyimide copper-clad laminate can be particularly preferably used. Then, these copper clad laminates are formed into a circuit to form a rigid circuit board, the surface of which is coated with the above adhesive, and a drying process is performed.
Adjust to a semi-cured state so that the flow of the adhesive is 0.5 mm or less when heating and pressurizing under the conditions of ℃ and 40 kgf / cm 2 . This flow adjustment of the adhesive is carried out for the purpose of facilitating the step of removing the unnecessary copper-clad laminate portion of the multilayer flex-rigid wiring board. The method of applying the adhesive is not particularly limited, and any of a roll coater, a curtain coater, screen printing, etc. may be used. It is necessary to adjust the thickness of the adhesive to a value that satisfies the circuit embeddability, total thickness, etc., and should be adjusted according to the copper foil thickness, total thickness, etc. of the copper clad laminate. You can
【００１４】上述した回路形成面に、上述した特定の成
分を含有する接着剤を塗布し、乾燥工程によって接着剤
を半硬化状態にした接着剤付きリジッド回路板は、カバ
ーレイ付きフレキシブル回路板と重ね合わせ加熱・加圧
一体化して多層フレックスリジッド積層板を得、次いで
穴明け、回路加工等の後加工を行って、多層フレックス
リジッド配線板を製造することができる。A rigid circuit board with an adhesive in which an adhesive containing the above-mentioned specific component is applied to the above-mentioned circuit forming surface and the adhesive is semi-cured by a drying step is a flexible circuit board with a cover lay. A multilayer flex-rigid wiring board can be manufactured by superimposing heating and pressure to obtain a multilayer flex-rigid laminated board, and then performing post-processing such as punching and circuit processing.
【００１５】本発明の多層フレックスリジッド配線板
は、カバーレイをラミネートしたカバーレイ付きフレキ
シブル回路板に、前記フレキシブル回路板との接着面に
上述した特定の成分を含有する接着剤を塗布し、乾燥工
程によって160 ℃，40ｋｇｆ／ｃｍ2 の条件で加熱・加
圧する際の、接着剤のフローが 0.5ｍｍ以下となるよう
な半硬化状態に調整した接着剤付きリジッド回路板を配
置することによって、製造工程が短縮され、ドリル加工
性、生産性に優れたものとすることができた。In the multilayer flex-rigid wiring board of the present invention, a flexible circuit board with a cover lay laminated with a cover lay is coated with an adhesive containing the above-mentioned specific component on the adhesive surface with the flexible circuit board and dried. Manufactured by arranging a rigid circuit board with an adhesive that is adjusted to a semi-cured state so that the flow of the adhesive when heated and pressed under the conditions of 160 ° C and 40 kgf / cm 2 depending on the process The process was shortened, and it was possible to achieve excellent drilling workability and productivity.
【００１６】[0016]
【発明の実施の形態】本発明を実施例によって具体的に
説明するが、本発明はこれらの実施例によって限定され
るものではない。以下の実施例および比較例において
「部」とは「重量部」を意味する。図１は実施例の製造
工程を示すフローチャート、図２は比較例の製造工程を
示すフローチャートである。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be specifically described by way of examples, but the present invention is not limited to these examples. In the following Examples and Comparative Examples, “parts” means “parts by weight”. FIG. 1 is a flowchart showing a manufacturing process of an example, and FIG. 2 is a flowchart showing a manufacturing process of a comparative example.
【００１７】実施例 図１のチャートに示したように、厚さ25μｍのポリイミ
ドフィルムをベースとし、その両面に厚さ35μｍの銅箔
を接着剤を介してラミネートしたフレキシブル両面銅張
積層板のＴＬＦ−Ｗ−５２１ＭＲ（東芝ケミカル社製、
商品名）にエッチドフォイル法により両面回路を形成し
てフレキシブル回路板をつくった。Example As shown in the chart of FIG. 1, a TLF of a flexible double-sided copper-clad laminate is prepared by laminating a polyimide film having a thickness of 25 μm on both sides of which a copper foil having a thickness of 35 μm is laminated with an adhesive. -W-521MR (manufactured by Toshiba Chemical Co.,
A flexible circuit board was made by forming a double-sided circuit on the product name) by the etched foil method.
【００１８】厚さ25μｍのポリイミドフィルムに、厚さ
40μｍになるように接着剤を塗布、乾燥、半硬化させた
ポリイミドフィルムカバーレイのＴＦＡ−５７７（東芝
ケミカル社製、商品名）を前記フレキシブル回路板に温
度160 ℃，圧力30ｋｇ／ｃｍ2 ，40分のプレス成形条件
でラミネートしカバーレイ付きフレキシブル回路板
（ａ）を作った。25 μm thick polyimide film, thickness
TFA-577 (trade name, manufactured by Toshiba Chemical Co., Ltd.), a polyimide film cover lay coated with an adhesive so as to have a thickness of 40 μm, dried and semi-cured, is applied to the flexible circuit board at a temperature of 160 ° C. and a pressure of 30 kg / cm 2 , 40. A flexible circuit board (a) with a cover lay was produced by laminating under the press molding condition for a minute.
【００１９】ガラスクロスにエポキシ樹脂を含浸、半硬
化させた厚さ 0.3ｍｍのプリプレグの両面に、それぞれ
厚さ18μｍと厚さ35μｍの銅箔をラミネートしたガラス
エポキシ樹脂両面銅張積層板のＴＬＣ−Ｗ−５５１（東
芝ケミカル社製、商品名）の35μｍ銅箔に片面回路を形
成しリジッド回路板（ｂ）を作った。TLC-a glass-epoxy resin double-sided copper-clad laminate in which copper foil having a thickness of 18 μm and a copper foil having a thickness of 35 μm are laminated on both surfaces of a 0.3 mm-thick prepreg obtained by impregnating glass cloth with epoxy resin and semi-curing A single-sided circuit was formed on a 35 μm copper foil of W-551 (manufactured by Toshiba Chemical Co., Ltd.) to prepare a rigid circuit board (b).
【００２０】エポキシ樹脂のＹＤＢ−７００（東都化成
社製、商品名）91.0部、 4,4′−ジアミノジフェニルス
ルホン8 部、三フッ化ホウ素モノエチルアミン 1.0部を
エチルセロソルブに溶解して接着剤（ｃ）を製造した。
この接着剤（ｃ）をスクリーン印刷によって、上記リジ
ッド回路板（ｂ）の回路面に、厚さ40μｍになるように
印刷し、乾燥・半硬化状態として接着剤付きリジッド回
路板（ｄ）とした。Epoxy resin YDB-700 (trade name, manufactured by Tohto Kasei Co., Ltd.) 91.0 parts, 4,4'-diaminodiphenyl sulfone 8 parts, and boron trifluoride monoethylamine 1.0 part were dissolved in ethyl cellosolve to obtain an adhesive ( c) was produced.
The adhesive (c) was printed by screen printing on the circuit surface of the rigid circuit board (b) so as to have a thickness of 40 μm, and dried and semi-cured to obtain a rigid circuit board (d) with an adhesive. .
【００２１】前記カバーレイ付きフレキシブル回路板
（ａ）と接着剤付きリジッド回路板（ｄ）とを重ね合わ
せて、ピンラミネーション法により温度160 ℃，圧力40
ｋｇ／ｃｍ2 ，120 分の条件で加熱・加圧一体にプレス
成形して多層フレックスリジッド積層板（ｅ）を作っ
た。The flexible circuit board with a cover lay (a) and the rigid circuit board with an adhesive (d) are superposed on each other, and the temperature is 160 ° C. and the pressure is 40 by a pin lamination method.
A multilayer flex-rigid laminate (e) was produced by press-molding integrally under heating and pressure under the conditions of kg / cm 2 and 120 minutes.
【００２２】こうして得た多層フレックスリジッド積層
板（ｅ）にＮＣ穴明け機を用いて、0.3〜 4.0ｍｍφの
穴明けを行った。また、上記積層板をピロリン酸銅メッ
キ液に約 5時間浸漬し、スルーホール部及び表面に約25
μｍのメッキを形成した。さらに、この積層板の外層を
エッチドフォイル法により回路形成して 6層のフレック
スリジッド配線板（ｆ）を製造した。The multi-layer flex-rigid laminate (e) thus obtained was perforated with an NC boring machine to make holes of 0.3 to 4.0 mmφ. Also, soak the above laminated plate in copper pyrophosphate plating solution for about 5 hours, and
A μm plating was formed. Further, a circuit was formed on the outer layer of this laminate by the etched foil method to manufacture a 6-layer flex-rigid wiring board (f).
【００２３】比較例 図２のチャートに示したように、実施例で製造した接着
剤（ｃ）にカルボキシ含有アクリロニトリルブタジエン
ゴムのニポール１０７２（日本ゼオン社製、商品名）を
固形分比 1：1 に配合して接着剤（ｇ）を製造した。こ
の接着剤（ｇ）を厚さ40μｍのポリプロピレンフィルム
にロールコーターで塗布し、乾燥、半硬化させ、接着剤
厚さ40μｍの接着フィルム（ｈ）をつくった。この接着
フィルム（ｈ）を所定の大きさに切断して層間接着シー
ト（ｉ）とした。この層間接着シート（ｉ）を実施例で
つくったリジッド回路板（ｂ）の回路面に、熱ロールを
通して仮付けして層間接着シート付きリジッド回路板
（ｊ）とした。Comparative Example As shown in the chart of FIG. 2, a carboxy-containing acrylonitrile-butadiene rubber, Nipol 1072 (trade name, manufactured by Nippon Zeon Co., Ltd.) was added to the adhesive (c) produced in the example in a solid content ratio of 1: 1. To prepare an adhesive (g). This adhesive (g) was applied to a polypropylene film having a thickness of 40 μm with a roll coater, dried and semi-cured to prepare an adhesive film (h) having an adhesive thickness of 40 μm. This adhesive film (h) was cut into a predetermined size to obtain an interlayer adhesive sheet (i). This interlayer adhesive sheet (i) was temporarily attached to the circuit surface of the rigid circuit board (b) prepared in the example through a heat roll to obtain a rigid circuit board with an interlayer adhesive sheet (j).
【００２４】実施例で作ったカバーレイ付きフレキシブ
ル回路板（ａ）に、保護フィルムであるポリプロピレン
フィルムを剥離した前記層間接着シート付きリジッド回
路板（ｊ）とを重ね合わせて、実施例と同様な条件で加
熱・加圧一体化して多層フレックスリジッド積層板
（ｋ）を作った。続いて、実施例と同様に穴明け、メッ
キ、外層回路形成を行い、 6層のフレックスリジッド配
線板（ｌ）を製造した。A flexible circuit board with a cover lay (a) made in the example was overlaid with the rigid circuit board with an interlayer adhesive sheet (j) from which a polypropylene film as a protective film was peeled off, and the same as in the example. A multilayer flex-rigid laminate (k) was produced by heating and pressurizing under the conditions. Subsequently, drilling, plating, and outer layer circuit formation were performed in the same manner as in the example to manufacture a 6-layer flex-rigid wiring board (1).
【００２５】実施例で作ったカバーレイ付きフレキシブ
ル回路板（ａ）に、保護フィルムであるポリプロピレン
フィルムを剥離した前記層間接着シート付きリジッド回
路板（ｊ）とを重ね合わせて、実施例と同様な条件で加
熱・加圧一体化して多層フレックスリジッド積層板
（ｋ）を作った。続いて、実施例と同様に穴明け、メッ
キ、外層回路形成を行い、 6層のフレックスリジッド配
線板（ｌ）を製造した。A flexible circuit board with a cover lay (a) made in the example was overlaid with the rigid circuit board with an interlayer adhesive sheet (j) from which a polypropylene film as a protective film was peeled off, and the same as in the example. A multilayer flex-rigid laminate (k) was produced by heating and pressurizing under the conditions. Subsequently, drilling, plating, and outer layer circuit formation were performed in the same manner as in the example to manufacture a 6-layer flex-rigid wiring board (1).
【００２６】実施例および比較例で製造した 6層フレッ
クスリジッド配線板について、半田耐熱性、ドリル加工
時のスミア発生について試験を行ったのでその結果を表
１に示した。本発明の 6層フレックスリジッド配線板
は、従来の半田耐熱性を保持し、スミアの発生は大幅に
減少しており、本発明の効果を確認することができた。The 6-layer flex-rigid wiring boards manufactured in the examples and comparative examples were tested for solder heat resistance and smearing during drilling. The results are shown in Table 1. The 6-layer flex-rigid wiring board of the present invention retained the conventional solder heat resistance, and the occurrence of smear was significantly reduced, confirming the effects of the present invention.
【００２７】[0027]
【表１】 ＊1 ：80℃で30分乾燥後半田浴に浸漬した場合の状態を観察した。○印…異常な し ＊2 ：ドリル送り速度 1.5ｍ／分，回転数 60,000 ｒｐｍ ＊3 ：ドリル送り速度 3.0ｍ／分，回転数 60,000 ｒｐｍ。[Table 1] * 1: The state when immersed in a solder bath after drying at 80 ° C for 30 minutes was observed. *: No abnormality * 2: Drill feed speed 1.5 m / min, rotation speed 60,000 rpm * 3: Drill feed speed 3.0 m / min, rotation speed 60,000 rpm.
【００２８】[0028]
【発明の効果】以上の説明および表１から明らかなよう
に、本発明の多層フレックスリジッド配線板の製造方法
よれば、製造工程が短縮化され、半田耐熱性を低下させ
ることなく、ドリル加工性に優れた信頼性の高い多層フ
レックスリジッド配線板を製造することができた。As is clear from the above description and Table 1, according to the method for manufacturing a multilayer flex-rigid wiring board of the present invention, the manufacturing process is shortened, and the solder heat resistance is not lowered, and the drill workability is reduced. It was possible to manufacture an excellent and reliable multilayer flex-rigid wiring board.
【図１】本発明の多層フレックスリジッド配線板の製造
工程を説明するためのフローチャートである。FIG. 1 is a flowchart for explaining a manufacturing process of a multilayer flex-rigid wiring board of the present invention.
【図２】従来の多層フレックスリジッド配線板の製造工
程を説明するためのフローチャートである。FIG. 2 is a flowchart for explaining a manufacturing process of a conventional multilayer flex-rigid wiring board.
Claims (2)
ルムをラミネートしたカバーレイ付きフレキシブル回路
板に、前記カバーレイ付きフレキシブル回路板との接着
面に回路形成したリジッド回路板の回路面上に接着剤を
塗布、乾燥、半硬化させた接着剤付きリジッド回路板を
配置して、加熱加圧一体化して多層フレックスリジッド
積層板を成形した後、後加工する多層フレックスリジッ
ド配線板の製造方法であって、接着剤付きリジッド回路
板における接着剤が、（Ａ）エポキシ樹脂、（Ｂ）硬化
剤として 4,4′−ジアミノジフェニルスルホン、（Ｃ）
硬化促進剤として三フッ化ホウ素錯化合物を必須成分と
するエポキシ樹脂組成物であることを特徴とする多層フ
レックスリジッド配線板の製造方法。1. A flexible circuit board with a cover lay in which a circuit is formed and a polyimide cover lay film is laminated, and an adhesive is applied to the circuit surface of a rigid circuit board with a circuit formed on the adhesive surface with the flexible circuit board with the cover lay. A method of manufacturing a multilayer flex-rigid wiring board, which comprises applying, drying, and arranging a semi-cured rigid circuit board with an adhesive, forming a multilayer flex-rigid laminated board by heat and pressure integration, and post-processing. The adhesive in the rigid circuit board with adhesive is (A) epoxy resin, (B) curing agent 4,4′-diaminodiphenyl sulfone, (C).
A method for producing a multilayer flex-rigid wiring board, which is an epoxy resin composition containing a boron trifluoride complex compound as an essential component as a curing accelerator.
・加圧した際の、接着剤付きリジッド回路板における接
着剤のフローが 0.5ｍｍ以下である請求項１記載の多層
フレックスリジッド配線板の製造方法。2. The multilayer flex-rigid wiring board according to claim 1, wherein the flow of the adhesive in the rigid circuit board with the adhesive is 0.5 mm or less when heated and pressed under the conditions of 160 ° C. and 40 kgf / cm 2. Manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8876996A JPH09260851A (en) | 1996-03-18 | 1996-03-18 | Multilayered flex rigid wiring board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8876996A JPH09260851A (en) | 1996-03-18 | 1996-03-18 | Multilayered flex rigid wiring board manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09260851A true JPH09260851A (en) | 1997-10-03 |
Family
ID=13952074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8876996A Pending JPH09260851A (en) | 1996-03-18 | 1996-03-18 | Multilayered flex rigid wiring board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09260851A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008001807A (en) * | 2006-06-22 | 2008-01-10 | Fujikura Ltd | Epoxy resin composition, epoxy adhesive, cover lay, prepreg, metal-clad laminate and printed circuit board |
| CN100417311C (en) * | 2005-02-18 | 2008-09-03 | 友达光电股份有限公司 | Pressure welding structure of flexible printed circuit board and manufacturing method thereof |
-
1996
- 1996-03-18 JP JP8876996A patent/JPH09260851A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100417311C (en) * | 2005-02-18 | 2008-09-03 | 友达光电股份有限公司 | Pressure welding structure of flexible printed circuit board and manufacturing method thereof |
| JP2008001807A (en) * | 2006-06-22 | 2008-01-10 | Fujikura Ltd | Epoxy resin composition, epoxy adhesive, cover lay, prepreg, metal-clad laminate and printed circuit board |
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