JPH09260140A - Thin film type coil component and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin film type coil component which has a self-resonance frequency, meets high frequency requirements satisfactorily, can be recognized by an image recognizer, and is easy to process and handle, and its manufacturing method. SOLUTION: A coil pattern 2 composed of a conductor thin film is provided on a substrate 1 which is made of quartz glass whose dielectric constant is 2.9 3.6. Further, a substrate which is made of quartz glass and which is at least partially not transparent is used. Moreover, after required electrode patterns are formed on a mother substrate made of quartz glass, the mother substrate is divided by a scribe/break method using a scriber to obtain individual thin film type coil components.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coil component, and more particularly, to a thin film type coil component having a coil pattern arranged on a substrate.

[0002]

2. Description of the Related Art In a thin-film coil component having a coil pattern disposed on a substrate, conventionally, a non-alkali glass substrate, an alumina substrate, and a mixture of alumina and glass are fired as the substrate. Substrates and the like are generally used.

However, each of the above-mentioned conventional substrates has the following problems. Alkali-free glass substrate The dielectric constant ε is around 5.8 and the self-resonance frequency is around 2.3 GHz in the measured value of the 33 nH product, but considering the high frequency of mobile communication equipment in the future, the self-resonance frequency is further Higher is preferable. In addition, since the alkali-free glass substrate that is normally used is transparent, it is difficult to recognize the image when positioning or using an image recognition device in the component processing process or mounting process, and it is difficult to process and handle. bad. In addition, since mechanical strength is low and shell cracks are likely to occur especially at the edge portion, care must be taken in handling and workability is poor. Alumina substrate Dielectric constant ε is around 9.3 to 10.6, self-resonant frequency is 3
Although the calculated value for a 3 nH product is about 1.8 GHz, it is desirable that the self-resonant frequency be higher in consideration of future higher frequencies of mobile communication devices, as in the case of the alkali-free glass substrate. In addition, since the surface roughness is rough, it is difficult to thin the wire, and because the substrate is hard, it is difficult to cut out the mother substrate into individual parts. Glass Ceramic Substrate Currently commercially available substrates have a dielectric constant ε of around 7.0,
It is located between the alkali-free glass substrate and the alumina substrate, and the self-resonant frequency is about 2.1 GHz as calculated value for the 33 nH product. However, in consideration of future high frequencies of mobile communication devices, further higher frequencies are desired.

Conventionally, in the case of using any of the above-mentioned substrates, conventionally, dicing is often used to cut out from the mother substrate into individual parts, and at that time, chipping, cracking, and coil pattern are performed. Peeling off occurs. Particularly, in the case of a component for miniaturization, a hard substrate is often used, and there is a problem that the yield is correspondingly low.

The present invention solves the above problems, has a high self-resonant frequency, is excellent in adaptability to high frequencies, and can be captured by an image recognition device, and has good workability and handleability. Another object of the present invention is to provide a thin film type coil component and a manufacturing method thereof.

[0006]

In order to achieve the above object, the thin-film coil component of the present invention has a dielectric constant of 2.9-.
It is characterized in that a coil pattern made of a conductive thin film is arranged on a substrate made of quartz glass of 3.6. By using quartz glass having a small dielectric constant (ε = 2.9 to 3.6) as a substrate, a thin-film coil component having a high self-resonance frequency can be reliably obtained, and
It becomes possible to form a precise coil pattern having a small line width on a dense substrate, and it is possible to improve adaptability to miniaturization.

Further, the thin-film coil component of the present invention is characterized in that, as the substrate, a substrate partially made of non-transparent quartz glass is used. Note that a part is not transparent is a concept including at least one surface of frosted glass, quarts glass containing bubbles, and quarts caused by adding an additive component. is there. In this way, by using a non-transparent substrate, it becomes possible to recognize by the image recognition device in the processing step, etc., so that the processability and handleability are improved,
Productivity can be increased. However, in the present invention, when image recognition is not necessary, transparent quartz glass can be used, and such an aspect is also included in the scope of the present invention.

In the method of manufacturing a thin-film coil component of the present invention, a predetermined electrode pattern is formed on a mother substrate made of quartz glass, and then the mother substrate is divided by a scribe / break method using a scriber. Thus, individual thin film coil components are obtained. In the method for manufacturing a thin coil component of the present invention, since the mother substrate on which a predetermined electrode pattern is formed is divided by a scribe / break method using a scriber to obtain individual thin film coil components, It is possible to reduce the occurrence of cracks and chips and improve the yield as compared with the case where the mother substrate is divided by dicing. Since quartz glass is hard and difficult to process by a conventional method such as dicing, it has not been paid much attention as a substrate until now. However, the method of dividing using the scribe / break method of the present invention should be applied. Thus, it can be used as a substrate. The scribe / break method is
With the scriber pressed against the substrate (quartz glass), after moving along a predetermined trajectory, it is a concept that means a method of applying stress to the substrate to divide the substrate along the predetermined trajectory, There are no special restrictions regarding the type and structure of the scriber, and how to apply stress during division.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described, and features thereof will be described in more detail.
1 (a) and 1 (b) are front and side views showing a manufacturing process of a thin film coil component according to one embodiment of the present invention, and FIGS. 2 (a) and 2 (b) are one embodiment of the present invention. It is the top view and front view of the thin film type coil component concerning an example.

In this embodiment, a substrate made of quartz glass having a dielectric constant ε of 2.9 to 3.6 was used as the mother substrate. The substrate made of quartz glass is
It is cut out from a block of quartz glass, and its surface is ground glass (semitransparent) by being cut by a blade when cut out from the block. Then, an electrode thin film was formed on the surface of the quartz glass substrate by a method such as vapor deposition or sputtering, and then the electrode thin film was trimmed by photolithography to form a plurality of coil patterns.

Then, as shown in FIGS. 1 (a) and 1 (b),
The mother substrate 10 was divided by the scribe / break method using the glass scriber 11 to obtain individual thin film coil components. In addition, in this embodiment, as shown in FIG.
As shown in (a) and (b), after the rotatable scribe chip 11a made of, for example, super steel or diamond is pressed against the surface of the mother substrate 10 made of quartz glass and moved along a predetermined trajectory, This is a method of dividing the mother substrate 10 by applying stress.

The cut-out thin film coil component is
As shown in FIGS. 2A and 2B, the coil pattern 2 is provided on the surface of a substrate 1 made of quartz glass. This thin-film coil component is used by providing terminal electrodes (not shown) electrically connected to the coil pattern 2 on both ends thereof, if necessary. In the above thin-film coil component, an insulating material (not shown) is interposed between the coil pattern 2 and the one lead portion 2a of the coil pattern 2 to prevent the lead portion 2a from short-circuiting with the coil pattern 2. I have to.

In the thin-film type coil component constructed as described above, since the quartz glass having the dielectric constant of 2.9 to 3.6 is used as the substrate for forming the coil pattern 2, the self-resonant frequency is The calculated value of 33 nH product can be increased to about 3.3 GHz. The self-resonant frequency (f ₀ ) was calculated by the following equation (1). Self-resonant frequency (f ₀ ) = 1 / {2π · (L · C) ^1/2 } (1)

Further, since the quartz glass used as the substrate in the above-mentioned embodiment is generally harder than non-alkali glass or borosilicate glass used as the substrate, if dicing is used when cutting the mother substrate, It is a material that is prone to chipping and has large blade wear.
By applying the break method, it is possible to scribe at high speed and make the break surface flat and smooth.

Further, since the quartz glass used as the substrate in the above-mentioned embodiment has a frosted glass surface with a turbid surface and is in a semitransparent state, it can be recognized by using an image recognition device at the time of positioning during processing. Therefore, by combining with a photolithography method or the like, precise processing can be surely performed. Therefore, it is possible to form a precise coil pattern by reducing the line width and the distance between lines of the pattern, so that a small-sized and high-performance thin-film coil component can be obtained.

In the above embodiment, the thin film type coil component in which the coil pattern is arranged on the substrate made of quartz glass having a rectangular planar shape has been described as an example. The type is not limited to this, and various substrate shapes and coil patterns can be arbitrarily selected and adopted.

Further, the present invention is not limited to the above-mentioned embodiment in other points as well, and the permittivity of the silica glass constituting the substrate, the kind of conductive material constituting the coil pattern, and the mother substrate are divided. With respect to the type of scriber used for this purpose, various applications and modifications can be made within the scope of the invention.

[0018]

As described above, in the thin film type coil component of the present invention, the coil pattern made of the conductive thin film is arranged on the substrate made of quartz glass having a dielectric constant of 2.9 to 3.6. Therefore, the thin-film coil component having a high self-resonant frequency can be reliably obtained. Also, it becomes possible to form a precise coil pattern with a small line width and a small distance between lines on a dense substrate,
The adaptability to miniaturization is improved.

Further, by using a substrate made of non-transparent quartz glass as a substrate, it becomes possible to recognize by an image recognition device in a processing step, etc., and the workability and handleability are improved and the productivity is improved. Can be increased.

Further, in the method of manufacturing a thin-film coil component of the present invention, after forming a predetermined electrode pattern on a mother substrate made of quartz glass, the mother substrate is divided by a scribe / break method using a scriber. Since individual thin film coil components are obtained, the yield is improved by reducing the occurrence of cracks and chips even when quartz glass is used as the substrate, which is likely to be cracked or chips by conventional dicing. It will be possible.
That is, according to the manufacturing method of the invention of the present application, it is difficult to process conventionally, so that a thin-film coil component having a high self-resonant frequency can be efficiently used by using a substrate made of quartz glass, which has not received much attention as a substrate until now. It becomes possible to manufacture well.

[Brief description of drawings]

1A and 1B are diagrams showing a method for manufacturing a thin film coil component according to an embodiment of the present invention, in which FIG. 1A is a front view showing a method of dividing a mother substrate in one step, and FIG. It is a figure.

FIG. 2 is a diagram showing a thin-film coil component according to an embodiment of the present invention, in which (a) is a plan view and (b) is a front view.

[Explanation of symbols]

 1 Substrate made of quartz glass 2 Coil pattern 2a Coil pattern extraction part 10 Mother substrate 11 Scriber 11a Scribe chip

Claims (3)

[Claims] 1. A thin-film coil component comprising a coil pattern made of a conductive thin film arranged on a substrate made of quartz glass having a dielectric constant of 2.9 to 3.6. 2. The thin-film coil component according to claim 1, wherein a substrate made of quartz glass, a part of which is not transparent, is used as the substrate. 3. An individual thin-film coil component is obtained by forming a predetermined electrode pattern on a mother substrate made of quartz glass and then dividing the mother substrate by a scribe / break method using a scriber. The method for manufacturing a thin-film coil component according to claim 1 or 2, characterized in that.