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JPH09257511A - Multidimensional mounting structure and manufacture - Google Patents

Multidimensional mounting structure and manufacture

Info

Publication number
JPH09257511A
JPH09257511A JP6648996A JP6648996A JPH09257511A JP H09257511 A JPH09257511 A JP H09257511A JP 6648996 A JP6648996 A JP 6648996A JP 6648996 A JP6648996 A JP 6648996A JP H09257511 A JPH09257511 A JP H09257511A
Authority
JP
Japan
Prior art keywords
mold
mounting structure
lead frame
frame
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6648996A
Other languages
Japanese (ja)
Inventor
Kiyoshi Takeuchi
潔 竹内
Akira Asaoka
昭 浅岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd
Priority to JP6648996A priority Critical patent/JPH09257511A/en
Publication of JPH09257511A publication Critical patent/JPH09257511A/en
Pending legal-status Critical Current

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  • Transmission And Conversion Of Sensor Element Output (AREA)

Abstract

PROBLEM TO BE SOLVED: To restrain an installation error between both elements in the stage of manufacture, and detect a multishaft directional component by setting of an accurate angle by fixing a mold in a condition where plural detecting elements are turned in the respectively different directions. SOLUTION: Inclined parts 2b and 2c which are parallel to each other and have an angle of 45 degrees to an installing surface 2a, are arranged in upper and lower positions of front and rear surfaces of a mold body 2 to shape a mounting structure, and a lead frame 3 is turned downward from the inclined part 2b, and a lead frame 4 is projected in the vertical direction to the lead frame 3 from the inclined part 2c. In this way, since the lead frames 3 and 4 are constituted so as to become a right angle from the beginning, magnetism detecting elements 5 and 6 fixed on them can be mutually vertically set, and magnetic fluxes in the vertical two directions can be respectively and accurately detected in the X direction by the detecting element 5 and in the Y direction by the detecting element 6. It can also be applied to an element such as an optical element without being limited to magnetism.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、多次元実装構造、
詳しくは自動車のスロットル等の回転角度を検出する回
転角度センサなどに使われる磁気センサおよびその製造
方法に関するものである。
TECHNICAL FIELD The present invention relates to a multidimensional mounting structure,
More specifically, the present invention relates to a magnetic sensor used as a rotation angle sensor for detecting a rotation angle of an automobile throttle or the like and a manufacturing method thereof.

【0002】[0002]

【従来の技術】従来の多次元実装構造技術には、例えば
特開平2−15252号公報に記載されているものがあ
る。この従来技術では、装着面に対してモールドの中に
感磁体を垂直に埋め込むと共に、リードフレームを装着
面に平行に引き出した実装技術である。これによって、
装着面を基準にして正確に平行に、装着面に平行な磁束
を捕える事ができる。このため、通常のモールド構造で
は、装着面に対してモールドの中に感磁体を平行に埋め
込むことが容易なため、両者を並べて装着すれば、装着
面に垂直と平行な磁束を感知できるため、磁束の大きさ
と方向を知ることができる。磁石を回転軸の中心に付け
て、回転角度によって磁束の方向を代える機構を付加す
ることによって、回転角度センサになる。
2. Description of the Related Art A conventional multidimensional mounting structure technology is disclosed in, for example, Japanese Patent Laid-Open No. 15252/1990. This conventional technique is a mounting technique in which the magnetic sensitive body is vertically embedded in the mold with respect to the mounting surface and the lead frame is pulled out in parallel to the mounting surface. by this,
It is possible to capture the magnetic flux parallel to the mounting surface exactly in parallel with the mounting surface. For this reason, in a normal mold structure, since it is easy to embed the magnetic sensitive body in parallel to the mounting surface in the mold, if both are mounted side by side, magnetic flux perpendicular to the mounting surface can be sensed. You can know the magnitude and direction of the magnetic flux. A rotation angle sensor is obtained by attaching a magnet to the center of the rotation axis and adding a mechanism for changing the direction of the magnetic flux depending on the rotation angle.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、このよ
うな従来技術では、2方向の磁束を捕えるためには、垂
直と平行の2種類の素子が必要になり、更に、2つの素
子の角度を注意深く決めて装着するにしても、誤差を見
込む必要があるという問題点があった。
However, in such a conventional technique, two kinds of elements, vertical and parallel, are required to capture the magnetic flux in two directions. Further, the angles of the two elements must be carefully adjusted. Even if it was decided and installed, there was a problem that it was necessary to allow for errors.

【0004】本発明はこのような従来の問題点に着目し
てなされたもので、両素子間の取付け誤差を製造段階で
抑えることができる多次元実装構造と製造方法を提供す
ることを目的とする。
The present invention has been made in view of such conventional problems, and an object thereof is to provide a multi-dimensional mounting structure and a manufacturing method capable of suppressing a mounting error between both elements at a manufacturing stage. To do.

【0005】[0005]

【課題を解決するための手段】本発明は上述の課題を解
決するために、各々の検出素子を異なる方向に向けた状
態で、複数の検出素子がモールド固定されている。
According to the present invention, in order to solve the above-mentioned problems, a plurality of detection elements are fixed in a mold with the respective detection elements facing different directions.

【0006】[0006]

【発明の実施の形態】以下、本発明の実施の形態を図面
に基づき詳細に説明する。
Embodiments of the present invention will be described below in detail with reference to the drawings.

【0007】(第1の実施の形態)図1に本発明の第1
の実施の形態の実装構造1の側方からの断面図を示す。
図1において実装構造1を形作るモールド体2の下面が
装着面2aであり、モールド体2の前後面の上下位置に
は、互いに平行で、装着面2aとは45°の角度を持つ
傾斜部2b,2cが設けられている。傾斜部2bから
は、リードフレーム3が下向に突き出ている。傾斜部2
cからは、リードフレーム4がリードフレーム3の垂直
方向に突き出ている。リードフレーム4は、途中から曲
げられて下方に向かう垂直部4aが構成されている。リ
ードフレーム3,4のそれぞれには、磁気検出素子5,
6が接続されている。
(First Embodiment) FIG. 1 shows a first embodiment of the present invention.
The sectional view from the side of the mounting structure 1 of the embodiment is shown.
In FIG. 1, the lower surface of the mold body 2 that forms the mounting structure 1 is a mounting surface 2a, and the inclined portions 2b that are parallel to each other at the upper and lower positions of the front and rear surfaces of the mold body 2 and that have an angle of 45 ° with the mounting surface 2a. , 2c are provided. The lead frame 3 projects downward from the inclined portion 2b. Inclined part 2
From c, the lead frame 4 projects in the vertical direction of the lead frame 3. The lead frame 4 includes a vertical portion 4a that is bent from the middle and extends downward. Each of the lead frames 3 and 4 has a magnetic detection element 5,
6 are connected.

【0008】図2は第1の実施の形態の実装構造1の正
面図を示す。リードフレーム3,4は互い違いに配置さ
れている。
FIG. 2 shows a front view of the mounting structure 1 of the first embodiment. The lead frames 3 and 4 are arranged alternately.

【0009】次に、作用を説明する。図1のようにリー
ドフレーム3とリードフレーム4が最初から直角に設定
されているため、それらの上に固定された磁気検出素子
5,6は、互いに垂直に設定することができる。このた
め、磁気検出素子5で図1のX方向、磁気検出素子6で
図1のY方向の、それぞれ正確に垂直な2方向の磁束を
検出できる。なお、磁気に限らず光素子等の素子にも応
用できる。
Next, the operation will be described. Since the lead frame 3 and the lead frame 4 are set at right angles from the beginning as shown in FIG. 1, the magnetic detection elements 5 and 6 fixed on them can be set perpendicular to each other. Therefore, the magnetic detection element 5 can detect the magnetic flux in the X direction of FIG. 1 and the magnetic detection element 6 in the Y direction of FIG. It should be noted that the present invention is not limited to magnetism, and can be applied to elements such as optical elements.

【0010】(第2の実施の形態)図3に本発明の第2
の実施の形態の実装構造1のリードフレーム3,4を製
造するための元の平坦なフレーム7の平面図を示す。図
3においてリードフレーム3,4のそれぞれの根元には
基部8,9が設けられており、フレーム7の橋渡し部7
aとはそれぞれ細い曲げ部8a,9aでつながってい
る。磁気検出素子5が固定されたリードフレーム3と、
電気接続された他のリードフレーム3の一群は共通の基
部8に固定されている。磁気検出素子6が固定されたリ
ードフレーム4と、電気接続された他のリードフレーム
4の一群は共通の基部9に固定されている。リードフレ
ーム3,4はそれぞれ互い違いに配置されている。
(Second Embodiment) FIG. 3 shows a second embodiment of the present invention.
The top view of the original flat frame 7 for manufacturing the lead frames 3 and 4 of the mounting structure 1 of the embodiment of FIG. In FIG. 3, base portions 8 and 9 are provided at the roots of the lead frames 3 and 4, respectively, and the bridging portion 7 of the frame 7 is provided.
It is connected to a by thin bent portions 8a and 9a, respectively. A lead frame 3 to which a magnetic detection element 5 is fixed,
A group of other electrically connected lead frames 3 is fixed to a common base 8. The lead frame 4 to which the magnetic detection element 6 is fixed and a group of other lead frames 4 electrically connected are fixed to a common base 9. The lead frames 3 and 4 are arranged alternately.

【0011】図4は図3の平坦なフレーム7に、曲げ加
工を施した後の側面図を示す。リードフレーム3,4を
曲げないために、リードフレーム3,4のそれぞれの基
部8,9とフレーム7との間に曲げ応力を施して、リー
ドフレーム3,4は互いに垂直になるように、曲げ部8
a,9aで曲げている。
FIG. 4 is a side view of the flat frame 7 shown in FIG. 3 after being bent. In order not to bend the lead frames 3 and 4, bending stress is applied between the bases 8 and 9 of the lead frames 3 and 4 and the frame 7, so that the lead frames 3 and 4 are bent perpendicular to each other. Part 8
It is bent at a and 9a.

【0012】図5はフレーム7をモールド加工を施して
いる様子を示す説明図である。モールド体2を形成する
ための金型は上下に分けられる。金型10は、リードフ
レーム3,4が互いに垂直になるように45°の山形状
をしており、頂上にくぼみを付けてモールド体2の形状
を作っている。モールド体2の装着面2aはリードフレ
ーム3と垂直に設定されている。傾斜部2b,2cを作
るための金型の面は、上下金型を分割してモールド体2
を垂直に引き抜くために、金型10の基盤面に垂直に設
定されている。金型11も同様で、傾斜部2b,2cを
作るための金型の面はモールド体2を垂直に引き抜くた
めに、金型11の基盤面に垂直に設定されている。
FIG. 5 is an explanatory view showing a state where the frame 7 is molded. The mold for forming the mold body 2 is divided into an upper mold and a lower mold. The mold 10 has a mountain shape of 45 ° so that the lead frames 3 and 4 are perpendicular to each other, and a recess is formed at the top to form the mold body 2. The mounting surface 2a of the molded body 2 is set to be perpendicular to the lead frame 3. The surfaces of the mold for forming the inclined portions 2b and 2c are divided into upper and lower molds and the mold body 2
Is set vertically to the base surface of the mold 10 in order to pull it out vertically. The same applies to the mold 11, and the surface of the mold for forming the inclined portions 2b and 2c is set to be perpendicular to the base surface of the mold 11 in order to pull out the mold body 2 vertically.

【0013】次に、作用を説明する。基部8,9とフレ
ーム7との間に曲げ応力を施しているため、リードフレ
ーム3,4には曲げ加工の影響はない。曲げ加工を施さ
れたフレーム7を金型10,11ではさんだ後、モール
ド材を入れてモールド体2を成形する。リードフレーム
3,4は金型10,11で設定される垂直な面ではさま
れるため、モールド材を入れても動くことなく、互いに
垂直な面を構成できる。さらに、装着面2aも金型10
で正確に設定できる。成型されたモールド体2は金型1
0,11から垂直に楽に引き抜くことができる。その
後、リードフレーム3,4は基部8,9から切り離され
て、リードフレーム4は中から曲げられて下方に向かう
垂直部4aが構成される。
Next, the operation will be described. Since bending stress is applied between the bases 8 and 9 and the frame 7, the lead frames 3 and 4 are not affected by bending. After the frame 7 that has been subjected to the bending process is sandwiched between the molds 10 and 11, a molding material is inserted to mold the molded body 2. Since the lead frames 3 and 4 are sandwiched by the vertical surfaces set by the molds 10 and 11, they do not move even when a molding material is put therein, and can form mutually vertical surfaces. Further, the mounting surface 2a is also the mold 10
Can be set accurately. Molded body 2 is mold 1
You can easily pull it out vertically from 0 and 11. After that, the lead frames 3 and 4 are separated from the base portions 8 and 9, and the lead frame 4 is bent from the inside to form a vertical portion 4a directed downward.

【0014】(第3の実施の形態)図6に、本発明の第
3の実施の形態の3次元の磁気検出を行なうためのフレ
ーム12を示す。図6においてリードフレーム13,1
4の他にY方向を検出するためのリードフレーム15
を、元のフレーム12に設けたものである。この第3の
実施の形態は第2の実施の形態とほぼ同様な製造工程を
取り、リードフレーム13,14,15をそれぞれに直
角に曲げた後に、モールド加工を施して立体構造とす
る。
(Third Embodiment) FIG. 6 shows a frame 12 for carrying out three-dimensional magnetic detection according to a third embodiment of the present invention. In FIG. 6, the lead frames 13, 1
4 and lead frame 15 for detecting the Y direction
Is provided on the original frame 12. In the third embodiment, substantially the same manufacturing steps as those in the second embodiment are taken, and the lead frames 13, 14 and 15 are bent at right angles to each other and then molded to form a three-dimensional structure.

【0015】[0015]

【発明の効果】以上説明したように本発明によると、あ
らかじめ複数の検出素子を、それぞれの設定角に固定し
たままモールドするため、多軸の方向成分を正確な角度
設定で検出できる。
As described above, according to the present invention, a plurality of detecting elements are molded in advance while being fixed at their respective set angles, so that it is possible to detect directional components of multiple axes with accurate angle settings.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施の形態の実装構造1の側方
からの断面図である。
FIG. 1 is a side sectional view of a mounting structure 1 according to a first embodiment of the present invention.

【図2】本発明の第1の実施の形態の実装構造1の正面
図である。
FIG. 2 is a front view of the mounting structure 1 according to the first embodiment of this invention.

【図3】本発明の第2の実施の形態のリードフレームの
平面図である。
FIG. 3 is a plan view of a lead frame according to a second embodiment of the present invention.

【図4】本発明の第2の実施の形態のリードフレームの
曲げ加工を施した後の側面図である。
FIG. 4 is a side view of the lead frame according to the second embodiment of the present invention after bending.

【図5】本発明の第2の実施の形態のモールド加工を施
している様子を示す側面図である。
FIG. 5 is a side view showing a state where a molding process according to a second embodiment of the present invention is performed.

【図6】本発明の第3の実施の形態のリードフレームの
平面図である。
FIG. 6 is a plan view of a lead frame according to a third embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 実装構造 2 モールド体 2a 装着面 2b,2c 傾斜部 3,4,13,14,15 リードフレーム 4a 垂直部 5,6 磁気検出素子 7,12 フレーム 7a 橋渡し部 8,9 基部 8a,9a 曲げ部 10,11 金型 1 Mounting structure 2 Molded body 2a Mounting surface 2b, 2c Inclined part 3,4,13,14,15 Lead frame 4a Vertical part 5,6 Magnetic detection element 7,12 Frame 7a Bridging part 8,9 Base part 8a, 9a Bending part 10,11 mold

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 各々の検出素子を異なる方向に向けた状
態で、複数の検出素子がモールド固定されていることを
特徴とする多次元実装構造。
1. A multi-dimensional mounting structure, wherein a plurality of detection elements are fixed to a mold, with the respective detection elements facing different directions.
【請求項2】 各々の検出素子を異なる方向に向けた状
態で、複数の検出素子をモールド固定することを特徴と
する請求項1記載の多次元実装構造の製造方法。
2. The method for manufacturing a multi-dimensional mounting structure according to claim 1, wherein the plurality of detection elements are fixed by molding with the respective detection elements facing different directions.
【請求項3】 検出素子が固定された複数のリードフレ
ームを、一体のフレーム上に形成するとともに、各リー
ドフレームを異なる方向に向けて曲げ加工した後に、モ
ールド固定することを特徴とする請求項2記載の多次元
実装構造の製造方法。
3. A plurality of lead frames to which the detecting elements are fixed are formed on an integral frame, and the lead frames are bent in different directions and then fixed by molding. 2. The method for manufacturing a multidimensional mounting structure according to 2.
【請求項4】 検出素子が固定されたリードフレームに
つながる基部と、基部とフレームをつなぐ曲げ部がフレ
ームに設けられ、異なる方向に向けての曲げ加工が曲げ
部で施されることを特徴とする請求項2もしくは3記載
の多次元実装構造の製造方法。
4. A base portion connected to a lead frame to which a detecting element is fixed, and a bending portion connecting the base portion and the frame are provided in the frame, and bending processing in different directions is performed at the bending portion. The method for manufacturing a multidimensional mounting structure according to claim 2 or 3.
JP6648996A 1996-03-22 1996-03-22 Multidimensional mounting structure and manufacture Pending JPH09257511A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6648996A JPH09257511A (en) 1996-03-22 1996-03-22 Multidimensional mounting structure and manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6648996A JPH09257511A (en) 1996-03-22 1996-03-22 Multidimensional mounting structure and manufacture

Publications (1)

Publication Number Publication Date
JPH09257511A true JPH09257511A (en) 1997-10-03

Family

ID=13317272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6648996A Pending JPH09257511A (en) 1996-03-22 1996-03-22 Multidimensional mounting structure and manufacture

Country Status (1)

Country Link
JP (1) JPH09257511A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006040987A1 (en) * 2004-10-08 2006-04-20 Yamaha Corporation Method of producing physical quantity sensor
US7187063B2 (en) 2002-07-29 2007-03-06 Yamaha Corporation Manufacturing method for magnetic sensor and lead frame therefor
US7221157B2 (en) * 2004-02-06 2007-05-22 Denso Corporation Magnetic sensor apparatus and manufacturing method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7187063B2 (en) 2002-07-29 2007-03-06 Yamaha Corporation Manufacturing method for magnetic sensor and lead frame therefor
US7494838B2 (en) 2002-07-29 2009-02-24 Yamaha Corporation Manufacturing method for magnetic sensor and lead frame therefor
US7541665B2 (en) 2002-07-29 2009-06-02 Yamaha Corporation Lead frame for a magnetic sensor
US8138757B2 (en) 2002-07-29 2012-03-20 Yamaha Corporation Manufacturing method for magnetic sensor and lead frame therefor
US7221157B2 (en) * 2004-02-06 2007-05-22 Denso Corporation Magnetic sensor apparatus and manufacturing method thereof
WO2006040987A1 (en) * 2004-10-08 2006-04-20 Yamaha Corporation Method of producing physical quantity sensor
US7754130B2 (en) 2004-10-08 2010-07-13 Yamaha Corporation Method for manufacturing physical quantity sensor

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