JPH0924463A - Jet type soldering device - Google Patents

Abstract

PURPOSE: To efficiently prevent the occurrence gas pools by preventing the possibility that the jet holes of a jet plate are clogged and positively changing the sizes, heights, etc., of jet waves. CONSTITUTION: A solder vessel 17 is internally provided with a jet nozzle 21 and the opening at the top end of the jet nozzle 21 is provided with the jet plate 23 having the many jet holes 24. The jet holes 24 are formed slender in the width direction of a substrate P and pins 26 disposed to project from a pin mounting plate 25 are loosely fitted respective freely movably in the same direction into the respective jet holes 24. A pin actuating mechanism 27 for moving the pins 26 back and forth within the jet holes 24 is connected to the pin mounting plate 25. The clogging of the jet holes 24 is prevented by moving the pins 26 in the longitudinal direction of the jet holes 24 and the sizes, heights, etc., of the jet waves are changed by changing the opening area of the jet holes 24 bisected by the pins 26.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jet soldering device.

[0002]

2. Description of the Related Art A conventional jet-type soldering apparatus is provided with a jet nozzle in a solder bath, as shown in Japanese Patent Publication No. Sho 62-15313 or Japanese Examined Patent Publication No. 1-34712, and the upper end opening of this jet nozzle is provided. A jet plate having a large number of jet holes in its part or one equivalent to the jet plate is movably provided, and by horizontally reciprocating the jet plate itself, the jet waves protruding above the jet holes are formed. It is reciprocating.

By moving the jet wave in this manner, flux gas generated on the lower surface of the printed wiring board at the time of soldering is expelled from between the chip parts and the like, and a gas pool is generated at a place to be soldered. The soldering failure, that is, non-wetting does not occur.

[0004]

In this conventional device,
The jet holes of the jet plate may be clogged with oxides, etc.
If this blockage occurs, there is no way to eliminate it.
There was a problem such as the non-wetting of the printed wiring board.

Further, the conventional jet plate prevents the generation of a gas pool by laterally changing the jet wave formed above each jet hole so that the jet wave itself is large and high. There is no technical idea that positively changes the
There was room for improvement in this respect.

The present invention has been made in view of the above points, and further prevents the jet holes of the jet plate from being clogged and positively changes the size and height of the jet wave to further improve the effect. The purpose is to prevent the generation of a typical gas pool.

[0007]

According to a first aspect of the present invention, there is provided a jet type solder in which a jet nozzle is provided in a solder bath, and a jet plate having a large number of jet holes is provided at an upper end opening of the jet nozzle. The soldering device is a jet type soldering device having a pin loosely fitted in the jet hole and an operating mechanism for moving at least one of the pin and the jet plate.

According to a second aspect of the present invention, in the jet type soldering apparatus according to the first aspect, the jet hole is formed to be elongated, and the pin is relatively movable with respect to the jet hole in the longitudinal direction of the jet hole. It has a structure fitted to.

According to a third aspect of the present invention, in the jet type soldering apparatus according to the first aspect, the jet holes and the pins fitted in the jet holes are provided so as to be inclined in the work transfer direction. Is.

According to a fourth aspect of the present invention, in the jet soldering apparatus according to the first aspect, the jet holes are provided with different diameters within the thickness of the jet plate, and are formed with different diameters depending on the position in the pin protruding direction. The ejected pin is fitted in the jet hole so as to be reciprocally movable in the pin projecting direction.

According to a fifth aspect of the present invention, in the jet soldering apparatus according to any one of the first to fourth aspects, a jet plate is fixedly provided at an upper end opening of the jet nozzle, and the jet plate is provided. In this configuration, a pin loosely fitted in the jet hole is movably provided, and a pin actuating mechanism for moving the pin in the jet hole is connected to the pin.

According to a sixth aspect of the present invention, in the jet type soldering apparatus according to any one of the first to fourth aspects, a jet plate is movably provided at an upper end opening of the jet nozzle, and the jet plate is provided. In this configuration, a pin that is loosely fitted in the jet hole is fixedly provided, and a jet plate actuating mechanism that moves the jet plate is connected to the jet plate.

[0013]

According to the first aspect of the present invention, at least one of the jet plate and the pin loosely fitted in the jet hole is moved relative to the jet hole by the actuating mechanism, so that the jet hole made of oxide or the like is formed. In addition to preventing clogging, the size and height of individual jet waves are positively changed to effectively prevent gas accumulation on the bottom surface of the work.

According to the second aspect of the present invention, the pin is relatively moved in the longitudinal direction of the elongated jet hole to prevent clogging of the jet hole and to prevent the jet hole from clogging. The opening area of the divided jet hole is changed to change the size and height of the jet wave.

According to the third aspect of the present invention, the jet holes and the pins that are tilted in the workpiece conveying direction are applied to the jet waves that are disturbed from the front or the rear of the work, so that the front and rear portions of the chip component and the like are applied. Prevents the generation of gas pools.

According to the fourth aspect of the invention, the pins having different diameters are reciprocally moved relative to the jet holes having different diameters.
The height of each jet wave is remarkably changed by narrowing or opening the opening around the pin.

In a fifth aspect of the present invention, a pin operating mechanism moves a pin loosely fitted in the jet hole of the jet plate fixedly provided.

In a sixth aspect of the present invention, a jet plate having a jet hole loosely fitted to the pin is moved by a jet plate actuating mechanism with respect to the pin fixedly provided.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to various embodiments shown in the drawings.

First, FIG. 11 shows the overall structure of a jet soldering apparatus, which is a work for carrying a work such as a component mounting board to be soldered from a work carrying-in port 12 to a work carrying-out port 13 of a device body 11. A conveyor 14 is provided.

Along the conveyor 14, a fluxer 15 for applying a foamed flux to a work, a preheater 16 for preheating the work, and a solder bath 17 for soldering the work with molten solder jetted from a jet nozzle. When,
A fan 18 for cooling the soldered work is sequentially arranged.

A primary jet nozzle 21 and a secondary jet nozzle 22 are provided in the solder bath 17. A jet plate 23 having a large number of jet holes is provided at the upper end opening of the primary jet nozzle 21.

FIG. 1 shows an example of a jet-type soldering device according to the invention described in claims 1, 2 and 5, wherein a jet plate 23 is fixedly provided at the upper end opening of a jet nozzle 21. A large number of pins 26 mounted on a pin mounting plate 25 movably provided in the horizontal direction are loosely fitted in the respective jet holes 24 of the plate 23, and the pins 26 are relatively moved in the jet holes 24. A pin operating mechanism 27 is provided on the pin mounting plate 25 as an operating mechanism.

The pin operating mechanism 27 connects an operating rod 29a of an actuator 29 such as an air cylinder via a connecting member 28. The operating rod 29a reciprocates within the opening range of the jet hole 24.

Inside the solder bath 17, a pump casing is connected to the primary jet nozzle 21 via a duct 31.
32 is provided, and the pump blades are provided inside the pump casing 32.
33 is rotatably supported by a pump shaft 34.
A pulley 35, which is rotated by a motor (not shown) via a belt transmission mechanism, is provided on the upper portion of the pump casing 34.
A suction port 36 for the molten solder S is opened on the lower surface of 32.
Such a pump mechanism is also provided for the secondary jet nozzle 22.

The work transfer conveyor 14 is equipped with endless chains not shown in the figure along the left and right rails 37 arranged in parallel, and a large number of work transfer claws 38 projecting from the endless chains are synchronized to the left and right. The work (parts mounting board) P sandwiched by the left and right work transfer claws 38 is driven to rotate at a speed.

As shown in FIG. 2, jet guide plates 39 are integrally provided on the work loading side and the work unloading side of the jet flow plate 23. The jet flow guide plate 39 protrudes obliquely downward from the jet flow plate 23 and has its tip immersed in the molten solder surface in the solder bath 17, so that the molten solder ejected from the jet holes 24 of the jet flow plate 23 can be applied to the solder bath 17 There is a smooth return function.

The molten solder S sucked into the central portion of the pump casing 32 from the suction port 36 by the rotation of the pump blade 33 is discharged from the outer peripheral portion of the pump casing 32, passes through the duct 31, and is shown in FIG. As described above, the molten solder is supplied to the lower surface of the work P that jets from the primary jet nozzle 21 and the secondary jet nozzle 22 and moves diagonally by the transfer conveyor 14.

The primary jet nozzle 21 has a jet hole 24 of a jet plate 23.
A large number of small primary jet waves W1 are ejected irregularly from the nozzle to supply molten solder to every corner of the electrode parts of the chip component, and the secondary jet nozzle 22 is used to generate a quiet secondary jet wave W2.
The soldering part is shaped by.

As shown in FIGS. 3 and 4, the jet hole 24 of the jet plate 23 is an ellipse elongated in the width direction of the work P, and the pin 26 is formed in the longitudinal direction of the jet hole 24. Movably fit to. Pin 26 is attached to pin mounting plate 25
Arrange in rows and project.

Next, the operation of the pin 26 of the jet type soldering device will be described with reference to FIG. 4. The pin 26 loosely fitted in the longitudinal direction of each jet hole 24 formed in the jet plate 23 will be described. By reciprocating in the work width direction by the operating mechanism 27, the clogging of the jet holes 24 due to oxides and the like is prevented, and the size and height of the individual primary jet waves W1 are positively changed to reduce the work bottom surface. Effectively prevent the generation of gas pool in.

That is, FIG. 4 (A) (a), FIG. 4 (B)
As shown in FIGS. 4B and 4C, by moving the pin 26, the jet hole 24 divided by the pin 26 is divided into two.
The opening area of the primary jet wave W1 is changed to change the size and height of the primary jet wave W1.

In the case of FIGS. 4A and 4A, a jet hole 24 having a large opening area is formed on the right side of each pin 26. In this case,
A large primary jet wave W1 is formed high.

In the case of FIGS. 4B and 4B, jet holes 24 having a small opening area are formed on both sides of each pin 26. In this case,
The small primary jet wave W1 narrowed by the small jet holes 24 is formed low.

In the case of FIGS. 4C and 4C, a jet hole 24 having a large opening area is formed on the left side of each pin 26. In this case,
A large primary jet wave W1 is formed high.

That is, the primary jet wave W1 repeatedly rises and falls on the left and right sides of each pin 26, and due to the fluctuation of the wave height in the vertical direction, molten solder can be effectively supplied to the gaps between the components mounted on the board. Prevent the possibility that flux gas generated during attachment will accumulate in the above gaps.

FIG. 5 shows a modified example of the essential part of the same jet type soldering device, which is an example in which three rows of pins 26 are attached to the pin attachment plate 25.

FIG. 6 shows the essential parts of the jet type soldering apparatus according to the inventions described in claims 3 and 5, and the jet plate 23
The jet hole 24 and the pin 26 fitted into the jet hole 24 are tilted in the conveying direction of the work P and provided. The jet holes 24 are formed to be elongated in a direction perpendicular to the plane of FIG. 6, and the pin 26 can be reciprocated in the same direction.
This is similar to the above embodiment.

Then, the primary jet wave W1 disturbed from the front or rear of the work P is obliquely applied by the jet holes 24 and the pins 26 tilted in the work transfer direction, so that the components mounted on the lower surface of the substrate It effectively prevents the accumulation of gas in the front and back that tends to become shade.

For example, a jet wave jetted from the jet hole 24 on the right side toward the upper left is applied from the front side of a chip component or the like mounted on the lower surface of the substrate, and a jet flow jetted from the jet hole 24 on the left side toward the upper right. By applying the waves from the rear of the chip component or the like, it is possible to effectively prevent the generation of gas pools in the front and rear parts of the chip component or the like.

7 (A) and 7 (B) show the essential parts of the jet type soldering apparatus according to the invention described in claims 4 and 5, and the jet holes 24 formed in the jet plate 23 are provided with the jet holes 24. A pin 26 having a different diameter within the thickness of the plate 23 and having a different diameter depending on the position in the pin projecting direction is fitted in the jet hole 24 so as to be reciprocally movable in the pin projecting direction.

That is, the jet hole 24 has a tapered hole 24a having a gradually increasing diameter from the middle to the lower surface of the jet plate 23 to the round hole having the same diameter from the upper surface to the middle of the plate thickness. Similarly, the pin 26 also has a tapered surface 26a having a gradually increasing diameter from the middle of the pin to the lower end of the portion formed to have the same diameter from the upper end to the middle of the pin.

The taper hole 24a having a different diameter in the vertical direction
By vertically moving the taper surface 26a having a different diameter in the vertical direction, the gap between the taper hole 24a and the taper surface 26a is narrowed or opened, and when narrowed, individual primary jet waves are lowered, When opened, they are raised to significantly change the height of their jet waves.

8 to 10 show claims 1, 2 and 6
Shows a jet type soldering device according to the invention described in,
A jet plate 23 is movably provided in the upper end opening of the primary jet nozzle 21 in the work width direction (longitudinal direction of FIGS. 8 and 9), and a large number of jet holes 24 formed in the jet plate 23 in the same direction are elongated.
Inside, a large number of pins 26 fixed via pin mounting plates 25 in the upper end opening of the primary jet nozzle 21 are loosely fitted relative to each other, and the jet plates 23 are arranged in the longitudinal direction of the jet holes 24. The jet plate actuating mechanism 41 that moves in the direction (work width direction) is connected.

As shown in FIG. 10 and the like, the movable structure of the jet plate 23 is such that the edge portions of the primary jet nozzle 21 on the work loading side and the unloading side are bent outward to form guide convex portions 42. Guide recesses 43 are formed in the lower portions of the work flow-in side and the carry-out side of the jet plate 23, and the guide recesses 43 are slidably fitted in the guide protrusions 42.

The jet plate operating mechanism 41 connects an operating rod 29a of an actuator 29 such as an air cylinder attached to the tank body of a solder bath (not shown) to one end of the jet plate 23. The operating rod 29a reciprocates within the opening range of the jet hole 24.

Then, the jet plate is moved by the jet plate actuating mechanism with respect to the pin 26 fixedly provided, and the position of the pin 26 in the jet hole 24 is relatively moved, so that the jet flow by the oxide or the like is generated. While preventing clogging of the holes 24 with the pins 26, the opening area of the jet holes 24 divided by the pins 26 is changed to positively change the size and height of each primary jet wave, and work Effectively prevent the accumulation of gas on the lower surface.

Further, also in the embodiment for moving the jet plate 23 shown in FIGS. 8 to 10, the jet holes 24 and the jet holes 24 are fitted in the same manner as the embodiment shown in FIG. The pins 26 are provided so as to be tilted in the workpiece conveying direction, or like the embodiment shown in FIG. 7, the jet holes 24 are provided with different diameters within the thickness of the jet plate 23, and the pins project into the jet holes 24. A technique of fitting pins 26 having different diameters depending on the position in the direction can be used together. However, in this case, the jet plate 23 is made to reciprocate in the vertical direction with respect to the fixed pin 26.

In the above description, the reciprocating motion of the jet plate 23 or the pin 26 is not limited to its stroke and speed, and includes a relatively low speed reciprocating motion to a relatively high speed vibration. . Further, the jet flow plate 23 is not limited to a flat plate, and includes, for example, a jet flow plate formed in a cylindrical shape.

[0050]

According to the first aspect of the present invention, by moving at least one of the jet hole and the pin by the actuating mechanism, it is possible to reliably prevent the jet hole from being clogged with oxide or the like and to form the jet hole on the jet hole. The size and height of the generated jet wave can be changed, and the fluctuation effectively eliminates the flux gas from the lower surface of the work, effectively generating gas pools on the lower surface of the board even in high-density mounting boards. It is possible to prevent soldering defects such as non-wetting.

According to the second aspect of the present invention, the pin is fitted in the elongated jet hole, and the pin is relatively moved in the longitudinal direction of the jet hole, thereby clogging the jet hole. It is possible to prevent the generation of the gas pool on the lower surface of the work by changing the opening area of the jet hole divided by the pin to change the size and height of the jet wave.

According to the third aspect of the present invention, the jet holes and the pins that are tilted in the workpiece conveying direction can apply a disturbed jet wave to the workpiece from the front or the rear, and the front and rear of the chip component or the like. It is possible to prevent the occurrence of non-wetting due to the accumulation of gas in the part that is easily shaded by the parts.

According to the fourth aspect of the invention, the pins having different diameters are reciprocally moved relative to the jet holes having different diameters.
The height of the jet wave can be remarkably changed by narrowing or opening the opening gap around the pin, and it is possible to effectively prevent the generation of gas accumulation on the lower surface of the work due to the fluctuation of the jet wave height. .

According to the fifth aspect of the present invention, by moving the pin with respect to the fixed jet hole by the pin operating mechanism, it is possible to reliably prevent clogging of the jet hole due to oxides and the like, and to form on the jet hole. The magnitude and height of the generated jet wave can be varied, and the variation can effectively prevent the generation of a gas pool on the lower surface of the work, and prevent soldering defects such as non-wetting.

According to the sixth aspect of the present invention, by moving the jet hole with respect to the fixed pin by the jet plate actuating mechanism, it is possible to reliably prevent clogging of the jet hole due to oxides and the like, and at the same time, the jet hole is The magnitude and height of the formed jet wave can be changed, and the fluctuation can effectively prevent the generation of a gas pool on the lower surface of the work, and prevent soldering failure such as non-wetting.

[Brief description of drawings]

FIG. 1 is a sectional view showing a first embodiment of a jet type soldering apparatus according to the invention described in claims 1, 2 and 5.

FIG. 2 is a sectional view of the first embodiment in the work transfer direction.

FIG. 3A is a sectional view of an essential part of the first embodiment,
FIG. 3B is a sectional view in the work transfer direction.

4A and 4B show the operation of the main part of the first embodiment, FIG. 4A is a plan view of the main part when the pin is moved to the left, and FIG.
(B) is a plan view of an essential part at the center of the pin, (b) is a sectional view thereof, (C) is a plan view of an essential part when the pin is moved rightward, and (c) is a sectional view thereof.

FIG. 5 is a sectional view of essential parts showing a second embodiment of the same jet-type soldering device.

FIG. 6 is a sectional view showing a third embodiment of the jet soldering apparatus according to the invention described in claims 3 and 5.

FIG. 7 (A) is a plan view of essential parts showing a fourth embodiment of the jet soldering apparatus according to the invention described in claims 4 and 5, and FIG. 7 (B) is a sectional view thereof.

FIG. 8 is a sectional view of essential parts showing a fifth embodiment of the jet soldering apparatus according to the invention described in claims 1, 2 and 6.

FIG. 9 is a plan view of the fifth embodiment of the same.

FIG. 10 is a sectional view taken along line XX-X of the fifth embodiment.

FIG. 11 is a schematic diagram showing an overall configuration of a jet soldering device.

[Explanation of symbols]

 17 Solder bath 21 Jet nozzle 23 Jet plate 24 Jet hole 26 Pin 27 Pin operating mechanism 41 Jet plate operating mechanism

Claims (6)

[Claims] 1. A jet-type soldering device in which a jet nozzle is provided in a solder bath, and a jet plate having a large number of jet holes is provided at an upper end opening of the jet nozzle, wherein a pin loosely fitted in the jet hole is provided. A jet-type soldering device comprising: an operating mechanism that moves at least one of the pin and the jet plate. 2. The jet soldering according to claim 1, wherein the jet hole is formed to be elongated, and a pin is fitted into the jet hole so as to be relatively movable in the longitudinal direction of the jet hole. apparatus. 3. The jet type soldering device according to claim 1, wherein the jet hole and the pin fitted in the jet hole are provided so as to be inclined in the workpiece conveying direction. 4. The jet holes are provided with different diameters within the thickness of the jet plate,
2. The jet soldering device according to claim 1, wherein a pin having a different diameter depending on the position of the pin projecting direction is fitted into the jet hole so as to be reciprocally movable in the pin projecting direction. . 5. A jet plate is fixedly provided at an upper end opening of a jet nozzle, and a pin loosely fitted in a jet hole of the jet plate is movably provided, and the pin is moved in the jet hole with respect to the pin. The jet soldering device according to any one of claims 1 to 4, wherein a pin actuating mechanism is connected. 6. A jet plate movably provided at an upper end opening of a jet nozzle, a pin loosely fitted in a jet hole of the jet plate is fixedly provided, and the jet plate moves the jet plate with respect to the jet plate. The jet type soldering device according to any one of claims 1 to 4, wherein an operating mechanism is connected.