JPH09235358A - Photocurable epoxy resin composition for electronic part and production of electronic part with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a photocurable epoxy resin composition capable of being cured in a short time. SOLUTION: This photocurable epoxy resin composition for electronic parts comprises (A) 100 pts.wt. of an epoxy resin having two or more 1,2-epoxy groups in the molecule, (B) 5-30 pts.wt. of a rubbery elastic resin liquid at the ordinary temperature, (C) 150-350 pts.wt. of an inorganic filler, and (D) 0.1-20 pts.wt. of a group VIb element onium salt capable of receiving UV light to release a Lewis acid onium salt.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photocurable epoxy resin composition for semiconductors, which is suitable for insulating electronic parts, and a method for producing an electronic part which has been insulation-treated with the photocurable epoxy resin composition.

[0002]

2. Description of the Related Art Conventionally, epoxy resin compositions have been widely used as insulating and encapsulating materials for electrical and electronic parts because they have excellent adhesiveness and moisture resistance and have good electrical and mechanical properties.

In recent years, further miniaturization and weight reduction and higher density have been demanded in the electronic industry field. In order to cope with this, direct mounting of semiconductor elements or chip parts on a substrate has come to be widely performed, and the DIP which has been the mainstream in the past has been widely used.
A method called COB (chip on board), in which a dedicated semiconductor chip is directly mounted on a substrate, has become the mainstream, instead of the insertion type mounting technology represented by (dual in-line package).

For COB mounting, wire bonding method, T
AB (Tape Automated Bondin)
The g) method and the flip chip method have been proposed. The wire bond method is characterized by its versatility and low cost.
The AB method has features of thinness and inspectability. The flip chip method reduces the total cost when packaged,
It is also applicable to high-speed logic devices due to its excellent multiple terminals.

On the other hand, as a method of sealing a discrete type semiconductor element, a resin sealing method is often adopted, and an epoxy resin for low voltage transfer molding is used as the resin.

However, in the case of encapsulating a semiconductor element used in the COB method, it is extremely difficult to apply the epoxy resin for transfer molding in view of the structure and the properties such as curability of the resin. It is difficult, and generally, a method of potting a semiconductor element with a liquid encapsulating material and heating and curing is adopted.

[0007]

However, this heat curing requires 2 to 10 hours at a temperature of 100 to 150 ° C., so that there is a problem that workability and productivity are poor.

The present invention solves the above problems of the prior art, is suitable for moisture-proof insulation, etc., and has excellent reliability, and a photo-curable epoxy resin composition for electronic parts, and a method for producing insulating-processed electronic parts. Is provided.

[0009]

According to the present invention, (A) 100 parts by weight of an epoxy resin having two or more 1,2-epoxy groups in a molecule, (B) a rubber-like elastic material 5 which is liquid at room temperature is used.
30 parts by weight, (C) inorganic filler 150 to 350 parts by weight,
And (D) a photocurable epoxy resin composition for electronic parts, containing 0.1 to 20 parts by weight of an onium salt of a Group VIb element that releases a Lewis acid upon receiving ultraviolet light.

The mixing ratios of (A), (B), (C) and (D) will be described. (B) component is (A) component 10
It is preferably 1 to 30 parts by weight, more preferably 5 to 25 parts by weight, and 5 to 2 parts by weight with respect to 0 parts by weight.
It is particularly preferable that the amount is 0 part by weight. If the amount of the component (B) is less than 1 part by weight, the flexibility of the resin cured product will decrease, and
If the amount is more than parts by weight, the coefficient of thermal expansion of the cured resin becomes large and the reliability such as thermal shock resistance deteriorates. The inorganic filler as the component (C) is used in an amount of 150 to 3 with respect to 100 parts by weight of the component (A).
The amount is preferably 50 parts by weight, more preferably 180 to 300 parts by weight, and particularly preferably 200 to 260 parts by weight. When the amount of the component (C) is less than 150 parts by weight, the coefficient of thermal expansion of the cured resin becomes large and the reliability such as thermal shock resistance deteriorates. Workability is reduced. The onium salt of the component (D) is
It is preferably 0.1 to 20 parts by weight, more preferably 0.5 to 15 parts by weight, and particularly preferably 1 to 10 parts by weight, relative to 100 parts by weight of the component (A). When the amount of component (D) is less than 0.1 parts by weight, the curing rate by ultraviolet irradiation becomes slow, and when it exceeds 20 parts by weight, it becomes difficult to form a film.

An element of an electronic component is covered with the composition by potting or filling, and then the composition is cured by irradiating a light ray to manufacture the electronic component.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The epoxy resin (A) used in the present invention having two or more 1,2-epoxy groups in the molecule is a bisphenol A type epoxy resin or a bisphenol F type epoxy which is liquid at room temperature. Resins, bisphenol AD type epoxy resins and novolac type epoxy resins are preferred. Other alicyclic epoxy resins and the like can also be used, and a mixture of these various epoxy resins can also be used.

Bisphenol A type epoxy resin is manufactured and sold by Yuka Shell Epoxy Co., Ltd.
Epicoat 825, Epicoat 827, Epicoat 82
8 (above, trade name of Yuka Shell Epoxy Co., Ltd.), YDF-170, YDF-17 manufactured and sold by Tohto Kasei Co., Ltd. as bisphenol F type epoxy resin.
5S (above, Toto Kasei Co., Ltd. product name) and the like, and as the bisphenol AD type epoxy resin, R-17 manufactured and sold by Mitsui Petrochemical Industry Co., Ltd.
0, R1710 (above, Mitsui Petrochemical Industry Co., Ltd. trade name) and the like. These may be used alone or as a mixture.

Examples of the novolac type epoxy resin include Epicoat 152 and Epicoat 154 (trade names of Yuka Shell Epoxy Co., Ltd.) manufactured and sold by Yuka Shell Epoxy Co., Ltd., which may be used alone or as a mixture. Is used.

As the rubber-like elastic material which is liquid at room temperature (B) used in the present invention, polybutadiene rubber and silicone rubber which are liquid at room temperature are used.

As the inorganic filler (C) used in the present invention, silica, silicon carbide and the like are used, and silica which is particularly excellent in light transmittance is preferable. The particle size of the inorganic filler is
It is preferably 300 μm or less, more preferably 200 μm or less, and particularly preferably 100 μm or less.

It should be noted that any of (A), (B) and (C) cannot be used because a component containing a nitrogen element impedes UV curing.

As the onium salt of the group VIb element which releases a Lewis acid upon receiving ultraviolet ray (D) used in the present invention, a compound represented by formula (I) of the general formula 1 is preferably used.

[0019]

Embedded image Where R is a monovalent organic aromatic group, R ¹ is a monovalent organic aliphatic group selected from alkyl, cycloalkyl and substituted alkyl, and R ² is a heterocyclic ring selected from an aliphatic group and aromatic group. Or a polyvalent organic group constituting a condensed ring structure, X is a Group VIb element selected from sulfur, selenium and tellurium,
M is a metal element or a metalloid element, and Q is a halogen. Further, a is an integer of 0 to 3, b is an integer of 0 to 2, c is an integer of 0 or 1, and (a + b + c) = the valence of X (=
3). Further, d = (ef), f = M valence (= an integer of 2 to 7), and e is an integer of 8 or less and larger than f.

In formula (I), the group contained in R is, for example, an aromatic hydrocarbon group having 6 to 13 carbon atoms, such as a phenyl group, a tolyl group, a naphthyl group or an anthryl group. It may be substituted with 1 to 4 monovalent groups such as an alkoxy group having 1 to 8 carbon atoms, an alkyl group having 1 to 8 carbon atoms, a nitro group, a halogen and a hydroxyl group. R may also be an aromatic heterocyclic group such as an arylacyl group, a benzyl group, an acyl group, an arylamino group, a pyridyl group or a furfuryl group. R ¹ represents an alkyl group having 1 to 8 carbon atoms such as a methyl group, an ethyl _{group, -C 2 H 4 OCH 3,} -CH 2 CO
Substituted alkyl groups such as OC ₂ H ₅ and —CH ₂ COCH ₃ are included. R ² is a group such as

[0021]

Embedded image And the like.

In the complex anion represented by [MQe] ^(ef) -in formula (I) of Formula 1, M is a transition metal element such as Sb, Fe, Sn, Bi, Al, Ca, In,
Ti, Zr, Sc, V, Cr, Mn, Cs, a rare earth element, and a metalloid element, and the rare earth element is a lanthanoid-based element such as Ce, Pr, or Nd, or an actinide-based element such as Th or Pa. , U, Na and the like. Further, B, P, As and the like are used as the semi-metal element. Such complex anions include BF ₄ ⁻ , PF
_{^{6 -, AsF 6 -, SbF}} 6 -, FeCl 4 -, SnCl 6 -, S
bCl ₆ ⁻ , BiCl ₅ ⁻ , AlF ₆ ³⁻ , CaCl ₄ ⁻ , In
F ₄ ⁻ , TiF ₆ ²⁻ , ZrF ₆ ^{− and the} like can be mentioned.

The component (C) is preferably a sulfonium salt of a Group VIb Lewis acid, that is, one in which X in the above general formula (I) is sulfur and M is a Group Vb metal element or metalloid element. Triphenylsulfonium antimony fluoride is preferred.

Further, the resin composition of the present invention includes a colorant,
Various additives such as a silane coupling agent and a curing accelerator may be used.

The photocurable epoxy resin composition for semiconductors according to the present invention is used to produce an insulated COB-mounted electronic component. The production method is the generally known potting method. And ultraviolet curing. In the case of COG (chip on glass), the resin composition may be filled (underfill) in the gap between the semiconductor chip and the glass substrate, and the glass substrate surface may be irradiated with ultraviolet rays to be cured.

[0026]

EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited thereto. Below, "part"
Is expressed in parts by weight. Bisphenol A
Type epoxy resin (using Epicoat 828 (trade name) manufactured by Yuka Shell Epoxy Co., Ltd.) 100 parts, silicon rubber (using KE-3475 (trade name) manufactured by Shin-Etsu Chemical Co., Ltd.) 15 parts, melted Silica (using FB-30 (trade name) manufactured by Denki Kagaku Kogyo Co., Ltd.) 250
Part, 2 parts of a silane coupling agent (using KBM-403 (trade name) manufactured by Shin-Etsu Chemical Co., Ltd.) and 10 parts of triphenylsulfonium hexamonate antimony fluoride are mixed to prepare a photocurable epoxy resin composition for semiconductors. The thing was prepared. The resulting photocurable epoxy resin composition for semiconductors,
It was potted on a glass plate and irradiated with light with an irradiation intensity of 100 mW / cm ² using a high-pressure mercury lamp of 2 kW, and the gelation time was measured. Table 1 shows the results.

Comparative Example 2 triphenylsulfonium antimony hexafluoride was added.
An epoxy resin composition for semiconductors was prepared by mixing and mixing in the same manner as in Example except that 5 parts of -phenyl-4-methylimidazole was used. The obtained epoxy resin composition for semiconductors was potted on a glass plate and heated at 120 ° C. in the same manner as in Examples, and the gelation time was measured. Table 1 shows the results.

[0028]

[Table 1]

[0029]

The photocurable epoxy resin composition for semiconductors of the present invention can be cured in a short time and is excellent in curability.

Claims (2)

[Claims] 1. (A) 100 parts by weight of an epoxy resin having two or more 1,2-epoxy groups in a molecule, (B) 5 to 30 parts by weight of a rubber-like elastic material which is liquid at room temperature, and (C) an inorganic material. 150-350 parts by weight of a filler, and (D) an onium salt of a Group VIb element which releases a Lewis acid upon receiving ultraviolet rays 0.1-0.1
A photocurable epoxy resin composition for electronic parts, containing 20 parts by weight. 2. The electronic component is potted or filled with the photocurable epoxy resin composition for electronic components according to claim 1,
A method of manufacturing an electronic component, which comprises photo-curing.