JPH09232708A - Connection structure of printed circuit board - Google Patents
Connection structure of printed circuit boardInfo
- Publication number
- JPH09232708A JPH09232708A JP8039567A JP3956796A JPH09232708A JP H09232708 A JPH09232708 A JP H09232708A JP 8039567 A JP8039567 A JP 8039567A JP 3956796 A JP3956796 A JP 3956796A JP H09232708 A JPH09232708 A JP H09232708A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- connection
- circuit board
- flexible printed
- pressure contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 abstract description 4
- 230000006835 compression Effects 0.000 abstract 3
- 238000007906 compression Methods 0.000 abstract 3
- 229910000679 solder Inorganic materials 0.000 description 8
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 4
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- AGCPZMJBXSCWQY-UHFFFAOYSA-N 1,1,2,3,4-pentachlorobutane Chemical compound ClCC(Cl)C(Cl)C(Cl)Cl AGCPZMJBXSCWQY-UHFFFAOYSA-N 0.000 description 1
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、たとえばカメラ等
の精密機械を始めとする各種電子機器、装置において、
多層リジットプリント回路基板とフレキシブルプリント
基板とを電気的に接続するためのプリント基板の接続構
造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to various electronic equipments and devices including precision machines such as cameras,
The present invention relates to a printed circuit board connection structure for electrically connecting a multilayer rigid printed circuit board and a flexible printed circuit board.
【0002】[0002]
【従来の技術】多層リジットプリント回路基板(以下、
PCBという)間を電気的に接続する方法として、フレ
キシブルプリント基板(以下、FPCという)を用い、
かつそれぞれの回路基板に対しコネクタ接続部を介して
行なうことが一般に行われている。前記PCBは硬質材
料からなる基板であって、この基板面に接続用コネクタ
を実装するうえで半田の浮きや実装不良のような問題が
ないことから、接続手段として有効である。また、PC
BとFPCとの間を電気的に接続する場合において接続
手段としては、PCB側ではコネクタ、半田ブリッジ、
圧着等を使用し、FPC側では半田ブリッジ、圧接等を
使用することが一般に行われている。2. Description of the Related Art A multilayer rigid printed circuit board (hereinafter referred to as
A flexible printed circuit board (hereinafter referred to as FPC) is used as a method for electrically connecting the
In addition, it is generally performed for each circuit board via a connector connecting portion. The PCB is a board made of a hard material and has no problems such as solder float or mounting failure when mounting a connector for connection on the board surface, and is therefore effective as a connecting means. Also, PC
In the case of electrically connecting B and FPC, a connector, a solder bridge,
It is general practice to use crimping or the like and use solder bridge, pressure welding or the like on the FPC side.
【0003】ここで、上述したようにPCBどおし、あ
るいはPCBとFPCとの間を接続する際の一般的な接
続手段の使い分けは、接続本数や実装スペース、作業
性、信頼性等を考慮して選択される。たとえば接続本数
が少ない場合には接続時の作業性、接続の信頼性を考慮
し、実装スペースに余裕がないならば半田ブリッジどお
しまたは圧着−半田ブリッジを介して接続される。ま
た、実装スペースに余裕があるならばコネクタ−半田ブ
リッジを介して接続され、接続本数が多い場合はコネク
タ−圧接を介して接続される。なお、上述した圧接接続
部には主に平圧接接続端と丸圧接接続端とがあり、一般
的にFPCの端面での接続には平圧接接続端が有効であ
り、FPCの端面以外での接続には丸圧接接続端が用ら
れている。Here, as described above, the number of connections, mounting space, workability, reliability, etc. are taken into consideration when selecting the general connecting means when connecting the PCB or between the PCB and the FPC. To be selected. For example, when the number of connections is small, workability at the time of connection and reliability of connection are taken into consideration, and if there is no mounting space, solder bridges or crimp-solder bridges are used for connection. If the mounting space is large, the connector is connected via the solder bridge, and if the number of connections is large, the connector is connected via the pressure contact. The above-mentioned pressure contact connecting portion mainly has a flat pressure contact connecting end and a round pressure contact connecting end. Generally, the flat pressure contact connecting end is effective for connection at the end face of the FPC, and the pressure contact connecting end other than the end face of the FPC. A round pressure connection end is used for the connection.
【0004】[0004]
【発明が解決しようとする課題】しかし、上述したよう
に従来から知られている接続方法では、以下のような問
題がある。すなわち、プリント基板を組込む各種の機
器、装置において、近年小型化、高性能化が進むに伴っ
て実装スペースが狭くなっており、限られたスペースで
基板上に高密度に部品を実装しなければならない。そし
て、このように高密度に実装可能な基板として多層のP
CBが採用されており、この多層のPCBとFPCとの
間を接続する信号ラインの接続本数が増大したことによ
って、これらの間を接続するための接続用FPCにおけ
るPCBとの接続手段としてコネクタを使用せざるを得
ない状況にある。However, the conventional connection method as described above has the following problems. That is, in various devices and apparatuses that incorporate a printed circuit board, the mounting space has become narrower as the size and performance have advanced in recent years, and components must be mounted on the circuit board with high density in a limited space. I won't. Then, as a substrate that can be mounted with high density as described above, a multilayer P
CB is adopted, and since the number of signal lines connecting between the multilayer PCB and the FPC has increased, a connector is used as a connecting means with the PCB in the connecting FPC for connecting between them. There is no choice but to use it.
【0005】このため、上述した接続用FPCにおける
FPCとの接続手段としては、従来一般に用いている半
田ブリッジでは信号ラインの接続本数に対応する実装ス
ペースを確保することが困難であって、しかもこの半田
ブリッジでの接続を行なうためには、接続用FPCの形
状が複雑となり、また接続時の作業性や接続部の信頼性
に欠けるという問題がある。したがって、上述したよう
なPCBとFPCとの接続にあたって、実装の高密度化
に対応し、しかも接続本数の増大化にも対処し、多層の
PCBとFPCとの接続も簡単に行なえるような何らか
の対策を講じることが望まれている。Therefore, it is difficult to secure a mounting space corresponding to the number of signal lines connected by a solder bridge which is generally used in the past as a means for connecting to the FPC in the above-mentioned connection FPC. In order to perform the connection by the solder bridge, there is a problem that the shape of the FPC for connection becomes complicated, and the workability at the time of connection and the reliability of the connection part are lacking. Therefore, when connecting the PCB and the FPC as described above, it is possible to cope with higher packaging density, cope with an increase in the number of connections, and easily connect the multilayer PCB and the FPC. It is hoped that measures will be taken.
【0006】本発明はこのような事情に鑑みてなされた
ものであり、PCBとFPCとの間を電気的に接続する
にあたって、実装の高密度化に伴なう多数本の信号ライ
ンの接続を、少ない接続スペースでしかも簡単に行なえ
るプリント基板の接続構造を得ることを目的とする。The present invention has been made in view of the above circumstances, and when electrically connecting a PCB and an FPC, connection of a large number of signal lines is required due to high packaging density. The purpose of the present invention is to obtain a printed circuit board connection structure that can be easily performed with a small connection space.
【0007】[0007]
【課題を解決するための手段】このような要請に応える
ために本発明に係るプリント基板の接続構造は、少なく
とも二つのコネクタを有するリジットプリント基板(P
CB)とフレキシブルプリント基板(FPC)とを電気
的に接続するにあたって複数の接続用フレキシブルプリ
ント基板(接続用FPC)を用い、かつこれらの接続用
フレキシブルプリント基板のリジットプリント基板への
接続をコネクタ接続によって行なうとともに、前記フレ
キシブルプリント基板との接続を、圧接接続部に設けた
導電パターンによる多点接続端子部の圧接によって行な
うようにしたものである。In order to meet such a demand, a printed circuit board connection structure according to the present invention is a rigid printed circuit board (P) having at least two connectors.
CB) and the flexible printed circuit board (FPC) are electrically connected by using a plurality of connecting flexible printed circuit boards (connecting FPC), and connecting these connecting flexible printed circuit boards to the rigid printed circuit board by connector connection. In addition, the connection with the flexible printed circuit board is performed by pressure contact of the multi-point connection terminal portion by the conductive pattern provided in the pressure contact connection portion.
【0008】ここで、本発明に係るプリント基板の接続
構造は、リジットプリント基板のコネクタを、この基板
の一辺寄りに並列に配置するとともに、フレキシブルプ
リント基板に、接続用フレキシブルプリント基板の枚数
と同数の圧接接続部を設けたり、リジットプリント基板
を少なくとも4層からなる多層リジットプリント回路基
板によって構成し、かつフレキシブルプリント基板と接
続用フレキシブルプリント基板を、両面基板によって構
成している。Here, in the printed circuit board connection structure according to the present invention, the connectors of the rigid printed circuit board are arranged in parallel near one side of the board and the flexible printed circuit board has the same number as the number of the connecting flexible printed circuit boards. Is provided, the rigid printed circuit board is composed of a multilayer rigid printed circuit board having at least four layers, and the flexible printed circuit board and the connecting flexible printed circuit board are composed of double-sided boards.
【0009】また、本発明に係るプリント基板の接続構
造は、多層リジットプリント回路基板に、二つのコネク
タを基板の一辺寄りに並列に設け、これら二つのコネク
タの接点部を異なる接点群によって構成するとともに、
この多層リジットプリント回路基板と電気的に接続する
フレキシブルプリント基板との接続を、二枚の接続用フ
レキシブルプリント基板によって行なうように構成し、
かつこれらの接続用フレキシブルプリント基板との接続
を行なう圧接接続部を二個所に設け、接続用フレキシブ
ルプリント基板を平行に配置し、それぞれの一方の基板
面に圧接接続部を構成する導電パターンによる圧接接続
用多点接続端子部および信号パターン部を形成し、他方
の基板面にはダミーパターン(電源系パターンまたはグ
ランド系パターン)を形成し、これら二枚の接続用フレ
キシブルプリント基板における圧接接続部を重ね合わせ
た状態でフレキシブルプリント基板の二個所の圧接接続
部で挟み込むことにより圧接接続を行なうようにしてい
る。Also, in the printed circuit board connection structure according to the present invention, two connectors are provided in parallel on one side of the board on the multilayer rigid printed circuit board, and the contact portions of these two connectors are constituted by different contact groups. With
The flexible printed circuit board electrically connected to the multilayer rigid printed circuit board is connected by two flexible printed circuit boards for connection,
In addition, two press-connecting connection parts for connecting to these connecting flexible printed circuit boards are provided, the connecting flexible printed circuit boards are arranged in parallel, and press-contacting by a conductive pattern that constitutes the press-connecting connecting part on one of the respective board surfaces. A multi-point connection terminal portion for connection and a signal pattern portion are formed, and a dummy pattern (power supply system pattern or ground system pattern) is formed on the other board surface. The flexible printed boards are sandwiched between two pressure-contacting connection portions in a stacked state to perform pressure-contacting connection.
【0010】本発明によれば、PCBとFPCとの間を
接続手段として設けた複数の接続用FPCによって行な
うようにし、かつPCB側はコネクタによるコネクタ接
続によって、FPC側は導電パターンによる圧接接続用
多点接続端子部による圧接接続によって接続することに
より、これらのPCBとFPCとの間での多数本の信号
ラインを、少ない接続スペースで効率よく接続すること
が可能となる。According to the present invention, a plurality of FPCs for connection provided between the PCB and the FPC as connection means are used, and the PCB side is for connector connection by a connector and the FPC side is for pressure contact connection by a conductive pattern. By connecting by pressure contact connection using the multi-point connection terminal portion, it becomes possible to efficiently connect a large number of signal lines between these PCBs and FPCs with a small connection space.
【0011】また、PCBの二つのコネクタを、PCB
の一辺寄りに並列に配置し、これらコネクタの異なる接
点群からなる接点部に接続する二枚の接続用FPCを平
行に配置し、さらにこれらの接続用FPCのそれぞれの
接続部および信号パターを同一の基板面に、ダミーパタ
ーン(電源系パターンまたはグランド系パターン)を他
方の基板面に形成することにより、PCBとFPCとの
間での多数本の信号ラインを、少ない接続スペースで効
率よく接続することができるとともに、接続用FPCど
おしのノイズや、FPC側の接続部における他のFPC
からのノイズを防止することもできる。In addition, the two connectors of the PCB are
Are arranged in parallel to one side, and two connection FPCs that connect to the contact portions of different contact groups of these connectors are arranged in parallel, and further, the respective connection portions and signal patterns of these connection FPCs are the same. By forming a dummy pattern (power system pattern or ground pattern) on the other board surface on the other board surface, a large number of signal lines between the PCB and the FPC can be efficiently connected with a small connection space. In addition to being able to, the noise from the FPC for connection and other FPCs at the connection part on the FPC side
The noise from can also be prevented.
【0012】リジットプリント基板は多層、たとえば四
層のリジットプリント回路基板(PCB)であり、また
フレキシブルプリント基板(FPC)、接続用フレキシ
ブルプリント基板(接続用FPC)は両面基板である
が、これには限らない。PCBのコネクタには、接続用
FPCの一端に設けた多数の信号ラインの接続端子群に
よる接続端を差し込んで接続するように構成されてい
る。接続用FPCの他端には多数の信号ラインの接続端
子群としての導電パターンによる圧接接続用多点接続端
子部を有する圧接接続部が設けられ、これらの圧接接続
部は、FPCに設けた圧接接続部と圧接して接続され
る。The rigid printed circuit board is a multilayer printed circuit board (PCB), for example, four layers, and the flexible printed circuit board (FPC) and the connecting flexible printed circuit board (connecting FPC) are double-sided boards. Not necessarily. The connector of the PCB is configured to be inserted and connected with a connection end of a connection terminal group of a large number of signal lines provided at one end of the connection FPC. The other end of the connection FPC is provided with a pressure contact connection portion having a multi-point connection terminal portion for pressure contact connection by a conductive pattern as a connection terminal group of a large number of signal lines, and these pressure contact connection portions are pressure contact terminals provided on the FPC. It is connected by pressure contact with the connection part.
【0013】[0013]
【発明の実施の形態】図1および図2は本発明に係るプ
リント基板の接続構造の一つの実施の形態を示すもので
あり、これらの図において、符号1は適宜の回路部品が
実装されて回路を形成している多層リジットプリント基
板であるPCB、2はこのPCB1と接続するためのフ
レキシブルプリント基板であるFPCである。1 and 2 show an embodiment of a printed circuit board connection structure according to the present invention. In these drawings, reference numeral 1 denotes an appropriate circuit component mounted. PCBs 2 and 2 which are multilayer rigid printed boards forming a circuit are FPCs which are flexible printed boards for connecting to the PCB 1.
【0014】前記PCB1には、図1に示すように、一
方の基板面1aの一辺寄りの部分に、少なくとも二つ、
この実施の形態では二つのコネクタ3,4を並べて設け
ている。なお、このようなコネクタ3,4としては従来
から広く知られている構造のものを用いるとよい。ま
た、前記FPC2は、両面フレキシブルプリント基板に
よって構成され、両面に多数の信号ラインが設けられて
いる。なお、必要に応じて回路部品を実装したものであ
ってもよい。As shown in FIG. 1, the PCB 1 is provided with at least two at one side of the substrate surface 1a.
In this embodiment, the two connectors 3 and 4 are provided side by side. It should be noted that as such connectors 3 and 4, it is preferable to use a connector having a widely known structure. The FPC 2 is composed of a double-sided flexible printed circuit board, and a large number of signal lines are provided on both sides. Note that circuit components may be mounted as needed.
【0015】5,6は上述したPCB1とFPC2との
間を接続する手段として設けた複数枚(この実施の形態
では二枚)の接続用フレキシブルプリント基板である接
続用FPCであって、前記PCB1への接続端7,8に
は、前記コネクタ3,4に差込みによって接続する多数
の信号ラインの接続端子群を並列に露呈させて設けてい
る。このような接続端7,8を対応するコネクタ3,4
に差し込むとそれぞれのラインの接続端子が接続され
る。Reference numerals 5 and 6 are connecting FPCs which are a plurality of (two in this embodiment) connecting flexible printed boards provided as means for connecting between the above-mentioned PCB1 and FPC2. Connection terminals 7 and 8 are provided in parallel with connecting terminal groups of a large number of signal lines connected to the connectors 3 and 4 by insertion. Such connecting ends 7 and 8 are connected to corresponding connectors 3 and 4.
When connected to, the connection terminals of each line are connected.
【0016】また、これらの接続用FPC5,6は、図
2(a),(b)に示すように、一方の基板面に、前記
接続端7,8での接続端子群が形成されるとともにこれ
らの端子に接続する導体パターンによる多数の信号ライ
ン9が形成され、他端の圧接接続部10,11に導かれ
ている。そして、これらの接続用FPC5,6における
圧接接続部10,11には、前記各信号ライン9と接続
されている圧接接続用多点接続端子部12が形成されて
いる。As shown in FIGS. 2 (a) and 2 (b), the connection FPCs 5 and 6 are formed with connection terminal groups at the connection ends 7 and 8 on one substrate surface. A large number of signal lines 9 are formed by a conductor pattern connected to these terminals, and are led to the pressure-contact connecting portions 10 and 11 at the other ends. The pressure contact connecting portions 10 and 11 of the connecting FPCs 5 and 6 are provided with pressure contact connecting multi-point connection terminal portions 12 connected to the signal lines 9.
【0017】この圧接接続用多点接続端子部12は、た
とえば図2(a)に示すように、丸形圧接接続部として
の環状導電パターンを放射方向に向かうスリットにより
複数に分割することにより多点接続端子を構成してい
る。このようにすれば、多数の信号ラインを少ない接続
スペースで効率よく接続することができる。また、前記
接続用FPC5,6の裏面である他方の基板面には、図
2(b)に示すように、銅箔のような導電層によるダミ
ーパターン(電源系パターンまたはグランド系パター
ン)13を形成している。As shown in FIG. 2A, for example, the multi-point connection terminal portion 12 for pressure contact connection is formed by dividing an annular conductive pattern as a round pressure contact connection portion into a plurality of slits extending in the radial direction. It constitutes a point connection terminal. With this configuration, a large number of signal lines can be efficiently connected with a small connection space. Further, as shown in FIG. 2B, a dummy pattern (power source pattern or ground pattern) 13 made of a conductive layer such as copper foil is formed on the other substrate surface which is the back surface of the connection FPCs 5, 6. Is forming.
【0018】一方、これらの接続用FPC5,6によっ
て接続される被接続側であるFPC2の端部には、前記
多点接続端子部12による圧接接続部10,11との接
続を行なう圧接接続部15,16が形成されている。な
お、詳細な図示はしないが、これらの圧接接続部15,
16には、前記多点接続端子部12に対応する形状をも
つ多点接続端子部12が対向する位置に適宜形成されて
いる。この実施の形態では、FPC2の二個所の圧接接
続部15,16を設けるために、このFPC2を二つ折
りし、両端の対向する面に設けている。On the other hand, at the end of the FPC 2 which is the connected side connected by these connecting FPCs 5 and 6, a pressure contact connecting portion for connecting with the pressure contact connecting portions 10 and 11 by the multipoint connection terminal portion 12 is provided. 15 and 16 are formed. Although not shown in detail, these pressure contact connecting portions 15,
The multi-point connection terminal portion 12 having a shape corresponding to the multi-point connection terminal portion 12 is appropriately formed at 16 at a position facing the multi-point connection terminal portion 12. In this embodiment, the FPC 2 is folded in two and provided on opposite surfaces of both ends in order to provide the two press-contacting connection portions 15 and 16 of the FPC 2.
【0019】そして、上述した接続用FPC5,6を、
その圧接接続部10,11が外向きになるように互いに
重ね合わせ、これらを前記FPC2の圧接接続部15,
16で挟み込む状態で圧接することにより、それぞれの
信号ラインの接続を所望の状態で行なえるようにしてい
る。なお、この実施の形態では、二枚の接続用FPC
5,6の導電パターンを形成する面が、同一面側を向く
状態で重ね合わせており、また圧接接続部10,11で
は、それを互いに外向きになる面に設けた場合を示す。
このとき、接続用FPC5,6の裏面でのダミーパター
ン(電源系パターンまたはグランド系パターン)13
は、圧接接続部10の部分には形成しないようにすると
よい。Then, the above-mentioned connection FPCs 5 and 6 are
The pressure contact connecting portions 10 and 11 are overlapped with each other so as to face outward, and these are connected to each other with the pressure contact connecting portions 15 and 15 of the FPC 2.
By press-contacting each other in a state of being sandwiched by 16, the signal lines can be connected in a desired state. In this embodiment, two FPCs for connection are used.
The case where the surfaces forming the conductive patterns 5 and 6 are superposed in a state of facing the same surface side, and the pressure contact connecting portions 10 and 11 are provided on the surfaces facing each other.
At this time, a dummy pattern (power supply system pattern or ground system pattern) 13 on the back surface of the connection FPCs 5, 6
Is preferably not formed in the press-connecting connection portion 10.
【0020】このような接続用FPC5,6を用い、P
CB1とFPC2との間を接続することにより、これら
間での接続を行なう多数本の信号ラインを少ない接続ス
ペースでもって効率よく接続することができる。すなわ
ち、接続用FPC5,6の接続端7,8を、PCB1の
コネクタ3,4にそれぞれ差し込んで接続するととも
に、他端の多点接続端子部12による圧接接続部10,
11を、それぞれFPC2の圧接接続部15,16と圧
接して接続することにより、所望の信号ラインの接続状
態を得ることができる。Using such connecting FPCs 5 and 6, P
By connecting the CB1 and the FPC2, it is possible to efficiently connect a large number of signal lines connecting between them with a small connection space. That is, the connection ends 7 and 8 of the connection FPCs 5 and 6 are respectively inserted into the connectors 3 and 4 of the PCB 1 to be connected, and the pressure contact connection portion 10 by the multipoint connection terminal portion 12 at the other end is connected.
By connecting 11 to the press-connecting connection portions 15 and 16 of the FPC 2 by press-contacting each other, a desired signal line connection state can be obtained.
【0021】図3は上述した実施の形態の変形例を示
し、この実施の形態では、接続用FPC5,6を、ダミ
ーパターン(電源系パターンまたはグランド系パター
ン)13を設けた裏面どおしが対面する状態で重ね合わ
せ、その端部でそれぞれ外向きに設けている圧接接続部
15,16を、FPC2の圧接接続部15,16で挟み
込んで圧接接続している。FIG. 3 shows a modified example of the above-described embodiment. In this embodiment, the connection FPCs 5 and 6 are provided with dummy patterns (power supply system pattern or ground system pattern) 13 on the back side. They are superposed in a state of facing each other, and the press-connecting connection parts 15 and 16 provided outwardly at their ends are sandwiched between the press-connecting connection parts 15 and 16 of the FPC 2 for press-contact connection.
【0022】このような構成によれば、接続用FPC
5,6において、片面に接続端7,8、信号ライン9、
多点接続端子部12による圧接接続部10,11を形成
し、別の片面にダミーパターン(電源系パターンまたは
グランド系パターン)13を形成していることから、こ
れらの接続用FPC5,6の製造が簡単に行われるとと
もに、配設中の接続用FPC5,6どおしのノイズやF
PC2側の接続部分における他のFPCからのノイズの
影響を防止することができる。すなわち、このようなダ
ミーパターン13によれば、たとえば別のFPCからの
ノイズ{発振(クロック)ノイズ、変動が激しい電源ラ
イン等}がアナログライン、特にインピーダンスの高い
ラインに影響を及ぼすことを防止することができる。According to this structure, the FPC for connection is connected.
5 and 6, the connection ends 7, 8 and the signal line 9, on one side,
Since the press-connecting connection parts 10 and 11 are formed by the multi-point connection terminal part 12 and the dummy pattern (power supply system pattern or ground system pattern) 13 is formed on the other surface, manufacturing of these connection FPCs 5 and 6 is performed. And the noise and F of the connection FPCs 5 and 6 being installed.
It is possible to prevent the influence of noise from another FPC in the connection portion on the PC2 side. That is, such a dummy pattern 13 prevents, for example, noise (oscillation (clock) noise, a power supply line with large fluctuation, etc.) from another FPC from affecting analog lines, particularly lines with high impedance. be able to.
【0023】なお、本発明は上述した実施の形態で説明
した構造には限定されず、各部の形状、構造等を適宜変
形、変更することは自由である。たとえば上述した実施
例では、二枚の接続用FPC5,6を用いて、PCB1
とFPC2とを接続した場合を説明したが、本発明はこ
れに限定されず、複数枚の接続用FPCで接続すればよ
い。この場合に、この接続用FPCの各圧接接続部に対
し圧接接続するようにFPC側の圧接接続部を順次重ね
合わせて圧接すればよい。さらに、接続用FPC5,6
の圧接接続部10,11における多点接続端子部12と
して、丸形圧接端子によるものを例示したが、これに限
定されないことは言うまでもない。The present invention is not limited to the structures described in the above-mentioned embodiments, and the shapes, structures, etc. of the respective portions can be freely modified or changed. For example, in the above-described embodiment, the PCB 1 is connected by using the two connecting FPCs 5 and 6.
However, the present invention is not limited to this, and a plurality of connection FPCs may be used for connection. In this case, the pressure contact connection portions on the FPC side may be sequentially overlapped and pressure contacted so as to perform pressure contact connection with each pressure contact connection portion of the connecting FPC. Furthermore, connection FPCs 5, 6
As the multi-point connection terminal portion 12 in each of the pressure contact connecting portions 10 and 11, a round pressure contact terminal is illustrated, but it goes without saying that the invention is not limited to this.
【0024】また、本発明によれば、このようなプリン
ト基板の接続構造を適用する機器として特別には明示し
なかったが、各種の電子機器、装置に適用できることは
勿論である。Further, according to the present invention, although not specifically indicated as a device to which such a printed circuit board connection structure is applied, it can be applied to various electronic devices and apparatuses.
【0025】[0025]
【実施例】リジットプリント基板1は多層、たとえば四
層のリジットプリント回路基板(PCB)であり、また
フレキシブルプリント基板(FPC)2、接続用フレキ
シブルプリント基板(接続用FPC)5,6は両面基板
である。また、PCB2のコネクタ3,4には、接続用
FPCの一端に設けた多数の信号ラインの接続端群によ
る接続端7,8を差し込んで接続するように構成してい
る。さらに、接続用FPCの他端には多数の信号ライン
の接続端群としての丸形圧接端子のような導電パターン
を分割することにより形成している圧接接続用多点接続
端子部12を有する圧接接続部10,11を設けてい
る。また、これらの圧接接続部10,11は、FPC2
に設けた圧接接続部15,16と圧接により接続され
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A rigid printed circuit board 1 is a multilayer printed circuit board (PCB), for example, a four-layered rigid printed circuit board (FPC) 2, a flexible printed circuit board for connection (connection FPC) 5, 6 is a double-sided board. Is. Further, the connectors 3 and 4 of the PCB 2 are configured so that the connection ends 7 and 8 formed by the connection end groups of a large number of signal lines provided at one end of the connection FPC are inserted and connected. Further, a pressure contact having a multi-point connection terminal portion 12 for pressure connection formed at the other end of the connection FPC by dividing a conductive pattern such as a round pressure contact terminal as a connection end group of a large number of signal lines. Connection parts 10 and 11 are provided. Further, these press-connecting connection portions 10 and 11 are connected to the FPC2
It is connected by pressure contact with the pressure contact connection portions 15 and 16 provided on the.
【0026】[0026]
【発明の効果】以上説明したように本発明に係るプリン
ト基板の接続構造によれば、少なくとも二つのコネクタ
を有するリジットプリント基板(PCB)とフレキシブ
ルプリント基板(FPC)とを電気的に接続するにあた
って複数の接続用フレキシブルプリント基板(接続用F
PC)を用い、かつこれらの接続用フレキシブルプリン
ト基板のリジットプリント基板への接続をコネクタ接続
によって行なうとともに、前記フレキシブルプリント基
板との接続を、圧接接続部に設けた導電パターンによる
多点接続端子部の圧接によって行なうようにしたので、
簡単な構成にもかかわらず、以下に述べる優れた効果を
奏する。As described above, according to the printed circuit board connection structure of the present invention, a rigid printed circuit board (PCB) having at least two connectors and a flexible printed circuit board (FPC) are electrically connected. Flexible printed circuit boards for multiple connections (F for connection
PC) and connecting these flexible printed circuit boards to the rigid printed circuit board by connector connection, and the flexible printed circuit board is connected to the flexible printed circuit board by a multi-point connection terminal portion by a conductive pattern provided in the pressure contact connection portion. Since it was done by pressure welding of
Despite the simple structure, the following excellent effects are obtained.
【0027】すなわち、本発明によれば、PCBとFP
Cとの間を接続手段として複数の接続用FPCを用いて
おり、しかもPCB側はコネクタによるコネクタ接続に
よって、FPC側は導電パターンによる圧接接続用多点
接続端子部による圧接接続によって電気的接続を得てい
るので、これらのPCBとFPCとの間での多数本の信
号ラインを、少ない接続スペースで効率よくしかも簡単
に接続することができる。That is, according to the present invention, the PCB and FP
A plurality of FPCs for connection are used as connection means between C and C, and furthermore, electrical connection is made by connector connection on the PCB side and pressure connection by the multi-point connection terminal portion for pressure connection by the conductive pattern on the FPC side. Since it is obtained, a large number of signal lines between these PCB and FPC can be efficiently and easily connected with a small connection space.
【0028】また、本発明によれば、PCBに、二つの
コネクタを基板の一辺寄りに並列に設け、これら二つの
コネクタの接点部を異なる接点群によって構成するとと
もに、このPCBと電気的に接続するFPCとの接続
を、二枚の接続用FPCによって行なうように構成し、
かつこれらの接続用FPCとの接続を行なう圧接接続部
を二個所に設け、接続用FPCを平行に配置し、それぞ
れの一方の基板面に圧接接続部を構成する導電パターン
による圧接接続用多点接続端子部および信号パターン部
を形成し、他方の基板面にはダミーパターン(電源系パ
ターンまたはグランド系パターン)を形成し、これら二
枚の接続用FPCにおける圧接接続部を重ね合わせた状
態でFPCの二個所の圧接接続部で挟み込むことで圧接
接続を行なっており、以下のような利点を奏する。Further, according to the present invention, two connectors are provided on the PCB in parallel near one side of the board, the contact portions of these two connectors are constituted by different contact groups, and are electrically connected to the PCB. The connection with the FPC to be connected is configured by two connecting FPCs,
In addition, multi-points for pressure contact connection are provided by providing pressure contact connection portions for connecting to these connection FPCs at two locations, the connection FPCs are arranged in parallel, and conductive patterns forming the pressure contact connection portions on one of the respective substrate surfaces. A connection terminal portion and a signal pattern portion are formed, a dummy pattern (power supply system pattern or ground system pattern) is formed on the other substrate surface, and the FPC for connecting these two FPCs for connection is superposed. The pressure contact connection is performed by being sandwiched between the two pressure contact connection portions, and has the following advantages.
【0029】すなわち、PCBとFPCとの間での多数
本の信号ラインを少ない接続スペースで効率よく接続で
きることは勿論、配設中の接続FPCどおしのノイズお
よびFPC側の接続部における他のFPCからのノイズ
の影響を防止することもできる。That is, it is of course possible to efficiently connect a large number of signal lines between the PCB and the FPC in a small connection space, and of course, noise of the connecting FPC in the arrangement and other parts in the connecting portion on the FPC side. It is also possible to prevent the influence of noise from the FPC.
【図1】 本発明に係るプリント基板の接続構造の一つ
の実施の形態を示すPCBとFPCとの接続構造の概略
構成を説明するための斜視図である。FIG. 1 is a perspective view for explaining a schematic configuration of a PCB / FPC connection structure showing an embodiment of a printed circuit board connection structure according to the present invention.
【図2】 本発明に係るプリント基板の接続構造の一つ
の実施の形態を示し、PCBとFPCとを接続する両面
基板からなる接続用FPCの表、裏面での導体パターン
を(a),(b)に示す説明図である。FIG. 2 shows an embodiment of a printed circuit board connection structure according to the present invention, in which the front and back conductor patterns (a) and (a) of a connection FPC including a double-sided board for connecting a PCB and an FPC are shown. It is explanatory drawing shown to b).
【図3】 本発明に係るプリント基板の接続構造の別の
実施の形態を示す図1の変形例を示す斜視図である。FIG. 3 is a perspective view showing a modified example of FIG. 1 showing another embodiment of the printed circuit board connection structure according to the present invention.
1…リジットプリント基板(PCB)、2…フレキシブ
ルプリント基板(FPC)、3,4…コネクタ、5,6
…接続用フレキシブルプリント基板(接続用FPC)、
7,8…接続端、9…導体パターンによる信号ライン、
10,11…圧接接続部、12…圧接接続用多点接続端
子部、13…ダミーパターン(電源系パターンまたはグ
ランド系パターン)、15,16…圧接接続部。1 ... Rigid printed circuit board (PCB), 2 ... Flexible printed circuit board (FPC), 3, 4 ... Connector, 5, 6
... Flexible printed circuit board for connection (FPC for connection),
7, 8 ... Connection end, 9 ... Signal line by conductor pattern,
10, 11 ... Pressure contact connection part, 12 ... Multi-point connection terminal part for pressure contact connection, 13 ... Dummy pattern (power system pattern or ground system pattern), 15, 16 ... Pressure contact connection part.
Claims (5)
ットプリント基板とフレキシブルプリント基板とを電気
的に接続する接続構造において、 前記リジットプリント基板とフレキシブルプリント基板
とを複数の接続用フレキシブルプリント基板によって接
続し、 かつこれらの接続用フレキシブルプリント基板の前記リ
ジットプリント基板への接続をコネクタ接続によって行
なうとともに、前記フレキシブルプリント基板との接続
を、圧接接続部に設けた導電パターンによる圧接接続用
多点接続端子部の圧接によって行なうことを特徴とする
プリント基板の接続構造。1. A connection structure for electrically connecting a rigid printed circuit board having at least two connectors to a flexible printed circuit board, wherein the rigid printed circuit board and the flexible printed circuit board are connected by a plurality of connecting flexible printed circuit boards. And the connection of these flexible printed boards to the rigid printed board is performed by connector connection, and the flexible printed board is connected to the multipoint connection terminal portion for pressure contact connection by the conductive pattern provided in the pressure contact connection portion. A printed circuit board connection structure, characterized in that the connection is performed by pressure welding.
において、 リジットプリント基板のコネクタを、この基板の一辺寄
りに並列に配置するとともに、 フレキシブルプリント基板に、接続用フレキシブルプリ
ント基板の枚数と同数の圧接接続部を設けることを特徴
とするプリント基板の接続構造。2. The printed circuit board connection structure according to claim 1, wherein the connectors of the rigid printed circuit board are arranged in parallel near one side of the board, and the flexible printed circuit board has the same number as the number of flexible printed circuit boards for connection. A connection structure for a printed circuit board, comprising:
基板の接続構造において、 リジットプリント基板を、少なくとも4層からなる多層
リジットプリント回路基板によって構成し、 フレキシブルプリント基板と接続用フレキシブルプリン
ト基板を、両面フレキシブルプリント基板によって構成
したことを特徴とするプリント基板の接続構造。3. The printed circuit board connection structure according to claim 1, wherein the rigid printed circuit board is configured by a multilayer rigid printed circuit board including at least four layers, and the flexible printed circuit board and the connecting flexible printed circuit board are provided. A printed circuit board connection structure comprising a double-sided flexible printed circuit board.
において、 多層リジットプリント回路基板に、二つのコネクタを基
板の一辺寄りに並列に設け、これら二つのコネクタの接
点部を異なる接点群によって構成するとともに、 この多層リジットプリント回路基板と電気的に接続する
フレキシブルプリント基板との接続を、二枚の接続用フ
レキシブルプリント基板によって行なうように構成し、
かつこれらの接続用フレキシブルプリント基板との接続
を行なう圧接接続部を二個所に設け、 前記接続用フレキシブルプリント基板を平行に配置し、
それぞれの一方の基板面に前記圧接接続部を構成する導
電パターンによる圧接接続用多点接続端子部および信号
パターン部を形成し、他方の基板面にはダミーパターン
を形成し、 これら二枚の接続用フレキシブルプリント基板における
圧接接続部を重ね合わせた状態で前記フレキシブルプリ
ント基板の二個所の圧接接続部で挟み込むことにより圧
接接続を行なうことを特徴とするプリント基板の接続構
造。4. The printed circuit board connection structure according to claim 1, wherein two connectors are provided in parallel on one side of the board on the multilayer rigid printed circuit board, and contact points of these two connectors are formed by different contact groups. In addition, the connection with the flexible printed circuit board electrically connected to the multilayer rigid printed circuit board is configured by two flexible printed circuit boards for connection,
And the pressure contact connecting portion for connecting with these connecting flexible printed boards is provided at two places, and the connecting flexible printed boards are arranged in parallel,
A multi-point connection terminal portion for pressure contact connection and a signal pattern portion by a conductive pattern forming the pressure contact connection portion are formed on one of the respective substrate surfaces, and a dummy pattern is formed on the other substrate surface. A flexible printed circuit board connection structure, wherein the flexible printed circuit boards are sandwiched between two flexible printed circuit boards in a state in which they are overlapped with each other to perform pressure contact connection.
において、 ダミーパターンを、電源系パターンまたはグランド系パ
ターンであることを特徴とするプリント基板の接続構
造。5. The printed circuit board connection structure according to claim 4, wherein the dummy pattern is a power system pattern or a ground system pattern.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8039567A JPH09232708A (en) | 1996-02-27 | 1996-02-27 | Connection structure of printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8039567A JPH09232708A (en) | 1996-02-27 | 1996-02-27 | Connection structure of printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09232708A true JPH09232708A (en) | 1997-09-05 |
Family
ID=12556667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8039567A Pending JPH09232708A (en) | 1996-02-27 | 1996-02-27 | Connection structure of printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09232708A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000046984A1 (en) * | 1999-02-02 | 2000-08-10 | Fastcom Technology S.A. | Modular structure of a smart camera for image signal processing |
CN109785750A (en) * | 2019-03-26 | 2019-05-21 | 京东方科技集团股份有限公司 | Display panel, flexible circuit board and display device |
WO2024043595A1 (en) * | 2022-08-24 | 2024-02-29 | 엘지이노텍 주식회사 | Flexible circuit board, cof module, and electronic device including same |
-
1996
- 1996-02-27 JP JP8039567A patent/JPH09232708A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000046984A1 (en) * | 1999-02-02 | 2000-08-10 | Fastcom Technology S.A. | Modular structure of a smart camera for image signal processing |
CN109785750A (en) * | 2019-03-26 | 2019-05-21 | 京东方科技集团股份有限公司 | Display panel, flexible circuit board and display device |
WO2024043595A1 (en) * | 2022-08-24 | 2024-02-29 | 엘지이노텍 주식회사 | Flexible circuit board, cof module, and electronic device including same |
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