JPH09213215A - Manufacture of plasma display device and glass board for plasma display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable partition walls partitioning a plasma generating space of plasma display device such as PDP(plasma display panel) and PALC (plasma addressed liquid crystal) to be made accurately and efficiently. SOLUTION: A pair of display electrodes 3, 4 are formed in an opposite side of a front glass substrate 1 with a back glass board 2, the display electrodes 3, 4 are covered with a dielectric layer 5, and the surface of the dielectric layer 5 is overlaid with a protective film 6 and projection parts 7 are formed in the shape of a platform. One the other hand, in the opposed face of the back glass board 2 with the front glass board 1, groove-like recess parts 8 whose cross section is humilis arc-shaped and partition walls 9 are formed by wet etching, address electrodes 10 corresponding to every pixel are formed in the bottom parts of the groove-like recess parts 8, a white dielectric layer 11 served as a reflecting layer and a phosphor later 12 are formed on the address electrodes 10, and plasma generating spaces S are formed by combining the front glass substrate 1 and the back glass board 2 so that the projection parts 7 are agreed with the partition walls 9.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a PDP (Plasma Displacement).
play panel) and PALC (Plasma Addressed Liquid Cr)
ystal) plasma display device and a method for manufacturing a glass substrate incorporated in the display device.

[0002]

2. Description of the Related Art PDPs and PALCs are attracting attention as large-screen flat panel displays. PDP
The structure of the PALC and the PALC will be briefly described with reference to FIGS. 8 and 9. First, as shown in FIG. 8, in the AC PDP, the front glass substrate 101 and the rear glass substrate 102 are opposed to each other, and the front glass substrate 101 is disposed. Display electrodes (transparent electrodes) 103 and 104 are formed on the opposite surface of the dielectric layer 105, and the dielectric layers 105 are coated on the display electrodes 103 and 104.
Cover with a protective film 106 such as gO, and back glass substrate 1
An address electrode 107 is formed on the opposite surface of No. 02, and a phosphor 108 is applied on the address electrode 107. A partition wall 109 is provided between the front glass substrate 101 and the rear glass substrate 102, and the partition wall 109 defines a plasma generation space S. A rare gas such as xenon is usually enclosed in the plasma generation space S at a pressure of several hundred Torr.

The light emitting principle of the AC PDP is as follows.
After all the pixels are made to emit light by using the display electrodes 103 and 104 and the addressing electrode 107, an AC voltage is applied to the display electrodes 103 and 104 only to the pixels to be turned on to emit plasma. 147n from xenon by plasma emission
m of ultraviolet rays are emitted, and the ultraviolet rays irradiate the phosphor 109 to generate visible light (one of the three primary colors), and the visible light is transmitted through the front glass substrate 101 as display light. It was done.

There is also a direct current type PDP, and the principle of light emission is similar to that of the alternating current type, but there is a slight structural difference in that a pilot cell is provided adjacent to the plasma generation space. There is.

On the other hand, in the PALC, as shown in FIG. 9, a front glass substrate 111 and a rear glass substrate 112 are opposed to each other, and a transparent electrode 11 is provided on the opposing surface of the front glass substrate 111.
3, color filter 114, liquid crystal 115, and dielectric film 1
16, and an anode electrode 117 and a cathode electrode 118 are formed on the opposite surface of the rear glass substrate 112,
Further, a partition 119 is provided between the front glass substrate 111 and the rear glass substrate 112, and the partition 119 defines a plasma generation space S.

The principle of light emission of PALC is that plasma is generated between the anode electrode 117 and the cathode electrode 118 to make the plasma generation space S equipotential, and the virtual electrode 120 is turned on.
A potential difference is generated between the transparent electrode 113 on one surface of the liquid crystal 15 and the dielectric film (virtual electrode) 116 on the other surface of the liquid crystal 115 to swirl the crystal plane of the liquid crystal 115 so that light from the light source (backlight) is emitted. Is the liquid crystal 115 of a portion corresponding to a predetermined pixel.
Also, an image is displayed by transmitting the light through the color filter 114.

Both of the above PDP and PALC use the plasma generated in the plasma generation space to display an image by using the PDP as a light source and the PALC as a switch.

The partition walls 109 and 119 for defining the plasma generation space have a width of 50 μm and a height of 150.
A material having a thickness of about μm is currently required, and conventionally, a printing method, an additive method, a sandblast method, and a photosensitive paste method have been known as methods for forming such partition walls.

The printing method is a method in which screen printing is repeated a plurality of times on a glass substrate to apply a paste, and the paste is baked to form partition walls having a predetermined height. The additive method is a material in which a resist (photosensitive film) is superposed on a glass substrate, exposed from above through a mask, exposed portions (or non-exposed portions) are removed by development, and the removed portions serve as partition walls. Is buried, the material for the partition walls is baked, and the resist is removed. In the sandblasting method, after applying a material for a partition on a glass substrate, a resist (photosensitive film) is overlaid on the glass substrate, exposure is performed from above through a mask, and an exposed portion (or an unexposed portion) is developed. Is removed, and then sandblasting is performed to dig in the removed portion, the material for the partition wall is baked, and the resist is removed. In the photosensitive paste method, a photosensitive paste material to be the partition walls is applied on a glass substrate, then exposed through a mask, and exposed portions (or non-exposed portions) are removed by development to form photosensitive walls to be the partition walls. This is a method of firing the paste material.

[0010]

Among the above-mentioned conventional methods, the printing method requires the alignment of the screen many times, and the shape of the partition wall is likely to collapse. In the additive method, it is difficult to form a thin and deep groove by exposure and development, and it is difficult to embed a paste material that becomes a partition in the narrow groove after development. In the sandblast method, it is difficult to apply a paste material that will form the partition walls onto the glass substrate to a thickness equal to the height of the partition walls. The photosensitive paste method, like the additive method, does not easily form thin deep grooves by exposure and development.

Further, all of the conventional partition wall forming methods have a large number of steps, and the width dimension of the partition wall must be made smaller as the pixel pitch becomes finer. For example, the pixel pitch is 0.3 mm (cell pitch 0.1 mm). In this case, the width of the partition wall must be about 30 μm, and the conventional method cannot sufficiently meet this requirement.

Further, in the conventional partition wall forming methods, only one glass substrate can be processed at a time, resulting in poor production efficiency.

[0013]

In order to solve the above-mentioned problems, the plasma display device according to the present invention has two facing electrodes.
A plasma generation space of a plasma display device, in which a plasma generation space is formed between a plurality of glass substrates corresponding to each pixel or each scanning line, and an image is displayed by using plasma generated in this space. Was formed by etching at least one glass substrate.

That is, between two glass substrates facing each other,
A plasma generation space is formed corresponding to each pixel or each scanning line, a phosphor is applied to this space, and visible light of a predetermined color is generated by ultraviolet rays from plasma generated in the plasma generation space. In a PDP (Plasma Display Panel) that extracts light as display light,
The plasma generation space was formed by etching at least one glass substrate.

Here, in the AC type PDP, an address electrode is formed at the bottom of the plasma generation space,
The address electrode is covered with a dielectric layer and a phosphor, and in a DC PDP, the pilot cell must etch the glass substrate adjacent to the plasma generation space coated with the phosphor. Is formed by.

Further, between two glass substrates facing each other,
A plasma generation space is formed corresponding to each pixel or each scanning line, and liquid crystal is sealed between one of the two glass substrates and the third glass substrate, and plasma is generated to form a predetermined pixel. The PALC is designed to change the voltage applied to both sides of the liquid crystal in the corresponding part and rotate the crystal plane of the liquid crystal in this part to allow the light from the backlight to pass through.
In (Plasma Addressed Liquid Crystal), the plasma generation space was formed by etching at least one glass substrate.

Here, a liquid crystal is sealed between a glass substrate etched to form a plasma generation space and a third glass substrate, and plasma is applied to the surface of the etched glass substrate on the liquid crystal side. It is possible to form a transparent electrode corresponding to the generation space.

Further, the light source is arranged on the side of the third glass substrate opposite to the liquid crystal, and the glass substrate forming a liquid crystal enclosed space with the third glass substrate is a concave lens for diffusing the light from the light source. It is possible to install it in the direction in which it works.

Further, in the PALC, it is preferable that the thickness of the bottom portion of the glass substrate etched to form the plasma generation space is 80 μm or less.

Further, as the shape of the concave portion for plasma generation space formed by etching on the glass substrate, for example, a groove shape along the scanning line is formed, and the cross-sectional shape of the bottom portion is a flat arc or a straight line at the central portion. And both sides of which are circular arcs, or a groove shape along the scanning line, which is formed by continuously forming a plurality of hemispherical recesses at a pitch shorter than its diameter in plan view, or , Is formed discontinuously for each pixel, and the cross-sectional shape of the bottom is a flat arc,
It is conceivable that the central portion is a straight line and both sides are circular arcs.

Further, in the method for manufacturing a glass substrate for a plasma display device according to the present invention, a recess for plasma generation space is formed by etching on the glass substrate through a mask, and a glass substrate having the same composition as described above is formed. This glass substrate is used as a stamper by forming recesses deeper than the recesses for the plasma generation space at the same pitch, and the electrode paste is applied to the surface of the protrusion between the recesses of this stamper. The stamper coated with the paste is made to face the glass substrate having the recess for the plasma generation space by a half pitch, and then the stamper is pressed against the glass substrate having the recess for the plasma generation space. The electrode paste was transferred to the central portion of the.

[0022]

Embodiments of the present invention will be described below with reference to the accompanying drawings. Here, FIG. 1 is an exploded perspective view of an AC PDP of the plasma display apparatus according to the present invention, and FIG. 2 is a sectional view of the AC PDP shown in FIG.

The AC type PDP has a front glass substrate 1 and a rear glass substrate 2. A pair of display electrodes (transparent electrodes) 3 and 4 are formed on the surface of the front glass substrate 1 facing the rear glass substrate 2. Note that the display electrodes 3 and 4 are formed in a direction orthogonal to a groove defining a plasma generation space described later as shown in FIG. 1, but are shown in parallel with the groove in FIG. 2 for the sake of clarity. ing.

The display electrodes 3 and 4 are covered with a dielectric layer 5, and the surface of the dielectric layer 5 is covered with a protective film 6 such as MgO. Here, the display electrodes 3 and 4 are formed by screen printing or the like, and the dielectric layer 5 and the protective film 6 are formed by a vapor deposition method such as sputtering.

Further, convex portions 7 are formed in a cross pattern on the surface of the front glass substrate 1 facing the rear glass substrate 2. The convex portion 7 is formed by screen printing or the like. However, unlike the conventional partition wall formation, the printing process is not repeated many times.

On the other hand, on the surface of the rear glass substrate 2 facing the front glass substrate 1, a recess 8 and a partition wall 9 are formed by wet etching.
Are formed. The concave portion 8 is formed in a groove shape corresponding to each scanning line, and the cross-sectional shape of the bottom portion thereof has a flat arc shape or a straight line in the central portion and arc shapes on both sides.

An address electrode 10 is formed on the bottom of the groove-shaped recess 8 corresponding to each pixel, and a white dielectric layer 11 and a phosphor layer 12 acting as a reflection layer are formed on the address electrode 10. .

Here, from the formation of the groove-shaped recess 8 to the phosphor layer 1
Processes up to formation of 2 will be described with reference to FIG. First, as shown in FIG. 3A, an opening 13 is formed on the surface of the glass substrate 2.
A mask 13 of chromium, chromium oxide, photoresist or the like having a formed thereon is overlaid, and in this state, the glass substrate 2 is dipped in an etchant containing hydrofluoric acid as a main component. After that, when the concave portion 8 is formed, the glass substrate 2 is immersed in an etchant for removing the mask, and the mask 13 is removed.

As the composition of the glass substrate 2, for example, SiO ₂ is 45 wt% or more and 75 wt% or less, and B ₂ O ₃ is 8.0 wt% or more and 19.0 wt% or less (preferably 9.
5 wt% or more and 12.5 wt% or less) is used. By setting the composition in this range, the coefficient of thermal expansion of the glass substrate can be kept within a suitable range of 30 to 50 × 10 ⁻⁷ / deg as the coefficient of thermal expansion of the glass substrate of PDP or PALC. Further, BaO is 4.2 wt% or more and 14 wt% or less (preferably 10 wt% or less), MO (M is a divalent metal other than Ba) is 10 wt% or more and 30 wt% or less, R ₂ O
By setting the content of (R is a monovalent metal) to 10% by weight or less (preferably 1% by weight or less), mirror surface etching that is isotropic and has less roughness on the etching surface becomes possible.

The surface of the glass substrate 2 forming the recess 8 is preferably not ground as much as possible, for example, a fire-coated surface is coated with chromium. Further, as the patterning method of the mask, the substrate size is 2
If the pixel size is 0 inch or less and the pixel size is 0.2 mm or less,
Photolithography is used and the substrate size is 40
Patterning is performed by screen printing when the pixel size is about 0.3 inch or more and about 0.3 mm.

If the specific dimensions of the groove-shaped recess 8 formed by the above-mentioned wet etching are shown, the opening diameter of the recess 8 is 54.
3 μm, depth 240 μm, width of bottom of recess 8 is 160
μm, the width of the arc part connecting both sides of the bottom is 191.5μ
The width of the tip of the convex portion 9 between the concave portions 8 and 57 was 57 μm.

Next, the address electrode 1 is formed on the bottom surface of the recess 8.
Form 0. The method is as shown in FIG.
It is performed using the stamper 14. In this stamper 14, a glass substrate having the same composition as the glass substrate 2 is subjected to the same etching as that of the glass substrate 2 to form a concave portion 15 and a convex portion 16. Here, the pitch of the concave portions 15 (the convex portions 16) is equal to the pitch of the concave portions 8 (the convex portions 9), and the depth of the concave portions 15 is made deeper than that of the concave portions 8. To do this, for example,
The opening diameter of the mask for forming the recess 15 is set to the mask 13
The diameter may be smaller than the diameter of the opening 13a, and the etching may take time.

When the stamper 14 is formed as described above, the paste 16a for the address electrode is applied to the convex portion 16 of the stamper 14 and the stamper 14 is formed.
Facing the glass substrate 2 and pressing the stamper 14 against the glass substrate 2 to paste 10a for the address electrode.
Is transferred to the bottom of the recess 8.

Thereafter, as shown in FIG. 3 (c), the recess 8 is formed.
A bottom-melting glass paste to be the white dielectric layer 11 and a paste to be the phosphor layer 12 are applied to the surface by screen printing or the like and baked.

After the electrodes and the like are formed on the front glass substrate 1 and the rear glass substrate 2 in this way, the front glass substrate 1 and the rear glass substrate 2 are bonded so that the convex portions 7 and the partition walls 9 are aligned with each other. To do. As a result, the plasma generation space S is defined. A rare gas such as xenon is enclosed in the plasma generation space S at a pressure of several hundred Torr.

The convex portion 7 provided on the front glass substrate 1 side may be omitted, and the partition wall 9 of the rear glass substrate 2 may be directly bonded to the front glass substrate 1 side. In the illustrated example, an AC type PDP is shown.
The PDP can also be applied to a direct current type. In this case, a seed ignition cell is required adjacent to the plasma generation space, and this seed ignition cell is also formed by etching the glass substrate.

FIG. 4A is a plan view showing another mode of the concave portion 8, and FIG. 4B is a sectional view taken along the line bb of FIG. 4A. As the concave portion 8, a plurality of hemispherical concave portions 18 are seen in a plan view. May be formed by continuing at a pitch shorter than the diameter. With such a configuration, the thickness of the bottom of the recess 8 can be increased in the continuous portion of the hemispherical recess 18, and the strength of the glass substrate 2 can be improved.

FIG. 5 (a) is a plan view showing another mode of the recess 8 and FIG. 5 (b) is a sectional view taken along line bb of FIG. 5 (a).
In this embodiment, the recess 8 is formed in a substantially quadrangular shape in plan view and is formed not for each scanning line but for each pixel. In order to make the recess 8 substantially square in a plan view, the shape of the opening formed in the mask may be a square or a closed diamond.

FIG. 6 is a sectional view of a PALC of the plasma display device according to the present invention. In this embodiment, the first glass substrate 21 and the second glass substrate 22 are used.
And a third glass substrate 23, and the anode electrode 24 and the cathode electrode 25 are formed on the second glass substrate 22 side of the first glass substrate 21 serving as the front glass, and the second glass substrate 22 is provided with the above-mentioned. 2 by wet etching
6 and the partition wall 27 are formed, and a plasma generation space S is defined between the partition wall 27 and the first glass substrate 21 for each pixel or each scanning line.

A liquid crystal 28 is sealed between the third glass substrate 23 and the second glass substrate 22, and a transparent electrode 29 connected to an AC power source is provided on the liquid crystal 28 side of the third glass substrate 23. Further, a color filter 30 is provided, and a backlight (light source) 31 is provided on the side of the third glass substrate 23 opposite to the liquid crystal 28.

When plasma is generated between the anode electrode 24 and the cathode electrode 25, the plasma generation space S becomes equipotential, and the liquid crystal 28 is sandwiched between the surface of the second glass substrate 22 and the transparent electrode 29. A potential difference occurs in the crystal plane of the liquid crystal 28, which causes the light from the backlight 31 to pass therethrough and is emitted as display light from the first glass substrate 21.

Here, the second glass substrate 22 has a recess 26.
Therefore, when the backlight (light source) 31 is arranged on the back side of the third glass substrate 23,
Glass substrate 22 acts as a concave lens, resulting in
The light from the backlight 31 is diffused to widen the viewing angle.

If the specific dimensions of the above-mentioned recess 26 are shown,
The opening diameter of the recess 26 is 543 μm, the depth is 240 μm, the width of the bottom of the recess 26 is 160 μm, the width of the arc portion connecting to both sides of the bottom is 191.5 μm, and the width of the tip of the partition wall 27 is 5.
The thickness of the deepest portion of the concave portion 26 (thickness of the thinnest portion of the glass substrate 22) is set to 7 μm and 50 μm.

As a means for making the thickness of the deepest portion of the recess 26 to be 50 μm, the thickness of the glass substrate before etching is 0.
In the case of 7 mm, a method of etching to a depth of 240 μm and then polishing the opposite side of the glass substrate by 410 μm.
After etching to a depth of 240 μm, the opposite side of the glass substrate is etched by about 240 μm without a mask, and then removed by polishing by about 170 μm. If the thickness of the glass substrate is 0.5 mm, after etching to a depth of 225 μm, the opposite side of the glass substrate is also exposed without a mask.
A method of etching by 5 μm and touch-polishing the etched surface. And so on.

When the opposite side surface of the glass substrate is etched or polished to be thickened, the etching can be carried out by adhering the third substrate to the surface side of the glass substrate on which the concave portion is formed. Prevents disadvantages such as damage to the glass substrate during the process.

FIG. 7 is a sectional view of a PALC according to yet another embodiment of the plasma display device according to the present invention. The same members as those in the embodiment shown in FIG. Omit it. In this embodiment, the electrode 32 is formed on the surface of the second glass substrate 22 facing the liquid crystal 28.

By forming the electrode 32, the brightness in the pixel can be made uniform. That is, the thickness of the second glass substrate 22 having the partition walls 27 formed by etching is thin in the central portion of the pixel and thick in the peripheral portion of the pixel. as a result,
The potential charged on the surface of the glass substrate 22 as the virtual electrode (see FIG. 9) also differs between the central portion and the peripheral portion of the pixel, and if this is left as it is, there is a difference in the degree of liquid crystal rotation between the central portion and the peripheral portion of the pixel. Occurs, and uniform brightness cannot be obtained. However, by forming the electrode 32, the charge becomes uniform and the brightness in the pixel is averaged.

[0048]

According to the present invention as described above,
In a plasma display device such as a PDP or a PALC, a glass substrate is etched with an etchant to form a recess for a plasma generation space.
It is possible to form a fine concave portion for a plasma generation space having a width dimension of about 30 μm with high precision, and a pixel pitch of 0.3.
It is possible to sufficiently meet the requirement of about mm.

In the conventional partition wall forming method, the partition wall is formed through a large number of steps, and finally the firing step is required. However, according to the present invention, the number of steps for forming the partition wall is small, Moreover, a large number of glass substrates can be processed simultaneously.

In the PALC, of the pair of glass substrates enclosing the liquid crystal, a transparent electrode corresponding to the plasma generation space is provided on the liquid crystal side surface of the glass substrate that has been etched to form the plasma generation space. By forming it, the voltage applied to the liquid crystal can be made uniform for each pixel, and a clear image can be obtained.

Further, in the PALC, of the pair of glass substrates enclosing the liquid crystal, the glass substrate etched to form the plasma generation space acts as a concave lens, and thus the glass thus etched is used. By arranging the light source on the glass substrate side facing the substrate, the viewing angle can be increased.

Further, as a method of providing an electrode on the bottom of the concave portion of the glass substrate where the concave portion for forming the plasma generating space is formed by etching, plasma generation is performed on the glass substrate having the same composition as the glass substrate. The glass substrate is used as a stamper by forming recesses deeper than the recesses for plasma generation at the same pitch as the recesses for space and using the glass substrate as a stamper, and the electrode paste is applied to the convex surface between the recesses of the stamper. Then, the stamper coated with this electrode paste is made to face the glass substrate having the recess for the plasma generation space by a half pitch, and then the stamper is pressed against the glass substrate having the recess for the plasma generation space. If the electrode paste is transferred to the central part of the recess for the generation space, a large number of It is possible to form a very, and since the thermal expansion coefficient equal to the glass substrate and the stamper, thermal environments also vary, never transfer position shifts.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an AC type PDP of a plasma display device according to the present invention.

FIG. 2 is a cross-sectional view of the AC PDP shown in FIG.

3 (a) to 3 (c) are views for explaining each step of etching a glass substrate, forming an electrode, and forming a phosphor layer.

4A is a plan view of another embodiment of a recess formed in a glass substrate, and FIG. 4B is a sectional view taken along line bb of FIG. 4A.

5A is a plan view of another embodiment of a recess formed in a glass substrate, and FIG. 5B is a sectional view taken along line bb of FIG. 5A.

FIG. 6 is a sectional view of a PALC of the plasma display device according to the present invention.

FIG. 7 is a cross-sectional view of another embodiment of PALC in the plasma display device according to the present invention.

FIG. 8 is a cross section of a conventional PDP.

FIG. 9 is a cross section of a conventional PALC.

[Explanation of symbols]

1 ... Front glass substrate, 2 ... Rear glass substrate, 3, 4 ... Display electrode, 5 ... Dielectric layer, 6 ... Protective layer, 7 ... Convex part, 8, 1
8, 26 ... Recesses, 9, 27 ... Partition walls, 10 ... Address electrodes, 11 ... White dielectric layer, 12 ... Phosphor layer, 13 ... Mask, 13a ... Mask opening, 14 ... Stamper, 21 ... First glass Electrode, 22 ... second glass electrode, 23 ... third
Glass electrode, 24 ... Anode electrode, 25 ... Cathode electrode, 28 ... Liquid crystal, 30 ... Color filter, 31 ... Backlight, 32 ... Electrode, S ... Plasma generation space.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication location H01J 17/16 H01J 17/16 (72) Inventor Yukisa Kusuda 3-chome, Doshomachi, Chuo-ku, Osaka-shi, Osaka 5-11 No. Nippon Sheet Glass Co., Ltd. (72) Inventor Kazuo Takemura 3-5-11 Doshomachi, Chuo-ku, Osaka City, Osaka Prefecture Nippon Sheet Glass Co., Ltd.

Claims (12)

[Claims] 1. A plasma generating space is formed between two glass substrates facing each other in correspondence with each pixel or each scanning line, and an image is displayed using the plasma generated in this space. In the plasma display device, the plasma generation space is formed by etching at least one glass substrate. 2. A plasma generation space is formed between two glass substrates facing each other, corresponding to each pixel or each scanning line, and a phosphor is applied to the space to generate plasma generated in the plasma generation space. In the plasma display device in which visible light of a predetermined color is generated by the ultraviolet light from the, and the visible light is extracted as display light, the plasma generation space is formed by etching at least one glass substrate. And a plasma display device. 3. The plasma display device according to claim 2, wherein an address electrode is formed at the bottom of the plasma generation space, and the address electrode is covered with a dielectric layer and a phosphor. Characteristic plasma display device. 4. The plasma display device according to claim 2, wherein a seed cell is formed by etching a glass substrate adjacent to the plasma generation space coated with the phosphor. Plasma display device. 5. A plasma generating space is formed between two facing glass substrates corresponding to each pixel or each scanning line, and one of the two glass substrates and a third glass substrate. The liquid crystal is sealed between the and, and the voltage applied to both sides of the liquid crystal in the part corresponding to the predetermined pixel is changed by the generation of plasma, and the crystal plane of the liquid crystal in this part is swung so that the light from the backlight can be transmitted. 2. The plasma display device according to claim 1, wherein the plasma generation space is formed by etching at least one glass substrate. 6. The plasma display device according to claim 5, wherein liquid crystal is sealed between a glass substrate etched to form the plasma generation space and a third glass substrate, and etching is performed. A plasma display device, wherein a transparent electrode is formed on the surface of the formed glass substrate on the liquid crystal side so as to correspond to the plasma generation space. 7. The plasma display device according to claim 5, wherein a light source is arranged on a side of the third glass substrate opposite to the liquid crystal, and a liquid crystal filled space is formed between the light source and the third glass substrate. A plasma display device characterized in that a glass substrate is incorporated in a direction in which it acts as a concave lens for diffusing light from a light source. 8. The plasma display device according to claim 5, wherein the thickness of the bottom portion of the glass substrate etched to form the plasma generation space is 80 μm.
A plasma display device having a thickness of m or less. 9. The plasma display device according to claim 1, wherein the concave portion for plasma generation space formed on the glass substrate by etching has a groove shape along a scanning line, and The plasma display device is characterized in that the cross-sectional shape is a flat arc or a straight line at the center and arcs at both sides. 10. The plasma display device according to claim 1, wherein the recess for the plasma generation space formed in the glass substrate by etching comprises:
A plasma display device, wherein the plasma display device has a groove shape along a scanning line, and the groove-like recess is formed by connecting a plurality of hemispherical recesses at a pitch shorter than the diameter in plan view. 11. The plasma display device according to claim 1, wherein the recess for the plasma generation space formed in the glass substrate by etching comprises:
A plasma display device, which is formed discontinuously for each pixel and has a flat cross-section at the bottom thereof, or a flat arc at the center and arcs at both sides. 12. A method of manufacturing a glass substrate for a plasma display device according to claim 1, wherein the method comprises etching a recess for a plasma generation space through a mask on the glass substrate. The glass substrate of the same composition is formed by etching to form a recess deeper than the recess for the plasma generation space at the same pitch as the above, and this glass substrate is used as a stamper. The electrode paste is applied to the surface of the convex portion, the stamper coated with the electrode paste is made to face the glass substrate having the concave portion for the plasma generation space by a half pitch, and then the stamper is formed with the concave portion for the plasma generation space. By pressing on the glass substrate,
A method of manufacturing a glass substrate for a plasma display device, characterized in that an electrode paste is transferred to a central portion of a recess for a plasma generation space.