JPH09206296A - X-ray photographing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To convert X-rays directly into electric signals, to enhance resolution and detecting efficiency, and to allow easy manufacture. SOLUTION: A unit picture element on the photographic side of a CCD (image sensing device) 1 consists of stepped light-sensing and -blocking parts 2, 5, and scintillator crystals that convert radiation into visible rays are developed directly on a photographic surface by a crystal developing means such as deposition. The columnar crystals 7a, 7b of the scintillator grow from independent nuclei according to the unevenness of the photographic surface, so that a photodiode part 2 that detects light is spatially isolated from other parts.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a medical X-ray imaging apparatus, and more particularly to an X-ray imaging apparatus used in dental practice.

[0002]

2. Description of the Related Art Transmission X-ray photography of a human body has been widely performed as a medical and dental diagnostic method. For example, for intraoral radiography of a tooth part in dentistry, an X-ray generator is placed outside the oral cavity, and a film is brought into contact with and supported by a fingertip on the back surface of the tooth in the oral cavity,
An X-ray photograph is obtained by exposing the film to X-rays emitted from an X-ray generator and transmitted through a tooth portion which is a subject. In panoramic photography, the X-ray source and the film are synchronously rotated around the fixed patient while the film is moved,
An X-ray photograph is taken on the film by irradiating slit-shaped X-rays.

However, taking an X-ray photograph with a film takes time and labor for developing, fixing, washing with water, etc. after the X-ray irradiation, and it is not easy to store and manage the film.

In addition, since the sensitivity of X-ray film is low, X
The ray irradiation time is relatively long, and blurring due to finger movements in intraoral radiography or head movements in panoramic radiography is likely to occur, which may affect the diagnosis.

[0005]

If a solid-state image sensor that directly converts X-rays into electric signals is used instead of the X-ray film, the photographed image can be stored as an electric signal, which facilitates storage and management.

As a solid-state image pickup device for X-ray photography, a scintillator is provided on the entire surface of the CCD on the light-receiving surface side to convert X-rays into scintillation light, which is visible light, by a scintillation, and the CCD detects the light. Has no directivity, so that crosstalk occurs between pixels and the resolution is reduced. Further, in order to increase the detection efficiency of X-rays, it is necessary to make the scintillator thicker, but the thicker it is, the more crosstalk in the scintillator increases and the resolution deteriorates. . To overcome this drawback, Japanese Patent Laid-Open No. 5-93780 proposes a structure in which a scintillator is provided for each pixel of the CCD. The following JP-A-5
The example disclosed in No. 93780 will be described with reference to the drawings. FIG. 11 shows the structure of a solid-state image sensor for X-ray imaging. 110 is a solid-state image sensor, 111 is a columnar crystal of a scintillator provided separately for each pixel of the image sensor, and 200 is a glass substrate. In this conventional example, a convex pattern of SiO 2 is formed for each pixel of the solid-state imaging device 110, and columnar crystals 111 of a scintillator are crystal-grown on the upper surface of the convex pattern. In such a configuration, since the scintillator is divided corresponding to the pixels of the solid-state image sensor, there is little crosstalk, but part of the scintillation light is absorbed by the newly provided convex pattern and the detection efficiency of the image sensor is reduced. To do.

Further, a metal film is formed on a portion other than the photoelectric conversion region of the image pickup surface of the CCD by a light exposure process and a lift-off method, and a scintillator is applied after forming a metal wall by plating on the plating electrode as a plating electrode. There is an example in which the metal wall is used for separation, but the manufacturing process of the scintillator unit is complicated, and the CCD is chemically treated in the manufacturing process, which may cause deterioration. Also,
When the pixel size is reduced, the scintillator becomes thicker than the pixel, which makes manufacturing difficult. Therefore, it is impossible to provide an image pickup apparatus having a high X-ray detection efficiency, a small pixel size, and a high resolution.

The present invention solves the above-mentioned conventional problems, and an object thereof is to provide an X-ray imaging apparatus which can directly convert X-rays into an electric signal, has high resolution and detection efficiency, and is easy to manufacture. Is.

[0009]

To achieve this object, the first means of the present invention is to directly grow a crystal of a scintillator for converting radiation into visible light on a surface of an image pickup side of an image pickup device, The columnar crystals of the scintillator grow from separate nuclei according to the unevenness of the surface of the image pickup device, and the light receiving part for detecting light and other parts are spatially separated.

According to a second aspect of the present invention, a light shielding wall having a thickness smaller than that of the scintillator is formed between pixels of the image pickup device,
A part of the scintillator is divided.

Further, according to a third aspect of the present invention, a grid-like hole corresponding to the pixel pitch of the image pickup device is provided in the light-shielding plate, and the scintillator is filled in this hole to arrange an independent scintillator for each pixel. Is.

Further, a fourth means of the present invention is to provide a grid-like through hole corresponding to the image pitch of the image pickup element in the light shielding plate,
By filling a scintillator in this through hole, an independent scintillator is arranged for each pixel.

Further, a fifth means of the present invention is to form a scintillator by forming a scintillator column on a reflecting plate via an adhesive and inserting the scintillator column into a grid-like through hole of a light shielding plate. is there.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION A first means of the present invention is that a columnar crystal of a scintillator is independently grown on a light receiving portion of each pixel of an image pickup device, and each pixel is optically divided. Visible light converted by the columnar crystals of one pixel has the effect of being extremely reduced from leaking to adjacent pixels.

In the second means of the present invention, since the scintillator at least in the vicinity of the pixel portion is separated for each pixel by the light shielding wall, the visible light generated by the scintillator is less likely to leak to the adjacent pixel. Have. Furthermore, the third means of the present invention has the effect of suppressing the leakage of visible light even when the thickness of the scintillator is increased by the light shielding plate as compared with the case where the light shielding plate is not provided.

Further, the fourth means of the present invention has the effect of preventing the visible light generated by the scintillator from leaking to the adjacent pixels because the pixels are completely separated by the light shielding plate and the reflecting plate.

The fifth means of the present invention is to form a scintillator column on the reflection plate by using an adhesive and insert the scintillator column into the grid-like through holes of the light-shielding plate so that the visible light from the scintillator is visible. Is reflected by the reflection plate, and the light shielding plate has an effect of suppressing the leakage of visible light to the adjacent pixel.

(Embodiment 1) Hereinafter, Embodiment 1 of the present invention will be described with reference to FIG. In FIG. 1, reference numeral 1 is a CCD, and the unit pixel of this CCD 1 basically comprises a photodiode 2 and a vertical CCD 3. 4 is a gate electrode, 5 is a light-shielding portion, and this light-shielding portion 5 is made of synthetic resin of
C, Ti, Pb, etc. are mixed. 6 is an insulating layer, 7
a and 7b are scintillators, and scintillator 7a is a CCD
On top of the photodiode 2 and also on the scintillator 7b.
Are separately and independently provided on the light shielding portion 5.

In the X-ray image pickup apparatus having this structure, when X-rays or radiation is incident, they are converted into scintillation light by scintillators 7a and 7b provided separately. Then, the scintillation light converted by the scintillator 7a on the photo diode 2 of the CCD 1 propagates through the scintillator 7a, reaches the photo diode 2, is converted into electric charge by the photo diode 2, and is transferred to the vertical CCD 3 and accumulated. Next, it is transferred by the operation of the gate electrode 4 and output as video information. Further, the scintillation light converted by the scintillator 7b is blocked by the light shielding unit 5. Since the scintillator 7b is separated from the scintillator 7a by a space, the proportion of the scintillation light converted by the scintillator 7b reaching the photodiode 2 via the adjacent scintillator 7a is very small. There is no direct incidence on.
Furthermore, the arrival of scintillation light converted by the scintillator 7a provided in the photodiode 2 of the pixel adjacent to the light shielding part 5 is not separated in a larger space. Therefore, there is no crosstalk of light between pixels forming the CCD 1, and an X-ray imaging device having high resolution is provided. Further, since the surfaces of the scintillators 7a and 7b act as a reflection surface of scintillation light, the detection efficiency is improved. Further, A1 and Cr are provided on the upper surfaces of the scintillators 7a and 7b
By providing the reflection film 8 of (1), the component of scintillation light traveling to the opposite side of the photodiode 2 also reaches the photodiode 2 by reflection and is detected, so that the detection efficiency is further improved.

Next, the manufacturing process of the first embodiment will be described with reference to FIG. 2A and 2B are cross-sectional views showing the manufacturing process of the scintillator portion according to the first embodiment. FIG. 2A shows a state before processing, and FIG. 2B shows a state after processing. As shown in FIG. 2A, on the image pickup surface of the CCD 1, the photodiode 2 is concave and the light-shielding portion 5 is convex to form a step. When a scintillator, for example, CsI, is crystal-grown on the imaging surface by vapor deposition or vapor phase growth, columnar crystals are separately grown from the concave photodiode 2 and the convex light-shielding portion 5.
The separated scintillators 7a and 7b are obtained as shown in (b). A reflective film 8 is provided on the upper surfaces of the scintillators 7a and 7b by vapor deposition. As described above, according to the second embodiment, it is possible to easily obtain an X-ray imaging apparatus having high resolution and high conversion efficiency.

Although the scintillators 7a and 7b have been described as CsI, they may be photostimulable scintillators having similar functions. Further, although the reflective film 8 has been described with A1 and Cr,
It is not limited to this.

(Second Embodiment) The second embodiment of the present invention will be described below with reference to FIG. In FIG. 3, 30 is a light shielding wall and 31 is a scintillator. FIG. 1
The same components as those shown in FIG.
The unit pixel of D1 is basically a photodiode 2 and a vertical CCD.
Consists of three. In the second embodiment, the light shielding wall 30 is provided on the light shielding portion 5 that covers the vertical CCD 3 and divides each unit pixel. The scintillator 31 is provided on the entire image pickup surface, and the scintillator 31 is thicker than the light shielding wall 30.

The operation of the X-ray imaging apparatus having this structure will be described below. When the X-ray enters the scintillator 31, it is converted into scintillation light. The scintillation light reaches the photodiode 2 and the image information is output through the same process as in the first embodiment. Then, the X-ray loses directivity when converted into scintillation light. Therefore, among the components of the scintillation light, there is a component that reaches the photodiode 2 of the adjacent pixel in addition to the component that reaches the photodiode 2 at the position where the X-ray is incident. This becomes crosstalk. In the second embodiment, since the light shielding wall 30 is provided between the pixels, crosstalk of the scintillation light to the photodiode 2 of the adjacent pixel can be prevented. The height of the light shielding wall 30 is lower than the thickness of the scintillator 31, and the light shielding is not sufficient, but the amount of crosstalk is significantly reduced as compared with the case where the light shielding wall 30 is not provided. The height of the light shielding wall 30 is the scintillator 3
An advantage lower than 1 is that a light shielding wall can be formed by printing. Generally, when the light shielding wall 30 having such a structure is formed by printing, it is difficult to increase the height of the light shielding wall 30.
On the other hand, the scintillator 31 needs to have a certain thickness in order to efficiently absorb and convert X-rays. The second embodiment satisfies the above constraints, and has a thickness of the scintillator 31 suitable for detecting X-rays, and the light shielding wall 30 can be easily formed. In addition, Pb and Ti are applied to the light shielding wall 30.
If a powder of a material having a large atomic number is mixed, it will pass through the scintillator 31 and a vertical C
The amount of X-rays that jump into the CD 3 can be suppressed, and the adverse effect on the image due to the incidence of X-rays on the vertical CCD 3 is also reduced. According to the second embodiment, it is possible to obtain an X-ray imaging apparatus that has high resolution and low crosstalk of scintillation light and high X-ray detection efficiency.

Next, FIG. 4A shows the second embodiment.
Description will be made with reference to (b) and (c). In FIG. 2, FIG. 2A shows before processing, and FIGS. 2B and 2C show during processing and after processing. The steps will be described below in order. First, C shown in FIG.
By pattern-printing a synthetic resin mixed with a light-shielding material on the light-shielding portion 5 on the image pickup surface of the CD 1, a light-shielding wall 30 is formed between pixels as shown in FIG. 2B. The light-shielding component is the P
Powders of metals and metal compounds such as b, Ti, C, Cr and Al. Next, when printing the scintillator,
As shown in (c), a structure in which the scintillator 31 is divided between the pixels by the light shielding wall 30 is obtained. According to the second embodiment, an X-ray imaging device having high resolution and high detection efficiency is provided by a simple manufacturing process.

Although the image pickup device has been described as a CCD, it may be another image sensor. Although examples of Pb, Ti, C, Al, and Ni are given as the light-shielding material, other metal materials and their compounds are also conceivable.

(Third Embodiment) The third embodiment will be described below with reference to FIG. 50 in FIG.
Is a light shielding plate, and 51 is an adhesive. The same components as those in FIG. 1 are designated by the same reference numerals. Similarly, CCD1
The unit pixel of is basically composed of the photodiode 2 and the vertical CCD 3. In the third embodiment, holes are provided in the light shielding plate 50 in a lattice shape, and the holes are filled with the scintillator 31. The light shielding plate 50 and the CCD 1 are bonded and fixed with an adhesive 51 so that the hole of the light shielding plate 50 and the photodiode 2 of each unit pixel of the CCD 1 face each other.

The operation of the X-ray imaging apparatus having this structure will be described below. The X-rays emitted from the upper part of FIG. 5 enter the scintillator 31 filled in the holes of the light shielding plate 50 and are converted into scintillation light. The scintillation light passes through the adhesive 51, enters the photodiode 2 of each unit pixel of the CCD 1, and is output as image information through the same process as in the first embodiment. In this configuration, the scintillator 31
Is completely divided between pixels by the light shielding plate 50, and crosstalk between pixels of scintillation light is eliminated.

Next, the manufacturing process of the X-ray imaging apparatus according to the third embodiment will be described with reference to FIG. In FIG. 6, 5
2 is a black polyimide film, 53 pattern mask, 5
4 is an excimer laser beam, and 55 is a hole. Other reference numerals are the same as those in FIG. 5, and description thereof will be omitted. As shown in FIG. 6A, the black polyimide film 52 is irradiated with excimer laser light 54 through a grid pattern mask 53. Then, as shown in FIG. 6B, the portion irradiated with the laser beam 54 is ejected to form the lattice-shaped holes 55 in the polyimide film 52. Next, as shown in FIG.
The scintillator 31 is attached to the surface provided with the lattice-shaped holes 55.
6 is applied and pressed from the application surface, a scintillator unit having holes 55 filled with scintillator 31 is formed as shown in FIG. 6D. Next, when the holes 55 of the scintillator unit and the photodiodes 2 of the pixels of the CCD 1 face each other and are bonded to each other, as shown in FIG. 6 (e), the scintillator 31 is divided into pixel units for X-ray imaging. The device is manufactured. FIG. 7 shows another method of forming the grid-shaped holes 55. After the lattice frame 71 is formed on the black polyimide film 55 by the light exposure process, the lattice frame 71 is used as a protective film and the silica particles 72 are wiped from the upper surface to form the lattice holes 55. According to the third embodiment, an X-ray imaging apparatus with high resolution and high detection efficiency can be obtained by a simple manufacturing process.

Although the light shielding plate 50 is processed using black polyimide in the third embodiment, a material having a light shielding property such as a black PET film may be used. Further, the laser light for performing hole processing has been described as an excimer laser, but other laser light capable of fine processing may be used. Further, although the image pickup element is described as a CCD, another image sensor may be used. Further, although the scintillator is filled in the holes of the light shielding plate, it may be partially filled.

(Embodiment 4) Hereinafter, Embodiment 4 will be described with reference to FIG. In FIG. 8, reference numeral 80 is a reflecting plate, and 81 is a reflecting film. Also in the fourth embodiment, the unit pixel of the CCD 1 is basically the photodiode 2 and the vertical C
It consists of CD4. In the fourth embodiment, through holes are provided in the light shielding plate 50 in a grid pattern, and the scintillator 31 is provided in the through holes.
Is filled. The reflection plate 80 is provided on the upper surface of the light shielding plate 50, and the adhesive 5 is provided so that the hole of the light shielding plate 50 and the photodiode 2 of each unit pixel of the CCD 1 face each other as in the third embodiment.
It was fixed at 1.

The operation of the X-ray imaging apparatus configured as above will be described below. The X-rays emitted from the upper part of FIG.
And is converted into scintillation light. The scintillation light passes through the adhesive 51, enters the photodiode 2 of each unit pixel of the CCD 1, and is output as image information through the same process as in the first embodiment. In this configuration, the scintillator 31 is completely divided between the pixels by the light shielding plate 50, and crosstalk between the pixels of scintillation light is eliminated. Furthermore, the reflector 2 allows the photodiode 2
Since the scintillation light traveling toward the opposite side of the light also reaches the photodiode 2 by reflection and is detected, the detection efficiency is improved. Further, when the reflection film 81 is provided on the inner surface of the through hole, the light shielding wall functions as a reflection surface, so that the detection efficiency is further improved.

Next, the manufacturing process of the fourth embodiment will be described with reference to FIG. FIG. 9 is a cross-sectional view showing the manufacturing process of the scintillator portion in the fourth embodiment. In FIG. 9, reference numeral 80 is a reflector and 90 is a through hole. The steps will be described below in order. First, as shown in FIG. 9A, a grid pattern mask 53 is formed on a black polyimide film 52.
The excimer laser light 54 is irradiated via the. Next, as shown in FIG. 9B, the portion irradiated with the laser beam 54 is ejected to form the lattice-shaped through holes 90 in the polyimide film 52. Then, as shown in FIG. 9C, when the scintillator 31 is applied to the surface on which the grid-like through holes 90 are provided and pressed from the applied surface, the through holes 90 shown in FIG. 9D are filled with the scintillator 31. The scintillator unit thus formed is formed. Furthermore, the through hole 90 of this unit
And the photodiode 2 of each pixel of the CCD 1 are bonded so as to face each other, and the reflection plate 80 is bonded to the upper surface of the light shielding plate 50,
An X-ray imaging device in which the scintillator 31 shown in FIG. 9E is divided in pixel units is manufactured. Here, similarly to the third embodiment, the through holes 90 can be formed by powder spraying. According to the fourth embodiment, an X-ray imaging device having high resolution and high detection efficiency can be obtained by a simple manufacturing process.

In the fourth embodiment, the reflector 80 is made of Al.
Any plate having a reflective action such as

(Fifth Embodiment) The fifth embodiment will be described below with reference to FIG. In FIG. 10, reference numeral 100 denotes an adhesive film, which has an adhesive property by being melted by heating. The steps will be described below in order. First, FIG.
As shown in (a), the adhesive film 100 is formed on the reflection plate 80.
The powder of the scintillator 31 is placed via the. Next, the excimer laser light 5 is passed through the lattice-shaped pattern mask 53.
When 4 is irradiated, the adhesive dissolves only in the portion irradiated with the excimer laser, and the scintillator 31 is fixed. Furthermore, when the unfixed scintillator is removed by the vibrating means, FIG.
An independent scintillator column 101 as shown in 0 (b) is formed. Here, the pitch of the scintillator columns 101 is
It is the same as the pixel pitch of the CCD 1 to be attached later.
Further, as shown in FIG. 10C, a light-shielding plate 50 made of a polyimide film in which a through hole 90 is formed by the same method as that of the fourth embodiment has a reflecting plate 80 and each scintillator column is inserted into the through hole 90. Adhesive fixing Here, the height of the scintillator column 101 may be lower than the thickness of the black polyimide film 50. Furthermore, the fourth embodiment
Similarly to the above, when bonded to the image pickup surface of the CCD 1, an X-ray image pickup device in which an independent scintillator 31 is provided corresponding to each pixel of the CCD 1 is manufactured. Also in the fifth embodiment, the pixels are separated by the light shielding plate 50, and crosstalk of scintillation light is prevented. Further, similarly to the fourth embodiment, the function of the reflection plate 80 improves the detection efficiency. Further, if a reflection film is provided on the inner surface of the through hole 90, the light shielding plate 80 functions as a reflection surface, so that the detection efficiency is further improved. As described above, according to the fifth embodiment, an X-ray imaging apparatus having high resolution and high detection efficiency is provided.

In the fifth embodiment, the light shielding plate 50 is a black polyimide film, but any material having a light shielding property such as a black PET film may be used. In addition, the reflector 80
Although it is set to 1, any plate having a reflecting action may be used. Although the laser light has been described as an excimer laser, it may be another laser light capable of fine processing. Further, although the image pickup element has been described as a CCD, it may be another image sensor.

[0036]

As described above, the X-ray imaging apparatus of the present invention is
A scintillator that converts X-rays into scintillation light;
The scintillator has an image sensor that detects scintillation light and outputs it as image information, and the scintillator is a columnar crystal and is provided independently for each unit pixel of the image sensor, or the pixels of the scintillator are separated by a light shielding wall. Therefore, crosstalk of scintillation light can be suppressed, and an X-ray imaging device with high resolution and high detection efficiency can be provided.

Further, the columnar crystal of the scintillator provided independently for each unit pixel of the image pickup device can be easily formed by crystal growth means such as vapor deposition utilizing the unevenness of the image pickup surface,
Further, by printing a light shielding wall on the image pickup surface of the image pickup device or providing a hole or a through hole in the light shield plate by laser processing, the hole or the through hole is filled with a scintillator and fixed so as to face each pixel of the image pickup device. Since the light shielding wall that separates the pixels of the scintillator is formed, it is possible to easily realize an X-ray imaging device having high resolution and high detection efficiency.

Therefore, in the X-ray imaging apparatus of the present invention, the X-ray imaging time can be shortened, a clear X-ray image can be captured with less blurring of the image due to the movement of the patient, and a video signal is output as an electric signal from the imaging device. Therefore, it has an excellent effect that it can be easily stored in a storage medium such as a magneto-optical disk and the captured images can be easily managed.

[Brief description of drawings]

FIG. 1 is a partial sectional view of an X-ray imaging apparatus according to a first embodiment of the present invention.

FIG. 2A is a partial cross-sectional view showing a state before forming a scintillator of the X-ray imaging apparatus, and FIG. 2B is a partial cross-sectional view showing a formation state of the scintillator of the X-ray imaging apparatus.

FIG. 3 is a partial sectional view of an X-ray imaging apparatus according to a second embodiment of the present invention.

FIG. 4A is a partial cross-sectional view showing a state before forming a light-shielding wall of the X-ray imaging apparatus, and FIG. 4B is a partial cross-sectional view showing a state of forming a light-shielding wall of the X-ray imaging apparatus. Partial sectional view showing the formation state of the scintillator of the X-ray imaging apparatus.

FIG. 5 is a partial sectional view of an X-ray imaging apparatus according to a third embodiment of the present invention.

6A is a partial schematic cross-sectional view showing a step of forming a light-shielding plate of the X-ray imaging apparatus, FIG. 6B is a schematic cross-sectional view of a light-shielding plate of the X-ray imaging apparatus, and FIG. 6C is a scintillator of the X-ray imaging apparatus. (D) Partial schematic sectional view showing a formation state of a scintillator of the X-ray imaging apparatus (e) Schematic sectional view of the same X-ray imaging apparatus

FIG. 7A is a partial schematic cross-sectional view showing another step of forming a light shield plate of the X-ray imaging apparatus, and FIG. 7B is a partial schematic cross-sectional view showing the state of the light shield plate of the X-ray imaging apparatus.

FIG. 8 is a partial sectional view of an X-ray imaging apparatus according to a fourth embodiment of the present invention.

9A is a partial schematic cross-sectional view showing a step of forming a light shielding plate of the X-ray imaging apparatus, FIG. 9B is a partial schematic cross-sectional view showing a formation state of the light shielding plate of the X-ray imaging apparatus, and FIG. (D) Partial schematic cross-sectional view showing the scintillator formation step of the X-ray imaging apparatus (d) Partial schematic cross-sectional view showing the scintillator formation state of the X-ray imaging apparatus (e) Schematic cross-sectional view of the X-ray imaging apparatus

10A is a partial schematic cross-sectional view showing a scintillator forming step of the X-ray imaging apparatus according to the fifth embodiment, and FIG. 10B is a partial schematic cross-sectional view showing a formation state of the scintillator of the X-ray imaging apparatus. c) Schematic sectional view of the X-ray imaging apparatus

FIG. 11 is a perspective view of a conventional X-ray imaging apparatus.

[Explanation of reference numerals] 1 CCD (imaging device) 2 Photo diode 3 Vertical CCD 5 Light-shielding part 6 Insulating layers 7a, 7b Scintillator 8 Reflective film 30 Light-shielding wall 31 Scintillator 50 Light-shielding plate 51 Adhesive 53 Pattern mask 54 Excimer laser light 55 Hole 71 Lattice Frame 72 Silica Particles (Powder) 80 Reflector 81 Reflective Film 90 Through Hole 100 Adhesive Film (Adhesive) 101 Scintillator Column

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI Technical display location H01L 31/09 H01L 31/00 A (72) Inventor Yasuhiko Majiji 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Incorporated (72) Inventor Yuji Matsuda 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (20)

[Claims] 1. A scintillator as a means for converting X-rays or radiation into visible light and an image sensor for converting visible light into an image signal, wherein the scintillator is a columnar crystal,
An X-ray imaging device in which at least one columnar crystal is independently provided on each unit pixel on the imaging surface of an imaging element via an insulating layer. 2. The X according to claim 1, wherein the image pickup device is a CCD.
Line imaging device. 3. A unit pixel on an image pickup surface of an image pickup device has a light-receiving portion and a light-shielding portion having at least a step, and a columnar shape is formed by crystal growth means such as vapor deposition utilizing the step between the light-receiving portion and the light-shielding portion. The X-ray imaging apparatus according to claim 1, wherein the crystal is formed separately and the scintillator is formed on the imaging surface. 4. The X according to claim 1, wherein the columnar crystal is CsI.
Line imaging device. 5. A scintillator for converting X-rays or radiation into visible light, and an image sensor for converting visible light into a video signal.
An X-ray in which a light-shielding wall whose height is lower than the thickness of the scintillator is formed between the light receiving portions of each pixel on the image pickup surface of the image pickup device, and the scintillator is provided on each unit pixel on the image pickup surface of the image pickup device via an insulating layer. Imaging device. 6. The X-ray imaging apparatus according to claim 5, wherein the light shielding wall is made of a synthetic resin mixed with a light shielding material. 7. The X-ray imaging apparatus according to claim 6, wherein the light shielding material is an element having a high effective atomic number such as Pb or Ti or a compound thereof. 8. The X according to claim 5, wherein a light shielding wall having a thickness smaller than that of the scintillator is formed on the image pickup surface of the image pickup device by a printing means.
Line imaging device. 9. The X according to claim 5, wherein the image pickup device is a CCD.
Line imaging device. 10. A scintillator for converting X-rays or radiation into visible light, a light-shielding plate provided with holes in a grid pattern, and an image sensor, wherein the scintillator is filled in the grid-like holes of the light shielding plate. An X-ray imaging device arranged such that each pixel on the imaging surface of the imaging element and the lattice-shaped hole of the light shielding plate face each other. 11. The X-ray imaging apparatus according to claim 10, wherein the holes formed in the light-shielding plate in a grid pattern are filled with scintillators. 12. The X-ray imaging apparatus according to claim 10, wherein a part of the holes formed in the light shielding plate in a grid pattern is filled with a scintillator. 13. A scintillator for converting X-rays or radiation into visible light, and a light-shielding plate provided with through holes in a grid pattern.
An image pickup device, the scintillator is filled in a grid-like through hole of the light shielding plate, and a reflecting plate is provided on one surface of the light shielding plate, and each pixel on the image pickup surface of the image pickup device and the lattice of the light shielding plate. X-ray imaging device arranged so as to face the through hole. 14. The X-ray imaging apparatus according to claim 13, wherein a scintillator is filled in the grid-like through holes of the light shielding plate so that the scintillator faces the imaging surface of the imaging device. 15. The X-ray imaging apparatus according to claim 13, wherein a part of the grid-like through holes of the light shielding plate is filled with a scintillator, and the scintillator is opposed to the imaging surface of the imaging device. 16. The X-ray imaging apparatus according to claim 13, wherein a reflection layer is provided on the inner surface of the through hole. 17. The X-ray imaging apparatus according to claim 10, wherein the light shielding plate is provided with a hole or a through hole by laser processing. 18. The X according to claim 10 or 15, wherein holes or through holes are provided by spraying powder on the light shielding plate.
Line imaging device. 19. A scintillator for converting X-rays or radiation into visible light, and a light-shielding plate provided with through holes in a grid pattern.
An X-ray imaging apparatus having an image pickup element, wherein a scintillator column is formed on a reflecting plate by using an adhesive, and the scintillator column is inserted into a through hole of a light shielding plate. 20. The X-ray image pickup device according to claim 19, wherein the image pickup element is a CCD.