JPH0919867A - Manufacture of super-abrasive grain single layer grinding wheel - Google Patents

Abstract

PURPOSE: To provide a super-abrasive grain single later grinding wheel having a uniform grain distribution by furnishing a gap which can be filled in a single row with super-abrasive grains granulated between a grinding wheel base and a die, filling the grain-filled gap further with a binder, and subjecting it to a hardening or sintering process. CONSTITUTION: Diamond abrasive grains are granulated using a Worster type fluidization tank which sprays a mixture of metal powder, organic binder, and organic solvent, and the resultant is subjected to a debinder process with heating so that metal-covered abrasive grains are obtained. A die 3 and grinding wheel base 1 are set on a bottom plate 5, wherein a gap 4 between the two should be approx. 0.45mm and is filled with the obtained abrasive grains under vibrational excitation. The vibration is given to the bottom plate 5 by a vibratory plate. After filling, silver solder is infiltrated into the gap 4 while the die 3 and the grinding wheel base 1 on the bottom plate 5 are induction heated. After removal of the die 3, the grinding wheel base 1 is machined for finishing, and the grinding wheel surface is dressed, and thus an intended grinding wheel is accomplished.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a single-layer superabrasive grindstone without using the electrodeposition method.

[0002]

2. Description of the Related Art Super-abrasive grindstones include resin-bonded grindstones, metal-bonded grindstones, and vitrified bond grindstones. These have a structure in which abrasive grains are dispersed in a binder having a thickness of several mm. This is a multi-layer structure in which the abrasive grains are sequentially projected onto the polishing surface in accordance with wear. On the other hand, the so-called single-layer structure superabrasive grain grindstone in which the abrasive grains are fixed only on the surface of the grindstone base metal is only the electrodeposition method.

[0003]

In the electrodeposition method, since the electrodeposition is carried out with the abrasive grains covering the abrasive surface, the abrasive grains are fixed without any gap and the abrasive grain gap cannot be adjusted. For this reason, a method of applying an insulating coating material to the polishing surface in advance to locally block the plating or performing segment processing later is adopted. However, the abrasive grain interval itself cannot be adjusted.

According to the present invention, an abrasive grain having a substantially uniform grain size is prepared by providing a gap having a width corresponding to the grain size of the granulated grain between a grinding stone base and a die. The method is characterized in that after the abrasive grains are filled, a binder is poured and the mixture is hardened or sintered.

According to the present invention, the pitch between the abrasive grains can be made arbitrary depending on the film thickness of the metal film that coats the abrasive grains by granulation, and furthermore, it is possible to achieve a completely uniform abrasive grain distribution. In the case of the electrodeposition method, the metals suitable for electrodeposition are limited, and most of them are Ni-plated, whereas the coated metal material of the present invention is not particularly limited. Therefore, it is possible to more firmly hold the abrasive grains and select a binder having abrasion resistance.

[0006]

In the present invention, although it is not particularly necessary, commercially available superabrasive grains are further selected so that a more uniform grain size distribution can be obtained. Easy to get. Since the variation in the abrasive grain size of the granulated abrasive grains is large, it is necessary to select and equalize the grain sizes. The most convenient and effective method for selection is to use a sieve.

[0007] When filling the gap between the mold and the abrasive grain base with the granulated abrasive grains, when the granulated abrasive grain size is small, when the gap is narrowed correspondingly, or in the manufacture of the grindstone, there is a gap. When it is formed into a curved surface, it is difficult for the abrasive grains to be filled. In such a case, if the mold and the whetstone base are filled while vibrating, the filling is extremely smooth.

When the binder is poured into the gap filled with the granulated abrasive grains coated with metal, silver solder or Ni solder is preferable. It is also possible to produce a resin-bonded single-layered grindstone by pouring a liquid resin or resin powder into a gap filled with a resin-coated granulated abrasive grain and curing or sintering the liquid resin or resin powder.

The mold may be a split mold or a carbon mold for easy removal.

[0010]

EXAMPLE An example to which the present invention is applied will be described below. . # 100 (particle size 125 to 150 μm) is used, and. The abrasive grains were granulated using a Wurster type fluidized tank in which a mixture of Cu-15Sn (wt%) metal powder, an organic binder and an organic solvent was sprayed, and heated and debindered to obtain metal-coated abrasive grains. The abrasive grain size was 350 to 450 μm, but it was screened to 355 to 425 μm. . As shown in FIG. 1, the mold 3 and the grindstone base metal 1 were set on the bottom plate 5, and the gap 4 between them was 0.45 mm. . The granulated abrasive grains obtained in step 1 were filled and filled while vibrating the gap. The vibration was applied to the bottom plate 5 by a vibration plate (not shown). . After the granulated abrasive grains were filled, the silver solder was infiltrated into the gap 4 while inductively heating the die on the bottom plate and the whetstone base metal. . The mold is a carbon mold so that it can be easily removed. After removing the mold, the whetstone base metal was finished by cutting and the whetstone surface was dressed to obtain the whetstone shown in the example.

The comparison between the grindstone manufactured in the example and the conventional electrodeposition grindstone was carried out as follows.

[Grinding test] Grinding stone of the present invention Size φ150-10 ^T abrasive grain Artificial diamond # 100 (however, granulated by the above method) Conventional grinding stone size φ150-10 ^T abrasive grain Artificial diamond # 100 Work material: Carbide (ST20E) Grinding conditions Grinding wheel peripheral speed 1600 m / min Feed 15 m / min Depth of cut 0.02 mm / pass Grinding fluid Neocool G 2.2%

[0012]

【result】

As a result, the present invention grindstone has an evenly distributed abrasive grain density, and because there is an abrasive grain interval as compared with the conventional electrodeposition grindstone, it has good chip removability and exhibits extremely excellent sharpness. It has been found.

[0013]

As described above, according to the method for manufacturing a superabrasive single-layer grindstone according to the present invention, the interval between the abrasive grains can be adjusted by the thickness of the coating layer of the abrasive grains. Further, since the abrasive grains are in contact with each other in a single layer on the metal surface of the whetstone base, the abrasive grain distribution is quite uniform. Therefore, it is possible to obtain good sharpness and finished surface with stable grinding performance. Although one example of the metal bond is shown in the embodiment, it is also possible to granulate the abrasive grains with a resin and fill the resin to obtain a resin-bonded single-layer grindstone. It is also possible to manufacture a special-purpose grindstone in which a granulated abrasive grain coated with a metal is filled with a resin. Although a straight type grindstone is shown in the embodiment, it is also possible to use a grindstone of a full type.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a manufacturing method according to an embodiment.

FIG. 2 is a partially enlarged view of an abrasive grain layer portion in an example.

[Explanation of symbols]

 1 Grindstone base metal 2 Shaft hole of grindstone 3 Mold 4 Gap between grindstone base metal and mold 5 Bottom plate 10 Granulated abrasive grains 11 Coating layer 12 Superabrasive grains 13 Binder

Claims (4)

[Claims] 1. A gap is provided between the grindstone base metal and the mold so that the granulated superabrasive grains can be filled in a single row. After filling the gap with the superabrasive grains, a binder is further filled to cure or burn. A method for producing a super-abrasive single-layer grindstone, which comprises binding. 2. The method for producing a superabrasive single-layer grindstone according to claim 1, wherein the granulated coating of superabrasive grains is a metal coating and the binder is a metal. 3. The method for producing a superabrasive single-layer grindstone according to claim 1, wherein the granulated coating of superabrasive particles is a metal coating and the binder is a synthetic resin. 4. The method for producing a super-abrasive single-layer grindstone according to claim 1, wherein the granulated coating of superabrasive particles is made of synthetic resin and the binder is made of synthetic resin.