JPH09181462A - Waterproof chassis structure - Google Patents

Abstract

(57) [PROBLEMS] To provide a small-sized, lightweight and inexpensive chassis structure in which the effective volume in the chassis is expanded without impairing waterproofness. A box-shaped chassis (7) is provided with a through hole (8), an O-ring (14) is fitted in the groove of a screw (12) having a groove,
From the outside, the screw is used to fix the interior component having the screw hole 11 formed therein.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chassis of electronic equipment, and more particularly to a chassis of electronic equipment having waterproof property.

[0002]

2. Description of the Related Art Some electronic devices are used in environments exposed to rainwater, such as outdoors, and those used in such situations are required to be waterproof.

A conventional chassis structure having a waterproof property is shown in FIG. In FIG. 5, reference numeral 1 denotes a box type chassis. The module case 2 is attached to the chassis as an interior component, and a fixed substrate 4 having a through hole 3 is fixed to the bottom surface of the module case 2.
No screw holes or the like are penetrated through the chassis 1 in order to maintain waterproofness, and the bottom surface of the chassis 1 has screw seats for the retaining screws 5 in the number matching the through holes 3 of the fixed substrate 4. Boss 6
Is protruding.

The module case 2 is fixed to the chassis 1 by screwing the retaining screw 5 inserted through the through hole 3 onto the boss 6.

Thus, the module case is fixed to the chassis 1. As described above, since the chassis 1 is not penetrated by the screw holes, water does not enter from the outside, and the waterproofness of the chassis 1 is maintained.

[0006]

However, in the above-mentioned conventional waterproof chassis structure, since the module case 2 is mounted on the protruding boss 6, the height of the boss 6 is between the bottom surface of the chassis 1 and the bottom surface of the module case 2. An extra space is created, and when a plurality of module cases 2 are mounted, a space is required around the module case 2, and the effective volume in the chassis 1 is reduced. Moreover, since the bottom surface of the module case 2 is floated from the bottom surface of the chassis 1 by the boss 6, sufficient heat transfer between the fixed substrate 4 and the bottom surface of the chassis 1 is not performed. Therefore, even when the module case 2 has a wiring board on which a heating element such as a power transistor is mounted, effective heat dissipation is not performed. Further, since there are many component parts and assembling steps such as the boss 6 protruding from the chassis 1 and the fixed substrate 4 fixed to the module case 2, there are problems such as poor production efficiency and high production cost.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a small-sized, lightweight and inexpensive chassis structure in which the effective volume in the chassis is expanded without impairing the waterproof property.

[0008]

SUMMARY OF THE INVENTION According to the present invention, a through hole is formed in a chassis, a screw inserted through the through hole is screwed to an interior product to fix the interior product to the chassis, and a screw head of the screw. An O-ring is interposed between the chassis and the chassis to make the through hole watertight, and the screw includes a screw rod and a screw head, and a groove is formed around the base end of the screw rod of the screw head, and the O-ring is formed in the groove. The chassis is fitted with a through hole and the interior parts are closely fixed to the chassis to improve the heat transfer efficiency between the chassis and the interior parts, while effectively utilizing the space inside the chassis. The O-ring is fitted to the screw to ensure the waterproofness of the chassis.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to FIGS.

Reference numeral 7 in the figure denotes a box-shaped chassis, and through holes 8 are formed at four wall surfaces of the chassis 7. or,
A seat 9 is formed in the through hole 8. Reference numeral 10 denotes a module case, which is an interior product to be attached to the chassis 7, and screw holes 11 are formed at four corners of the module case 10. The module case 10 is fixed to the chassis 7 with screws 12. Screw head 12a of the screw 12
A groove 13 is formed around the base end of the screw rod 12b, and an O-ring 14 as a seal member is fitted in the groove 13. The screw hole 11 of the module case 10 and the through hole 8 of the chassis 7 are aligned, and the interior product is screwed by the screw 12 inserted into the through hole 8.

The module case 10 is fixed to the chassis 7. By fitting the O-ring on the screw 12, the through hole 8 is sealed by the O-ring 14, and intrusion of water from the outside is prevented. Further, the chassis 7 and the module case 10 are brought into close contact with each other by directly forming the through hole 8 in the chassis 7 and screwing the through hole 8. Further, since the module case 10 is directly attached to the wall surface of the chassis 7, the surrounding space required for mounting the module case 10 may be small. FIG. 4
As shown by, even when the wiring board 16 on which the heating element 15 such as a power transistor is mounted is housed in the module case 10, the heat from the heating element 15 is efficiently transferred to the chassis 7 from the module case 10. , Heat dissipation is done efficiently.

[0012]

As described above, according to the present invention, since the space around the module case for mounting is small, the space inside the chassis can be effectively used, and a small and lightweight chassis can be used. Becomes Further, since the chassis wall surface and the module case side surface are in close contact with each other, heat can be easily transferred even in a module case accommodating a wiring board on which a heating element is mounted. Further, since it is only necessary to pass through the through hole in the chassis body, the number of parts and the work steps are reduced, the production efficiency is improved, and the production cost is reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a view corresponding to an arrow AA in FIG.

FIG. 3 is a view as viewed in the direction of arrows AA in FIG. 1;

FIG. 4 is a perspective view showing another embodiment of the present invention.

FIG. 5 is a perspective view showing a conventional example.

[Explanation of symbols]

 7 chassis 8 through hole 9 seat 10 module case 11 screw hole 12 screw 12a screw head 12b screw rod 13 groove 14 O-ring 15 heating element 16 wiring board

Claims (2)

[Claims] 1. A chassis is provided with a through hole, and a screw inserted through the through hole is screwed to an interior product to fix the interior product to the chassis, and an O-ring is provided between the screw head of the screw and the chassis. A waterproof chassis structure characterized in that the through hole is interposed and is watertight. 2. The waterproof chassis structure according to claim 1, wherein the screw comprises a screw rod and a screw head, and a groove is formed around the base end of the screw rod of the screw head, and an O-ring is fitted in the groove.