JPH09178715A - Method for detecting peak in ultrasonic flaw detection equipment - Google Patents
Method for detecting peak in ultrasonic flaw detection equipmentInfo
- Publication number
- JPH09178715A JPH09178715A JP7354527A JP35452795A JPH09178715A JP H09178715 A JPH09178715 A JP H09178715A JP 7354527 A JP7354527 A JP 7354527A JP 35452795 A JP35452795 A JP 35452795A JP H09178715 A JPH09178715 A JP H09178715A
- Authority
- JP
- Japan
- Prior art keywords
- flaw
- peak value
- waveform
- detected
- peak
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/04—Wave modes and trajectories
- G01N2291/044—Internal reflections (echoes), e.g. on walls or defects
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は工業用その他に多く使用
される超音波探傷器において、傷のピーク値の検出方法
に関し、さらに詳しくは傷が底面に近くに存在する場合
でも、傷の反射波のみをピーク検出の対象とし得るピー
ク検出方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for detecting a peak value of a flaw in an ultrasonic flaw detector, which is often used for industrial purposes and the like. The present invention relates to a peak detection method in which only waves can be targeted for peak detection.
【0002】[0002]
【従来の技術】従来の超音波探傷装置の一例を図1以下
に示す。超音波探傷の際、探触子(図2P)に10−7
秒以下の短い電気パルスを与えると、そこから発生した
超音波パルス波形が被測定物中に進み、傷があるとそこ
で傷の程度による反射率で反射する。この反射波が探触
子に到達すると、その波形を探触子が電圧に変換するか
ら、それを増幅すれば図1の如くなる。2. Description of the Related Art An example of a conventional ultrasonic flaw detector is shown in FIG. At the time of ultrasonic flaw detection, the probe (Fig. 2P) has 10 -7
When a short electric pulse of less than a second is given, the ultrasonic pulse waveform generated from the electric pulse advances into the object to be measured, and if there is a flaw, it is reflected at a reflectance depending on the degree of the flaw. When this reflected wave reaches the probe, the probe converts the waveform into a voltage, and if it is amplified, it becomes as shown in FIG.
【0003】すなわち図1は図2のような測定を実施し
たときの例で、図2で、Aは超音波探傷増幅器で内部に
ピーク値検出回路等を持ち、増幅した波形はCRTに示
すブラウン管オシログラフ装置その他の波形観測表示器
で観測出来て、検出した傷ピーク値はアナログ電圧とし
て出力を生じる。PはAで駆動される超音波探傷用探触
子で、Hで示す被測定板の表面に超音波が減衰しないよ
うな接触媒体を経由して接触している。Hの中をPから
発生した超音波が通過し、傷Fから、その傷の大きさに
応じた反射波がPに向けて戻るが、超音波の主体は更に
進み、底面Bに反射してPに戻る。そして探触子Pを板
Hの表面Sを移動させながら連続的測定をするものであ
る。That is, FIG. 1 shows an example when the measurement shown in FIG. 2 is carried out. In FIG. 2, A is an ultrasonic flaw detection amplifier having a peak value detection circuit and the like, and the amplified waveform is a CRT shown in CRT. It can be observed with an oscillograph device or other waveform observation display, and the detected flaw peak value produces an output as an analog voltage. P is an ultrasonic flaw detection probe driven by A, and is in contact with the surface of the plate to be measured indicated by H via a contact medium such that the ultrasonic waves are not attenuated. The ultrasonic wave generated from P passes through H, and the reflected wave corresponding to the size of the wound returns from P to P, but the main body of the ultrasonic wave further advances and is reflected on the bottom surface B. Return to P. Then, the probe P is moved on the surface S of the plate H for continuous measurement.
【0004】従って図1においてFは傷からの反射波、
Bは底面からの反射波を示し、Tは超音波探触子Pに印
加する探触子駆動パルスで、一般にこの出力波形にて見
る限りは完全に飽和する大振幅を持ち、明確な1ケのパ
ルスと見えない。Therefore, in FIG. 1, F is a reflected wave from a flaw,
B represents a reflected wave from the bottom surface, and T is a probe driving pulse applied to the ultrasonic probe P. Generally, as far as the output waveform is seen, it has a large amplitude that completely saturates and a clear single Invisible with the pulse of.
【0005】ここで図1の波形に対して、図3のように
Aの中でTより一定時間経過したG1から別の一定時間
経過したG2までの間をゲートとして波形をとり出すよ
うにすると、とり出される波形pは図4の如くである。
この波形に対して+側のピーク値を検出する回路をつく
ればpの値をアナログ値としてとり出せる。このG1か
らG2までの間のゲートはあらかじめ傷の存在可能位置
から決めて設定しておく。Here, as shown in FIG. 3, the waveform from FIG. 1 is taken out as a gate from G1 after a certain time has elapsed from T to G2 in A as shown in FIG. , The extracted waveform p is as shown in FIG.
If a circuit for detecting the peak value on the + side of this waveform is created, the value of p can be taken out as an analog value. The gate between G1 and G2 is set in advance from the position where the scratch can exist.
【0006】しかしてG1はTからの時間であり、これ
はHの音速が材質・温度による一定値としてH中のある
一定深さ位置を示し、またG2は同じくそれからの深さ
距離である。ところが傷位置Fと底面Bが近接する場合
は、図1は図5のごとくになり、このときゲートの位置
G1〜G2はそのままとすれば、ゲートによりとり出さ
れる波形は図6のごとくなってBの波形も含み、その結
果得られるピーク値pは傷Fの高さを示すのではなく底
面反射波のそれであり、傷の大きさに関する情報になら
ない。底面は極めて大きい傷に相当すると考えられるか
ら、Bは殆どFより大きい波形となる。[0006] G1 is the time from T, which means that the sound velocity of H indicates a certain depth position in H as a constant value depending on the material and temperature, and G2 is the depth distance from it. However, when the flaw position F and the bottom surface B are close to each other, FIG. 1 is as shown in FIG. 5. At this time, if the gate positions G1 and G2 are left unchanged, the waveform taken out by the gate becomes as shown in FIG. The waveform of B is also included, and the resulting peak value p does not indicate the height of the flaw F but that of the bottom surface reflected wave, and does not serve as information regarding the size of the flaw. Since the bottom surface is considered to correspond to an extremely large scratch, B has a waveform almost larger than F.
【0007】[0007]
【発明が解決しようとする課題】上記の問題を解決する
ためにはG2位置をFとBの間におけばよいが、傷Fが
被測定板Hの底面に極めて近接する場合、これは、例え
ば圧延した板の底面直下に発生する傷の如きものを示す
のであるが、Hの厚みが少しであっても変動するような
ときは、FとBは近接しながら板表面Sから、すなわち
Tから遠ざかったり近づいたりすることとなる。すなわ
ちG2の位置を最初にFとBの中間に設定しても、B
が、従ってFも動くからG2が常にFとBの間にある可
能性は小さく、更に肝心のFがG2より後になることも
有り得てFを検出しないことも生ずる。In order to solve the above problems, the G2 position may be set between F and B, but when the flaw F is extremely close to the bottom surface of the plate H to be measured, this is For example, it shows a scratch generated just below the bottom surface of the rolled plate, but when the thickness of H fluctuates even a little, F and B come close to each other from the plate surface S, that is, T You will move away from and approach. That is, even if the position of G2 is initially set between F and B, B
However, since F also moves, it is unlikely that G2 is always between F and B, and the important F may be after G2, and F may not be detected.
【0008】[0008]
【課題を解決するための手段】本発明は、超音波探傷器
において増幅した出力波形に時間的なゲートをかけ、そ
の範囲内に存在する傷からの反射波形に対してピーク値
を検出して傷の相対的大きさを測定する際に、想定され
る傷波形ピーク値より大きく底面反射波形ピーク値より
小さい電圧の識域値を設定しておき、それを越える反射
波電圧が発生したときに検出ピーク値を記憶させる回路
の入力受け入れ動作を停止し、一方検出したピーク値が
記憶回路に到達する間に遅延回路で遅延させることによ
り、ゲート時間内に検出したい傷と、それより遅れて発
生する検出不要の大きい底面反射が一緒に存在する場合
に、記憶するピーク値は目的とする傷のもののみとして
記憶回路に収納し、これを出力できるピーク検出方法で
ある。SUMMARY OF THE INVENTION According to the present invention, an output waveform amplified by an ultrasonic flaw detector is gated in time, and a peak value is detected for a reflection waveform from a flaw existing within the range. When measuring the relative size of scratches, set a threshold value of the voltage that is larger than the expected peak value of the scratch waveform and smaller than the peak value of the bottom reflected waveform, and when the reflected wave voltage exceeds that value. By stopping the input acceptance operation of the circuit that stores the detected peak value and delaying it with the delay circuit while the detected peak value reaches the storage circuit, the flaw that you want to detect within the gate time and the delay later than that When there is a large amount of bottom reflection that does not need to be detected, the peak value to be stored is stored only in the storage circuit as the target flaw, and the peak value can be output.
【0009】以下に本発明を図7〜図13によって説明
する。図7に本発明による超音波探傷器の中のゲートと
ピーク検出回路部のみのブロック図を示す。The present invention will be described below with reference to FIGS. FIG. 7 shows a block diagram of only the gate and the peak detection circuit section in the ultrasonic flaw detector according to the present invention.
【0010】図8は図5と同じで、Rは設定された識域
値を示す。図9はそれに対して設定したゲートの開始G
1と終了G2の位置を示す。図10は図8の波形の図9
位置のゲートにより検出したピークアナログ電圧pを示
す。図11はそのアナログ電圧にある時間遅延させた電
圧を示す。図12は図8の波形の識域値を越える電圧を
検出した状況を示す。FIG. 8 is the same as FIG. 5, and R represents the set threshold value. Figure 9 shows the start G of the gate set for it.
The positions of 1 and end G2 are shown. FIG. 10 is a waveform diagram of FIG.
The peak analog voltage p detected by the gate of the position is shown. FIG. 11 shows the analog voltage with some time delay. FIG. 12 shows a situation in which a voltage exceeding the threshold value of the waveform of FIG. 8 is detected.
【0011】図7のゲート発生部2はG1〜G2の設定
器1にてG1〜G2間の指令を出し、スイッチ回路はゲ
ート間のみ図8の波形を通過させる。これをピーク値検
出器3で検出したのが図10である。これを遅延回路4
を通過させることにより図11の如くになる。遅延させ
る時間は例えば5MHzの探触子を使用したときに0.
5μsecとか、各種条件により決定される時間とす
る。ところが識域値設定器7で図8のRが設定され、識
域値以上を検出する回路6で図12が得られる。図12
の波形が遅延された図11のアナログ波形を記憶する記
憶回路5に行き、その記憶の波形受け入れを停止するの
で、記憶回路5に記憶したアナログ値は図13の如くな
り図11に示すFのピーク値のみを記憶し、Bのピーク
値は記憶していない。すなわち記憶値を出力としてとり
出すと、これは傷Fのピーク値のみを示すのである。当
然ながらこの動作は底面反射波Bは傷反射波Fより必ず
大きいことを条件としているが、これは常に満たされる
ものである。The gate generator 2 of FIG. 7 issues a command between G1 and G2 by the setting device 1 of G1 and G2, and the switch circuit passes the waveform of FIG. 8 only between the gates. This is detected by the peak value detector 3 in FIG. This is the delay circuit 4
The result is as shown in FIG. The delay time is, for example, 0 when a 5 MHz probe is used.
It is set to 5 μsec or a time determined by various conditions. However, R of FIG. 8 is set by the threshold value setting device 7, and FIG. 12 is obtained by the circuit 6 which detects the threshold value or more. FIG.
11 goes to the storage circuit 5 for storing the delayed analog waveform of FIG. 11 and stops accepting the stored waveform. Therefore, the analog value stored in the storage circuit 5 is as shown in FIG. Only the peak value is stored, and the peak value of B is not stored. That is, when the stored value is taken out as an output, this shows only the peak value of the flaw F. Of course, this operation is conditioned that the bottom surface reflected wave B is always larger than the flaw reflected wave F, but this is always satisfied.
【0012】以上のように検出したピーク値を遅延させ
る遅延回路4と、遅延させたアナログ値の記憶回路5
と、傷Fの想定するピーク値以上でBのピーク値より小
さい値に設定する識域値設定器7と、その識域値以上の
波形を検出する検出回路6により検出した波形の到来で
記憶回路5のアナログ波形受け入れを停止する結線によ
り、記憶回路5の出力は傷Fのみで底面反射波Bのピー
ク値は除外されているのである。当然ゲートの開始G1
は考えられる傷F位置より早い時間位置に設定しておく
ものとし、またゲート終了のG2は考えられる傷F位置
より遅い時間位置にしておくのみでよい。The delay circuit 4 for delaying the peak value detected as described above and the delayed analog value storage circuit 5
And the arrival of the waveform detected by the threshold value setting unit 7 for setting the value higher than the peak value of the flaw F and lower than the peak value of B, and the detection circuit 6 for detecting the waveform higher than the threshold value. Due to the wiring for stopping the acceptance of the analog waveform of the circuit 5, the output of the memory circuit 5 is only the flaw F and the peak value of the bottom reflected wave B is excluded. Naturally the start of the gate G1
Is set to a time position earlier than the possible flaw F position, and G2 at the end of the gate need only be set to a time position later than the possible flaw F position.
【0013】上記説明中の記憶回路の受け入れ停止状態
はT又はG1又はFのいずれかと共に解除してピークア
ナログ値の受け入れを開始するものとしてよい。この受
け入れ開始と共にそれまでの記憶値を消せばよい。また
記憶回路のアナログ値受け入れ停止と共にゲートを終了
させ、そのときをG2としてもよい。更にこれらのピー
ク値検出回路3、遅延回路4、記憶回路5等についてア
ナログ方式によらずデイジタル方式によっても動作趣旨
は同一であり、アナログ出力をデイジタル出力としても
記憶したピーク値の出力であることに変りない。The acceptance stop state of the memory circuit in the above description may be released together with either T, G1 or F to start accepting the peak analog value. When this acceptance is started, the stored value up to that point may be erased. Further, the gate may be terminated when the analog value acceptance of the memory circuit is stopped, and the time may be set as G2. Further, the operation of the peak value detection circuit 3, the delay circuit 4, the storage circuit 5 and the like is the same regardless of whether it is an analog method or a digital method, and the analog output is a stored peak value output as a digital output. It does not change to
【0014】[0014]
【発明の効果】一般に傷Fと底面Bが近接して存在し底
面位置が変動するとき、出力波形をデイジタル化してコ
ンピュータに入力し解析することで傷Fの波形ピーク値
を見出すことは可能であるが、本発明の超音波探傷器の
方法によれば、コンピュータは不要で、大きさ、検出速
度、取り扱い、コスト等でもコンピュータより遥かに有
利である。In general, when the flaw F and the bottom surface B are close to each other and the bottom position fluctuates, it is possible to find the peak value of the flaw F waveform by digitizing the output waveform and inputting it to a computer for analysis. However, according to the method of the ultrasonic flaw detector of the present invention, a computer is unnecessary, and it is far more advantageous than a computer in terms of size, detection speed, handling, cost, and the like.
【図1】従来の超音波探傷装置での反射波形を示す。FIG. 1 shows a reflection waveform in a conventional ultrasonic flaw detector.
【図2】従来の超音波探傷装置の一例を示す。FIG. 2 shows an example of a conventional ultrasonic flaw detector.
【図3】ゲートを構成するG1と一定時間経過したG2
を示す。FIG. 3 is a diagram illustrating a G1 forming a gate and a G2 after a predetermined time has passed.
Is shown.
【図4】傷Fの反射波ピークの波形を示す。FIG. 4 shows a waveform of a reflected wave peak of a flaw F.
【図5】傷Fと底面Bとの位置が近接した場合の反射波
形を示す。FIG. 5 shows a reflection waveform when the flaw F and the bottom surface B are close to each other.
【図6】図5における波形のゲートによりとり出された
波形を示す。6 shows the waveform extracted by the waveform gate in FIG.
【図7】本発明のピーク検出方法におけるピーク検出回
路部のみのブロック図である。FIG. 7 is a block diagram of only a peak detection circuit section in the peak detection method of the present invention.
【図8】本発明における傷Fと底面Bとの位置が近接し
た場合の反射波形を示す。FIG. 8 shows a reflection waveform when the flaw F and the bottom surface B of the present invention are close to each other.
【図9】ゲートを構成するG1とG2の位置を示す。FIG. 9 shows the positions of G1 and G2 forming the gate.
【図10】図8の反射波形をピーク検出器で検出したア
ナログピーク電圧を示す。10 shows an analog peak voltage obtained by detecting the reflection waveform of FIG. 8 with a peak detector.
【図11】図10のピークアナログ電圧をある時間遅延
させた電圧を示す。11 shows a voltage obtained by delaying the peak analog voltage of FIG. 10 by a certain time.
【図12】図8の波形の識域値を越える電圧を検出した
状況を示す。FIG. 12 shows a situation in which a voltage exceeding the threshold value of the waveform of FIG. 8 is detected.
【図13】図12の電圧を記憶回路に記憶したアナログ
値を示す。13 shows an analog value in which the voltage of FIG. 12 is stored in a storage circuit.
A 超音波探傷増幅器 H 被測定板 B 被測定板底面 S 被測定板表面 F 傷 P 超音波探傷用探触子 G1,G2 ゲート p ピーク値 R 識域値 1 ゲート設定器 2 ゲートスイッチ回路 3 ピーク値検出器 4 ピーク値遅延回路 5 記憶回路 6 識域値以上の値の検出器 7 識域値設定器 A Ultrasonic flaw detection amplifier H Measured plate B Measured plate bottom surface S Measured plate surface F Damage P Ultrasonic testing probe G1, G2 Gate p Peak value R Threshold value 1 Gate setting device 2 Gate switch circuit 3 Peak Value detector 4 Peak value delay circuit 5 Memory circuit 6 Detector for values above the threshold value 7 Threshold value setter
Claims (1)
に時間的なゲートをかけ、その範囲内に存在する傷から
の反射波形に対してピーク値を検出して傷の相対的大き
さを測定する際に、想定される傷波形ピーク値より大き
く底面反射波形ピーク値より小さい電圧の識域値を設定
しておき、それを越える反射波電圧が発生したときに検
出ピーク値を記憶させる回路の入力受け入れ動作を停止
し、一方検出したピーク値が記憶回路に到達する間に遅
延回路で遅延させることにより、ゲート時間内に検出し
たい傷と、それより遅れて発生する検出不要の大きい底
面反射が一緒に存在する場合に、記憶するピーク値は目
的とする傷のもののみとして記憶回路に収納し、これを
出力できるピーク検出方法。1. A relative size of a flaw is measured by applying a temporal gate to an output waveform amplified by an ultrasonic flaw detector and detecting a peak value with respect to a reflection waveform from a flaw existing within the range. The threshold value of the voltage that is larger than the expected flaw waveform peak value and smaller than the bottom surface reflection waveform peak value is set, and the detected peak value is stored when the reflected wave voltage exceeds it. By stopping the input receiving operation and delaying it with the delay circuit while the detected peak value reaches the memory circuit, scratches you want to detect within the gate time and large bottom reflection that does not need to be detected and occurs later than that When existing together, the peak value to be stored can be stored in the memory circuit as only the target flaw and can be output.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP7354527A JPH09178715A (en) | 1995-12-21 | 1995-12-21 | Method for detecting peak in ultrasonic flaw detection equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7354527A JPH09178715A (en) | 1995-12-21 | 1995-12-21 | Method for detecting peak in ultrasonic flaw detection equipment |
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Publication Number | Publication Date |
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JPH09178715A true JPH09178715A (en) | 1997-07-11 |
Family
ID=18438158
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JP7354527A Pending JPH09178715A (en) | 1995-12-21 | 1995-12-21 | Method for detecting peak in ultrasonic flaw detection equipment |
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---|---|---|---|---|
JPS61151458A (en) * | 1984-12-25 | 1986-07-10 | Kawasaki Steel Corp | C-scanning ultrasonic flaw detection method and apparatus thereof |
JPH02271251A (en) * | 1989-04-12 | 1990-11-06 | Hitachi Constr Mach Co Ltd | Ultrasonic measuring device |
JPH032261A (en) * | 1989-05-31 | 1991-01-08 | Toray Ind Inc | Liquid crystal polyester resin composition |
JPH0664020A (en) * | 1992-08-21 | 1994-03-08 | Masao Moriyama | Device for molding resin material into sheet |
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