JPH09159729A - Semiconductor testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily and safely mount a performance board on a test head by using an actuator. SOLUTION: A sliding member 15 which is slid in the lateral direction on a test head 1 by means of an actuator 4 provided on the side face of the head 1 is provided. Then a plurality of engaging sections 6 is provided on the member 15 and engaged section 10 which are engaged with the sections 6 are provided on the rear surface of a performance board 9. Each engaged section 10 has a hook-like shape composed of a longitudinal groove section 10a and a transversal groove section 10b inclined upward and when the sections 6 enter the longitudinal groove sections 10a and ride on the bottom faces of the transversal groove sections 10b, the sections 6 push down the board 9 by the riding-on amounts and firmly press the board 9 against the head 1. When the board 9 is pressed against the head 1, positioning pins 2 provided on the head 1 are engaged with positioning holes 11 provided in the board 9 so as to prevent the shifting of the board 9 in the lateral direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor tester for mounting a performance board on a test head and testing a device under test mounted on the performance board, and particularly to resisting the spring force of a pogo pin on the test head side. And improved workability when mounting the performance board on the test head.

[0002]

2. Description of the Related Art In a semiconductor tester, a performance board is mounted on a test head and a device under test (DUT) mounted on the performance board is evaluated.
The mounting of this performance board is conventionally performed manually. For example, as shown in FIG. 5, the performance board 51 is pressed onto the test head 53 by the pressing frame 52. The holding frame 52 is locked by the locking pins 54, and the pogo pins 55 are pressed against the performance board 51 to electrically connect the performance board 51 and the test head 53.

[0003]

However, the above-mentioned conventional device has the following drawbacks.

(1) When the number of pogo pins increases due to the increase in the number of pins in the test head, the pin pressure for pushing back the performance board increases. Therefore, in order to perform it manually, it is necessary to press the holding frame against the large pin pressure. I won't. For this reason, it is difficult to carry out the work smoothly, and particularly, the maximum pin pressure is received during locking, which is dangerous because the pin for locking may come off.

(2) In addition, there is a problem in that the contact of the pogo pin with the performance board is not always sufficient in the case of pressing and fixing by pin locking, which results in defective DUT measurement.

An object of the present invention is to solve the above-mentioned drawbacks of the prior art, and to provide a semiconductor test apparatus capable of automatically, reliably and easily and safely mounting a performance board on a test head by using an actuator. is there.

[0007]

According to a first aspect of the present invention, a performance board is pressed onto a test head, and pogo pins on the test head are pressed against the performance board to electrically connect the test head and the performance board. In the semiconductor testing device configured to take such measures, a locked portion provided on the performance board, a slide member provided on the test head and sliding along a test head surface, an actuator for sliding the slide member, and When the slide member slides, it is attached to the slide member, and the slide member slides to lock the performance board placed on the test head and to lock the performance board onto the test head. , The performance mounted on the test head A semiconductor testing device provided with a regulating means for regulating the test head parallel to the surface movement of the performance board.

In the first invention, after the performance board is placed at a predetermined position on the test head, the actuator is driven to move the slide member in the locking direction. Then, the locking portion of the slide member is locked to the locked portion of the performance board. At this time, since the movement of the performance board is restricted by the locking means in parallel with the test head surface, the locked portion does not escape due to the movement of the locking portion, and the performance board moves to the locked portion of the locking portion. Is reliably locked. As a result, the performance board is firmly pressed onto the test head and the pogo pins on the test head are pressed against the performance board, so that the electrical connection between the test head and the performance board is ensured.

In a second aspect of the present invention, the performance board is pressed onto a test head having a printed circuit board arranged in a radial pattern, and the pogo pins attached to the printed circuit board are pressed against the performance board, whereby the performance of the printed circuit board and the performance of the test head is improved. In a semiconductor test device for electrical connection with a board, the performance board is provided with a plurality of locked portions provided along the circumference of the board, and the test head is provided with a printed portion. A ring-shaped slide member that rotates around the center point of the radial arrangement of the substrate, an actuator that rotates the slide member, and the slide member that is mounted on the test head by sliding the slide member. The test head is locked to multiple locked parts on the performance board. Semiconductor test apparatus including a plurality of locking portions for pressing the performance board on the top, and a regulation means for regulating movement of the slide member parallel to the test head surface of the performance board placed on the test head Is.

When the printed circuit boards of the test head are not arranged in parallel but in a radial arrangement, the performance boards are evenly pressed against the pogo pins which are arranged concentrically on the test head surface because of the radial arrangement. There is a need to. In this respect, in the second invention, since the slide force of the actuator is applied as a resultant force to the single ring-shaped slide member that is not divided, even if there is a variation in the slide force among the plurality of actuators, the slide force is concentric. The performance boards can be evenly pressed against the pogo pins on the printed circuit boards.

In a third aspect based on the first or second aspect, the engaged portion is formed by a groove cut obliquely upward from the back surface of the performance board, and is engaged in the groove. In the semiconductor testing device, the locking portion is constituted by a roller. As described above, when the locked portion is formed by the groove and the locking portion is configured by the roller locked in the groove, the structure becomes simple. Further, the rotation and rotation of the roller allows the locking and unlocking to be performed more smoothly, and the performance board can be easily attached and detached.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. 1 is an explanatory view of a state in which the performance board 9 is removed from the test head 1, FIG. 2 is an explanatory view of a procedure of mounting the performance board 9 on the test head 1, and FIG. 3 is a plan view of the performance board 9 and the test head 1. is there.

The test head 1 includes a large number of printed circuit boards 17 arranged in parallel with each other, and a large number of pogo pins 3 elastically supported by springs are provided on each printed circuit board 17 so as to project therefrom.

The semiconductor test apparatus presses the performance board 9 onto the test head 1 and presses the pogo pins 3 on the test head 1 against the performance board 9 to press the test head 1 and the performance board 9 together.
The electrical connection with is carried out to evaluate the DUT 13 mounted on the performance board 9.

The performance board 9 has a rectangular shape, and four sides thereof are constituted by a reinforcing frame 14, and the reinforcing frame 14
A plurality of locked parts 10 are provided on the back surfaces of the two opposite sides. As shown in FIG. 1, the locked portion 10 is a groove cut in the back surface of the reinforcing frame 14, that is, a vertical groove portion 10a in the thickness direction of the board opened at the bottom, and a board length continuous with the vertical groove portion 10a. It has a hook shape including the lateral groove portion 10b in the depth direction. The lateral groove portion 10b is formed so as to face obliquely upward, not in the lateral direction, and when the locking portion 6 described later enters the lateral groove portion 10b, a pressing force that pushes down the performance board 9 is generated. .

Further, a plurality of positioning holes 11 are provided on the remaining two opposite sides of the performance board 9, and these positioning holes 11 are engaged with positioning pins 2 provided at predetermined positions on the test head 1. Then, the performance board 9 can be placed at a predetermined position on the test head 1. By the pin engagement, the performance board 9 placed on the test head 1 is allowed to move in a direction perpendicular to the test head surface 1a, but the movement in a direction parallel to the test head surface 1a is restricted. The position determining hole 11 and the position determining pin 2 constitute the regulating means of the present invention.

The reinforcing frame 1 of the performance board 9
A plurality of handles 12 for gripping the performance board 9 are provided on the upper part of 4.

On the other hand, on both sides of the test head 1 corresponding to the two opposite sides of the performance board 9 provided with the locked portion 10, rod-shaped slides on the test head 1 by the actuator 4 along the test head surface 1a. Two slide members 15 are provided. The slide member 15 is provided with a plurality of elongated holes 7 along the length direction, and the guide pins 8 attached to the fixing member 16 are inserted into these elongated holes 7 to prevent the sliding member 15 from rattling when sliding. I'm losing.

Locking portions 6 that engage with the locked portions 10 of the performance board 9 are attached to predetermined positions above the slide members 15 via mounting plates 5. Each locking portion 6 enters the groove of the locked portion 10 through the opening of the vertical groove portion 10a, rides on the bottom surface of the horizontal groove portion 10b through the vertical groove portion 10a, and is locked into the depth of the horizontal groove portion 10b when locked. Then, the performance board 9 is pressed onto the test head 1. On the contrary, when it is disengaged from the locked portion 10, the lock is released, and the pressing of the performance board 9 against the test head 1 is released.

The locking portion 6 to be locked to the locked portion 10 may be a simple bar, but is freely rotatable with respect to the mounting plate 5 in order to facilitate engagement and disengagement with the locked portion 10. It is preferable that the roller be attached to the roller. Further, as the actuator 4 for sliding the slide member 15,
For example, a hydraulic cylinder or an air cylinder can be used.

A procedure for mounting the performance board 9 on the test head 1 will be described with reference to FIG. The performance board 9 is placed at a predetermined position on the test head 1 by engaging the positioning hole 11 of the performance board 9 with the positioning pin 2 on the test head 1 (FIG. 2).
(A)). At this time, the locking portion 6 of the slide member 15 mounted on the test head 1 is inserted into the vertical groove portion 10a from the opening of the locked portion 10 of the performance board 9.

In this state, the actuator 4 is driven to move the slide member in the right direction, that is, the locking portion 6 causes the locked portion 1 to move.
It automatically slides in the direction of engaging 0. Then, the locking portion 6 attached to the slide member 15 runs from the vertical groove portion 10a of the performance board 9 to the bottom surface of the horizontal groove portion 10b formed continuously with the vertical groove portion 10a. During the process in which the locking portion 6 rides on the bottom surface of the lateral groove portion 10b that rises to the right, the performance board 9
Receives a force pushed down by the locking portion 6 and is pushed onto the test head 1. The locking portion 6 is the lateral groove portion 10.
When reaching the back of b, the locking portion 6 is locked, and at this time, the performance board 9 is firmly pressed onto the test head 1 with the maximum pressure contact force (FIG. 2 (b)). The inclination angle and the length of the lateral groove portion 10b forming the locked portion 10 are as follows.
Determine according to the required pressing force.

Although there is concern that the performance board 9 may shift in the same direction as the locking portion 6 slides and the locked portion 10 may escape, the performance board 9 is pin-engaged and moves laterally. Since the locked portion 10 is restricted, the locked portion 10 does not escape, and the locking portion 6 is reliably locked to the locked portion 10. As a result, the pogo pin 3 on the test head 1 is firmly pressed against the performance board 9, so that the electrical connection between the test head 1 and the performance board 9 is surely made.

As described above, since the actuator that can generate a mechanical force is used even if the number of pogo pins increases and the pin pressure increases, unlike the case of manual operation, a force exceeding the pin pressure can be easily applied. Can be sent to
The performance board can be easily pressed against the test head. Moreover, since the pressing is automatically performed by the actuator, there is no danger of work and it is very safe.

Further, by sliding one slide member with one actuator on each side of the test head, each locking portion provided on the slide member is engaged with each hook-shaped groove of the performance board. Since the performance board is stopped and the performance board is pressed down at multiple points at the same time, it is possible to reduce the variation in the pressing force of the performance board compared to when the multiple points on the performance board are pressed down directly by multiple actuators. it can. As a result, the pressure contact force of the pogo pin can be made uniform in the plane, the contact of the pogo pin can be sufficiently secured, and the DUT measurement failure can be eliminated.

Also, in the normal test head, a large number of printed boards and motherboards arranged in parallel are provided, a cooling fan for cooling the board, and a large number of wirings. In the configuration, the actuator is used horizontally, so the actuator can be attached to the side of the test head. Therefore, as in the case where the actuator is used vertically, a space for the actuator is forcibly secured in the test head. Or
There is no need to upsize the test head.

By the way, in the above-mentioned embodiment, the case where the printed circuit board is a semiconductor test device in which the printed circuit boards are arranged in parallel has been described. FIG. 4 shows a test head 2 having a printed circuit board in a radial array.
1 and a plan view of a performance board 29 attached to the same.

A plurality of locked portions 30 and a plurality of positioning holes 31 are provided on the back surface of the performance board 29, and the positioning pins 22 that engage with the positioning holes 31 and the locked portion 3 are provided on the test head 21.
Basically, the locking portion 26 that is locked to 0, the slide member 35 that slides the locking portion 26, and the actuator 24 are provided in the same manner as in the parallel-arranged semiconductor test apparatus.
However, the slide member 35 is ring-shaped, the actuator 24 is provided in the tangential direction of the ring so that the ring-shaped slide member 35 rotates about the center point 38 of the radial arrangement, and the ring-shaped slide member 35 is attached to the ring-shaped slide member 35. The difference is that the locked portions 30 to which the stoppers 26 are locked are arranged along the circumference of the performance board 29.

It is necessary to evenly press the performance board 29 to the pogo pins 23 which are arranged concentrically on the test head surface because of the radial arrangement. According to the present embodiment, a plurality of actuators 24 are provided. However, since these forces are evenly applied as a resultant force to one ring-shaped slide member 35, the printed circuit boards 37 arranged in concentric circles are not affected by variations in actuators.
The performance board 29 can be evenly pressed against the pogo pins 23 of FIG.

In the above-described embodiment, the locked portion is formed by the hook-shaped groove, but the invention is not limited to this. For example, it suffices if the upper part of the groove is opened and there is a take-in port for the locking part and a mountain on which the locking part rides. In short, the lateral movement of the locking part is changed to the downward direction and the performance board is pushed. Any configuration may be used as long as the force for lowering is generated.

[0031]

According to the present invention, since the performance board is automatically pressed against the test head by using the actuator, the pressing is easier and safer than the conventional manual pressing. In addition, even if the number of pogo pins increases and a large force is required to press the performance board, the actuator can easily generate a pressing force that exceeds that force, so the pogo pin will surely contact the performance board. Can be made.

[Brief description of the drawings]

FIG. 1 is a state diagram in which a performance board is removed from a test head for explaining an embodiment of a semiconductor test apparatus of the present invention.

FIG. 2 is an explanatory diagram showing a procedure for mounting a performance board on the test head according to the present embodiment.

FIG. 3 is a plan view of a performance board and a test head according to the present embodiment.

FIG. 4 is a schematic plan view of a performance board and a test head for explaining another embodiment.

FIG. 5 is an explanatory diagram of mounting a performance board on a test head of a conventional example.

[Explanation of symbols]

 1 Test Head 1a Test Head Surface 2 Positioning Pin 3 Pogo Pin 4 Actuator 6 Locking Part 9 Performance Board 10 Locked Part 11 Positioning Hole 13 DUT (Device Under Test) 15 Slide Member

Claims (3)

[Claims] 1. A semiconductor test apparatus in which a performance board is pressed against a test head, and pogo pins on the test head are pressed against the performance board to electrically connect the test head and the performance board. A locked portion provided on the performance board, a slide member provided on the test head and sliding along the test head surface, an actuator for sliding the slide member, and a slide member mounted on the slide member and sliding the slide member. Is locked to the locked part of the performance board mounted on the test head, and presses the performance board onto the test head, and the performance mounted on the test head when the slide member slides. Board test head The semiconductor test apparatus characterized by comprising a restricting means for restricting the plane parallel to the motion. 2. A performance board is pressed onto a test head having a printed circuit board arranged in a radial pattern,
In a semiconductor test device in which the pogo pins attached to the printed circuit board are pressed into contact with the performance board to electrically connect the printed circuit board of the test head to the performance board, the performance board is mounted on the circumference of the board. A plurality of locked portions provided along the ring, a ring-shaped slide member that is provided on the test head and that rotates about the center point of the radial arrangement of the printed circuit board, and an actuator that rotates the slide members. And a plurality of locking portions which are attached to the slide member and which are locked by a plurality of locked portions of the performance board placed on the test head by the slide of the slide member to press the performance board on the test head. When the slide member is rotated, the performance placed on the test head The semiconductor test apparatus being characterized in that a regulating means for regulating the test head parallel to the surface movement of Nsubodo. 3. The locked portion is formed by a groove cut obliquely upward from the back surface of the performance board, and the locking portion which is locked in the groove is a roller. 1. The semiconductor test device according to 1 or 2.