JPH09136319A - Apparatus for dividing substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To wholly divide a substrate by a small driving force for dividing and to make a large scale facility unnecessary and to decrease maintenance cost by forming integrally a press part for breaking the substrate at a channel part for dividing and a tapered cutter part for cutting the substrate at the channel part for dividing. SOLUTION: As a substrate 60 is broken at a channel part 61 for dividing by means of a press part 31 while pushing is performed by a pushing means 20, strain of the substrate 60 is little and a force being necessary for breaking can be done as small as possible. In addition, as after breaking is done in advance at the channel part 61 for dividing, cutting is performed at the channel part 61 for dividing by means of a cutter part 32, a force being necessary for cutting can be done as small as possible. In addition, as the cutter part 32 is a tapered shape, the force is a point contact where the force is concentrated at one point and it is possible to make the force being required for cutting smaller furthermore. Therefore, as the substrate 60 can be divided surely by a small driving force for dividing, it is unnecessary to use a hard steel sheet and an easily moldable material such as a stainless steel can be used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate dividing device, and more particularly to a substrate dividing device for dividing a substrate into a predetermined size and a predetermined shape to form a circuit substrate.

[0002]

2. Description of the Related Art When dividing a substrate using a dividing device, various dividing devices have been conventionally used. FIG.
(A) is a schematic perspective view showing an example of a substrate before being divided, and (b) is a schematic partially enlarged perspective view of the substrate shown in (a).

A dividing groove 61 is formed at a predetermined portion of the substrate 60 to be divided, and a product pattern 60a, which is a main portion of the substrate 60 partitioned by the dividing groove 61, has a wiring pattern, an electronic component, etc. (Not shown) is arranged.
Dummy portions 60b and 60c are arranged around the product portion 60a partitioned by the dividing groove 61.
Positioning holes (not shown) and the like are formed in b and 60c.

FIG. 5 is a schematic side view of a substrate dividing apparatus shown for explaining an example of a conventional substrate dividing method. In the figure, reference numeral 200 denotes a plate-shaped dividing device main body having a substantially L-shaped side view, and a pressing member 201 having a predetermined shape is fixed to an L-shaped inner side surface 200a of the dividing device main body 200. In order to divide the substrate 60 by using the dividing device configured as described above, the substrate 60 is inserted between the L-shaped inner side surface 200a of the dividing device main body 200 and the pressing member 201,
The substrate 60 is pressed downward (in the direction of arrow A in the figure) by human power. At this time, the dummy portion 60b (60c) of the substrate 60 is pressed by the pressing member 201, the pressing force is concentrated on the dividing groove 61 portion, and the substrate 60 is divided at the dividing groove 61 portion.

However, when the substrate 60 is divided (manually divided) by the above-mentioned dividing device, a considerably large strain force acts on the substrate 60, and the strain force causes the substrate 6 to move.
The electronic component 62 and the like formed on the surface 0 will be considerably stressed. Further, in order to prevent the deterioration of the quality of the electronic component 62 due to the stress, the distance B between the arrangement position of the electronic component 62 and the dividing groove 61 is set to, for example, at least 30.
However, it is difficult to mount the electronic components 62 at a high density, and the size of the substrate 60 is increased.

Therefore, instead of the above-mentioned manual division, a method using shear division is also adopted. FIG. 6 is a schematic cross-sectional view showing a dividing device that divides a substrate by shear division. Reference numeral 301 in the figure denotes a pressing member that presses the peripheral portion of the product portion 60a of the substrate 60, and the substrate 6 is provided above the pressing member 301.
An upper frame body 301a extending horizontally is formed so as to be larger than the outer periphery of the zero dummy portion 60b (60c). A cylinder portion (not shown) is connected to the upper side of the pressing member 301, and the air is introduced into the cylinder portion so that the pressing member 301 moves downward (direction of arrow A in the figure). A pressing member 302 for pressing the dummy portion 60b is provided below the upper frame 301a of the pressing member 301.
Are arranged. Further, the through hole 3 is formed in the upper frame 301a.
01b is formed, and the guide lot 305 is attached to the upper surface of the pressing member 302.
Reference numeral 05 penetrates the through hole 301b. Further, the guide lot 30 between the upper frame 301a and the pressing member 302
A coil spring 307 is provided on the outer periphery of the coil 5, and the coil spring 307 constantly urges the pressing member 301 upward.

A mounting table 303 is disposed at a lower position facing the pressing member 301 via the product section 60a, and the mounting table 303 is configured to be movable downward. A pressing member 304 is provided on the outer periphery of the mounting table 303 at a position facing the pressing member 302 via the dummy part 60b (60c).
Is arranged so that it cannot be moved downward.

In order to divide the substrate 60 by using the dividing device 300 having the above-mentioned structure, first, the pressing member 301 is moved downward by introducing air. At this time, the substrate 60
A pressing force in the direction of arrow A in the figure is applied to the pressing member 30.
While the product portion 60a sandwiched between 1 and the mounting table 303 is movable downward, the dummy portion 60b (60 sandwiched between the pressing member 302 and the pressing member 304 (60).
Since c) is in the immovable state, stress concentrates on the dividing groove 61 portion formed between the product portion 60a and the dummy portion 60b (60c), and the substrate 60 is divided at the dividing groove 61 portion. .

[0009]

The dividing device 3 having the above structure.
According to 00, the substrate 60 can be divided by one dividing step, but the equipment becomes large because it requires a large force of, for example, 500 to 1000 kg, and the total weight of the equipment becomes several hundred kg, for example. There was a problem of reaching. In addition, there is a problem that the operating noise of the splitting device is large and that the component parts are easily worn, resulting in high maintenance cost.

In addition to the above-mentioned dividing device 300, there are a dividing device for push-cutting by a cutter blade, a dividing device for a rotary blade, and the like.

FIG. 7 is a schematic side view showing a splitting device for push-cutting by a cutter blade. In the figure, 401 is the substrate 60.
2 shows a pressing member for pressing the product portion 60a, and a cutter blade mounting base 404 which is vertically movable is arranged above the pressing member 401. Cutter blade mount 40
A cutter blade 405 is attached at a predetermined position of 4 and at a position facing each other with the pressing member 401 interposed therebetween. The substrate 60 is mounted on the mounting table 403, and a recess 403a into which the cutter blade 405 can be inserted is formed at a predetermined position of the mounting table 403. These pressing members 4
01, the mounting table 403, the cutter blade mounting table 404, and the cutter blade 405 constitute the dividing device 400. In the dividing device 400 configured as described above, the cutter blade mounting base 404 is lowered so that the cutter blade 405 moves from the dividing groove 61 of the substrate 60 to the mounting table 4.
03 is placed in the concave portion 403a, and the substrate 60 becomes the product portion 60.
a and the dummy portion 60b (60c).

However, in the dividing device 400 having the above-mentioned structure, it is difficult to divide the substrate 60 in a lump, and the number of operations is two.
In addition to the problem of more than the number of steps, the force required for division (hereinafter referred to as division propulsion force) is not reduced, and maintenance of the cutter blade 405 is required, which makes it difficult to reduce costs.

FIG. 8 is a schematic side view showing a dividing device using a rotary blade. In the figure, 501 is the product portion 60a of the substrate 60.
It shows a pressing member for pressing, and the product part 60a is mounted on the mounting table 503. Pressing member 50
A rotary blade 505 attached to a rotary blade attachment portion (not shown) that is vertically movable is disposed on the side of 1 and above the split groove portion 61. The dividing device 500 is configured to include the pressing member 501, the mounting table 503, and the rotary blade 505. Dividing device 500 configured in this way
In the above, the rotary blade 505 is brought into contact with the divided groove 61 portion of the substrate 60 and rotated, so that the divided groove 61 portion is shaved and the substrate 60 becomes the product portion 60a and the dummy portion 60b (60).
c) and

However, the dividing device 500 having the above structure has a problem that the shavings scatter on the substrate 60 and cannot be used especially for cutting a glass ceramic substrate or the like. Further, the work process requires two or more processes, the divisional propulsive force is not reduced, and the rotary blade 505 needs to be maintained, which makes it difficult to reduce the cost.

The present invention has been made in view of the above problems, and it is possible to divide a substrate in a batch with a small dividing propulsion force, a large facility is not required, and a maintenance cost can be reduced. It is intended to provide a dividing device.

[0016]

Means for Solving the Problems and Effects Thereof In order to achieve the above object, a substrate dividing apparatus according to the present invention comprises a substrate mounting table, pressing means for pressing the substrate against the mounting table, and the substrate. A cutter blade integrally formed with a press portion for folding at the dividing groove portion and a tapered cutter portion for cutting the substrate at the dividing groove portion, and a driving means for moving the cutter blade up and down. It is characterized (1).

According to the substrate dividing device (1), since the substrate is bent at the dividing groove portion by the pressing portion while being pressed by the pressing means, the distortion of the substrate is small, and the force required for bending is small. It requires as little power as possible. Further, since it is cut in the dividing groove portion by the cutter portion after being folded in the dividing groove portion in advance, the force required for cutting can be minimized. Further, since the cutter portion has a tapered shape, the force is concentrated at one point so that a point contact is achieved, and the force required for cutting can be further reduced. Therefore, it is possible to reliably divide the board with a small divisional propulsion force, so that it is not necessary to use a hard steel plate or the like as a component material, and a relatively easy-to-form material such as stainless steel can be used, which reduces the component manufacturing cost. can do. Further, since a small divisional propulsive force is sufficient, the cutter blade is less likely to be damaged and maintenance cost can be reduced. Furthermore, since it is not necessary to use a particularly large component as a component of the dividing device, the facility does not become large.

Further, the substrate dividing apparatus according to the present invention is characterized in that the cutter blades arranged to face each other are set to the same height level (2).

According to the above-mentioned substrate dividing device (2), the dividing propulsive forces distributed substantially equally act on the cutter blades arranged to face each other, so that the substrate can be divided in a well-balanced manner. . Further, for example, if another set of facing cutter blades is set to a height level different from the height level, for example, a total of 4 in a single dividing step.
It is possible to cut a set of parts, and it is possible to collectively divide the substrate.

The substrate dividing apparatus according to the present invention is characterized in that the mounting table is automatically arranged at the substrate mounting position and the substrate dividing position, and the vertical movement of the cutter blade is automatically controlled. Yes (3).

According to the substrate dividing device (3), the operator only has to place the substrate on the mounting table, and the operation of mounting the substrate on the mounting table does not need to be performed below the cutter blade. Therefore, safety can be improved. Further, since the work after placing the substrate can be automated, the substrate dividing position can be precisely controlled. Therefore, it is possible to improve workability and to stably improve product quality.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a substrate dividing apparatus according to the present invention will be described below with reference to the drawings. FIG. 1 (a)
FIG. 3 is a schematic side sectional view showing a substrate dividing device according to an embodiment, and (b) is a schematic partially exploded perspective view showing a part of the dividing device shown in FIG. And
(C) is a schematic enlarged perspective view showing a cutter blade of the dividing device shown in (a).

In the figure, reference numeral 11 indicates a rectangular plate-shaped mount, for example, and a through hole 11a is formed in the substantial center of the mount 11. A rod 12b connected to a piston 12a arranged in the cylinder 12 passes through the through hole 11a,
The tip of the rod 12b below the gantry 11 is connected to the cutter blade mount 15. The cylinder 12 is formed with an air introduction / exhaust port (not shown), and the piston 12a and the rod 12b in the cylinder 12 are driven in the vertical direction by the introduction / exhaust of the air.
A through hole 11b is formed at a predetermined position near a corner of the gantry 11, and a guide rod 13 supported by a bearing portion 14 on the gantry 11 is inserted into the through hole 11b.
A ball (not shown) is disposed in the bearing portion 14, and the guide rod 13 is rotated by the rotation of the ball.
Is smoothly guided up and down. The rod 12b and the guide rod 13 in these cylinders 12 penetrate the gantry 11, the rod 12b is fixed to a substantially central portion of the cutter blade mounting base 15, and the guide rod 13 is fixed to a predetermined position of a corner portion. These gantry 11, cylinder 12, guide rod 13, cutter blade mount 15
The drive means 10 is configured to include the above. Driving means 1
0 is supported at the corners of the gantry 11 by the columns 16 attached to the workbench 50.

The cutter blade mounting base 15 is formed with through holes 15a at, for example, four predetermined positions, and the through holes 15a have, for example, predetermined positions on the upper surface of the pressing means 20 located below the cutter blade mounting base 15. Fixed shaft 1 formed in 4 places
7 is inserted. Also, the cutter blade mount 15
A coil spring 18 is provided on the outer circumference of the fixed shaft 17 between the pressing unit 20 and the pressing unit 20. The pressing means 20 is arranged so as to face the product portion 60a of the substrate 60 placed on the mounting table 40, and a recess 20a is formed on substantially the entire lower surface of the pressing means 20 except for the peripheral portion. The pressing means 20
The peripheral portion of the product portion 60a is pressed only by the peripheral portion 20b. The mounting table 40 is arranged on a slide block (not shown) of the automatic arranging device 70 arranged on the work table 50, and the automatic arranging device 70 allows the mounting position of the substrate 60 and the dividing position of the substrate 60. It is arranged automatically.

For example, four cutter blades 30 are attached vertically to the work table 50 so as to surround the outer periphery of the pressing means 20 at predetermined positions of the cutter blade mounting base 15, and the tip portion of the cutter blade 30 is attached. The press part 31 is arranged at a position where it comes into contact with the dummy part 60b (60c) of the substrate 60, and the cutter part 32 is provided inside the press part 31 of the cutter blade 30 with the dividing groove 6 of the substrate 60.
It is formed so as to come to a position above 1. As the cutter blade 30, for example, the cutter blades 30a arranged to face each other,
30b is set to the same height level, and the other pair of facing cutter blades 30c and 30d is set to the same height level higher than the height level of the cutter blades 30a and 30b. Cutter blades 30a, 30b, 30
a cutter portion 32a formed on each of c and 30d,
Each of 32b, 32c, and 32d has a taper angle of about 5 to 10 °.

FIG. 2 is a schematic partial cross-sectional plan view and side view showing a general automatic placement device 70 used in the substrate dividing device according to the embodiment.

Reference numeral 71 in the figure denotes a slide block on which the mounting table 40 is mounted. The side portions of the slide block 71 are hollow guide shafts 72, 73 and the guide shaft 72 formed in the automatic placement device 70. The cylinder tube 75 located between 73 penetrates. The guide shafts 72 and 73 and the cylinder tube 75 are arranged in parallel with each other, and in the cylinder tube 75, for example, an N-pole magnet 76 and a piston 77 fixed to the magnet 76 are arranged. The cylinder tube 75 extends substantially in the center of the automatic placement device 70 in the long axis direction.
5 or the center of the side surface of the automatic placement device 70 and the tip of the guide shaft 73, that is, the automatic placement device 70.
Air inlet / outlet ports 78a, 78
b is formed so that air can be supplied to or discharged from the cylinder tube 75 via the guide shaft 73.

A donut-shaped magnet 79 having, for example, an S pole surrounding the cylinder tube 75 is disposed at a predetermined position inside the slide block 71. The magnet 76 and the magnet 79 are provided.
The piston 77 and the slide block 71 are integrally operated by attracting each other.

Air is introduced into and discharged from the cylinder 12 and the cylinder tube 75 by a control device (not shown) automatically.

FIG. 3 shows a dividing device 10 constructed as described above.
6 is a schematic perspective view showing a state of the substrate 60 at each stage when the substrate 60 is divided by 0. FIG.

The substrate 60 (see FIG.
To divide (a)), first, an operator places the substrate 60 on the mounting table 40 on the slide block 71 in the mounting position shown in FIG. 2, and the air is introduced from the air inlet port 78b into the guide shaft. It is introduced into the cylinder tube 75 via 73 and the piston 77 is moved in the D direction. As a result, the entire slide block 71, the mounting table 40 on the slide block 71, and the substrate 60 on the mounting table 40 move in the automatic placement device 70 in the D direction to predetermined division positions.

Next, air is introduced into the cylinder 12 shown in FIG. 1, and the rod 12b connected to the piston 12a moves downward. Since the rod 12b is fixed to the cutter blade mount 15, the cutter blade mount 15
Moves down together with the guide rod 13 guided by the bearing portion 14 fixed to the mount 11, and the peripheral portion 20b of the pressing means 20 presses the peripheral portion of the product portion 60a of the substrate 60. Then, first, the dummy portions 60b of the substrate 60 are pressed by the press portions 31a and 31b of the cutter blades 30a and 30b. When more air is introduced into the cylinder 12, the cutter blade mounting base 15 is further lowered, and the dummy portions 60b of the substrate 60 are further pressed by the press portions 31a and 31b of the cutter blades 30a and 30b, as shown in FIG. As shown, the split groove 61 is folded downward. At this time, a downward stress similarly acts on the pressing means 20, but the fixed shaft 17 supporting the pressing means 20 is fixed to the cutter blade mount 15
After the pressing means 20 contacts the substrate 60, the stress is applied to the cutter blade mounting base 15 and the pressing means 20.
Since the coil spring 18 interposed between and is absorbed to some extent, the product portion 60a of the substrate 60 is not damaged by the pressing by the pressing means 20.

When more air is introduced into the cylinder 12, the cutter blade mounting base 15 is further lowered and the cutter portions 32a and 32b of the cutter blades 30a and 30b connect the dummy portion 60b to the product portion 60a in the dividing groove 61. Are separated (FIG. 3 (c)).

When the air is further introduced into the cylinder 12, the cutter blade mounting base 15 is further lowered, and the dummy portion 60c of the substrate 60 is pressed against the press portions 31c and 31d of the cutter blades 30c and 30d, and the dummy portion 60c is pressed. As shown in (d), the split groove 61 is folded downward.

When more air is introduced into the cylinder 12, the cutter blade mounting base 15 is further lowered and the dummy portions 60c connected to the product portion 60a in the dividing groove 61 by the cutter portions 32c and 32d of the cutter blades 30c and 30d. Are separated (FIG. 3 (e)).

When the product section 60a is retracted from the mounting table 40, air is introduced into the cylinder tube 75 from the air introduction port 78a of the automatic placement device 70, and the piston 77 is released.
The magnet 76 fixed to the piston 77 is moved in the C direction. As a result, the entire slide block 71 having the magnet 79 attracting the magnet 76 is returned to the predetermined mounting position in the C direction in the automatic placement device 70.

As described above in detail, according to the dividing device 100 according to the embodiment, the product portion 60a is pressed by the pressing means 20.
Since the substrate 60 is folded at the dividing groove 61 portion by the pressing portion 31 while pressing the peripheral portion of the substrate, distortion of the substrate 60 is small,
Also, the force required to fold it is as small as possible. further,
Since it is cut at the dividing groove 61 portion by the cutter portion 32 after being folded at the dividing groove 61 portion in advance, the force required for cutting is also as small as possible. In addition, the cutter unit 32
Since the taper has a tapered shape, a point contact in which the force is concentrated at one point is made, and the force required for cutting can be further reduced. Therefore, it is possible to reliably divide the board with a small divisional propulsion force, so that it is not necessary to use a hard steel plate or the like as a component material, and a relatively easy-to-form material such as stainless steel can be used, which reduces the component manufacturing cost. can do. Further, since a small divisional propulsive force is sufficient, the cutter blade is less likely to be damaged and maintenance cost can be reduced. Furthermore, since it is not necessary to use a particularly large component as a component of the dividing device 100, the facility does not increase in size.

Further, the divisional propulsive forces distributed substantially equally act on the cutter blades 30 arranged so as to face each other, so that the substrate can be divided in good balance. Further, for example, if another set of opposing cutter blades 30 is set to a height level different from the height level, it is possible to cut, for example, a total of three sets of facing parts in one dividing step, which is complicated. Even a substrate 60 having a simplified shape can be divided at once.

Further, the mounting table 40 is automatically arranged at the mounting position of the substrate 60 and the dividing position of the substrate 60, and the cutter blade 3
Since the vertical movement of 0 is automatically controlled, the operator only has to place the substrate 60 on the mounting table 40, and the substrate 6 is mounted on the mounting table 40.
Since it is not necessary to perform the work of placing 0 under the cutter blade 30, the safety can be improved. Also, the substrate 60
Since the work after mounting can be automated, the substrate dividing position can be precisely controlled. Therefore, it is possible to improve workability and to stably improve product quality.

In this embodiment, the case where the taper angles of the cutter portions 32 formed on the cutter blades 30 arranged to face each other are formed in the same direction with respect to the two cutter blades 30 facing each other has been described. However, the present invention is not limited to this, and it may be formed in the opposite direction in another embodiment.

Further, in the present embodiment, the case where two sets of the cutter blades 30 arranged to face each other has been shown, but the present invention is not limited to this, and in another embodiment, various substrates 60 to be divided. A large number of sets of cutter blades 30 may be used according to various shapes.

Although the automatic placement device 70 shown in FIG. 2 is used as the automatic placement device in the present embodiment, the automatic placement device is not limited to this, and another automatic placement device may be used in another embodiment. You may use.

[Brief description of the drawings]

FIG. 1 (a) is a schematic side sectional view showing a substrate dividing device according to an embodiment of the present invention, and FIG. 1 (b) is different from the dividing device driving means shown in FIG. 1 (a). FIG. 3 is a schematic partially exploded perspective view showing a part thereof, and (c) is a schematic enlarged perspective view showing a cutter blade of the dividing device shown in (a).

2A and 2B are a schematic partial cross-sectional plan view and a side view showing a general automatic placement device used in the substrate dividing device according to the embodiment.

3A to 3E are schematic perspective views showing a state of the substrate at each stage when the substrate is divided by the dividing device according to the embodiment.

4A is a schematic perspective view showing a substrate before being divided, and FIG. 4B is a schematic partial enlarged perspective view of the substrate shown in FIG. 4A.

FIG. 5 is a schematic side view of a substrate dividing device shown for explaining an example of a conventional substrate dividing method.

FIG. 6 is a schematic cross-sectional view showing a conventional dividing device for dividing a substrate by shear division.

FIG. 7 is a schematic side view showing a conventional push-cut dividing device using a cutter blade.

FIG. 8 is a schematic side view showing a conventional dividing device using rotary blades.

[Explanation of symbols]

 10 Driving Means 20 Pressing Means 30a, 30b, 30c, 30d Cutter Blades 31a, 31b, 31c, 31d Pressing Parts 32a, 32b, 32c, 32d Cuttering Parts 40 Mounting Table 50 Working Table 60 Substrate

Claims (3)

[Claims] 1. A substrate mounting table, pressing means for pressing the substrate onto the mounting table, a press section for folding the substrate at the dividing groove portion, and a tapered cutter for cutting the substrate at the dividing groove portion. 1. A substrate dividing device comprising: a cutter blade having a unit integrally formed; and driving means for moving the cutter blade up and down. 2. The substrate dividing device according to claim 1, wherein the cutter blades arranged facing each other are set to the same height level. 3. A substrate dividing apparatus, wherein a mounting table is automatically arranged at a substrate mounting position and a substrate dividing position, and vertical movement of a cutter blade is automatically controlled.