JPH09134857A - Abnormality countermeasure processing method in semiconductor manufacturing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a proper recovering measure and a safety measure to be quickly carried out when abnormalities occur in a manufacturing process by a method wherein a recovering measure which is previously set corresponding to events comprised in a semiconductor manufacturing process is taken if abnormalities occur when the events are carried out. SOLUTION: A process is shifted to an error recipe R1 specified by a normal recipe A if abnormalities occur while an event A02 is carried out so as to deal with abnormalities. The error recipe R1 is composed of events 101, 102, and 103, and the events 101, 102, and 103 are successively carried out from top the same as the normal recipe A. When the error recipe R1 is finished, the manufacturing process is returned to the normal recipe A, and then the rest of the normal recipe A is carried out. A recovering measure is carried out through such a manner that a temperature correction control is carried out when a temperature control gets out of order, and an instruction that specimens arc automatically fed is issued when the specimens are short.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing method in a semiconductor manufacturing apparatus, and more particularly to an abnormality countermeasure processing method in semiconductor manufacturing capable of taking appropriate countermeasures when an abnormality occurs.

[0002]

2. Description of the Related Art First, a conventional processing method in semiconductor manufacturing will be described with reference to FIG. FIG. 4 is an explanatory view showing a processing method in the conventional semiconductor manufacturing, (a)
Is an explanatory diagram of recipe A, (b) is an explanatory diagram at the time of normal execution, (c) is an explanatory diagram of abnormal processing 1,
(D) is an explanatory view of the abnormality processing 2. In the conventional semiconductor manufacturing processing method, processing is executed based on a recipe (normal recipe) that defines the processing content. Here, the recipe will be described with reference to FIG.

As shown in FIG. 4A, the recipe is composed of a plurality of events and defines the processing order of the events. An event is a unit of processing that is executed at one time, and the details of detailed processing are specified. FIG.
In the example of (a), the recipe A includes events A01 and A0.
2, A03, A04, A05, A06 are defined to be executed in this order.

When the processing is executed based on the above recipe A, at the time of normal execution, as shown in FIG. 4B, the events A01 to A06 are sequentially executed without delay, and the processing is ended. is there.

If an abnormality occurs during processing,
As shown in FIG. 4C, the abnormality process 1 in which the previous process is not performed at all from the abnormality occurrence point and the process is skipped and forcibly terminated, and as shown in FIG. 4D, from the abnormality occurrence point There is an abnormal process 2 that skips some of the above events and shifts the process to an event that can be processed normally.

Here, a case where an abnormality occurs in the middle of the event A03 is shown. In the abnormality processing 1, the event A
In the abnormal process 2, the rest of the event A03 and the event A04 are skipped, and the processes of the event A05 and the event A06 are normally performed.

[0007]

However, in the above-described conventional abnormality processing method in semiconductor manufacturing, there is a problem that when an abnormality occurs, the processing is simply ended or skipped, and appropriate countermeasure processing is not performed. In addition, the operator has to perform a recovery operation every time an abnormality occurs to restart the process or take a safety measure, which causes a problem that the work at the time of the abnormality is complicated.

The present invention has been made in view of the above circumstances, and when an abnormality occurs during processing, it is possible to promptly execute appropriate recovery processing and safety countermeasure processing, and
An object of the present invention is to provide an abnormality countermeasure processing method in semiconductor manufacturing, which can reduce the work of an operator when an abnormality occurs.

[0009]

According to a first aspect of the present invention for solving the problems of the above conventional example, in an abnormality countermeasure processing method in semiconductor manufacturing, an abnormality occurs when an event constituting the semiconductor manufacturing processing is executed. In this case, the processing for recovering the abnormality set in advance corresponding to the event is executed, and if the abnormality occurs at the time of executing the event, appropriate recovery processing can be quickly performed. , The work of the operator can be reduced and the processing speed can be improved.

According to a second aspect of the present invention for solving the above-mentioned problems of the conventional example, in the abnormality countermeasure processing method in semiconductor manufacturing, when an event occurs during execution of an event constituting the semiconductor manufacturing process, the event occurs. In order to prevent accidents, it is possible to quickly perform appropriate safety measure processing when an error occurs during event execution. The work of the operator can be reduced.

[0011]

Embodiments of the present invention will be described with reference to the drawings. An abnormality countermeasure processing method in semiconductor manufacturing according to the embodiment of the present invention (this method) is provided with an error recipe for performing abnormality recovery processing and safety countermeasure processing at the time of abnormality, and when an abnormality occurs during execution of an event, By shifting the processing to an error recipe defined in advance corresponding to each event, it is possible to perform appropriate abnormality recovery processing and safety countermeasure processing.

FIG. 1 is an explanatory diagram showing the configuration of a recipe used in the abnormality countermeasure processing method (present method) in semiconductor manufacturing according to the embodiment of the present invention. As shown in FIG.
In order to realize this method, an error recipe for performing processing when an abnormality occurs is provided independently of a recipe for performing normal processing (normal recipe). In the example of FIG. 1, a plurality of normal recipes (recipe A, recipe B, ...) And error recipes (R1, R2, ... Rn) are provided.

The error recipe is a recipe that is executed when an abnormality occurs during the execution of an event of the normal recipe.
The processing of the normal recipe is interrupted and the processing is shifted to the error recipe. Here, the error recipe defines the processing content for recovering the abnormality or taking safety measures after the abnormality has occurred regarding the abnormality (error) that is expected to occur during the execution of the event.

Further, since the coping method differs depending on the type of abnormality, a plurality of error recipes are provided according to the events in the normal recipe. That is, since the error recipe is specified for each event of the normal recipe, it does not correspond to only a specific normal recipe but is common to a plurality of normal recipes. I am supposed to do it.

As shown in FIG. 1, in the normal recipe, an error recipe corresponding to each event is defined, and to which error recipe the process is to be transferred when an abnormality occurs during the execution of the event. Is specified.

Next, with respect to the processing flow of this method, FIG.
This will be described with reference to FIG. FIG. 2 is an explanatory diagram showing a first processing method of the present method, and FIG. 3 is an explanatory diagram showing a second processing method. In the example of FIGS. 2 and 3, event A01-
For the normal recipe A (recipe A) composed of A06, an error recipe R1 for performing an abnormality recovery process and an error recipe R2 for performing a safety measure process are set. Furthermore, the recipe A causes an abnormality of events A01 to A03. It is stipulated that the error recipe R1 be transferred from time to time, and the error recipe R2 be transferred when events A04 to A06 are abnormal.

Then, as shown in FIG. 2, in the first processing method, when an abnormality occurs during the execution of the event A02, the error recipe R1 defined by the recipe A is used.
The process is transferred to and abnormal recovery processing is performed. Error recipe R1 is event 101, 102, 1
03, and the processing is performed in order from the beginning as in the case of the normal recipe. When the processing of the error recipe R1 is completed,
The process is transferred to the recipe A again, and the remaining part of the recipe A is processed.

The abnormality recovery processing includes, for example, processing for performing temperature correction control when an abnormality occurs in temperature control, and processing for issuing an instruction for automatic sample supply when a sample shortage occurs. is there.

With this, when an abnormality occurs during the execution of an event of a normal recipe, an appropriate recovery process is automatically performed to reduce the work of the operator when the abnormality occurs and the processing time can be shortened. Is.

Further, as shown in FIG. 3, in the second processing method, when an abnormality occurs during the execution of the event A05,
The process shifts to the error recipe R2 and the safety measure process is performed. Error recipe R2 is event 201, 202, 2
Processing is performed in the order of 03, 204, but in particular, event 20
4 is an end designation, which is specified so that the processing is ended when the error recipe R2 is ended and the normal recipe is not returned.

Thus, when an abnormality occurs during the execution of an event, appropriate safety measures can be swiftly performed to prevent the occurrence of an accident, and the work of the operator when the abnormality occurs can be reduced. .

The safety measures include, for example, a process of closing the valve of the gas in use to stop the gas supply when an abnormality occurs during use of dangerous gas, or an abnormal temperature rise. There are processes such as lowering the temperature to a safe range.

According to the abnormality countermeasure processing method in semiconductor manufacturing according to the embodiment of the present invention, an error recipe for carrying out a recovery countermeasure or a safety countermeasure when an abnormality occurs corresponding to an event of a normal recipe is set, and the event execution is performed. If an error occurs at some time, the process is transferred to the error recipe corresponding to the event, so if an error occurs at the time of event execution, it is possible to quickly perform appropriate recovery processing and safety countermeasure processing. Therefore, there is an effect that the work of the operator can be reduced.

[0024]

According to the first aspect of the present invention, since the abnormality countermeasure processing method in semiconductor manufacturing executes the processing for recovering the preset abnormality when the abnormality occurs at the time of executing the event, the event When an abnormality occurs during execution, there is an effect that an appropriate recovery process can be quickly performed, the work of the operator can be reduced, and the processing speed can be improved.

According to the second aspect of the present invention, since the abnormality countermeasure processing method in semiconductor manufacturing executes the preset safety countermeasure processing when the abnormality occurs during the event execution, the event countermeasure is executed. When an abnormality occurs, appropriate safety measures can be swiftly performed, an accident can be prevented, and the work of the operator can be reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a configuration of a recipe used in an abnormality countermeasure processing method (present method) in semiconductor manufacturing according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a first processing method of the present method.

FIG. 3 is an explanatory diagram showing a second processing method of the present method.

4A and 4B are explanatory views showing a processing method in the conventional semiconductor manufacturing, FIG. 4A is an explanatory view of recipe A, and FIG.
Is an explanatory diagram at the time of normal execution, and (c) is an abnormal process 1
And (d) is an explanatory diagram of the abnormality processing 2.

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[Procedure amendment]

[Submission date] December 8, 1995

[Procedure amendment 1]

[Document name to be amended] Drawing

[Correction target item name] Figure 3

[Correction method] Change

[Correction contents]

[Figure 3]

Claims (2)

[Claims] 1. An abnormality in semiconductor manufacturing, characterized in that, when an abnormality occurs during execution of an event constituting a semiconductor manufacturing process, a process for recovering an abnormality preset corresponding to the event is executed. Countermeasure processing method. 2. An abnormality in semiconductor manufacturing, characterized in that, when an abnormality occurs at the time of executing an event constituting the semiconductor manufacturing process, a process for carrying out a safety measure set in advance corresponding to the event is executed. Countermeasure processing method.