JPH09129778A - Pga type electronic component mounting board - Google Patents
Pga type electronic component mounting boardInfo
- Publication number
- JPH09129778A JPH09129778A JP30843795A JP30843795A JPH09129778A JP H09129778 A JPH09129778 A JP H09129778A JP 30843795 A JP30843795 A JP 30843795A JP 30843795 A JP30843795 A JP 30843795A JP H09129778 A JPH09129778 A JP H09129778A
- Authority
- JP
- Japan
- Prior art keywords
- pin
- substrate
- pins
- fixing plate
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 102
- 239000004033 plastic Substances 0.000 claims abstract description 23
- 241000587161 Gomphocarpus Species 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims description 55
- 230000001070 adhesive effect Effects 0.000 claims description 55
- 238000005476 soldering Methods 0.000 claims description 13
- 238000005304 joining Methods 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- 239000000919 ceramic Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 description 13
- 239000011521 glass Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000006071 cream Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＰＧＡ（ピン・グ
リッド・アレイ）型電子部品用基板に関し、詳しくは、
プラスチック製基板の主面に入出力端子用のピンが立設
状に多数の設けられたＰＧＡ型電子部品用基板（以下、
ＰＧＡ型基板、若しくは、単に基板ともいう）に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a PGA (pin grid array) type electronic component substrate.
A PGA type electronic component substrate (hereinafter, referred to as “PGA type electronic component substrate” in which a large number of pins for input / output terminals are provided upright on the main surface of a plastic substrate.
PGA type substrate, or simply referred to as a substrate).
【０００２】[0002]
【従来の技術】ＰＧＡ型基板は、入出力端子を平面的に
取り出せるため、端子数が増大してもパッケージの外径
寸法を大きくすることなく、比較的、十分な端子間ピッ
チを確保できることなどから広く用いられている。この
基板は、アルミナなどのセラミックからなるセラミック
タイプのものと、ガラス−エポキシ樹脂複合板などを積
層してなるプラスチックタイプのものとに大別される。2. Description of the Related Art In a PGA type substrate, since input / output terminals can be taken out in a plane, a relatively sufficient pitch between terminals can be secured without increasing the outer diameter of the package even if the number of terminals increases. Widely used from. This substrate is roughly classified into a ceramic type made of ceramics such as alumina and a plastic type made by laminating a glass-epoxy resin composite plate.
【０００３】このうち、セラミックタイプのＰＧＡ型基
板は多層化が容易であり、上下層間の配線を結合するビ
アホールも容易に形成することができる。また、入出力
端子用のピン（以下、単にピンともいう）も、基板の主
面に形成された同ピンの接合用のパッドに、頭部がネイ
ルヘッド型をなすピンをその頭部の端面を突き当ててロ
ー付けすることにより容易に、しかも高強度に接合でき
る。Of these, the ceramic type PGA type substrate is easy to be multi-layered, and the via hole for connecting the wiring between the upper and lower layers can be easily formed. In addition, pins for input / output terminals (hereinafter, also simply referred to as pins) are joined to pads for bonding the pins formed on the main surface of the substrate, and pins having a head of a nail head form end faces of the head. It can be joined easily and with high strength by abutting and brazing.
【０００４】これに対して、プラスチックタイプのＰＧ
Ａ型基板は、片面に銅板を張り付けた銅張り樹脂板（ガ
ラス−エポキシ樹脂複合板など）をレジスト塗布やエッ
チング等して銅配線パターンを形成したり、樹脂板に穿
孔し、その孔壁面にメッキにより銅を形成等したものを
エポキシ接着剤により積層することにより製造される。
ところで、プラスチックタイプのものは基板の耐熱性が
低いため、セラミックタイプのように、ピンをロー付け
することはできず、比較的融点の低い半田付け接合にな
る。しかし、ネイルヘッド型の頭部を持つピンをその頭
部を基板のパッドに当接状にして半田付けしただけで
は、実用上、接着（接合）強度が不十分である。また、
このものでは基板とパッド（銅箔または銅メッキ）との
密着強度も１〜２ｋｇｆ／ｍｍ2 と低い。こうしたこと
から、従来一般のプラスチックタイプのＰＧＡ型基板で
は、基板に貫通孔を形成し、その内壁面に銅メッキ等で
電気的導通をとって、その貫通孔にピンを貫通状に挿入
（圧入）し、或いはその後さらに半田含浸をしてピンを
基板に固定する構造とされていた。On the other hand, a plastic type PG
The A-type board has a copper-clad resin plate (glass-epoxy resin composite plate, etc.) with a copper plate adhered on one side to form a copper wiring pattern by resist coating or etching, or perforates the resin plate to form a wall surface of the hole. It is manufactured by laminating, for example, copper formed by plating with an epoxy adhesive.
By the way, since the plastic type has a low heat resistance of the substrate, the pins cannot be brazed like the ceramic type, and the soldering has a relatively low melting point. However, the bonding (joining) strength is not sufficient in practice simply by soldering a pin having a nail head type head with the head in contact with the pad of the substrate. Also,
In this case, the adhesion strength between the substrate and the pad (copper foil or copper plating) is as low as 1-2 kgf / mm 2 . For this reason, in a conventional general plastic type PGA type substrate, a through hole is formed in the substrate, electrical conduction is established by copper plating on the inner wall surface, and a pin is inserted into the through hole (press fit). ), Or thereafter, further impregnated with solder to fix the pins to the substrate.
【０００５】[0005]
【発明が解決しようとする課題】上記のように従来のプ
ラスチックタイプのＰＧＡ型基板では、その構造上、ピ
ンを固定するための貫通孔が設けられていることより、
ピンのある部分の上下にわたって回路配線を形成できな
いことから、その分、回路（配線）の密度が低くなって
しまうといった問題があった。また、ピンがあるために
回路の引き回しも困難となることから、多ピン化ないし
ピンの高密度化の要求に十分応えられないといった問題
があった。また、ピンを通して固定する孔を貫通孔とす
ることなく基板の途中までとし、その孔にピンを嵌入す
る構造のものもあるが（特開平４−１０５３５１号）、
その場合には強度が不十分となりやすく、また、ピンが
途中まで入り込んでいる分、回路の引き回しが妨げられ
てしまう。As described above, the conventional plastic type PGA type substrate is provided with the through holes for fixing the pins because of its structure.
Since the circuit wiring cannot be formed above and below the portion where the pin is present, there is a problem that the density of the circuit (wiring) is reduced accordingly. Further, since there are pins, it becomes difficult to route the circuit, and there is a problem that it is not possible to sufficiently meet the demands for increasing the number of pins or increasing the pin density. Also, there is a structure in which the hole for fixing the pin is not formed as a through hole but halfway through the substrate and the pin is fitted into the hole (Japanese Patent Laid-Open No. 4-105351).
In that case, the strength is likely to be insufficient, and since the pin is inserted halfway, the routing of the circuit is hindered.
【０００６】本発明は、このような問題点に鑑みてなさ
れたもので、プラスチックタイプの基板のもつ優れた特
性（低抵抗配線、低誘電率絶縁体、低コスト性など）を
生かしつつ、セラミックタイプの基板のように基板内に
ピンを挿入することなく、しかも接合強度の低下を招く
ことなくピンを接合することのできる構造を実現するこ
とで、基板内に形成される回路配線の密度を高くすると
共に多ピン化ないしピンの高密度化の要求に十分応える
ことのできるＰＧＡ型電子部品用基板を提供することを
その目的とする。The present invention has been made in view of the above problems, and ceramics are used while taking advantage of the excellent characteristics of a plastic type substrate (low resistance wiring, low dielectric constant insulator, low cost, etc.). By realizing a structure that allows pins to be joined without inserting pins into the substrate as with other types of substrates and without lowering the joint strength, the density of circuit wiring formed in the substrate can be reduced. It is an object of the present invention to provide a PGA type electronic component substrate which can be increased in height and can sufficiently meet the demand for higher pin count or higher pin density.
【０００７】[0007]
【課題を解決するための手段】上記の目的を達成するた
め、本発明の請求項１記載のＰＧＡ型電子部品用基板
は、プラスチック製基板の主面に、入出力端子用のピン
の接合用のパッドが複数形成され、該パッドに、頭部が
ネイルヘッド型をなす前記ピンがその頭部を介して電気
的導通を保持されており、そして、該ピンの配置に対応
すると共に該ピンの軸部を貫通可能でありかつその頭部
を係合可能に形成されてなる貫通孔を備えたピン固定板
が、その貫通孔に前記ピンの軸部を通しかつ該ピンの頭
部を係合させて前記プラスチック製基板の主面に接着
（固着）されていることを特徴とする。In order to achieve the above-mentioned object, a PGA type electronic component substrate according to claim 1 of the present invention is used for joining pins for input / output terminals to a main surface of a plastic substrate. A plurality of pads are formed on the pad, and the pin whose head is a nail head type is held in electrical continuity through the head, and the pad corresponds to the arrangement of the pin and A pin fixing plate having a through hole formed so as to be capable of penetrating the shaft portion and engaging the head portion of the pin, through which the shaft portion of the pin is passed and the head portion of the pin is engaged. And is adhered (fixed) to the main surface of the plastic substrate.
【０００８】前記手段において、前記パッドと前記ピン
の頭部との間における電気的導通は、半田付け若しくは
導電性接着剤による接着で保持するとよいが、これに限
定されるものではない。また、これらの手段において
は、前記ピン固定板を、前記プラスチック製基板の主面
に、プリプレグ（Prepreg ）を接着剤として接着しても
よい。In the above means, electrical conduction between the pad and the head of the pin may be maintained by soldering or bonding with a conductive adhesive, but the invention is not limited to this. Further, in these means, the pin fixing plate may be bonded to the main surface of the plastic substrate by using a prepreg as an adhesive.
【０００９】このような本発明の構成によれば、パッド
と前記ピンの頭部との間における電気的導通は、半田付
け若しくは導電性接着剤による接着などで保持される一
方、ピン固定板は基板の主面に接着されていると共に、
ピンの頭部がそのピン固定板の貫通孔に係合されている
ために、ピンに軸方向に引張り力が作用した際には抜け
止め作用をなし、さらにその係合がある分、横方向（ピ
ンの軸半径方向）に外力を受けても抗することができる
など、ピンは基板に当接状に接合されているにもかかわ
らず、高い接合強度を備えている。According to the structure of the present invention, the electrical continuity between the pad and the head of the pin is maintained by soldering or adhesion with a conductive adhesive, while the pin fixing plate is While being adhered to the main surface of the substrate,
Since the head of the pin is engaged with the through hole of the pin fixing plate, it does not come off when a tensile force is applied to the pin in the axial direction. Even if an external force is applied to the pin (in the radial direction of the pin), it can withstand the external force, and the pin has a high bonding strength even though it is bonded to the substrate in an abutting manner.
【００１０】さらに、上記請求項１記載の手段において
は、前記パッドと前記ピンの頭部との間における電気的
導通を、前記プラスチック製基板の主面と前記ピン固定
板との間に介在されて前記パッドと前記ピンの頭部との
間において局所的に加圧された異方導電性接着シートの
圧縮変形によって保持すると共に、前記ピン固定板を前
記プラスチック製基板の主面に該異方導電性接着シート
を接着剤として接着してもよい。Further, in the means according to claim 1, electrical conduction between the pad and the head of the pin is interposed between the main surface of the plastic substrate and the pin fixing plate. Is held by compressive deformation of the anisotropic conductive adhesive sheet locally pressed between the pad and the head of the pin, and the pin fixing plate is anisotropically attached to the main surface of the plastic substrate. A conductive adhesive sheet may be adhered as an adhesive.
【００１１】なお、ピン固定板は、所定の電気絶縁性、
強度、耐熱性を保持するものであればよく、例えば、ガ
ラスＢＴ（ビスマレイミド−トリアジン）レジン、ガラ
スポリイミド、ガラスフェノール樹脂、ガラスＢＣＢが
例示される。そして、こうした複合材においては、ガラ
ス（繊維）に代えて紙や有機繊維を用いることもでき
る。なお、ピン固定板は、その材質や基板の平面形状
（大きさ）などを考慮し、適宜の厚さで、適宜の平面形
状に設計すればよい。また、ピンの軸部が貫通する貫通
孔は、その軸部を貫通させることができかつピンの頭部
を係合可能に形成されていればよく、円形孔など適宜の
孔形状とすることができる。The pin fixing plate has a predetermined electrical insulation property.
Any material that retains strength and heat resistance may be used, and examples thereof include glass BT (bismaleimide-triazine) resin, glass polyimide, glass phenol resin, and glass BCB. In such a composite material, paper or organic fiber can be used instead of glass (fiber). The pin fixing plate may be designed to have an appropriate thickness and an appropriate planar shape in consideration of the material thereof and the planar shape (size) of the substrate. Further, the through hole through which the shaft portion of the pin penetrates should be formed so that the shaft portion can penetrate therethrough and the head portion of the pin can be engaged, and may be formed in an appropriate hole shape such as a circular hole. it can.
【００１２】[0012]
第１形態例 図１ないし図４を参照して本発明の実施の第１形態例を
説明する。図１中、１は、平面視、略矩形をなす、ガラ
スエポキシ樹脂などからなるＰＧＡ型電子部品用基板
（パッケージ本体）であって、その一主面（図１下面）
２には、入出力端子用のピンの接合用のパッド（以下、
単にパッドともいう）３が多数形成されており、このパ
ッド３は、図示はしないが基板１の断面内に形成された
回路配線を介して、搭載されるＩＣチップとワイヤボン
ディングにより接続されるよう形成されている。そし
て、このパッド３には、ネイルヘッド型をなすピン４が
その頭部５の端面５ａを当接して半田付けされており、
この半田（層）１０を介してパッド３とピン４との電気
的導通が保持されている。First Embodiment Example A first embodiment example of the present invention will be described with reference to FIGS. 1 to 4. In FIG. 1, reference numeral 1 denotes a PGA type electronic component substrate (package body) made of glass epoxy resin or the like, which has a substantially rectangular shape in plan view, and one main surface (lower surface of FIG. 1) thereof.
2 is a pad for joining pins for input / output terminals (hereinafter,
A large number of pads 3 are also formed, and the pads 3 are connected to the mounted IC chip by wire bonding through circuit wiring formed in the cross section of the substrate 1 though not shown. Has been formed. Then, a nail head type pin 4 is soldered to the pad 3 by abutting an end surface 5a of the head portion 5 thereof,
Electrical continuity between the pad 3 and the pin 4 is maintained through the solder (layer) 10.
【００１３】一方、このピン４の頭部５の下面５ｂに係
合するようにして、薄板状のピン固定板６が後述するよ
うに接着剤（層）７により基板１の主面２に接着されて
いる。すなわち、本例では、ピン４の配置に対応する所
定の配置で、所定の内径をもつ多数の貫通孔８を備えた
ピン固定板６（以下、単に固定板ともいう）が、その貫
通孔８にピン４の軸部４ａを貫通させて基板１の一主面
２に接着剤７により接着されている。ただし、本例にお
ける固定板６は、基板１の一主面２よりやや小さめの四
角に形成されたガラスエポキシ樹脂製の薄板であり、貫
通孔８の内径（直径）はピン４の軸部４ａの外径Ｄ１
（０．４５ｍｍ）より大きくかつピン４の頭部５の外径
Ｄ２（０．７ｍｍ）より小さく形成されており、本例で
は０．５ｍｍに設定されている。しかして、本例では、
頭部５が設計上片側０．１ｍｍ係合するよう設定されて
いる。On the other hand, a thin pin fixing plate 6 is adhered to the main surface 2 of the substrate 1 with an adhesive (layer) 7 so as to engage with the lower surface 5b of the head 5 of the pin 4 as described later. Has been done. That is, in this example, the pin fixing plate 6 (hereinafter, also simply referred to as a fixing plate) having a large number of through holes 8 having a predetermined inner diameter in a predetermined arrangement corresponding to the arrangement of the pins 4 has the through holes 8 formed therein. The shaft portion 4a of the pin 4 is passed through and is adhered to the one main surface 2 of the substrate 1 with an adhesive 7. However, the fixing plate 6 in this example is a thin plate made of glass epoxy resin formed in a square slightly smaller than the one main surface 2 of the substrate 1, and the inner diameter (diameter) of the through hole 8 is the shaft portion 4 a of the pin 4. Outer diameter D1
It is formed to be larger than (0.45 mm) and smaller than the outer diameter D2 (0.7 mm) of the head 5 of the pin 4, and is set to 0.5 mm in this example. Then, in this example,
The head 5 is designed to engage with 0.1 mm on one side by design.
【００１４】なお、本例に用いたピン４は、その頭部５
の近傍の軸部４ａの外径が貫通孔８の孔径よりやや大き
く膨拡されており、ピン４が固定板６の貫通孔８に圧入
された際、その膨拡部４ｂが貫通孔８の壁面に食付いて
固定されるようになっている（図２参照）。しかして、
ピン４の頭部５の下面（頭部の鍔部）５ｂが、貫通孔８
の周縁面８ａに係合され、さらにその頭部５の周囲は、
充填・固化した接着剤７で埋められており、ピン４を保
持すると共に、固定板６を基板１に接着している。な
お、固定板６には、本例ではピン４の貫通孔８とは別
に、接着剤７の充填孔９が多数、設けられている。The pin 4 used in this example has a head 5
The outer diameter of the shaft portion 4a in the vicinity of is expanded slightly larger than the hole diameter of the through hole 8, and when the pin 4 is press-fitted into the through hole 8 of the fixing plate 6, the expanded portion 4b of the through hole 8 is expanded. It is designed to bite and be fixed on the wall surface (see Fig. 2). Then
The lower surface (flange portion of the head) 5b of the head 5 of the pin 4 has a through hole 8
Is engaged with the peripheral surface 8a of the
It is filled with the filled and solidified adhesive 7, holds the pin 4 and adheres the fixing plate 6 to the substrate 1. In this example, the fixing plate 6 is provided with a large number of filling holes 9 for the adhesive 7 in addition to the through holes 8 for the pins 4.
【００１５】ここで図１及び図２に示した本例の一製法
を図３及び図４を参照して説明する。まず、基板１の一
主面２に形成された所定の大きさの多数のパッド３，３
に半田クリーム（例えばＳｎ／Ｐｂ＝９０／１０）１０
を所定量（所定厚さ）印刷する。一方、上記の固定板
（樹脂板）６を別途、用意し、その所定の貫通孔８にピ
ン４をその頭部５が係合するまでプレスにより一括して
圧入する（図３参照）。次いで、ピン４が圧入されたこ
の固定板６を、図４に示したように、各ピン４の頭部５
の端面５ａが基板１の各パッド３に対面するように位置
決めして当接させる。そして、所定温度（２００〜３０
０℃）下で例えば３０秒間加熱して半田クリーム１０を
リフローし、冷却固化させる。この結果、ピン４はパッ
ド３に半田付けされ、電気的導通が保持される。Here, one manufacturing method of this embodiment shown in FIGS. 1 and 2 will be described with reference to FIGS. First, a large number of pads 3 and 3 of a predetermined size formed on one main surface 2 of the substrate 1.
Solder cream (eg Sn / Pb = 90/10) 10
Is printed by a predetermined amount (predetermined thickness). On the other hand, the fixing plate (resin plate) 6 is separately prepared, and the pins 4 are collectively press-fitted into the predetermined through holes 8 by a press until the heads 5 thereof are engaged (see FIG. 3). Next, as shown in FIG. 4, the fixing plate 6 into which the pins 4 are press fitted is attached to the head 5 of each pin 4.
The end surface 5a of the substrate 1 is positioned and brought into contact with the pads 3 of the substrate 1 so as to face each other. And a predetermined temperature (200-30
The solder cream 10 is reflowed by heating at 0 ° C.) for 30 seconds, for example, to be cooled and solidified. As a result, the pin 4 is soldered to the pad 3 and electrical continuity is maintained.
【００１６】そして、この半田付け後には、基板１の主
面２と固定板６との間に微小な間隙ｋが生じるが、この
間隙ｋには、基板１及び固定板６の外縁部の隙間或いは
固定板６に形成した充填孔９より、接着剤としてエポキ
シ樹脂などの熱硬化性樹脂系接着剤を注入（圧入）、充
填する。この充填の際には、基板１の外縁部や別の充填
孔９から余剰の樹脂がでるまで充填する。しかる後、所
定温度下で所定時間（例えば常温で２４時間程度、或い
は１５０℃で５時間程度）加熱して接着剤を硬化させ、
基板１の主面２に固定板６を接着する。After this soldering, a minute gap k is formed between the main surface 2 of the substrate 1 and the fixed plate 6, and this gap k is a gap between the outer edges of the substrate 1 and the fixed plate 6. Alternatively, a thermosetting resin adhesive such as an epoxy resin is injected (press-fitted) as an adhesive through a filling hole 9 formed in the fixing plate 6 to fill it. At the time of this filling, the resin is filled until excess resin comes out from the outer edge portion of the substrate 1 or another filling hole 9. Then, the adhesive is cured by heating at a predetermined temperature for a predetermined time (for example, at room temperature for about 24 hours or at 150 ° C. for about 5 hours),
The fixing plate 6 is bonded to the main surface 2 of the substrate 1.
【００１７】かくして、図１及び図２のように形成され
るが、この固定板６の接着により、ピン４の頭部５の外
周近傍が接着剤７により固められると共にピン４の頭部
５の下面５ｂが貫通孔８の周縁面８ａに係合することか
ら、半田付けのみでは不十分なピンの接合強度も高く保
持される。因みに、ピンの引張り試験によれば、半田付
けのみの場合には、２〜３ｋｇｆ程度でピンの頭部の端
面（半田付け部）がパッドから分離したが、本例の場合
にはそのような分離を生ずることなく、ピンは８ｋｇｆ
以上で軸部の途中で切断された。Thus, although formed as shown in FIGS. 1 and 2, the fixing plate 6 is adhered so that the vicinity of the outer periphery of the head 5 of the pin 4 is fixed by the adhesive 7 and the head 5 of the pin 4 is fixed. Since the lower surface 5b engages with the peripheral surface 8a of the through hole 8, the joining strength of the pin, which is insufficient only by soldering, is kept high. By the way, according to the pulling test of the pin, the end face (soldering part) of the pin head is separated from the pad by about 2 to 3 kgf in the case of only soldering. 8 kgf of pin without separation
As a result, the shaft was cut halfway.
【００１８】このように本例では、プラスチック製のＰ
ＧＡパッケージでありながら、ピン４を基板１に貫通状
ないし嵌入状にすることなく、当接状で接合したもので
あることから、セラミックタイプのＰＧＡ型基板と同様
にその断面の内部に配線を引き回すことができるので、
それと同程度の配線の高密度化や多ピン化を図ることが
できる。Thus, in this example, the plastic P
Although it is a GA package, the pins 4 are joined to the substrate 1 in an abutting manner without forming a through shape or a fitting shape. Therefore, as in the ceramic type PGA type board, wiring is provided inside the cross section. Because it can be routed,
The wiring density and the number of pins can be increased to the same extent.
【００１９】なお、上記の構造のものは、ピンを固定板
に予め圧入しなくても製造できる（図５ないし図７参
照）。すなわち、所定の治具を用いるなどして、半田ク
リーム１０の塗布、形成されたパッド３に、まずピン４
をその頭部５の端面を当接し、立設状態に保持してリフ
ローして接合しておく（図５参照）。そして、エポキシ
樹脂などの接着剤１７をピン４の接合された基板１の主
面２側（図６上面）に塗布し、しかる後、図６に示した
ように、固定板６をその貫通孔８にピン４を通して基板
１の主面２に被せ、図７に示したように固定板６を所定
の荷重Ｗで押さえ付け、その下で所定温度で所定時間加
熱することで接着剤１７を硬化させ、接着させればよ
い。このような製法によれば、ピン４を接合（半田付
け）した際（図５の状態）には固定板がないことから、
フラックスの洗浄が容易となる。なお、この製法におい
ては接着剤を固定板に塗布しておいてもよい。The structure described above can be manufactured without press-fitting the pins into the fixing plate in advance (see FIGS. 5 to 7). That is, the pins 4 are first applied to the pad 3 formed by applying and forming the solder cream 10 by using a predetermined jig.
Are brought into contact with the end surface of the head portion 5 and held in an upright state to be reflowed and joined (see FIG. 5). Then, an adhesive 17 such as an epoxy resin is applied to the main surface 2 side (upper surface in FIG. 6) of the substrate 1 to which the pins 4 are joined, and then, as shown in FIG. The main surface 2 of the substrate 1 is covered with the pin 4 through the pin 8, and the fixing plate 6 is pressed with a predetermined load W as shown in FIG. 7, and the adhesive 17 is cured by heating it under a predetermined temperature for a predetermined time. And bond them. According to such a manufacturing method, since there is no fixing plate when the pins 4 are joined (soldered) (state of FIG. 5),
Flux cleaning becomes easy. In this manufacturing method, the adhesive may be applied to the fixing plate.
【００２０】また、上記製法ではピンの接合（半田付
け）のため、半田クリームを基板１のパッド３上に形成
したが、ピン４の頭部５の端面に半田クラッドを形成し
ておいてもよい。なお、ピンの頭部とパッドとの接合は
電気的導通が保持されればよく、したがって、半田に代
えて、これとほぼ同一条件で融着できるＡｕ−Ｓｎペー
ストをパッドに塗布しておいてもよい。さらに、電気的
導通が保持されていればよいことから、これらに代え
て、導電性（樹脂）接着剤をパッド上、或いは、ピンの
頭部の端面に塗布してから接着してもよい。Further, in the above manufacturing method, the solder cream is formed on the pad 3 of the substrate 1 for the purpose of joining (soldering) the pins. However, the solder clad may be formed on the end face of the head 5 of the pin 4. Good. It should be noted that the head of the pin and the pad may be joined only if electrical continuity is maintained. Therefore, instead of solder, an Au-Sn paste that can be fused under substantially the same conditions is applied to the pad. Good. Further, as long as electrical continuity is maintained, a conductive (resin) adhesive may be applied to the pad or the end surface of the head of the pin instead of the above, and then the adhesive may be adhered.
【００２１】導電性接着剤をパッドとピンとの電気的導
通の保持に用いれば、例えば１５０℃で１時間程度保持
することで接着できるが、固定板の接着剤は、その硬化
温度が導電性接着剤の耐熱温度よりも低いものを用い
る。導電性接着剤を用いた場合には、半田付けなどと異
なりリフロー工程が不要となるため、製造が容易とな
る。なお、導電性接着剤を用いる場合でも、ピンを予め
固定板に圧入しておいて、パッドと接合（導通を保持）
し、そして上記したのと同様に充填孔などから接着剤を
充填して接着してもよいし、ピンをパッドに接合（導通
を保持）してから固定板を後で接着してもよい。すなわ
ち、本発明にかかるＰＧＡ型基板おけるピンとパッドと
は、電気的導通が保持されていればよく、半田付けや導
電性接着剤による接着に限定されるものではない。If a conductive adhesive is used to maintain electrical continuity between the pad and the pin, it can be bonded by holding it at, for example, 150 ° C. for about 1 hour. However, the adhesive of the fixing plate has a conductive bonding temperature. Use one that is lower than the heat resistant temperature of the agent. When a conductive adhesive is used, a reflow process is not required unlike soldering and the like, which facilitates manufacturing. Even when a conductive adhesive is used, the pins are pressed into the fixing plate in advance and bonded to the pads (maintaining continuity).
Then, similarly to the above, an adhesive may be filled through the filling holes or the like for adhesion, or the pin may be bonded to the pad (maintaining continuity) and then the fixing plate may be adhered later. That is, the pins and pads in the PGA-type substrate according to the present invention need only maintain electrical continuity, and are not limited to soldering or bonding with a conductive adhesive.
【００２２】さらに、上記構造のＰＧＡ型基板において
は、固定板を基板に接着する接着手段（接着剤）に、ピ
ンの配置に対応する貫通孔（孔径がピンの頭部の径と略
同じもの）を備えたプリプレグ（ガラスクロス繊維など
にエポキシ樹脂などを含浸させ半硬化してなる板）を用
いることもできる。Further, in the PGA type substrate having the above-mentioned structure, the through means (hole diameter is approximately the same as the diameter of the head of the pin) is used as the bonding means (adhesive) for bonding the fixing plate to the substrate. It is also possible to use a prepreg (a plate obtained by impregnating glass cloth fibers or the like with an epoxy resin or the like and semi-curing).
【００２３】ここで、プリプレグを用いた場合の製法を
図８ないし図１１を参照して説明する。その第１例は、
上記のようにしてまずピン４を基板１のパッド３に半田
付け或いは導電性接着剤１０で接着する。次いで、図８
に示したように、所定の厚さ（例えば５０〜１００μ
ｍ）でもって、固定板６と同様に、ピン４の配置に対応
する位置にピン４の頭部５の径と略同径の貫通孔２８を
備えたプリプレグ２７を、基板１と上記のような固定板
６との間に介在するようにし、かつプリプレグ２７の貫
通孔２８と固定板６の貫通孔８をピン４に合うように対
面させ、その下でピン４を通して固定板６を基板１の主
面２に張り合わせる（図９参照）。そして、所定温度
（１５０〜２００℃）下で所定時間（１．５〜２．５時
間）、所定の圧力（２０〜７０ｋｇｆ／ｃｍ2 ）で加圧
し、プリプレグ２７を硬化させる。このようにすること
で、基板１と固定板６とがプリプレグ２７を接着剤とし
て接着され、ピン４はその頭部５が固定板６の貫通孔２
８の周縁面に係合した状態で固定される。なお、固定板
６の充填孔９は、真空プレスによる加圧接着によるとき
は不要となる。A manufacturing method using a prepreg will be described with reference to FIGS. 8 to 11. The first example is
As described above, first, the pins 4 are soldered or adhered to the pads 3 of the substrate 1 with the conductive adhesive 10. Then, FIG.
As shown in, a predetermined thickness (for example, 50 to 100 μm)
m) Therefore, similarly to the fixing plate 6, the prepreg 27 having the through hole 28 having a diameter substantially the same as the diameter of the head 5 of the pin 4 is provided at the position corresponding to the arrangement of the pin 4 as described above with the substrate 1. The fixing plate 6 and the through hole 28 of the prepreg 27 and the through hole 8 of the fixing plate 6 face each other so as to fit the pin 4, and the fixing plate 6 is passed under the pin 4 to fix the fixing plate 6 to the substrate 1. It is attached to the main surface 2 (see FIG. 9). Then, at a predetermined temperature (150 to 200 ° C.), a predetermined time (1.5 to 2.5 hours) is applied at a predetermined pressure (20 to 70 kgf / cm 2 ) to cure the prepreg 27. By doing so, the substrate 1 and the fixed plate 6 are bonded together using the prepreg 27 as an adhesive, and the head 5 of the pin 4 is the through hole 2 of the fixed plate 6.
It is fixed in a state of being engaged with the peripheral edge surface of 8. The filling hole 9 of the fixing plate 6 becomes unnecessary when pressure bonding is performed by a vacuum press.
【００２４】なお、この製法においては、プリプレグ２
７の他に固定板６を用いたが、プリプレグが基板側に接
合され硬化した際に、その貫通孔２８をピンの頭部５の
径より小さくすることによりピンの頭部が係合し、それ
によってピンの固定（接合強度）が保持できるようにし
た場合には、別途独立の固定板は要しない。つまり、プ
リプレグの接合、固化後にそれ自体が固定板となるから
である。In this manufacturing method, the prepreg 2
In addition to 7, the fixing plate 6 was used, but when the prepreg is bonded to the substrate side and cured, the through hole 28 is made smaller than the diameter of the pin head 5 so that the pin head engages, When the pin is fixed (joint strength) by this, a separate fixing plate is not required. That is, the prepreg itself becomes a fixing plate after joining and solidifying.
【００２５】さて次に、プリプレグを用いた場合の第２
の製法を図１０及び図１１を参照して説明する。この方
法は、基板１のパッド３に予めピンを接合しておくこと
なく、固定板６の貫通孔８にピン４を一括してその頭部
５まで挿入（圧入）しておく一方、プリプレグ２７に形
成されたピン用の貫通孔２８には導電性接着剤３０を充
填し或いは埋め込んでおく。そして、図１１に示したよ
うに、プリプレグ２７を介し、ピン４を挿入してなる固
定板６を、そのピン４の頭部５がプリプレグの貫通孔に
充填された導電性接着剤３０の部位とパッド３に対応す
るようにして合わせる。そして、所定温度下、所定荷重
Ｗで圧着してプリプレグ及び導電性接着剤を硬化させ
る。すると、パッド３とピン４の頭部５との間が導電性
接着剤３０で接着されて電気的導通が保持される。そし
て、基板１の主面２と固定板６との間がプリプレグ２７
で接着され、ピン４の頭部５が固定板６の貫通孔の周縁
面に係合して固定され、図９に示したのと同様の所望と
する構造を得ることができる。Next, the second case using a prepreg
The manufacturing method will be described with reference to FIGS. In this method, the pins 4 are collectively inserted (press-fitted) into the through holes 8 of the fixing plate 6 up to their heads 5 without preliminarily joining the pins to the pads 3 of the substrate 1, while the prepreg 27 is used. A conductive adhesive 30 is filled or embedded in the through hole 28 for the pin formed in the above. Then, as shown in FIG. 11, the fixing plate 6 in which the pin 4 is inserted through the prepreg 27 is provided, and the head portion 5 of the pin 4 is filled with the conductive adhesive 30 in the through hole of the prepreg. And pad 3 to match. Then, the prepreg and the conductive adhesive are cured by pressure bonding under a predetermined load W at a predetermined temperature. Then, the pad 3 and the head 5 of the pin 4 are bonded to each other with the conductive adhesive 30 to maintain the electrical continuity. The prepreg 27 is provided between the main surface 2 of the substrate 1 and the fixed plate 6.
Then, the head portion 5 of the pin 4 is engaged and fixed to the peripheral surface of the through hole of the fixing plate 6, and a desired structure similar to that shown in FIG. 9 can be obtained.
【００２６】なお、プリプレグ２７の貫通孔２８の大き
さや埋め込んでおく導電性接着剤３０の量などは、接着
後において対面するパッド３とピン４とに、他との電気
絶縁が確保された上で、電気的導通が保持されればよ
く、適宜に設定すればよい。したがって、プリプレグ２
７に設ける貫通孔２８の大きさをピン頭部５の径よりも
小さく、軸部の径よりも大きくして、前記したのと同様
に用いてもよい。この場合には、プリプレグ２７の材質
や厚さを適当なものにすることによって、プリプレグ２
７が変形して硬化する。したがって、固定板６の貫通孔
の周縁面８ａとピンの頭部５とは、このプリプレグ２７
を介して係合しつつ固定板６が基板１の主面２に接着さ
れる。The size of the through hole 28 of the prepreg 27, the amount of the conductive adhesive 30 to be embedded, and the like ensure that the pads 3 and the pins 4 facing each other after the bonding are electrically insulated from each other. Then, electrical continuity may be maintained, and may be set appropriately. Therefore, prepreg 2
The size of the through hole 28 provided in 7 may be smaller than the diameter of the pin head 5 and larger than the diameter of the shaft portion, and may be used in the same manner as described above. In this case, the material and thickness of the prepreg 27 are adjusted to a suitable value so that the prepreg 2
7 is deformed and hardened. Therefore, the peripheral surface 8a of the through hole of the fixing plate 6 and the head portion 5 of the pin are formed by the prepreg 27.
The fixing plate 6 is bonded to the main surface 2 of the substrate 1 while engaging with each other.
【００２７】なお、上記した例においてはいずれも、パ
ッド３とピン４とは、半田や導電性接着剤などで接合し
て電気的導通を保持したものを示したが、パッド３とピ
ン４の頭部５とを密着せしめて両者の電気的導通を保持
する一方、両者の接合強度はピン４の頭部５が固定板６
に係合することにより得られるようにしてもよい。ま
た、ピンの頭部５の端面５ａを粗面としたりローレット
かけしたり、円錐状などの凹凸を設けると、導電性接着
剤３０やパッド３との電気的導通を保持し易くなり好ま
しい。In each of the above examples, the pad 3 and the pin 4 are shown to be joined by solder or a conductive adhesive to maintain electrical continuity. While keeping the head 5 in close contact with each other to maintain electrical continuity between them, the joint strength between the two is such that the head 5 of the pin 4 has the fixing plate 6
May be obtained by engaging with. Further, it is preferable that the end surface 5a of the pin head 5 is roughened, knurled, or provided with concavities and convexities such as a conical shape, because electrical continuity with the conductive adhesive 30 and the pad 3 is easily maintained.
【００２８】第２形態例 次に、本発明に係る第２形態例を図１２ないし図１３を
参照して説明する。本例は、プラスチック製基板１の主
面２と固定板６との間に、圧力のかかった部位だけ上下
に導通する一定厚さ（例えば１５〜２５μｍ程度）の異
方導電性接着シート３７を介在させてパッド３とピン４
の頭部５との間で電気的導通をとりつつ、基板１と固定
板６とを接着してなるものである。Second Mode Example Next, a second mode example according to the present invention will be described with reference to FIGS. In this example, an anisotropic conductive adhesive sheet 37 having a constant thickness (for example, about 15 to 25 μm) is provided between the main surface 2 of the plastic substrate 1 and the fixing plate 6 so as to vertically conduct only a portion under pressure. Pad 3 and pin 4 intervening
The substrate 1 and the fixing plate 6 are adhered to each other while electrically connecting to the head 5.
【００２９】本形態例のものは、ピン４を貫通してなる
固定板６をそのピン４の頭部５と、基板１のパッド３と
を対面させるようにして位置決めし、その間に異方導電
性接着シート３７を介在させる（図１３参照）。そし
て、基板１の主面２と固定板６との間において所定の温
度下、所定時間、所定の荷重（圧縮力）Ｗを加え（例え
ば、１５０℃〜２００℃、２０秒、１〜３Ｍｐａ）、基
板１と固定板６とを圧着することで得ることができる。
本例では、ピン４の頭部５の厚さとパッド３の厚さのあ
る分、異方導電性接着シート３７はこの部位において局
所的に強く加圧されて圧縮変形を起こすことから、パッ
ド３とピン４とは同接着シート３７中の導電粒子を介し
て電気的導通が得られる一方、パッド３及びピンの頭部
５のない部位は相対的に大きな圧力を受けないことから
絶縁されて接着層としてのみ機能する。In the case of this embodiment, the fixing plate 6 penetrating the pin 4 is positioned so that the head 5 of the pin 4 and the pad 3 of the substrate 1 face each other, and the anisotropic conductivity is provided therebetween. The adhesive sheet 37 is interposed (see FIG. 13). Then, a predetermined load (compressive force) W is applied between the main surface 2 of the substrate 1 and the fixed plate 6 under a predetermined temperature for a predetermined time (for example, 150 ° C. to 200 ° C., 20 seconds, 1 to 3 MPa). It can be obtained by crimping the substrate 1 and the fixing plate 6.
In this example, since the thickness of the head 5 of the pin 4 and the thickness of the pad 3 cause the anisotropic conductive adhesive sheet 37 to be locally strongly pressed at this portion to cause compression deformation, the pad 3 The pin 4 and the pin 4 can be electrically connected to each other through the conductive particles in the adhesive sheet 37, while the pad 3 and the part without the head 5 of the pin are not subjected to a relatively large pressure, and are thus insulated and bonded. Functions only as a layer.
【００３０】本例では、電気的導通の保持と、基板１に
対する固定板６の接着とが、半田付け工程を要すること
なく、異方導電性接着シート３７のみですむことから、
構造の簡素化を図ることができる。In this example, since the electrical continuity is maintained and the fixing plate 6 is adhered to the substrate 1, only the anisotropic conductive adhesive sheet 37 is required without a soldering step,
The structure can be simplified.
【００３１】[0031]
【発明の効果】本発明によれば、プラスチックタイプの
基板のもつ優れた特性（低抵抗配線、低誘電率絶縁体、
低コスト性など）を生かしつつ、セラミックタイプの基
板のように基板内にピンを挿入することなく、しかも接
合強度の低下を招くことなくピンを接合することのでき
る構造を実現できる。したがって、プラスチックタイプ
のＰＧＡ型電子部品用基板でありながら、基板内に形成
される回路配線の密度を高くでき、多ピン化ないしピン
の高密度化を図ることができる。According to the present invention, the excellent characteristics of the plastic type substrate (low resistance wiring, low dielectric constant insulator,
It is possible to realize a structure in which the pins can be joined without inserting the pins into the substrate and lowering the joining strength, unlike the ceramic type substrate, while taking advantage of low cost. Therefore, even though it is a plastic type PGA type electronic component substrate, the density of circuit wiring formed in the substrate can be increased, and the number of pins or the density of pins can be increased.
【図１】本発明に係るＰＧＡ型電子部品用基板の実施の
第１形態例を示す中央縦断正面図。FIG. 1 is a central vertical sectional front view showing a first embodiment of an embodiment of a PGA type electronic component substrate according to the present invention.
【図２】図１の要部拡大断面図。FIG. 2 is an enlarged sectional view of a main part of FIG.
【図３】図１のＰＧＡ型電子部品用基板の製造過程の説
明図であって、ピンをピン固定板に圧入して基板のパッ
ドに対面させる中央縦断正面図。FIG. 3 is an explanatory view of a manufacturing process of the PGA type electronic component substrate of FIG. 1, and is a central vertical sectional front view in which pins are press-fitted into a pin fixing plate to face pads of the substrate.
【図４】図３に示す工程の後、ピンの頭部を基板のパッ
ドに半田付けした状態の中央縦断正面図。FIG. 4 is a central vertical sectional front view showing a state in which the head of the pin is soldered to the pad of the board after the step shown in FIG. 3;
【図５】図１のＰＧＡ型電子部品用基板の別の製法の説
明図であって、ピンをその頭部を介して基板のパッドに
半田付けした状態の中央縦断正面図。5 is an explanatory view of another method of manufacturing the PGA type electronic component substrate of FIG. 1, and is a central longitudinal sectional front view showing a state in which pins are soldered to the pads of the substrate via the heads thereof.
【図６】図５に示す工程の後、接着剤を基板の主面側に
塗布し、固定板をその貫通孔にピンを通して基板の主面
に被せる状態を説明する中央縦断正面図。FIG. 6 is a central vertical front view for explaining a state in which an adhesive is applied to the main surface side of the substrate after the step shown in FIG. 5 and a fixing plate is passed through the through-holes and pins are put on the main surface of the substrate.
【図７】図６に示す工程において、固定板を基板の主面
に接着した状態の中央縦断正面図。7 is a central longitudinal front view showing a state in which a fixing plate is bonded to the main surface of a substrate in the step shown in FIG.
【図８】ピン固定板を基板に接着する接着手段にプリプ
レグ用いた場合の製法を説明する図であって、ピンを基
板のパッドに接着し、プリプレグを基板と固定板との間
に介在させて位置合わせしている状態の中央縦断正面
図。FIG. 8 is a diagram illustrating a manufacturing method in the case where a prepreg is used as an adhesive means for adhering the pin fixing plate to the substrate, in which the pin is adhered to the pad of the substrate and the prepreg is interposed between the substrate and the fixing plate. Central vertical sectional front view in a state of being aligned.
【図９】図８に示す工程の後、ピン固定板を基板に接着
した状態の中央縦断正面図。9 is a central vertical sectional front view showing a state in which a pin fixing plate is adhered to a substrate after the step shown in FIG.
【図１０】ピン固定板を基板に接着する接着手段にプリ
プレグ用いた場合の別の製法を説明する図であって、ピ
ンを圧入したピン固定板をプリプレグを介して基板と対
面状態にしている状態の中央縦断正面図。FIG. 10 is a diagram for explaining another manufacturing method in the case where a prepreg is used as an adhesive means for adhering the pin fixing plate to the substrate, wherein the pin fixing plate into which the pin is press-fitted is in a state of facing the substrate through the prepreg. The central longitudinal front view of a state.
【図１１】図１０に示す工程の後、ピンを圧入したピン
固定板を基板に当接させた状態の中央縦断正面図。11 is a central longitudinal front view showing a state in which the pin fixing plate with the pins press-fitted is brought into contact with the substrate after the step shown in FIG.
【図１２】本発明に係るＰＧＡ型電子部品用基板の実施
の第２形態例を示すものであって、ピンとパッドとの電
気的導通の保持及びピン固定板を基板に接着する接着手
段に異方導電性接着シートを用いたものの中央縦断正面
図。FIG. 12 is a view showing a second embodiment of a PGA type electronic component substrate according to the present invention, which is different from an adhesive means for holding electrical continuity between pins and pads and for adhering a pin fixing plate to the substrate. The central longitudinal front view of what used the one-way conductive adhesive sheet.
【図１３】図１２のＰＧＡ型電子部品用基板の製造過程
の説明図であって、ピンを圧入したピン固定板とパッド
との間に異方導電性接着シートを介在させている状態の
中央縦断正面図。FIG. 13 is an explanatory view of the manufacturing process of the PGA type electronic component substrate of FIG. 12, which is a center state in which an anisotropic conductive adhesive sheet is interposed between a pin fixing plate into which pins are press-fitted and a pad; FIG.
１ プラスチック製基板 ２ 基板の主面 ３ パッド ４ 入出力端子用のピン ４ａ 入出力端子用のピンの軸部 ５ 入出力端子用のピンの頭部 ６ ピン固定板 ７，１７ 接着剤 ８ ピン固定板の貫通孔 ２７ プリプレグ（接着剤） ３７ 異方導電性接着シート（接着剤） 1 plastic substrate 2 main surface of substrate 3 pad 4 pin for input / output terminal 4a pin shaft for input / output terminal 5 head of pin for input / output terminal 6 pin fixing plate 7,17 adhesive 8 pin fixing Through hole of plate 27 Prepreg (adhesive) 37 Anisotropic conductive adhesive sheet (adhesive)
Claims (4)
子用のピンの接合用のパッドが複数形成され、該パッド
に、頭部がネイルヘッド型をなす前記ピンがその頭部を
介して電気的導通を保持されており、そして、該ピンの
配置に対応すると共に該ピンの軸部を貫通可能でありか
つその頭部を係合可能に形成されてなる貫通孔を備えた
ピン固定板が、その貫通孔に前記ピンの軸部を通しかつ
該ピンの頭部を係合させて前記プラスチック製基板の主
面に接着されていることを特徴とするＰＧＡ型電子部品
用基板。1. A plurality of pads for joining pins for input / output terminals are formed on a main surface of a plastic substrate, and the pins having heads of a nail head type are placed on the pads through the heads. A pin fixing plate having electrical continuity and provided with a through hole corresponding to the arrangement of the pin and capable of penetrating the shaft of the pin and engaging the head of the pin. The PGA type electronic component substrate is characterized in that the shaft portion of the pin is passed through the through hole and the head portion of the pin is engaged to be bonded to the main surface of the plastic substrate.
ける電気的導通が、半田付け若しくは導電性接着剤によ
る接着によって保持されている請求項１記載のＰＧＡ型
電子部品用基板。2. The PGA type electronic component substrate according to claim 1, wherein electrical continuity between the pad and the head of the pin is maintained by soldering or adhesion with a conductive adhesive.
基板の主面に、プリプレグを接着剤として接着されてい
る請求項１又は２記載のＰＧＡ型電子部品用基板。3. The PGA type electronic component substrate according to claim 1, wherein the pin fixing plate is bonded to the main surface of the plastic substrate using a prepreg as an adhesive.
ける電気的導通が、前記プラスチック製基板の主面と前
記ピン固定板との間に介在されて前記パッドと前記ピン
の頭部との間において局所的に加圧された異方導電性接
着シートの圧縮変形によって保持されると共に、前記ピ
ン固定板が前記プラスチック製基板の主面に該異方導電
性接着シートを接着剤として接着されている請求項１記
載のＰＧＡ型電子部品用基板。4. Electrical continuity between the pad and the head of the pin is interposed between the main surface of the plastic substrate and the pin fixing plate, and the pad and the head of the pin are connected to each other. Is held by the compressive deformation of the anisotropic conductive adhesive sheet locally pressed between the pin fixing plate and the pin fixing plate is bonded to the main surface of the plastic substrate by using the anisotropic conductive adhesive sheet as an adhesive. The PGA type electronic component substrate according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30843795A JP3037885B2 (en) | 1995-10-31 | 1995-10-31 | Substrate for PGA type electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30843795A JP3037885B2 (en) | 1995-10-31 | 1995-10-31 | Substrate for PGA type electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09129778A true JPH09129778A (en) | 1997-05-16 |
| JP3037885B2 JP3037885B2 (en) | 2000-05-08 |
Family
ID=17981037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30843795A Expired - Lifetime JP3037885B2 (en) | 1995-10-31 | 1995-10-31 | Substrate for PGA type electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3037885B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003028100A3 (en) * | 2001-09-27 | 2003-11-20 | Intel Corp | Encapsulation of pin solder for maintaining accuracy in pin position |
| JP2008277526A (en) * | 2007-04-27 | 2008-11-13 | Shinko Electric Ind Co Ltd | Substrate with pin, manufacturing method therefor, and semiconductor product |
| WO2009031251A1 (en) * | 2007-09-05 | 2009-03-12 | Ibiden Co., Ltd. | Wiring substrate and method for manufacturing the same |
| JP2009200313A (en) * | 2008-02-22 | 2009-09-03 | Shinko Electric Ind Co Ltd | Pga wiring board and method of manufacturing the same |
| JP2009239223A (en) * | 2008-03-28 | 2009-10-15 | Ngk Spark Plug Co Ltd | Multilayer wiring board |
| JP2009260335A (en) * | 2008-03-28 | 2009-11-05 | Ngk Spark Plug Co Ltd | Multi-layer wiring board and manufacturing method thereof |
| US7847393B2 (en) | 1998-12-16 | 2010-12-07 | Ibiden Co., Ltd. | Conductive connecting pins for a package substrate |
-
1995
- 1995-10-31 JP JP30843795A patent/JP3037885B2/en not_active Expired - Lifetime
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7847393B2 (en) | 1998-12-16 | 2010-12-07 | Ibiden Co., Ltd. | Conductive connecting pins for a package substrate |
| US8536696B2 (en) | 1998-12-16 | 2013-09-17 | Ibiden Co., Ltd. | Conductive pin attached to package substrate |
| US8110917B2 (en) | 1998-12-16 | 2012-02-07 | Ibiden Co., Ltd. | Package substrate with a conductive connecting pin |
| US8035214B1 (en) | 1998-12-16 | 2011-10-11 | Ibiden Co., Ltd. | Conductive connecting pin for package substance |
| US7902659B2 (en) | 1998-12-16 | 2011-03-08 | Ibiden Co., Ltd. | Conductive connecting pin and package substrate |
| US6974765B2 (en) | 2001-09-27 | 2005-12-13 | Intel Corporation | Encapsulation of pin solder for maintaining accuracy in pin position |
| US7211888B2 (en) | 2001-09-27 | 2007-05-01 | Intel Corporation | Encapsulation of pin solder for maintaining accuracy in pin position |
| WO2003028100A3 (en) * | 2001-09-27 | 2003-11-20 | Intel Corp | Encapsulation of pin solder for maintaining accuracy in pin position |
| JP2008277526A (en) * | 2007-04-27 | 2008-11-13 | Shinko Electric Ind Co Ltd | Substrate with pin, manufacturing method therefor, and semiconductor product |
| US8188589B2 (en) | 2007-04-27 | 2012-05-29 | Shinko Electric Industries Co., Ltd. | Substrate with pin, manufacturing method thereof, and semiconductor product |
| WO2009031251A1 (en) * | 2007-09-05 | 2009-03-12 | Ibiden Co., Ltd. | Wiring substrate and method for manufacturing the same |
| JP2009200313A (en) * | 2008-02-22 | 2009-09-03 | Shinko Electric Ind Co Ltd | Pga wiring board and method of manufacturing the same |
| JP2009260335A (en) * | 2008-03-28 | 2009-11-05 | Ngk Spark Plug Co Ltd | Multi-layer wiring board and manufacturing method thereof |
| JP2009239223A (en) * | 2008-03-28 | 2009-10-15 | Ngk Spark Plug Co Ltd | Multilayer wiring board |
| TWI451536B (en) * | 2008-03-28 | 2014-09-01 | Ngk Spark Plug Co | Multi-layer wiring board and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3037885B2 (en) | 2000-05-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6600224B1 (en) | Thin film attachment to laminate using a dendritic interconnection | |
| KR100478314B1 (en) | Multi-layer flexible wiring boards and fabricating methods thereof | |
| JP4716038B2 (en) | Electronic component and manufacturing method thereof | |
| US5943212A (en) | Ceramic circuit board and semiconductor device using same | |
| JPH07240496A (en) | Semiconductor device, its manufacture method and board for testing semiconductor and manufacture of test board | |
| JP4992310B2 (en) | Manufacturing method of laminated substrate | |
| JPH1126902A (en) | Printed wiring board with protruding electrodes and method of manufacturing the same | |
| JPH10275966A (en) | Printed-wiring board and its manufacture | |
| JP2005191156A (en) | Wiring plate containing electric component, and its manufacturing method | |
| JPH09199635A (en) | Multilayer film for forming circuit substrate, multilayer circuit substrate using it, and package for semiconductor device | |
| JPH1126631A (en) | Semiconductor device and manufacturing method thereof | |
| JP2000277649A (en) | Semiconductor and manufacture of the same | |
| JP3037885B2 (en) | Substrate for PGA type electronic components | |
| JPH10335528A (en) | Semiconductor package and method of manufacturing semiconductor package | |
| JP4046854B2 (en) | Method for manufacturing printed wiring board with pins | |
| JPH11112150A (en) | Multilayered substrate and its manufacture | |
| JP2003197822A (en) | Wiring board, multilayer wiring board and manufacturing method thereof | |
| JPH0951018A (en) | Semiconductor device and its manufacturing method | |
| JP3889888B2 (en) | Pin standing plate and resin wiring board | |
| JPH10189655A (en) | Wiring board, semiconductor device and mounting of electronic component | |
| JP4755151B2 (en) | Electrical connection device | |
| JP3730980B2 (en) | Manufacturing method of mounted circuit board | |
| JPH09283931A (en) | Multilayer wiring board | |
| JP2004134817A (en) | Method for manufacturing semiconductor device | |
| JP2689956B2 (en) | Semiconductor device and manufacturing method thereof |