JPH09120745A - Touch panel and its manufacture - Google Patents
Touch panel and its manufactureInfo
- Publication number
- JPH09120745A JPH09120745A JP29916695A JP29916695A JPH09120745A JP H09120745 A JPH09120745 A JP H09120745A JP 29916695 A JP29916695 A JP 29916695A JP 29916695 A JP29916695 A JP 29916695A JP H09120745 A JPH09120745 A JP H09120745A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- insulating substrate
- touch panel
- boards
- adhered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 230000002093 peripheral effect Effects 0.000 claims abstract description 46
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 89
- 229920006267 polyester film Polymers 0.000 abstract description 10
- 230000004927 fusion Effects 0.000 abstract description 8
- 239000011521 glass Substances 0.000 abstract description 8
- 238000006073 displacement reaction Methods 0.000 abstract description 6
- 239000002390 adhesive tape Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 description 26
- 230000001070 adhesive effect Effects 0.000 description 26
- 238000007789 sealing Methods 0.000 description 8
- 238000000605 extraction Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 4
- 229920006254 polymer film Polymers 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- AZWHFTKIBIQKCA-UHFFFAOYSA-N [Sn+2]=O.[O-2].[In+3] Chemical compound [Sn+2]=O.[O-2].[In+3] AZWHFTKIBIQKCA-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- -1 ethylene butylene Chemical group 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- DAONBNNRBFCSLS-UHFFFAOYSA-N styrene Chemical compound C=CC1=CC=CC=C1.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 DAONBNNRBFCSLS-UHFFFAOYSA-N 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
Landscapes
- Manufacture Of Switches (AREA)
- Push-Button Switches (AREA)
- Position Input By Displaying (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、タッチパネル及びその
製造方法に関し、特に、周辺部の接着法を改良したタッ
チパネル及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a touch panel and a method for manufacturing the same, and more particularly to a touch panel having an improved bonding method for peripheral portions and a method for manufacturing the same.
【0002】[0002]
【従来の技術】タッチパネルは、液晶やプラズマ、エレ
クトロルミネセンス等のディスプレイ等の表示体の表面
に載せて情報を入力したり、あるいは図面等の上に載せ
て座標を指示するために用いている。2. Description of the Related Art A touch panel is used for inputting information on a surface of a display such as a display such as a liquid crystal display, a plasma display, and an electroluminescence display, or for indicating coordinates on a drawing or the like. .
【0003】そして従来のタッチパネルは、高分子フィ
ルム等の表面に透明導電膜からなる電極を設けた絶縁基
板と、ガラス板等の表面に透明導電膜からなる電極を設
けた絶縁基板とを重ね合せ、周辺部で接着した構造にな
っている。絶縁基板の周辺部を接着するには、例えば、
両面テープや粘着剤、熱融着部材を用い、これらを絶縁
基板の周辺部に予じめ設けている。そして、両面テープ
や粘着剤を用いた場合には加圧して、熱融着部材を用い
た場合には加熱して接着している。In a conventional touch panel, an insulating substrate having an electrode made of a transparent conductive film on the surface of a polymer film or the like and an insulating substrate having an electrode made of a transparent conductive film on the surface of a glass plate or the like are superposed on each other. The structure is adhered at the periphery. To bond the peripheral part of the insulating substrate, for example,
A double-sided tape, an adhesive, and a heat-sealing member are used, and these are preliminarily provided in the peripheral portion of the insulating substrate. When the double-sided tape or the adhesive is used, the pressure is applied, and when the heat-sealing member is used, the pressure is applied to heat the adhesive.
【0004】[0004]
【発明が解決しようとする課題】しかし、絶縁基板の周
辺部を、両面テープや粘着剤等を用い加圧して接着した
場合には、高温雰囲気中においてタッチパネルを使用す
ると、接着力が弱まり、タッチ面に圧力を加えたりする
と絶縁基板どうしの位置がずれ易い欠点がある。However, in the case where the peripheral portion of the insulating substrate is pressure-bonded by using a double-sided tape or an adhesive, if the touch panel is used in a high temperature atmosphere, the adhesive strength is weakened and the touch is reduced. If pressure is applied to the surface, the insulating substrates are easily displaced from each other.
【0005】また、熱融着部材を用いて周辺部を加熱に
より接着した場合には、絶縁基板に高分子フィルムを用
いると、周辺部が縮み、中央部がたるみ易い欠点があ
る。In addition, when the peripheral portion is heated and adhered by using the heat-sealing member, when the polymer film is used as the insulating substrate, the peripheral portion shrinks and the central portion easily sags.
【0006】本発明の目的は、以上の欠点を改良し、絶
縁基板の位置のずれを防止でき、絶縁基板の中央部のた
るみを防止できるタッチパネル及びその製造方法を提供
するものである。An object of the present invention is to provide a touch panel which can improve the above-mentioned drawbacks, prevent the displacement of the position of the insulating substrate, and prevent the slack of the central portion of the insulating substrate, and a manufacturing method thereof.
【0007】[0007]
【課題を解決するための手段】請求項1の発明は、上記
の目的を達成するために、表面に電極を設けた絶縁基板
どうしを重ね合せ、周辺部を接着したタッチパネルにお
いて、周辺部の一部を加圧して接着するとともにこの周
辺部の他の部分を加熱して接着していることを特徴とす
るタッチパネルを提供するものである。In order to achieve the above-mentioned object, the invention according to claim 1 is a touch panel in which insulating substrates having electrodes on their surfaces are superposed on each other and the peripheral portions are adhered to each other. The present invention provides a touch panel characterized in that a part is pressed and bonded and at the same time, another part of the peripheral part is heated and bonded.
【0008】また、請求項2の発明は、表面に電極を設
けた絶縁基板どうしを重ね合せ、周辺部を接着するタッ
チパネルの製造方法において、周辺部の一部を加圧して
接着する工程と、この工程後に前記周辺部の他の部分を
加熱して接着する工程とを行うことを特徴とするタッチ
パネルの製造方法を提供するものである。According to a second aspect of the present invention, in a method of manufacturing a touch panel in which insulating substrates having electrodes provided on their surfaces are superposed on each other and the peripheral portions thereof are adhered, a step of adhering a part of the peripheral portions by applying pressure, And a step of heating and adhering the other part of the peripheral portion after this step, to provide a method for manufacturing a touch panel.
【0009】加圧して接着する手段としては、両面テー
プや粘着剤を用いる。なお、両面テープを用いる場合に
は、四角形のタッチパネルであれば、絶縁基板の一辺又
は対向する二辺に両面テープを張り付けて用いる方が好
ましい。すなわち、両面テープを絶縁基板の三辺以上に
張り付けるには、絶縁基板とほぼ同一幅の両面テープの
中央部を全型で打抜き、この中央部を捨て、周辺部を残
すようにして成形した両面テープを使用しなければなら
ず、量産に時間がかかり、コストを低減し難くなる。絶
縁基板の一辺又は対向する二辺であれば、両面テープと
して最初から絶縁基板の周辺部を接着するのに必要な幅
のものを使用でき、短時間で量産でき、かつ捨てる部分
もなくなりコストを容易に低減できる。また、粘着剤の
場合には、絶縁基板どうしを重ね合せる前に粘着剤にゴ
ミが付着するのを防止するため、表面に保護用フィルム
を張り付ける作業が必要となる。従って、両面テープの
方が粘着剤よりも作業性が良い。A double-sided tape or a pressure-sensitive adhesive is used as a means for applying pressure and adhesion. When the double-sided tape is used, it is preferable to stick the double-sided tape to one side or two opposite sides of the insulating substrate in the case of a rectangular touch panel. That is, in order to stick the double-sided tape on three or more sides of the insulating substrate, the central part of the double-sided tape having almost the same width as the insulating substrate was punched out with a full die, the central part was discarded, and the peripheral part was left. Since double-sided tape must be used, it takes time for mass production and it is difficult to reduce the cost. If the insulating substrate has one side or two opposite sides, it is possible to use a double-sided tape with a width necessary to bond the peripheral portion of the insulating substrate from the beginning, mass production in a short time, and no part to be thrown away, and cost is reduced. It can be easily reduced. Further, in the case of the pressure-sensitive adhesive, it is necessary to attach a protective film to the surface in order to prevent dust from adhering to the pressure-sensitive adhesive before stacking the insulating substrates. Therefore, the double-sided tape has better workability than the adhesive.
【0010】そして加熱して接着する手段には、熱融着
部材を用いる。この熱融着部材としては、SBS(スチ
レン・ブタジエン・スチレン)やSEBS(スチレン・
エチレンブチレン・スチレン)等のスチレン系ブロック
コポリマ系やポリビニルブチラール、ポリエステル系等
の熱可塑性接着剤、エポキシ樹脂系やポリウレタン系、
アクリル樹脂系等の熱硬化性接着剤を用いる。なお、加
熱して接着する部分は、四角形のタッチパネルであれ
ば、絶縁基板の一辺又は対向する二辺が好ましい。この
部分が多くなると、絶縁基板に高分子フィルムを用いた
場合、中央部のたるみを防止する効果が低くなる。A heat fusion member is used as a means for heating and adhering. As the heat-sealing member, SBS (styrene-butadiene-styrene) or SEBS (styrene-styrene
Styrene block copolymers such as ethylene butylene and styrene), polyvinyl butyral, thermoplastic adhesives such as polyester, epoxy resin and polyurethane,
A thermosetting adhesive such as an acrylic resin is used. It should be noted that the portion to be heated and adhered is preferably one side of the insulating substrate or two sides facing each other in the case of a rectangular touch panel. When the number of this portion is large, when a polymer film is used for the insulating substrate, the effect of preventing the slack in the central portion becomes low.
【0011】[0011]
【作用】本発明は、周辺部の一部を加圧して接着し、そ
の他の周辺部を加熱して接着している。そして加熱して
接着した部分は、高温中においてもその接着力があまり
低下しない。そのため、タッチパネルを高温雰囲気中に
おいて使用した場合、加圧により接着した部分の接着力
が低下しても、他の周辺部を加熱により接着しているた
め、絶縁基板のずれを防止できる。According to the present invention, a part of the peripheral portion is pressed and bonded, and the other peripheral portion is heated and bonded. The adhesive strength of the heated and bonded portion does not decrease so much even at high temperature. Therefore, when the touch panel is used in a high-temperature atmosphere, even if the adhesive force of the part bonded by pressure is reduced, the other peripheral parts are bonded by heating, so that the displacement of the insulating substrate can be prevented.
【0012】また、加熱により接着する部分と、加圧に
よる接着する部分とを併用しているため、加熱により高
分子フィルムからなる絶縁基板が縮むのを軽減でき、従
って絶縁基板が中央部でたるむのを軽減できる。Further, since the portion to be adhered by heating and the portion to be adhered by pressurization are used together, shrinkage of the insulating substrate made of a polymer film due to heating can be reduced, and therefore the insulating substrate is slack in the central portion. Can be reduced.
【0013】さらに、請求項2の発明において、特に、
周辺部の一部を加圧して接着し、その後に他の周辺部を
加熱して接着している。そして周辺部を加圧して接着し
た部分は、接着直後には比較的容易に剥離できる。した
がって、加圧して接着した後に、絶縁基板どうしがずれ
ていることが判明した場合にはこの工程の直後に絶縁基
板どうしを剥し、位置を正確に合せて再び重ね合せ加圧
して接着する。これにより、製造時に絶縁基板どうしが
ずれて接着するのを防止できる。Further, in the invention of claim 2, in particular,
A part of the peripheral portion is pressed and bonded, and then the other peripheral portion is heated and bonded. The portion where the peripheral portion is pressed and adhered can be peeled off relatively easily immediately after the adhesion. Therefore, if it is found that the insulating substrates are displaced from each other after being pressed and bonded, the insulating substrates are peeled off immediately after this step, the positions are accurately aligned and the layers are again stacked and pressed to bond. Thereby, it is possible to prevent the insulating substrates from being displaced and bonded to each other during manufacturing.
【0014】[0014]
【実施例】以下、本発明を実施例に基づいて説明する。
図1(イ)において、1は、厚さ125μmのポリエス
テルフィルムからなる、ほぼ長方形状の第1の絶縁基板
であり、長辺の一辺に突起2を設けている。3はこの第
1の絶縁基板1の表面に、抵抗値が500Ω/□となる
ように、長方形状に設けたITO(酸化インジウム−酸
化スズ)の透明導電膜からなる第1の電極である。4
は、この第1の電極3の短辺に接続して第1の絶縁基板
1の表面に印刷して設けたAgインク等からなる第1の
集電用電極である。5はこの第1の集電用電極4に接続
して引出し、突起2まで延長して設けたAgインク等か
らなる第1の引き出し用電極である。6は第1の電極3
と絶縁して第1の絶縁基板1の表面にAgインク等を印
刷して設けた第1の接続用電極である。7はこの第1の
接続用電極6に接続し突起2まで延長して設けたAgイ
ンク等からなる第2の引き出し用電極である。EXAMPLES The present invention will be described below based on examples.
In FIG. 1A, reference numeral 1 is a substantially rectangular first insulating substrate made of a 125 μm-thick polyester film, and a protrusion 2 is provided on one long side thereof. Reference numeral 3 is a first electrode made of a transparent conductive film of ITO (indium oxide-tin oxide) provided in a rectangular shape on the surface of the first insulating substrate 1 so as to have a resistance value of 500Ω / □. 4
Is a first current collecting electrode made of Ag ink or the like, which is connected to the short side of the first electrode 3 and printed on the surface of the first insulating substrate 1. Reference numeral 5 is a first lead-out electrode made of Ag ink or the like, which is connected to the first current-collecting electrode 4 and is led out and extended to the protrusion 2. 6 is the first electrode 3
Is a first connection electrode that is provided by printing Ag ink or the like on the surface of the first insulating substrate 1 so as to be insulated. Reference numeral 7 is a second lead-out electrode made of Ag ink or the like, which is connected to the first connection electrode 6 and extends to the protrusion 2.
【0015】また、図1(ロ)において、8は、厚さ
1.8mmのガラス板からなる長方形状の第2の絶縁基板
である。9は、この第2の絶縁基板8の表面に、抵抗値
が500Ω/□となるように設けたITOの透明導電膜
からなる長方形状の第2の電極である。10はこの第2
の電極9の長辺に接続して第2の絶縁基板8の表面にA
gインク等を印刷して設けた第2の集電用電極である。
11はこの第2の集電用電極10の表面に設けたAgイ
ンク等を成分とする導電性接着剤等からなる第2の接続
用電極である。12は、第2の電極9の両短辺に沿って
第2の絶縁基板8の周辺部の表面に設けた3mm幅の両面
テープである。13は、第2の電極9の両長辺に沿って
第2の絶縁基板8の周辺部の表面に設けた熱融着部材で
ある。この熱融着部材13には、熱可塑性接着剤や熱硬
化性接着剤を用いる。14は第2の絶縁基板8及び第2
の電極9の表面に設けた底部の直径が50μmのドット
状の絶縁性のスペーサである。Further, in FIG. 1B, 8 is a rectangular second insulating substrate made of a glass plate having a thickness of 1.8 mm. Reference numeral 9 denotes a rectangular second electrode made of a transparent conductive film of ITO provided on the surface of the second insulating substrate 8 so as to have a resistance value of 500Ω / □. 10 is this second
Connected to the long side of the electrode 9 of the second insulating substrate 8
This is a second current collecting electrode provided by printing g ink or the like.
Reference numeral 11 denotes a second connection electrode formed on the surface of the second current collecting electrode 10 and made of a conductive adhesive or the like containing Ag ink or the like as a component. Reference numeral 12 is a double-sided tape having a width of 3 mm provided on the surface of the peripheral portion of the second insulating substrate 8 along both short sides of the second electrode 9. Reference numeral 13 is a heat-sealing member provided on the surface of the peripheral portion of the second insulating substrate 8 along both long sides of the second electrode 9. A thermoplastic adhesive or a thermosetting adhesive is used for the heat fusion member 13. 14 is the second insulating substrate 8 and the second
Is a dot-shaped insulating spacer having a bottom diameter of 50 μm provided on the surface of the electrode 9.
【0016】図1(ハ)は、第1の絶縁基板1と第2の
絶縁基板8とを重ね、周辺部を接着したタッチパネル1
5を示す。FIG. 1C shows a touch panel 1 in which a first insulating substrate 1 and a second insulating substrate 8 are superposed and peripheral portions thereof are adhered.
5 is shown.
【0017】次に、このタッチパネル15の製造方法を
述べる。先ず、第1の絶縁基板1を製造すには、ポリエ
ステルフィルムにITOをスパッタリングしその表面に
透明導電膜を形成し、エッチング処理して第1の電極3
を形成する。次に、Agインク等を印刷して第1の集電
用電極4、第1の引き出し用電極5、第1の接続用電極
6及び第2の引き出し用電極7を形成する。その後、ポ
リエステルフィルムを切断して、第1の絶縁基板1を形
成する。Next, a method of manufacturing the touch panel 15 will be described. First, in order to manufacture the first insulating substrate 1, ITO is sputtered on a polyester film to form a transparent conductive film on the surface of the polyester film, and an etching treatment is performed to form the first electrode 3
To form Next, Ag ink or the like is printed to form the first current collecting electrode 4, the first extraction electrode 5, the first connection electrode 6, and the second extraction electrode 7. After that, the polyester film is cut to form the first insulating substrate 1.
【0018】また、第2の絶縁基板8は次の通りに製造
する。すなわち、先ず、予じめ長方形状に成形したガラ
ス板にITOをスパッタリングして透明導電膜を形成
し、エッチング処理して第2の電極9を形成する。この
第2の電極9を形成後、Agインク等を印刷して第2の
集電用電極10及び第2の接続用電極11を形成する。
この後、第2の電極9の両短辺に沿って周辺部に3mm幅
の両面テープ12を張り付ける。また、第2の電極9の
両長辺に沿って周辺部に熱融着部材13を塗布する。そ
して加熱処理する。この加熱処理により、熱融着部材1
3が熱可塑性接着剤の場合には溶剤を蒸発でき、熱硬化
性接着剤の場合には半硬化の状態になる。The second insulating substrate 8 is manufactured as follows. That is, first, ITO is sputtered on a glass plate formed in advance into a rectangular shape to form a transparent conductive film, and an etching process is performed to form the second electrode 9. After forming the second electrode 9, Ag ink or the like is printed to form the second collecting electrode 10 and the second connecting electrode 11.
After that, a double-sided tape 12 having a width of 3 mm is attached to the peripheral portion along both short sides of the second electrode 9. Further, the thermal fusion bonding member 13 is applied to the peripheral portion along both long sides of the second electrode 9. Then, heat treatment is performed. By this heat treatment, the heat fusion member 1
When 3 is a thermoplastic adhesive, the solvent can be evaporated, and when it is a thermosetting adhesive, it is in a semi-cured state.
【0019】次に、第2の絶縁基板8の表面に第1の絶
縁基板1を重ね合せる。重ね合せた後、ローラ等で両面
テープ12に接している第1の絶縁基板1の周辺部を加
圧して接着する。この接着工程後、第1の絶縁基板1及
び第2の絶縁基板8の位置が合っているか否かを検査す
る。そして位置がずれている場合には、第1の絶縁基板
1を剥し、位置を正確に合せて第2の絶縁基板8に再度
重ね、周辺部を加圧して接着する。この接着後、加熱
し、熱融着部材13に接している第1の絶縁基板1の周
辺部を軽く加圧して接着する。この加熱処理により、熱
硬化性接着剤であれば完全硬化して第1の絶縁基板1の
周辺部が第2の絶縁基板8の周辺部に接着する。Next, the first insulating substrate 1 is superposed on the surface of the second insulating substrate 8. After overlapping, the peripheral portion of the first insulating substrate 1 in contact with the double-sided tape 12 is pressed by a roller or the like to be bonded. After this bonding step, it is inspected whether the first insulating substrate 1 and the second insulating substrate 8 are aligned with each other. Then, if the positions are deviated, the first insulating substrate 1 is peeled off, the positions are accurately aligned and the second insulating substrate 8 is overlapped again, and the peripheral portion is pressed and bonded. After this bonding, heating is performed, and the peripheral portion of the first insulating substrate 1 in contact with the heat-sealing member 13 is lightly pressed and bonded. By this heat treatment, the thermosetting adhesive is completely cured and the peripheral portion of the first insulating substrate 1 is bonded to the peripheral portion of the second insulating substrate 8.
【0020】また、図2は本発明の他の実施例を示す。
すなわち、図2(イ)において、20は、厚さ188μ
mのポリエステルフィルムからなる長方形状の第1の絶
縁基板である。21はこの第1の絶縁基板20の表面
に、抵抗値が700Ω/□となるように設けたITOの
透明導電膜からなる第1の電極である。22はこの第1
の電極21の短辺に接続して第1の絶縁基板20の表面
にAg等を印刷して設けた第1の集電用電極である。2
3は第1の電極21の長辺に沿って第1の絶縁基板20
の表面に設けた両面テープである。FIG. 2 shows another embodiment of the present invention.
That is, in FIG. 2A, 20 is a thickness of 188 μ.
It is a rectangular first insulating substrate made of m polyester film. Reference numeral 21 is a first electrode made of a transparent conductive film of ITO provided on the surface of the first insulating substrate 20 so as to have a resistance value of 700Ω / □. 22 is this first
Is a first current collecting electrode provided by printing Ag or the like on the surface of the first insulating substrate 20 connected to the short side of the electrode 21. 2
3 is the first insulating substrate 20 along the long side of the first electrode 21.
It is a double-sided tape provided on the surface of.
【0021】そして図2(ロ)において、24は厚さ
1.5mmのガラス板からなる長方形状の第2の絶縁基板
である。25は、この第2の絶縁基板24の表面に、抵
抗値が700Ω/□となるように設けたITOの透明導
電膜からなる、長方形状の第2の電極である。26はこ
の第2の電極25の長辺に接続して第2の絶縁基板24
の表面にAgインク等を印刷して設けた第2の集電用電
極である。27及び28は第2の絶縁基板の表面にその
短辺の一辺に沿ってAgインク等を印刷して設けた第1
の接続用電極及び第2の接続用電極である。29は、第
2の集電用電極26に接続し、引き出して第1の接続用
電極27に接続した第1の引き出し用電極である。30
は、第2の電極25と絶縁し、この第2の電極25の短
辺に沿って、Agインク等を印刷して設けた第3の接続
用電極である。31は、この第3の接続用電極30に接
続し、引き出して第2の接続用電極28に接続した第2
の引き出し用電極であり、Agインク等を印刷して設け
ている。32は、一方の第3の接続用電極30を覆って
第2の絶縁基板24の短辺の一辺に沿って設けた熱融着
部材である。33は第1の接続用電極27、第2の接続
用電極28及び他方の第3の接続用電極30を覆って第
2の絶縁基板24の他方の短辺に沿って設けた異方導電
体からなる接着剤である。この異方導電体からなる接着
剤33は、加圧して接着するものまたは加熱して接着す
るもの、湿気によって硬化して接着するもののどれか一
つを用いる。In FIG. 2B, 24 is a rectangular second insulating substrate made of a glass plate having a thickness of 1.5 mm. Reference numeral 25 is a rectangular second electrode made of a transparent conductive film of ITO provided on the surface of the second insulating substrate 24 so as to have a resistance value of 700Ω / □. 26 is connected to the long side of the second electrode 25 and is connected to the second insulating substrate 24.
Is a second current collecting electrode provided by printing Ag ink or the like on the surface of. Reference numerals 27 and 28 denote first and second electrodes provided on the surface of the second insulating substrate by printing Ag ink or the like along one of its short sides.
And the second connection electrode. Reference numeral 29 is a first lead-out electrode that is connected to the second current collecting electrode 26, is led out, and is connected to the first connecting electrode 27. 30
Is a third connecting electrode that is insulated from the second electrode 25 and is provided by printing Ag ink or the like along the short side of the second electrode 25. Reference numeral 31 denotes a second connection electrode connected to the third connection electrode 30 and drawn to be connected to the second connection electrode 28.
And is provided by printing Ag ink or the like. Reference numeral 32 is a heat-sealing member that covers one of the third connecting electrodes 30 and is provided along one short side of the second insulating substrate 24. An anisotropic conductor 33 is provided along the other short side of the second insulating substrate 24 so as to cover the first connection electrode 27, the second connection electrode 28 and the other third connection electrode 30. It is an adhesive consisting of. As the adhesive 33 made of this anisotropic conductor, one of a pressure-sensitive adhesive, a heat-sensitive adhesive, and a moisture-curable adhesive is used.
【0022】そして図2(ハ)において、34は厚さ2
5μmのポリエステルフィルムからなる第3の絶縁基板
である。35はこの第3の絶縁基板34の表面にAgイ
ンク等を印刷して設けた第4の接続用電極である。36
はこの第4の接続用電極35に接続して第3の絶縁基板
34にAgインク等を印刷して設けた第3の引き出し用
電極である。In FIG. 2C, 34 is a thickness 2
It is a third insulating substrate made of a 5 μm polyester film. Reference numeral 35 is a fourth connection electrode provided by printing Ag ink or the like on the surface of the third insulating substrate 34. 36
Is a third extraction electrode connected to the fourth connection electrode 35 and provided by printing Ag ink or the like on the third insulating substrate 34.
【0023】さらに、図2(ニ)は、第1の絶縁基板2
0と第2の絶縁基板24、第3の絶縁基板34を重ね、
周辺部を接着したタッチパネル37を示す。Further, FIG. 2D shows the first insulating substrate 2
0, the second insulating substrate 24, and the third insulating substrate 34 are overlapped,
The touch panel 37 with which the peripheral part was bonded is shown.
【0024】このタッチパネル37は次の通りに製造す
る。すなわち、先ず、ポリエステルフィルムの表面に第
1の電極21、第1の集電用電極22を形成し、3mm幅
の両面テープ23を第1の電極21の長辺に沿って張り
付ける。次にこのポリエステルフィルムを切断して、第
1の絶縁基板20を形成する。The touch panel 37 is manufactured as follows. That is, first, the first electrode 21 and the first current collecting electrode 22 are formed on the surface of the polyester film, and the double-sided tape 23 having a width of 3 mm is attached along the long side of the first electrode 21. Next, the polyester film is cut to form the first insulating substrate 20.
【0025】また、予じめ長方形状に成形したガラス板
に第2の電極25、第2の集電用電極26、第1の接続
用電極27、第2の接続用電極28、第3の接続用電極
30、第1の引き出し用電極29、第2の引き出し用電
極31を形成する。次に、第3の接続用電極30を覆っ
てガラス板の一方の短辺の周辺部に熱融着部材32を印
刷して塗布する。塗布後、加熱処理する。また、第1の
接続用電極27、第2の接続用電極28、第3の接続用
電極30を覆ってガラス板の他の短辺の周辺部に異方導
電体からなる接着剤33を塗布して第2の絶縁基板24
を形成する。Further, the second electrode 25, the second current collecting electrode 26, the first connecting electrode 27, the second connecting electrode 28, and the third connecting electrode 28 are formed on the glass plate formed in advance in a rectangular shape. The connection electrode 30, the first extraction electrode 29, and the second extraction electrode 31 are formed. Next, a thermal fusion bonding member 32 is printed and applied to the peripheral portion of one short side of the glass plate while covering the third connection electrode 30. After coating, heat treatment is performed. Also, an adhesive 33 made of an anisotropic conductor is applied to the peripheral portion of the other short side of the glass plate so as to cover the first connection electrode 27, the second connection electrode 28, and the third connection electrode 30. Then, the second insulating substrate 24
To form
【0026】さらに、ポリエステルフィルムの表面にA
gインク等を塗布して第4の接続用電極35及び第3の
引き出し用電極36を形成し、所定の大きさに切断して
第3の絶縁基板34を形成する。Furthermore, A is formed on the surface of the polyester film.
g ink or the like is applied to form the fourth connection electrode 35 and the third extraction electrode 36, which are cut into a predetermined size to form the third insulating substrate 34.
【0027】そしてこの第3の絶縁基板34を、第4の
接続用電極35を第2の絶縁基板24の第1の接続用電
極27及び第2の接続用電極28に対向して、接着剤3
3に接着する。この接着後、第2の絶縁基板24の表面
に第1の絶縁基板20を重ね合せる。重ね合せた後、両
面テープ23を設けた第1の絶縁基板20の周辺部を加
圧して接着する。また、接着剤33が加圧して接着する
か湿気によって硬化して接着するものであれば、同様
に、接着剤33に接着している第1の絶縁基板20の周
辺部を加圧して接着する。そしてこの接着後、加熱し
て、熱融着部32に接している第1の絶縁基板20の周
辺部を軽く加圧して接着する。なお、接着剤33が加熱
して接着するものであれば、同様に加熱し加圧して接着
する。An adhesive is applied to the third insulating substrate 34 so that the fourth connecting electrode 35 faces the first connecting electrode 27 and the second connecting electrode 28 of the second insulating substrate 24. Three
Adhere to 3. After this bonding, the first insulating substrate 20 is superposed on the surface of the second insulating substrate 24. After overlapping, the peripheral portion of the first insulating substrate 20 provided with the double-sided tape 23 is pressed and bonded. Further, if the adhesive 33 adheres under pressure or is cured by moisture and adheres, similarly, the peripheral portion of the first insulating substrate 20 adhered to the adhesive 33 is adhered under pressure. . Then, after this bonding, heating is performed to lightly press the peripheral portion of the first insulating substrate 20 in contact with the heat-sealing portion 32 to bond the same. If the adhesive 33 is heated and bonded, it is heated and pressed in the same manner to bond.
【0028】[0028]
【発明の効果】以上の通り、請求項1の発明によれば、
重ね合せた絶縁基板の周辺部の一部を加圧して接着する
とともに、他の周辺部を加熱して接着しているため、絶
縁基板の位置のずれを防止でき、絶縁基板の中央部がた
るむのを軽減できるタッチパネルが得られる。As described above, according to the first aspect of the present invention,
Since a part of the peripheral portions of the superposed insulating substrates are pressed and bonded to each other and the other peripheral portions are heated and bonded, the displacement of the position of the insulating substrate can be prevented and the central portion of the insulating substrate sags. It is possible to obtain a touch panel that can reduce
【0029】また、請求項2の発明の製造方法によれ
ば、特に絶縁基板の周辺部の一部を加圧して接着した後
に、他の周辺部を加熱して接着しているため、製造工程
中の絶縁基板の位置づれを防止でき、より寸法精度の高
いタッチパネルが得られる。According to the manufacturing method of the second aspect of the present invention, in particular, after the peripheral portion of the insulating substrate is pressure-bonded and bonded, the other peripheral portion is heated and bonded. It is possible to prevent displacement of the insulating substrate inside, and to obtain a touch panel with higher dimensional accuracy.
【0030】さらに、本発明によれば、絶縁基板の周辺
部を別々の手段で接着しているため、一つの手段で接着
した後、内部のごみを取り出したり、電気的なプルーブ
を差し込んで電気的な検査ができ、より信頼性の高いタ
ッチパネルが得られる。Further, according to the present invention, since the peripheral portion of the insulating substrate is adhered by different means, after adhering by one means, the internal dust is taken out or an electric probe is inserted to generate electricity. It is possible to perform a physical inspection and obtain a touch panel with higher reliability.
【図1】本発明の実施例に用いる絶縁基板の平面図及び
実施例の断面図を示す。FIG. 1 shows a plan view of an insulating substrate used in an embodiment of the present invention and a sectional view of the embodiment.
【図2】本発明の他の実施例に用いる絶縁基板の平面図
及び実施例の断面図を示す。FIG. 2 shows a plan view of an insulating substrate used in another embodiment of the present invention and a sectional view of the embodiment.
1,20…第1の絶縁基板、 3,21…第1の電極、
8,24…第2の絶縁基板、 9,25…第2の電極、
12,23…両面テープ、 13,32…熱融着部材、
15,37…タッチパネル、 33…接着剤、 34…
第3の絶縁基板。1, 20 ... First insulating substrate, 3, 21 ... First electrode,
8, 24 ... Second insulating substrate, 9, 25 ... Second electrode,
12, 23 ... Double-sided tape, 13, 32 ... Thermal fusion bonding member,
15, 37 ... Touch panel, 33 ... Adhesive, 34 ...
Third insulating substrate.
Claims (2)
ね合せ、周辺部を接着したタッチパネルにおいて、周辺
部の一部を加圧して接着するとともにこの周辺部の他の
部分を加熱して接着していることを特徴とするタッチパ
ネル。1. In a touch panel in which insulating substrates having electrodes provided on their surfaces are superposed on each other and peripheral portions thereof are adhered, a part of the peripheral portions is pressed and adhered, and other portions of the peripheral portions are heated and adhered. A touch panel that is characterized by
ね合せ、周辺部を接着するタッチパネルの製造方法にお
いて、周辺部の一部を加圧して接着する工程と、この工
程後に前記周辺部の他の部分を加熱して接着する工程と
を行うことを特徴とするタッチパネルの製造方法。2. A method of manufacturing a touch panel, wherein insulating substrates having electrodes on their surfaces are superposed on each other and the peripheral portions are adhered to each other. A method of manufacturing a touch panel, which comprises performing a step of heating and adhering the other portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29916695A JPH09120745A (en) | 1995-10-24 | 1995-10-24 | Touch panel and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29916695A JPH09120745A (en) | 1995-10-24 | 1995-10-24 | Touch panel and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09120745A true JPH09120745A (en) | 1997-05-06 |
Family
ID=17868988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29916695A Pending JPH09120745A (en) | 1995-10-24 | 1995-10-24 | Touch panel and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09120745A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030094842A (en) * | 2002-06-08 | 2003-12-18 | 주식회사 에이터치 | Structure for getting signal in touch panel |
KR100482321B1 (en) * | 2001-12-27 | 2005-04-13 | 엘지.필립스 엘시디 주식회사 | Touch Panel and Fabricated Method Thereof |
JP2008506173A (en) * | 2004-07-06 | 2008-02-28 | ユーピーエム−キンメネ コーポレイション | Electric field detection sensor products |
KR101103736B1 (en) * | 2009-12-07 | 2012-01-11 | 엘지이노텍 주식회사 | Touch Panel Manufacturing Equipment |
JP5186496B2 (en) * | 2007-06-28 | 2013-04-17 | 京セラ株式会社 | Touch panel and touch panel display device |
-
1995
- 1995-10-24 JP JP29916695A patent/JPH09120745A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100482321B1 (en) * | 2001-12-27 | 2005-04-13 | 엘지.필립스 엘시디 주식회사 | Touch Panel and Fabricated Method Thereof |
KR20030094842A (en) * | 2002-06-08 | 2003-12-18 | 주식회사 에이터치 | Structure for getting signal in touch panel |
JP2008506173A (en) * | 2004-07-06 | 2008-02-28 | ユーピーエム−キンメネ コーポレイション | Electric field detection sensor products |
JP5186496B2 (en) * | 2007-06-28 | 2013-04-17 | 京セラ株式会社 | Touch panel and touch panel display device |
KR101103736B1 (en) * | 2009-12-07 | 2012-01-11 | 엘지이노텍 주식회사 | Touch Panel Manufacturing Equipment |
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