JPH09116274A - Package for packaging electronic parts, or the like - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for packaging electronic parts, etc., in which electronic parts can be packaged easily with a high space efficiency and with high connection reliability of connecting terminals and which can surely retain the electronic parts. SOLUTION: The inside of a package main body 1 having an opened top is formed in a housing section 11 and a recessed section 12 is provided in one end wall of the main body 1. In addition, an opening 13 is formed on the other end side so that a quartz oscillator 4 can be inserted into the main body 1. A projection 14a for stopper is protruded into the top opening of the main body 1. Two groove sections are formed on the bottom of the recessed section 12. A circuit pattern 2 for packaging for electrically connecting the recessed section 12, groove sections, and the bottom face of the main body 1 to each other is formed in such a shape that can prevent the electric short-circuiting of connecting terminals 4a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for mounting an electronic component such as a crystal oscillator, and more particularly to mounting an electronic component in which the outer shape of a sealed container is a body length. .

[0002]

2. Description of the Related Art As a first example of a state in which a crystal oscillator in which a crystal unit is sealed in a container is mounted on a printed circuit board, a crystal oscillator A uses a long-length sealed container as shown in FIG. In order to mount this crystal oscillator on the printed board P, the connection terminals a1,
a1 is inserted, and the tips of the connection terminals protruding on the back surface of the printed circuit board are fixed to the circuit pattern by soldering. In this example, the crystal oscillator A is mounted on the printed board P in a standing state. In the second conventional example, FIG.
As shown in Fig. 5, the crystal oscillator Aa is mounted on the printed circuit board in a lying state. In this case, the connection terminals a2, a
2 is first bent downward at a right angle, then further bent forward from the lower end of the crystal oscillator, and the bent tips of both connection terminals are applied to the circuit pattern of the printed circuit board by soldering or a conductive adhesive. Some are connected.

[0003]

However, since the crystal oscillator A is erected on the circuit board P in the first conventional example described above, space efficiency is poor, and in particular, as in recent years, the entire device is made thin. In the case of forming, the crystal oscillator A in this standing state becomes an obstacle to thinning. Further, in the second conventional example, not only it is necessary to bend the connection terminals a2 and a2, but even if the connection terminals a2 and a2 are mounted on the printed circuit board, the crystal oscillator can be moved up and down by an external force such as vibration during transportation. There is a risk of swinging in the direction, deformation of the connection terminal and sometimes peeling from the circuit pattern, and there is a problem that the connection state is unreliable.

Therefore, an object of the present invention is to provide a package for mounting electronic parts, etc., which has good space efficiency, high reliability of connection of connection terminals, easy mounting work of electronic parts, etc., and reliable holding of electronic parts. To provide.

[0005]

A feature of a packaging package for electronic parts and the like according to the present invention is that it comprises a package body and a packaging circuit pattern formed at one end of the package body. The main body has an upper end opening, and a groove portion for connecting a connection terminal such as an electronic component is formed on one side surface of the package body, and an opening for inserting an electronic component etc. is formed on the other side surface of the package body. The upper end opening of the package main body is provided with a stopper projection projecting inward, and the mounting circuit pattern connects the groove portion and the bottom surface of the package main body and is connected. It is in a shape that prevents electrical short circuits such as terminals.

Another feature of the present invention is that a recess is formed on one side surface of the package body, and the groove for connecting a connection terminal of the electronic component or the like is formed on the upper surface of the recess. Where it is.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, a package body (hereinafter referred to as a body) 1 and one end portion of this body are formed. And a circuit pattern 2 for mounting.

The body 1 is injection-molded from a liquid crystal polymer, and as well known, there are aromatic polyester liquid crystal polymer and thermoplastic crystalline polyester resin as the liquid crystal polymer. Other than the liquid crystal polymer, it is also possible to use non-crystalline polyetherimide. The main body 1 is in the shape of a horizontally long box as a whole, the upper end of which is open, and the inside is a storage portion 11 for electronic components. This storage portion stores electronic components, for example, a crystal oscillator 4 described later. The bottom surface of this storage portion has an arc shape corresponding to the outer shape of the sealed container. One side of the main body 1 (lower left side of FIG. 1)
Has a concave portion 12 formed on its side wall, and the other side surface (upper right side) of the main body has an opening 13 of a size into which the crystal oscillator 4 can be inserted. , The projection 1 for the stopper facing inward in the facing positional relationship
4a and 14a are projected.

On the upper surface of the bottom surface of the concave portion 12, two connecting groove portions 12a for connecting connecting terminals such as electronic parts are provided.
12a are formed at a predetermined interval, and the bottom surfaces of the both groove portions are semi-circular.

On the side surface of the accommodating portion 11, there are through holes 15a, 15 at positions corresponding to the stopper projections 14a, 14a.
Although a is open, this through hole is formed by the insert for forming this stopper projection at the time of injection molding.

Because of the shape of the main body 1 as described above, the mold for injection molding the main body can be molded only by moving in the vertical direction, and the structure of the mold is simple.

The mounting circuit pattern 2 is plated with the recess 12 and the connecting grooves 12a, 12a formed on the bottom surface of the recess and the bottom surface 1a of the main body 1 so as to be electrically conductive. In order to prevent an electrical short circuit between the connection terminals 4a, 4a, this plating separates the grooves, and further, as shown in FIG. 2, the bottom surface 1a is separated into two circuit patterns 2a, 2a and plated. I am doing it.

The other end of the main body 1 is also plated to form fixing electrodes 3a, 3a.

Now, the plating process of the mounting circuit pattern 2a and the fixing electrode 3a will be described. The main body 1 is made of liquid crystal polymer and is etched with alkali, which is caustic soda or caustic potash to a predetermined concentration. The dissolved alkaline aqueous solution is heated to a predetermined temperature, and the main body is immersed in this aqueous solution for a predetermined time. After drying, a plating resist is applied to the parts other than the mounting circuit pattern 2a and the fixing electrode 3a and dried to form a resist film,
A catalyst for electroless plating is applied to the etched surface other than the resist film. Then, the catalyst-applied surface, that is, the surface to be the mounting circuit pattern 2a and the fixing electrode 3a is electroless plated with copper.

Therefore, in order to mount the crystal oscillator on the printed circuit board, as shown in FIG. 3, the crystal oscillator 4 is inserted into the housing portion 11 of the main body 1 through the opening 13 and the connection terminals 4a and 4a of the crystal oscillator are provided. Is aligned with the plated connecting grooves 12a of the recess 12 and fitted, and fixed with solder. The height of the connection groove portions 12a, 12a from the bottom surface of the housing portion 11 corresponds to the positions of the connection terminals 4a, 4a of the crystal oscillator 4, that is, the radius of the crystal oscillator. Then, the main body 1 is mounted on the circuit pattern 5a of the printed circuit board by fixing the mounting circuit pattern 2a formed on the back surface of the main body 1 shown in FIG. 2 with a conductive adhesive or solder. At the same time, the fixing electrode 3a is also fixed to the fixing circuit pattern 5b of the printed circuit board with a conductive adhesive or solder to make the mounting of the main body 1 on the circuit board stronger. The work of fixing with this conductive adhesive or solder,
Since the connecting groove portion 12a is provided in the concave portion 12, the space of the concave portion can be utilized and workability is good. Further, even if the crystal oscillator 4 is mounted on the main body 1 and is subjected to vibration during transportation, it is safely held by the stopper projection 14a.

Next, another embodiment will be described with reference to FIGS. 4 to 6. The main body 6 has a box shape as a whole, an upper end thereof is open, and an inside is a storage portion 61 for electronic components. . On one side surface (lower right side in FIG. 4) of the main body 1 are formed three groove portions 62a for connecting connection terminals such as electronic parts.
.. are formed at a predetermined interval, and the bottom shape of this groove is semi-circular. The other side surface (upper left side) of the main body 6 has an opening 63 into which an electronic component or the like can be inserted. On both sides of the upper end opening of the main body 6, stopper projections 64a, 64a are provided so as to project inward in a facing positional relationship. In addition, a stopper protrusion 64 is provided on the side surface of the storage portion 61.
Through holes 65a, 65a are opened at the portions corresponding to a, 64a, and these through holes are formed by a nest for forming the stopper projection at the time of injection molding.
Therefore, also in this embodiment, the main body 6 can be injection-molded by moving the mold only in the vertical direction.

The mounting circuit patterns 7a ... Are plated for electrical connection between the connection grooves 62a, 62a and the bottom surface 6a of the main body 6, and are plated to prevent electrical short-circuiting of connection terminals and the like. The grooves are separated from each other, and the bottom surface is separated into three parts as shown in FIG.

The other end of the body 6 is also plated to form a fixing electrode 8.

Here, the plating process of the mounting circuit pattern 7a and the fixing electrode 8 is the same as that described above.

Therefore, in order to mount the crystal oscillator 9 on the printed circuit board, as shown in FIG. 6, the crystal oscillator is inserted into the housing portion 61 of the main body 6 through the opening 63, and the three crystal oscillators are connected. The terminals 9a ... Are fitted into the plated connection groove portions 62a and fixed with solder. The ground terminal is located at the center of the connection terminal 9a. Then, the main body 6 is fixed to the circuit pattern 10a of the printed circuit board, and the mounting circuit pattern 7a formed on the back surface 6a of the main body 6 shown in FIG. 6 is fixed with a conductive adhesive or solder to mount.

[0021]

EFFECTS OF THE INVENTION According to the present invention, the work of mounting electronic parts on a circuit board is simple, and the space efficiency is improved as compared with the conventional electronic parts mounted in a standing state. Since the electronic components are reliably mounted on the circuit board, the connection is highly reliable, and the electronic components are securely held by the package body by the stopper projections.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main body.

FIG. 2 is a perspective view of the main body as viewed from the back side.

FIG. 3 is a perspective view showing a state where electronic components are mounted on a circuit board.

FIG. 4 is a perspective view of a main body according to another embodiment.

FIG. 5 is a perspective view of a main body according to another embodiment as viewed from the back side.

FIG. 6 is a perspective view showing a state in which an electronic component according to another embodiment is mounted on a circuit board.

FIG. 7 is a cross-sectional view showing a first conventional example.

FIG. 8 is a perspective view showing a second conventional example.

[Explanation of symbols]

 1 Package Main Body 1a Back Side of Package Main Body 11 Storage Section 12 Recess 12a Groove 13 Insertion Opening 14a Stopper Protrusion 2 Mounting Circuit Pattern 4 Electronic Component (Crystal Oscillator) 4a Connection Terminal 5a Circuit Pattern 6 Package Main Body 6a Back Side of Package Main Body 61 Storage part 62a Groove part 63 Insertion opening 64a Stopper protrusion 7a Mounting circuit pattern 9 Electronic component (crystal oscillator) 9a Connection terminal 10a Circuit pattern

Claims (2)

[Claims] 1. A package main body and a mounting circuit pattern formed at one end of the package main body, wherein the package main body has an upper end opening, and an electronic component or the like is provided on one side surface of the package main body. Groove is formed for connecting the connection terminals of the package body, and an opening for inserting an electronic component or the like is formed on the other side surface of the package body. An electronic component characterized in that a projection is provided, and the mounting circuit pattern electrically connects the groove and the bottom surface of the package body, and has a shape that prevents an electrical short circuit such as a connection terminal. Package for mounting such as. 2. The recess according to claim 1, wherein a recess is formed on one side surface of the package body, and the groove is formed on an upper surface of the recess for connecting a connection terminal such as the electronic component. Package for mounting electronic parts etc.