JPH09113537A - Vertical operation type probe card - Google Patents

Abstract

(57) [Abstract] [Purpose] Suitable for high-speed operation tests and avoiding problems with the mechanical strength of the substrate. A probe card for measuring electrical characteristics of an LSI chip 610 which is an object to be measured, in which a probe 100 whose contact portion 110 at the tip contacts an electrode pad 611 of the LSI chip 610, and a probe 100 in a vertical direction A support part 200 that supports the probe 1 so that the probe 1 is movable.
00 and the substrate 300 having a conductive pattern electrically connected to the connection portion 120 at the rear end thereof, the probe 100 is connected to the conductive pattern of the substrate 300 at a position corresponding to directly above the electrode pad 611 to be contacted. The substrate 300 is subjected to characteristic impedance matching.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vertical probe card used for measuring various electrical characteristics of an LSI chip or the like which is an object to be measured.

[0002]

2. Description of the Related Art In a conventional vertical operation type probe card of this type, as shown in FIG. 3, a probe 100 is arranged vertically to an LSI chip 610. In such a vertical probe card, a probe 100 having a curved portion 130 formed in the middle abdomen and a conductive pattern (not shown) to which a connecting portion 120 which is the rear end of the probe 100 is connected by soldering or the like are formed. The substrate 300 and the probe 10
And a support portion 200 that vertically supports 0.

In such a vertical probe card, the contact portion 110, which is the tip of the probe 100, has the LSI chip 61.
Since it makes contact with the electrode pad 611 of No. 0 from the vertical direction, even if overdrive is applied (the wafer mounting table 700 is raised even after the contact portion 110 of the probe 100 comes into contact with the electrode pad 611). Part 11
There is an advantage that the position of 0 is hard to shift and the probe 100 surely contacts the electrode pad 611. As a result, there is an effect that the contact portion 110 is less worn and has a longer life.

When the contact portion 110 of the probe 100 comes into contact with the electrode pad 611 and overdrive is applied to the probe 100, the bending portion 130 bends to secure a predetermined contact pressure.

The supporting portion 200 is provided on the back surface 3 of the substrate 300.
Support leg 210 hung from 30 and this support leg 2
Upper support plate 220 and lower support plate 23 attached to
0 and a probe fixing member 240 attached to the upper surface 222 of the upper support plate 220.

The upper support plate 220 and the lower support plate 230 include
Through holes 221 and 231 through which the probe 100 penetrates are opened, respectively.

Further, the substrate 300 is provided with an opening 340. This opening 340 has a plurality of probes 1
00 passes through, and the rear end of the probe 100 passing through the opening 340 is curved to connect the connecting portion 120 to the conductive pattern of the substrate 300.

[0008]

However, in the conventional vertically actuated probe card, as shown in FIG. 3, the probe 100 passing through the opening 340 of the substrate 300 tends to be long. If the probe 100 becomes longer, the LSI
This hinders the high-speed operation test of the chip 610.

Further, an opening 340 provided in the substrate 300
Needs to be increased as the area (probe area) where the electrode pad 611 of the LSI chip 610 is arranged is increased. Therefore, LS with a large probe area
The mechanical strength of the substrate 300 of the vertically actuated probe card used when measuring the electrical writing characteristics of the I-chip 610 tends to decrease. Therefore, if used for a long period of time, there is a problem that accurate measurement becomes difficult due to the deformation of the substrate 300.

Further, it is necessary to mount electronic components such as a relay, a capacitor, or a diode, which form a part of the measurement circuit, on the substrate 300, but since the opening 340 is opened in the central portion of the substrate 300. Inevitably, electronic components must be mounted on the peripheral portion of the substrate 300. For this reason, the wiring connecting the electronic components tends to be long. Therefore, the high-speed operation test is hindered.

The present invention was devised in view of the above circumstances, and an object thereof is to provide a vertical operation type probe card suitable for a high speed operation test and having no problem in mechanical strength of a substrate.

[0012]

A vertically actuated probe card according to a first aspect of the present invention is a probe card for measuring electrical characteristics of an object to be measured, wherein a contact portion at a tip is an electrode pad of the object to be measured. A probe that comes into contact, a support portion that supports the probe so as to be movable only in the vertical direction, and a substrate having a conductive pattern that is electrically connected to the connection portion at the rear end of the probe, and the probe, It is connected to the conductive pattern of the substrate at a position just above the electrode pad to be contacted, and the substrate is subjected to characteristic impedance matching.

Further, the substrate of the vertically actuated probe card according to the second aspect of the invention is closed at a position directly above the object to be measured.

Further, a component mounting board for mounting an electronic component is provided on the substrate of the vertical operation type probe card according to claim 3, and the electronic component mounted on the component mounting board is: It is mounted directly above the probe to be connected.

[0015]

1 is a schematic sectional view of a vertically actuated probe card according to a first embodiment of the present invention, FIG.
FIG. 6 is a schematic sectional view of a vertically actuated probe card according to a second embodiment of the present invention. It is to be noted that parts and the like that are substantially the same as those of the related art are denoted by the same reference numerals and described.

The vertical operation type probe card according to the first embodiment is a probe card for measuring various electrical characteristics of an LSI chip 610 which is an object to be measured, and the contact portion 110 at the tip is the LSI chip 610. Electrode pad 611
A probe 100 that contacts the probe 100, a support part 200 that supports the probe 100 so as to be movable only in the vertical direction, and a conductive pattern (not shown) electrically connected to the connection part 120 at the rear end of the probe 100. The probe 100 is connected to the conductive pattern of the substrate 300 at a position directly above the electrode pad 611 to be contacted, and the substrate 300 is subjected to characteristic impedance matching.

First, a predetermined conductive pattern is formed on the substrate 300, and characteristic impedance matching is performed between the conductive pattern and the probe 100 connected thereto.

In addition, the conductive pattern connection portion 310,
That is, the portion to which the connecting portion 120 of the probe 100 is connected is provided at a position corresponding to directly above the electrode pad 611 to which the connected probe 100 is to be brought into contact. That is, the connection unit 310 is an LSI whose electrical characteristics are to be measured.
It is provided according to the arrangement position of the electrode pad 611 of the chip 610.

The substrate 300 is provided with a through hole 320 for reaching the connection portion 310 of the conductive pattern. Therefore, the connection part 120 of the probe 100 is inserted into the through hole 320 and the connection part 310 of the conductive pattern is inserted.
Will be connected.

The probe 100 is made of a conductive metal such as tungsten, and its tip is sharpened as a contact portion 110. Further, the rear end of the probe 100 is a connecting portion 120.

In addition, the middle part of the probe 100,
Specifically, when attached to the substrate 300, a substantially V-shaped curved portion 130 is formed in a portion located between the upper support plate 220 and the lower support plate 230 of the support part 200. The bending portion 130 bends when overdrive is applied, and applies a predetermined contact pressure to the electrode pad 611.

The length dimension of the probe 100, that is, the length dimension from the contact portion 110 to the connecting portion 120 is such that the connecting portion 120 of the probe is connected to the connecting portion 310 formed on the substrate 300 by soldering or the like. When the probe 100 is supported by the supporting part 200 attached to the contact part 1,
10 is set to project from the lower support plate 230 of the support part 200.

Further, the supporting part 200 is a substrate 300.
A support leg portion 210 hung from the back surface 330, an upper support plate 220 and a lower support plate 230 attached to the support leg portion 210, and a probe fixing member 240 attached to the upper surface 222 of the upper support plate 220. doing.

The upper support plate 220 and the lower support plate 230 include:
Through holes 221 and 231 through which the probe 100 penetrates are opened, respectively. When the through holes 221 and 231 of both the support plates 220 and 230 are attached to the support leg portion 210, they are located on the same straight line as the through holes 320 of the substrate 300.

Further, between the upper support plate 220 and the lower support plate 230, the curved portion 130 of the probe 100 mounted at a predetermined position on the substrate 300 may be located between the both support plates 220, 230. The dimensions are set like this.

The probe fixing member 240 attached to the upper surface 222 of the upper supporting plate 220 is a material having insulating properties and flexibility such as silicon rubber, is attached to the substrate 300, and penetrates both supporting plates 220 and 230. Holes 221, 2
The probe 100 penetrating 31 is fixed.

Without the probe fixing member 240, when an overdrive is applied, an upward force is applied to the connecting portion 120 of the probe 100 and the connecting portion 310 of the conductive pattern connected to the connecting portion 120, 310. There is a risk that the solder that connects to will peel off. However, since the probe fixing member 240 absorbs the force applied upward to the probe 100 to some extent, the risk of peeling of the solder is reduced.

As described above, since the probe 100 is supported by the supporting portion 200, it is movably supported only in the vertical direction, that is, the vertical direction.

In the probe 100, since the contact portion 110 at the front end and the connecting portion 120 at the rear end are on the same straight line (excluding the curved portion 130), the conductive pattern formed on the substrate 300 and the electrode pad 611 are connected to each other. The distance between can be minimized.

According to the vertically actuated probe card constructed as described above, the contact portion 110 of the probe 100 is
When overdrive is applied after contacting the electrode pad 611 of the SI chip 610, the bending portion 1 of the probe 100
As the probe 30 bends, the probe 100 and the electrode pad 6
A predetermined contact pressure can be secured between the probe 100 and the contact portion 110 of the probe 100.
No slippage with respect to 1 and no displacement occurs.

Further, since the conductive pattern of the substrate 300 and the probe 100 are matched with each other in characteristic impedance, it is possible to cope with a high speed operation test of the LSI chip 610.

Further, unlike the conventional vertical operation type probe card, since the substrate 300 is not provided with a large opening, the mechanical strength of the substrate 300, that is, the vertical operation type probe card is high. .

Next, a vertical operation type probe card according to the second embodiment will be described with reference to FIG. The vertical operation type probe card according to the second embodiment is different from the vertical operation type probe card according to the first embodiment in that a component mounting substrate 400 for mounting an electronic component 500 on a substrate 300. Is provided.

The vertical operation type probe card according to the second embodiment is a probe card for measuring various electrical characteristics of the LSI chip 610 which is the object of measurement, and the contact portion 110 at the tip is the LSI chip 610. Electrode pad 611
A probe 100A, 100B that contacts the probe 100A, a support part 200 that supports the probe 100A, 100B movably only in the vertical direction, and a conductive pattern that is electrically connected to the connection part 120A at the rear end of the probe 100A. The substrate 300 and the substrate 300 is located on the
The component mounting substrate 400 on which the electronic component 500 is mounted is provided, and the probes 100A and 100B are disposed on the substrate 300 at positions corresponding to directly above the electrode pads 611 to be contacted.
Connected to the conductive pattern, the substrate 300 is subjected to characteristic impedance matching, and the electronic component 500 is mounted right above the probe 100B to be connected.

An electronic component 500 such as a relay, a condenser or a diode is mounted at a predetermined position on the component mounting board 400. A predetermined conductive pattern (not shown) is formed on the component mounting board 400. Leads (not shown) of the electronic component 500 are connected to the conductive pattern.

Further, the component mounting board 400 includes:
A through hole 460 through which the rear end side of the probe 100B penetrates,
Through hole 4 through which connection lead 550 for connecting the conductive pattern of substrate 300 and the lead of electronic component 500 penetrates
70 etc. have been opened. The component mounting board 4
At a predetermined position of 00, a connection pin opening 410 into which a connection pin 420 described below is inserted is opened.

The component mounting substrate 400 is the substrate 30.
It is attached at a predetermined interval on top of 0. The component mounting substrate 400 is mounted on the substrate 300 by connecting pins 420 erected on the substrate 300, flanges 430 attached to the connecting pins 420, and nuts screwed to the connecting pins 420. 440.

When the connection pin 420 to which the flange 430 is attached is inserted into the connection pin opening 410, the component mounting board 400 is supported by the flange 430. At this time, the connection pin 420 projects from the connection pin opening 410 by an amount enough for the nut 440 to be screwed. When the nut 440 is screwed onto the connection pin 420, the component mounting board 400 is mounted on the board 300 with a predetermined gap in a state of being sandwiched between the flange 430 and the nut 440. .

The vertically actuated probe card according to the second embodiment has two types of probes 100A,
100B is used. That is, the probe 100A
Is the same as the probe 100 in the first embodiment, and the rear end connecting portion 120A is connected to the connecting portion 310 of the conductive pattern of the substrate 300 by soldering or the like. The connection portion 120B at the rear end is directly connected to the lead of the electronic component 500 mounted on the component mounting board 400.

That is, the probe 100B includes the substrate 30.
The through hole 320 opened at 0 and the through hole 460 opened at the board mounting substrate 400 are also directly connected to the leads of the electronic component 500 by the connecting portion 120B.

On the substrate 300, the LSI chip 61 is also provided.
Tester for measuring electrical characteristics of 0 (not shown)
A ground plane 370 connected to the ground. It is also possible to connect the ground surface 370 to the ground of the LSI chip 610 via a relay as the electronic component 500. Such a configuration is shown in FIG.

According to the vertically actuated probe card having the above-described structure, when overdrive is added, as in the vertically actuated probe card according to the first embodiment,
A predetermined contact pressure can be secured between the probe 100 and the electrode pad 611, and the contact portion 110 of the probe 100 does not slip with respect to the electrode pad 611, so that no positional displacement occurs. Further, since the characteristic impedance matching is performed between the conductive pattern of the substrate 300 and the probe 100, it is possible to support a high speed operation test of the LSI chip 610. Further, unlike the conventional vertical operation type probe card, since the substrate 300 is not provided with a large opening, the mechanical strength of the substrate 300, that is, the vertical operation type probe card is high.

Further, according to the vertically actuated probe card according to the second embodiment, the electronic component 500 is not mounted on the substrate 300, but the electronic component 500 is mounted on the component mounting substrate 400. , Probe 100B
Since the distance between the electronic component 500 and the electronic component 500 is shorter than that of the conventional vertical operation type probe card, it is more suitable for the high speed operation test of the LSI chip 610.

[0044]

The vertical actuation type probe card according to claim 1 is a probe card for measuring electrical characteristics of an object to be measured, in which the contact portion at the tip contacts the electrode pad of the object to be measured. An electrode to be contacted, the supporting part supporting the probe so as to be movable only in a vertical direction, and the substrate having a conductive pattern electrically connected to the connecting part at the rear end of the probe. It is connected to the conductive pattern of the board at a position corresponding to just above the pad,
The substrate is subjected to characteristic impedance matching.

Therefore, according to this vertical operation type probe card, when the contact portion of the probe contacts the electrode pad of the LSI chip and then overdrive is applied, the probe bends to cause a predetermined distance between the probe and the electrode pad. The contact pressure of the probe can be secured, and the contact portion of the probe does not slip with respect to the electrode pad, and the positional displacement does not occur.

Further, since the probe is constructed to be short by the conventional vertical operation type probe card, the LSI
It is possible to support high-speed operation tests of chips. Further, the characteristic impedance matching between the conductive pattern of the substrate and the probe is also one of the reasons that it becomes possible to cope with the high speed operation test of the LSI chip.

Further, since the substrate of the vertically actuated probe card according to claim 2 is closed at a position corresponding to directly above the LSI chip, the conventional vertical structure in which the portion directly above the LSI chip is an opening. Since the mechanical strength is higher than that of the actuating probe card, the life of the vertically actuating probe card that is repeatedly used can be extended.

Furthermore, a component mounting board for mounting an electronic component is provided on the substrate in the vertically actuated probe card according to claim 3, and the electronic component mounted on the component mounting board is: It is mounted directly above the probe to be connected.

Therefore, since the probe to be connected to the electronic component is directly connected to the electronic component, it is possible to omit an extra transmission path such as a conductive pattern formed on a substrate or the like as in the conventional case, so that the probe operates at high speed. More suitable for testing.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view of a vertically actuated probe card according to a first embodiment of the present invention.

FIG. 2 is a schematic sectional view of a vertically actuated probe card according to a second embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view of a conventional vertically actuated probe card.

[Explanation of symbols]

 100 probe 110 contact part 120 connection part 200 support part 300 substrate 610 LSI chip 611 electrode pad

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Masao Okubo 2-5-13 Nishi-Nagasu-cho Amagasaki City, Hyogo Prefecture Nihon Electronic Materials Co., Ltd. (72) Teruhisa Sakata 2-chome Nishi-Nagasu-cho Amagasaki City, Hyogo Prefecture 5-13 No. Nihon Electronic Materials Co., Ltd. (72) Inventor Keiji Matsuoka 2-5-13 Nishi-Nagasu-cho Amagasaki City, Hyogo Prefecture Nihon Electronic Materials Co., Ltd.

Claims (3)

[Claims] 1. A probe card for measuring electrical characteristics of an object to be measured, a probe having a contact portion at a tip contacting an electrode pad of the object to be measured, and a support for movably supporting the probe only in a vertical direction. And a substrate having a conductive pattern electrically connected to the connection portion at the rear end of the probe, wherein the probe has a conductive pattern on the substrate at a position corresponding to directly above the electrode pad to be contacted. A vertical actuation type probe card, wherein the substrate is connected to the substrate and characteristic impedance matching is applied to the substrate. 2. The vertically actuated probe card according to claim 1, wherein the substrate is closed at a position directly above the object to be measured. 3. A component mounting substrate for mounting an electronic component is provided on the substrate, and the electronic component mounted on the component mounting substrate is mounted right above a probe to be connected. The vertically actuated probe card according to claim 1, wherein the probe card is a vertically actuated probe card.