JPH0890280A - Low melting alloy brazing filler metal - Google Patents
Low melting alloy brazing filler metalInfo
- Publication number
- JPH0890280A JPH0890280A JP24727494A JP24727494A JPH0890280A JP H0890280 A JPH0890280 A JP H0890280A JP 24727494 A JP24727494 A JP 24727494A JP 24727494 A JP24727494 A JP 24727494A JP H0890280 A JPH0890280 A JP H0890280A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- low melting
- alloy brazing
- brazing filler
- filler metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 71
- 229910052751 metal Inorganic materials 0.000 title abstract description 22
- 239000002184 metal Substances 0.000 title abstract description 22
- 239000000945 filler Substances 0.000 title abstract description 21
- 229910000743 fusible alloy Inorganic materials 0.000 title abstract 3
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 9
- 229910052738 indium Inorganic materials 0.000 claims abstract description 9
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 7
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 6
- 229910052796 boron Inorganic materials 0.000 claims abstract description 6
- 239000012535 impurity Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 35
- 229910001020 Au alloy Inorganic materials 0.000 claims description 29
- 239000003353 gold alloy Substances 0.000 claims description 28
- 230000008018 melting Effects 0.000 claims description 26
- 238000002844 melting Methods 0.000 claims description 26
- 239000010931 gold Substances 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 6
- 235000019646 color tone Nutrition 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 18
- 229910052737 gold Inorganic materials 0.000 description 18
- 150000002739 metals Chemical class 0.000 description 9
- 230000005496 eutectics Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 239000008188 pellet Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Landscapes
- Adornments (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、黄金色を有し、ろう
付け時の濡れ性が良好でかつ融点が４００℃以下である
低融点金合金ろう材に関するものであり、この低融点金
合金ろう材は、特に、２４Ｋ硬化金製装飾品をろう付け
するためのろう材として有効であるが、その用途はこれ
にのみ限定されるものではない。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a low melting point gold alloy brazing material having a golden color, having good wettability during brazing and having a melting point of 400 ° C. or lower. The brazing material is particularly effective as a brazing material for brazing 24K hardened gold ornaments, but its use is not limited to this.
【０００２】[0002]
【従来の技術】従来、ネックレス、ブレスレット、ブロ
ーチなどの金装飾品を製造するには、純金にＡｇ、Ｃ
ｕ、Ｎｉ、Ｐｄ、Ｚｎなどを２５〜４０％含有させた１
４Ｋ金合金や１８Ｋ金合金などが用いられているが、近
年、純金装飾品と称して２４Ｋ硬化純金からなるネック
レス、ブレスレット、ブローチが市販されるようになっ
てきた。これら２４Ｋ硬化純金製装飾品もろう付けによ
り作製されるため各種のろう材が使用されている。2. Description of the Related Art Conventionally, to produce gold ornaments such as necklaces, bracelets, and broaches, pure gold has to be made of Ag and C.
25% to 40% of u, Ni, Pd, Zn, etc. contained 1
Although 4K gold alloys and 18K gold alloys are used, in recent years, necklaces, bracelets, and broaches made of 24K hardened pure gold have been put on the market as pure gold ornaments. Since these 24K hardened pure gold ornaments are also produced by brazing, various brazing materials are used.
【０００３】これら２４Ｋ硬化純金製装飾品をろう付け
するためのろう材としては、１４Ｋ金ろう材（Ａｇ：１
１．０％、Ｃｕ：１４．７％、Ｇａ：１．０％、Ｉｎ：
１０．７％、Ｚｎ：２．６％、残部：Ａｕ）、１８Ｋろ
う材（Ａｇ：１．２％、Ｃｕ：１５％、Ｇａ：２．５
％、Ｉｎ：５．８％、残部：Ａｕ）、Ａｕ−３．１４％
Ｓｉ共晶ろう材、Ａｕ−２０％Ｓｎ共晶ろう材などが知
られている。As a brazing material for brazing these 24K hardened pure gold ornaments, 14K gold brazing material (Ag: 1
1.0%, Cu: 14.7%, Ga: 1.0%, In:
10.7%, Zn: 2.6%, balance: Au, 18K brazing filler metal (Ag: 1.2%, Cu: 15%, Ga: 2.5)
%, In: 5.8%, balance: Au), Au-3.14%
Si eutectic brazing filler metal, Au-20% Sn eutectic brazing filler metal and the like are known.
【０００４】[0004]
【発明が解決しようとする課題】ところが、２４Ｋ硬化
純金製装飾品はろう付け温度が４５０℃以上であると軟
化し、硬さが不足して装飾品として使用できなくなる。
したがって、融点が６００℃以上である１４Ｋ金ろう材
（融点：６７０℃）および１８Ｋ金ろう材（融点：７３
０℃）は２４Ｋ純金製装飾品のろう付けに使用すること
ができない。However, if the brazing temperature is 450 ° C. or higher, the 24K hardened pure gold ornament softens and becomes insufficient in hardness, so that it cannot be used as an ornament.
Therefore, a 14K gold brazing material (melting point: 670 ° C) and an 18K gold brazing material (melting point: 73) having a melting point of 600 ° C or higher.
0 ° C) cannot be used for brazing 24K pure gold ornaments.
【０００５】そのため、２４Ｋ純金装飾品のろう付けに
はＡｕ−３．１４％Ｓｉ共晶ろう材（融点：３６５℃）
またはＡｕ−２０％Ｓｎ共晶ろう材（融点：２８０℃）
を主に使用するが、Ａｕ−３．１４％Ｓｉ共晶ろう材は
濡れ性が悪いため細かい装飾品のろう付けには適さず、
一方、Ａｕ−２０％Ｓｎ共晶ろう材は色合いが白色であ
るために、ろう付け部を黄金色に見せるため、ろう付け
部に金メッキを施す必要があるなどの煩わしさがあっ
た。Therefore, for brazing 24K pure gold ornaments, Au-3.14% Si eutectic brazing material (melting point: 365 ° C.)
Or Au-20% Sn eutectic brazing material (melting point: 280 ° C)
However, since Au-3.14% Si eutectic brazing material has poor wettability, it is not suitable for brazing of fine ornaments.
On the other hand, since the Au-20% Sn eutectic brazing material has a white tint, the brazing part looks golden and therefore the brazing part needs to be plated with gold.
【０００６】[0006]
【課題を解決するための手段】そこで、本発明者等は、
かかる観点から、融点が４５０℃以下であり、色合いが
黄金色を有し、かつ濡れ性に優れた金合金ろう材を得る
べく研究を行った結果、（ａ）重量％で、Ｓｉ：２〜１
０％、ＢｉおよびＩｎの内の１種以上：１〜１０％を含
有し、残りがＡｕおよび不可避不純物からなる組成を有
する低融点金合金ろう材は、融点が４００℃以下であ
り、色合いが黄金色を呈し、かつ濡れ性に優れている、
（ｂ）前記（ａ）の低融点金合金ろう材において、希土
類元素、Ｂ、Ａｌの内の１種または２種以上を：１０〜
２０００ｐｐｍを含有させると、濡れ性が一層向上す
る、という知見を得たのである。Therefore, the present inventors have
From this point of view, as a result of conducting research to obtain a gold alloy brazing material having a melting point of 450 ° C. or less, a golden color tone, and excellent wettability, (a) wt%, Si: 2 to 1
A low melting point gold alloy brazing material having a composition of 0%, 1 or more of Bi and In: 1 to 10%, and the balance of Au and unavoidable impurities has a melting point of 400 ° C. or less and a tint. Has a golden color and excellent wettability,
(B) In the low melting point gold alloy brazing material of (a) above, one or more of rare earth elements, B and Al are used: 10
We have found that the inclusion of 2000 ppm further improves the wettability.
【０００７】この発明は、かかる知見にもとづいてなさ
れたものであって、（１）重量％で、Ｓｉ：２〜１０
％、ＢｉおよびＩｎの内の１種以上：１〜１０％を含有
し、残りがＡｕおよび不可避不純物からなる組成を有す
る低融点金合金ろう材、並びに、（２）前記（１）の低
融点金合金ろう材において、さらに希土類元素、Ｂ、Ａ
ｌの内の１種または２種以上を：１０〜２０００ｐｐｍ
を含有する低融点金合金ろう材、に特徴を有するもので
ある。The present invention has been made on the basis of such findings, and (1) wt% Si: 2 to 10
%, Bi and In, at least one of: 1 to 10%, and a low melting point gold alloy brazing material having a composition of Au and unavoidable impurities, and (2) the low melting point of (1) above. In the gold alloy brazing material, further rare earth elements, B, A
1 or 2 or more of 1: 10 to 2000 ppm
And a low melting point gold alloy brazing filler metal containing.
【０００８】この発明の低融点金合金ろう材を製造する
には、所定割合の組成の合金を真空雰囲気、不活性ガス
雰囲気または還元性ガス雰囲気中にて溶解し、鋳造して
インゴットを製造し、それぞれの目的および用途に応
じ、圧延加工したりアトマイズしたりして製造する。In order to manufacture the low melting point gold alloy brazing material of the present invention, an alloy having a predetermined composition is melted in a vacuum atmosphere, an inert gas atmosphere or a reducing gas atmosphere and cast to manufacture an ingot. According to each purpose and use, it is manufactured by rolling or atomizing.
【０００９】つぎに、この発明の低融点金合金ろう材の
成分組成を上記の如く限定した理由を説明する。 （１） Ｓｉ この発明の低融点金合金ろう材において、Ｓｉ含有量が
２％未満および１０％を越えて含有すると、ろう材の融
点が高くなるのでろう付け温度が上昇し好ましくない。
したがって、Ｓｉ含有量を２〜１０％に定めた。Ｓｉ含
有量の一層好ましい範囲は２〜６％である。Next, the reason why the composition of the low melting point gold alloy brazing material of the present invention is limited as described above will be explained. (1) Si In the low melting point gold alloy brazing material of the present invention, if the Si content is less than 2% or more than 10%, the melting point of the brazing material becomes high and the brazing temperature rises, which is not preferable.
Therefore, the Si content is set to 2 to 10%. A more preferable range of Si content is 2 to 6%.
【００１０】（２） Ｂｉ、Ｉｎ これら成分は、ろう材の濡れ性を向上させるために添加
される成分であるが、１％未満ではろう材の濡れ性が十
分でなく、一方、１０％を越えて添加すると色合いが白
色となるので好ましくない。したがって、ＢｉおよびＩ
ｎの内の１種以上：１〜１０％に定めた。ＢｉおよびＩ
ｎの内の１種以上の一層好ましい範囲は３〜１０％であ
る。(2) Bi, In These components are components added in order to improve the wettability of the brazing material, but if the content is less than 1%, the wettability of the brazing material is not sufficient, while 10% is added. If added in excess, the color tone becomes white, which is not preferable. Therefore Bi and I
One or more of n are set to 1 to 10%. Bi and I
The more preferable range of one or more of n is 3 to 10%.
【００１１】（３） 希土類元素、Ｂ、Ａｌ これら成分は、ろう材の濡れ性を一層向上させるために
添加される成分であるが、１０ｐｐｍ未満ではろう材の
濡れ性の一層の改善は見られず、一方、２０００ｐｐｍ
を越えて添加すると、ろう材の濡れ性の一層の改善せは
見られず、かえって、ろう材の融点が上昇するので好ま
しくない。したがって、希土類元素、Ｂ、Ａｌの内の１
種以上：１０〜２０００ｐｐｍに定めた。希土類元素、
Ｂ、Ａｌの内の１種以上の一層好ましい範囲は１０〜１
５００ｐｐｍである。(3) Rare earth element, B, Al These components are components added to further improve the wettability of the brazing filler metal, but if the content is less than 10 ppm, the wettability of the brazing filler metal is further improved. No, on the other hand, 2000 ppm
If it is added over the range, no further improvement in the wettability of the brazing material is seen, and the melting point of the brazing material rises, which is not preferable. Therefore, one of rare earth elements, B and Al
Species or higher: 10 to 2000 ppm. Rare earth elements,
A more preferable range of at least one of B and Al is 10 to 1.
It is 500 ppm.
【００１２】[0012]
【実施例】表１〜表３に示される成分組成のＡｕ合金ろ
う材を真空雰囲気のリフロー炉にて溶解し、得られた溶
湯を鋳造し、インゴットを得た。このようにして得られ
たインゴットを冷間圧延し、厚さ：２０μｍの冷間圧延
箔を得た。ついで上記冷間圧延箔を２ｍｍ角に切断し、
本発明金合金ろう材１〜２５および比較金合金ろう材１
〜６のペレットを得た。また、これとは別に市販の従来
金合金ろう材を購入し、２ｍｍ角で厚さ：２０μｍの従
来金合金ろう材１〜２のペレットを得た。Example An Au alloy brazing material having the composition shown in Tables 1 to 3 was melted in a reflow furnace in a vacuum atmosphere and the resulting molten metal was cast to obtain an ingot. The ingot thus obtained was cold-rolled to obtain a cold-rolled foil having a thickness of 20 μm. Then, the cold rolled foil was cut into 2 mm squares,
The present invention gold alloy brazing materials 1 to 25 and comparative gold alloy brazing material 1
~ 6 pellets were obtained. Separately from this, a commercially available conventional gold alloy brazing filler metal was purchased, and pellets of the conventional gold alloy brazing filler metals 1 and 2 having a 2 mm square and a thickness of 20 μm were obtained.
【００１３】これら本発明金合金ろう材１〜２５、比較
金合金ろう材１〜６および従来金合金ろう材１〜４の融
点を測定してそれらの結果を表１〜表３に示し、さら
に、これら本発明金合金ろう材１〜２５、比較金合金ろ
う材１〜６および従来金合金ろう材１〜２のペレットを
それぞれ２４Ｋ純金板の上に乗せ、トーチバーナーで加
熱し、金合金ろう材の濡れ広がりの面積を測定してろう
材の濡れ性を評価し、さらに２４Ｋ純金板の上に広がっ
たろう材の色調を目視により観察し、それらの結果を表
１〜表３に示した。The melting points of these gold alloy brazing filler metals 1 to 25 of the present invention, comparative gold alloy brazing filler metals 1 to 6 and conventional gold alloy brazing filler metals 1 to 4 were measured, and the results are shown in Tables 1 to 3. The pellets of the present invention gold alloy brazing filler metals 1 to 25, the comparative gold alloy brazing filler metals 1 to 6 and the conventional gold alloy brazing filler metals 1 and 2 were placed on a 24K pure gold plate and heated with a torch burner to obtain the gold alloy brazing filler metal. The wettability of the brazing material was evaluated by measuring the area of wet spreading of the material, and the color tone of the brazing material spread on the 24K pure gold plate was visually observed, and the results are shown in Tables 1 to 3.
【００１４】[0014]
【表１】 [Table 1]
【００１５】[0015]
【表２】 [Table 2]
【００１６】[0016]
【表３】 [Table 3]
【００１７】[0017]
【発明の効果】表１〜表３に示される結果から、本発明
金合金ろう材１〜２５は、いずれも融点が４００℃以下
で、色調が黄金色を有し、ろう付け時の濡れ性が良好で
あることが分かる。しかし、この発明の条件から外れた
比較金合金ろう材１〜６は、融点が４００℃を越えた
り、色調が白色を有し、ろう付け時の濡れ性が不良であ
ったりして、好ましくない特性が少くとも１つ現れるこ
ともわかる。From the results shown in Tables 1 to 3, all of the gold alloy brazing filler metals 1 to 25 of the present invention have a melting point of 400 ° C. or less, a golden color tone, and wettability during brazing. It turns out that is good. However, the comparative gold alloy brazing filler metals 1 to 6 which are out of the conditions of the present invention have a melting point exceeding 400 ° C., have a white color tone, and have poor wettability during brazing, which is not preferable. It can also be seen that at least one characteristic appears.
【００１８】上述のように、この発明の低融点金合金ろ
う材はいずれも融点が４００℃以下と低いので、この発
明のろう材を用いて２４Ｋ硬化金製装飾品をろう付けし
ても２４Ｋ硬化金製装飾品が軟化することがなく、色調
が黄金色を有するのでろう付け部をメッキする必要がな
く、さらに濡れ性に優れているのでろう付けしやすいな
ど優れた効果を奏し、産業の発展に大いに貢献しうるも
のである。As described above, the melting point of the low melting point gold alloy brazing material of the present invention is as low as 400 ° C. or less, so even if the brazing material of the present invention is used to braze a 24K hard gold decorative article, Hardened gold ornaments do not soften, the color tone has a golden color, there is no need to plate the brazing part, and since it has excellent wettability, it has excellent effects such as easy brazing, It can greatly contribute to the development.
Claims (2)
びＩｎの内の１種または２種：１〜１０％を含有し、残
りがＡｕおよび不可避不純物からなる組成を有すること
を特徴とする低融点金合金ろう材。1. A composition containing, by weight%, Si: 2 to 10%, one or two kinds of Bi and In: 1 to 10%, and the balance being Au and inevitable impurities. Low melting point gold alloy brazing material.
びＩｎの内の１種または２種：１〜１０％を含有し、さ
らに希土類元素、Ｂ、Ａｌの内の１種または２種以上
を：１０〜２０００ｐｐｍを含有し、残りがＡｕおよび
不可避不純物からなる組成を有することを特徴とする低
融点金合金ろう材。2. By weight, Si: 2 to 10%, 1 or 2 kinds of Bi and In: 1 to 10%, and 1 or 2 kinds of rare earth elements, B and Al. A low melting point gold alloy brazing material containing at least one kind: 10 to 2000 ppm, and the balance being Au and inevitable impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24727494A JPH0890280A (en) | 1994-09-14 | 1994-09-14 | Low melting alloy brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24727494A JPH0890280A (en) | 1994-09-14 | 1994-09-14 | Low melting alloy brazing filler metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0890280A true JPH0890280A (en) | 1996-04-09 |
Family
ID=17161034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24727494A Withdrawn JPH0890280A (en) | 1994-09-14 | 1994-09-14 | Low melting alloy brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0890280A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100617398B1 (en) * | 2005-09-02 | 2006-09-01 | 최진수 | Copper Alloy Brazing Solder Containing Ce |
| JP2008137018A (en) * | 2006-11-30 | 2008-06-19 | Mitsubishi Materials Corp | Au-Sn ALLOY SOLDER PASTE HAVING EXCELLENT VOID GENERATION RESISTANCE |
| CN111286641A (en) * | 2020-02-26 | 2020-06-16 | 深圳市粤豪珠宝有限公司 | Anti-discoloration repaired mouth alloy for rose gold and preparation method and application thereof |
-
1994
- 1994-09-14 JP JP24727494A patent/JPH0890280A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100617398B1 (en) * | 2005-09-02 | 2006-09-01 | 최진수 | Copper Alloy Brazing Solder Containing Ce |
| JP2008137018A (en) * | 2006-11-30 | 2008-06-19 | Mitsubishi Materials Corp | Au-Sn ALLOY SOLDER PASTE HAVING EXCELLENT VOID GENERATION RESISTANCE |
| CN111286641A (en) * | 2020-02-26 | 2020-06-16 | 深圳市粤豪珠宝有限公司 | Anti-discoloration repaired mouth alloy for rose gold and preparation method and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20011120 |