JPH0871975A - Part attaching device - Google Patents

Abstract

PURPOSE: To provide a part attaching device which can rapidly accelerate and decelerate the vertical motion of a head part which realizing the minimization of the tool pressing value so as to shorten the tact and prevent abrasion of a component and lowering of accuracy thereof. CONSTITUTION: A head part 301 which is vertically movable, relative to a base, is composed of a part holding means 305 for removably holding a part 317 so as to vertically move the head part in order to supply the part 317 to an object, a weight reducing means for reducing the weight in the holding means in order to reduce the degree of pressing during the supply of the part to the object, and a clamp means for preventing vibration from producing the weight reducing means during vertical movement of the holding means.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a component mounting device such as a bare chip bonder.

[0002]

2. Description of the Related Art FIGS. 7 to 10 show a conventional bare chip bonder. The head unit 101 of FIG.
It is configured on the moving table 104 of the Z axis table 103. The moving base 104 of the Z-axis table 103 is vertically controlled (Z direction) by the motor 102. Tool 10 for adsorbing and holding bare chip 117 of FIG.
5 has a structure that moves up and down together with the moving table 104 of FIG. The tool 105 in FIG. 7 has a flange portion 407.
Is connected to the ball spline shaft 110, and the ball spline shaft 110 is held by a ball spline 106 that guides a linear movement in the vertical direction while controlling the rotation direction. The ball spline 106 in FIG. 7 is held by a ball bearing 107 so that it can rotate freely. The ball spline 106 is rotated by the micrometer head 108 shown in FIGS. 7 and 9 so that the bare chip 117 attracted to the tool 105 with respect to the substrate 118 can be aligned in the rotational direction.

The conventional examples shown in FIGS. 7 and 8 show images when a rotary ball spline in which the ball spline 106 and the ball bearing 107 are integrated is used. The ball spline shaft 110 shown in FIG. 7 is held above by a stopper 109 and a clamper 111 fixed to the ball spline shaft 110. The stopper 109 is fixed to the plate 113 placed on the linear guide 112. The clamper 111 is supported by the compression coil spring 128. The compression coil spring 128 is used for the mechanical parts (that is, the tool 105 and the bare chip 1) hanging from the ball spline shaft 110.
It is a means for canceling the weight of 17). The lower end of the compression coil spring 128 is supported by a spring receiver 129 mounted on the housing of the ball spline 106. The stopper 109 is the nut 1 of the ball screw 114.
The stopper 109 is fixed to 26 and can be finely moved in the vertical direction (Z direction) by rotating the ball screw 114.

The balance between the vertical position of the stopper 109 and the bending amount of the compression coil spring 128 enables fine adjustment of weight cancellation around the ball spline shaft 110.

The vertical position of the stopper 109 can be adjusted as follows. A rotary lever 115 is fixed to the shaft end of the ball screw 114 shown in FIG.
The micrometer head 116 shown in FIG. 0 can rotate the ball screw 114 by a minute amount.
By rotating the micrometer head 116,
The lever 115 rotates. When the lever 115 rotates, the ball screw 114 to which the lever 115 is fixed also rotates by the same amount.

When the ball screw 114 rotates, the ball screw nut 126 shown in FIG. 8 moves up and down. When the ball screw nut 126 moves up and down, the ball screw nut 12
The stopper 109 fixing 6 can move up and down as a unit to adjust the vertical position. The stopper 109 shown in FIG. 7 performs a highly accurate linear movement by the action of the linear guide 112. Here micrometer head 116
By performing the ultra-precision adjustment of (1) to balance the weight around the tool 105 (that is, an element hanging from the tool 105), it is possible to minimize the amount of pressurization of the tool 105 with respect to the substrate 118.

On the other hand, due to the repulsive force of the compression coil spring 120 shown in FIGS. 7 and 8, which is bent by the set pressure,
The ball spline shaft 11 is inserted through the spring seat 119 of FIG.
A clamper 111, which is fixed to the ball spline shaft 110 of 0, is in close contact with the stopper 109. Therefore, the ball spline shaft 110 also moves up and down together with the stopper 109. However, the head portion 10
When the tip of 1 descends and contacts something, the stopper 10
A gap is created between 9 and the clamper 111, and the pressure detected by the load cell <pressure detector> changes. Stopper 10
When the 9 moves up and down, the tool 105 moves together with the clamper 111.

The head portion 101 in FIG. 7 is a Z-axis motor 1
When the bare chip 117 lowered by the operation of 02 and adsorbed to the tool 105 comes into contact with the substrate 118 waiting in the downward direction, a gap is created between the stopper 109 and the clamper 111. By arranging the compression coil spring 120 on the clamper 111 via the spring seat 119 and bending the compression coil spring 120,
It is possible to generate a contact pressure between the bare chip 117 and the substrate 118. The compression coil spring 12 of FIG.
0 has a structure in which it can be bent by a micrometer head 124 installed via a load cell block 122 of FIG.
The contact pressure can be set by the output display of the load cell 123. The amount of movement of the Z-axis moving base 104 and the amount of movement of the stopper 109 when finely moved vertically by
Observation is possible with the linear scale 125 attached to the side surface of the plate 113.

Micrometer head 12 of FIGS. 7 and 8.
The role of No. 4 is to flexure the compression coil spring 120 (the repulsive force of the main spring becomes the pressing pressure of the tool) through the load cell block 122 with high precision by a set amount. The reason why not only the load cell but also the compression coil spring 120 is used is to reduce the influence of the displacement of the tool 105 in the Z-axis direction on the error of the contact pressure (the spring is used more directly than when the load cell is directly used). The constant is small).

The role of the micrometer head 108 of FIG. 7 is as follows. Micrometer head 108
When is rotated, the rotating lever 127 of FIG. 9 rotates. When the rotary lever 127 rotates, the ball spline 106 screwed and fixed to the lever 127 rotates.
The ball spline 106 is rotatably held by a ball bearing 107. When the ball spline 106 of FIG. 7 rotates, the ball spline shaft 110 also rotates, the bare chip 117 attracted to the lower end of the ball spline shaft 110 also rotates, and the posture of the bare chip 117 is changed to the angle of the wiring conductor pattern of the substrate 118 mounted. It becomes possible to adjust to. The pattern matching between the bare chip 117 and the substrate 118 requires this angle matching and XY position matching.
Plays the role of angle adjustment. By the way, X
Of the Y alignments, for example, the X alignment is performed by moving the entire head unit 101 in the X direction.
The direction alignment is performed by moving the substrate 118 in the Y direction.

[0011]

However, in the above-mentioned conventional bare chip bonder, in order to set the minimum amount of pressurization of the tool 105, as described above, the vertical position of the stopper 109 and the amount of bending of the compression coil spring 128 are set. Of the weight around the ball spline shaft 110, that is, the weight balance around the tool shaft (that is, the tool 105, the bare chip 117, and the clamper 111 of the element hanging from the ball bearing shaft 110) needs to be finely adjusted. There is. In this delicate weight balance state, when the head portion 101 is suddenly lowered or raised and stopped, the tool shaft vibrates vertically and the stopper 109 and the clamper 11 are vibrated.
Chattering may occur at the contact portion 1 or the height of the tool 105 of micron order cannot be controlled with high accuracy. When the vertical movement of the head part is rapidly accelerated and reduced while the amount of pressurization of the tool 105 with respect to the substrate 118 is minimized, the tact becomes long, and the clamper and the stopper collide each time the tool moves up and down, causing wear. Or accuracy may be degraded.

Therefore, the present invention has been made in order to solve the above-mentioned problems, and it is possible to minimize the amount of pressurization of a holding means for holding a component such as a tool against an object such as a substrate while vertically moving the head portion. Provides a component mounting device that enables rapid acceleration and deceleration of motion, shortens tact time, and prevents wear and deterioration of precision due to collision of components such as clamper and stopper each time the tool moves up and down. The purpose is to do.

[0013]

According to the present invention, there is provided a component mounting apparatus for supplying a component to an object, a base, and a head unit movable up and down with respect to the base. The head unit detachably holds the component, and the component holding unit for supplying the component to the object by vertically moving the head unit; and the component to the object. And a weight reducing means for reducing the weight of the holding means in order to reduce the amount of pressure applied to the holding means, and to prevent vibration generated by the weight reducing means when the holding means is moved up and down. It is achieved by a component mounting device including a clamping means.
In the present invention, preferably the component is a bare chip and the object is a substrate. In the present invention, preferably, the clamping means is a fluid pressure cylinder.
In the present invention, preferably, the weight reducing means has a compression coil spring. In the present invention, preferably, the holding means is a suction type tool that sucks and holds the component.

[0014]

According to the above construction, the clamp means prevents the vibration generated by the weight reducing means when the holding means is moved up and down. As a result, the vertical movement of the head portion can be rapidly accelerated and decelerated while the amount of pressurization of the holding means for holding the component such as the tool against the object such as the substrate is minimized, and the tact can be shortened. Moreover, the constituent elements such as the clamper and the stopper do not collide with each other when the holding means moves up and down.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. The examples described below are
Since it is a preferred specific example of the present invention, various technically preferable limitations are attached, but the scope of the present invention is, unless otherwise stated to limit the present invention, in the following description.
It is not limited to these modes.

FIG. 1 shows a preferred embodiment of the component mounting apparatus of the present invention. The component mounting apparatus 201 of FIG. 1 is a bare chip bonder for mounting a bare chip 317 as a component on a substrate 318 that is an object, for example. The bare chip 317 is supplied onto the chip supply table 203. The head unit 301 is fixed to the X-axis table 205, and the X-axis table 205 can be moved by a motor in the X direction and positioned at an arbitrary position. Board 31
8 is fixed and held on the Y-axis table 207, and the Y-axis table 207 can be moved to a motor in the Y direction and positioned at an arbitrary position.

The chip recognition camera 208 is equipped with the suction tool 3
It is used for recognizing the position of the bare chip 317 that has been vacuum-adsorbed on 05. The board recognition camera 210 fixedly held on the X-axis table 205 is used to recognize the position of the wiring pattern of the board 318. Start button 211, operation unit 21
2 and the above-mentioned chip supply table 203 and the X-axis table 2
05, Y-axis table 207 and chip recognition camera 20
8 is arranged and fixed on the base 213.

2 and 3 show the head portion 301. The head portion 301 of FIG. 2 is formed on a moving base 304 of a Z-axis table 303 as a base. The moving base 304 of the Z-axis table 303 is set so as to be movable up and down with respect to the Z-axis table 303, and the motor 302
The vertical movement is performed by. Ball spline shaft 31
0 and the suction tool 305 constitute a holding means for sucking and holding the bare chip 317. The suction tool 305 has a structure that moves up and down together with the moving table 304. The suction tool 305 is coupled to the ball spline shaft 310 via the flange portion 407. The ball spline shaft 310 is held by the ball spline 306. The ball spline 306 guides the vertical motion (Z axis) of the ball spline shaft 310 while regulating the rotation direction of the ball spline shaft 310.

The ball spline 306 of FIG. 2 is held by a ball bearing 307 so that it can rotate freely. The ball spline 306 has a structure in which the position of the sucked bare chip 317 with respect to the substrate 318 can be adjusted with respect to the rotation direction by being rotated by the micrometer head 308 of FIGS. 2 and 4.

The embodiments shown in FIGS. 2 and 3 show images when a rotary ball spline in which the ball spline 306 and the ball bearing 307 are integrated is used. The ball spline shaft 310 of FIGS. 2 and 3 is
It is held above by a stopper 309 and a clamper 311 fixed to the ball spline shaft 310. The stopper 309 in FIG. 2 is fixed to the plate 313 placed on the linear guide 312. The clamper 311 is supported by a compression coil spring 328 for canceling the weight of mechanical parts (that is, the suction tool 305, the bare chip 317, and the clamper 311) hanging on the ball spline shaft 310.

As shown in FIGS. 2 and 3, the lower end of the compression coil spring 328 is supported by a spring receiver 329 mounted on the housing of the ball spline 306. The stopper 309 is fixed to the nut 326 of the ball screw 314, and the stopper 309 can be finely moved in the vertical direction by rotating the ball screw 314.

The balance between the vertical position of the stopper 309 and the bending amount of the compression coil spring 328 shown in FIG. 2 enables fine adjustment of weight cancellation around the ball spline shaft 310.

The vertical position of the stopper 309 is as follows. As shown in FIG. 2, a rotary lever 315 is fixed to the shaft end of the ball screw 314, and the micrometer head 316 of FIGS. 2 and 5 can rotate the ball screw 314 by a minute amount. . By rotating the micrometer head 316 of FIGS. 2 and 5, the lever 315 rotates. When the lever 315 rotates, the ball screw 314 to which the lever 315 is fixed also rotates by the same amount.

When the ball screw 314 of FIG. 3 rotates, the ball screw nut 326 of FIG. 3 moves up and down. When the ball screw nut 326 moves up and down, the stopper 309 to which the ball screw nut 326 is fixed can move up and down together to adjust the vertical position. When the stopper 309 moves up and down, the stopper 309 performs a highly accurate linear movement by the action of the linear guide 312 of FIG.
By adjusting the weight around the suction tool 305 of FIG. 2 by the ultra-precision adjustment of the micrometer head 316 of FIG. 2 and FIG.
It is possible to minimize the amount of pressurization. In other words, minimizing the amount of pressurization means that the ball spline shaft 31
The weight of the mechanical parts hanging at 0, that is, the suction tool 305 and the bare chip 317 is reduced by the compression coil spring 32.
8 is canceled by the force of 8 and the component 317 is mounted on the substrate 318 with a pressure amount as small as possible. The reason why the pressure applied to the component 317 is minimized and the component 317 is mounted on the substrate 318 is that the contact portion of the component 317 is a bare chip that is easily deformed.

FIG. 2 which is bent by the magnitude of the set pressure.
Of the compression coil spring 320 of FIG.
The ball spline shaft 310 and the clamper 311 fixed to the ball spline shaft 310 are in close contact with the stopper 309 via. Therefore, the ball spline shaft 310 also moves up and down together with the stopper 309. However, when the tip of the head portion 301 descends and comes into contact with something, the stopper 309 and the clamper 311 are
A gap is created between the two and the pressure detected by the load cell <pressure detector> changes.

Here, when the head portion 301 is moved up and down when the set pressure due to the repulsive force of the compression coil spring 320 different from the compression coil spring 328 is 50 g or less,
The tool shaft, that is, the ball spline shaft 310, easily vibrates up and down, which hinders the original highly accurate height control. Therefore, a characteristic of the embodiment of the present invention is that the shaft clamper 331 is operated by the force of the air cylinder 330 in order to press the clamper 311 integrated with the ball spline shaft 310 against the stopper 309. The force of the compression coil spring 328 is regulated so that the clamper 311 can be clamped to the stopper 309 side. The air cylinder 330 and the shaft clamper 331 constitute a clamp means 600 for the ball spline shaft 310. This can prevent the ball spline shaft 310 from vertically vibrating when the head portion 301 is moved up and down. Therefore, the compression coil spring 328 is used to minimize the amount of pressure applied by the suction tool 305 to the substrate 318.
The vertical movement of the head portion 301 does not vibrate up and down even when the vertical movement of the head portion 301 is suddenly accelerated and decelerated, and rapid acceleration and deceleration of the vertical movement of the head portion 301 is possible. Can be realized. Moreover, the suction tool 305
Every time the up and down movement of the clamper 311 and the stopper 309
They do not collide with each other, and it is possible to prevent wear and deterioration of accuracy of these elements.

When the stopper 309 moves up and down, the suction tool 305 moves together with the clamper 311. On the other hand, the head unit 301 descends in the Z direction by the operation of the Z-axis motor 302, and the bare chip 317 sucked by the suction tool 305 stands by below the substrate 31.
8 comes into contact with the stopper 309 and the clamper 311
There is a gap between them.

By placing a compression coil spring 320 on the clamper 311 via a spring seat 319 and bending the compression coil spring 320, it is possible to generate a contact pressure between the bare chip 317 and the substrate 318. . The compression coil spring 320 shown in FIG. 3 has a structure that can be bent by the micrometer head 324. The micrometer head 324 is installed via the load cell block 322 mounted on the linear guide 321 of FIG. The contact pressure is the load cell 323 of FIG.
It can be set by the output display of. Z axis moving table 304
2 and the amount of movement of the stopper 309 when finely moved up and down manually can be observed by the linear scale 325 attached to the side surface of the plate 313 in FIG.

The role of the micrometer head 324 is to
Compression coil spring 32 through load cell block 322
0 (the repulsive force of the compression coil spring 320 becomes the pressing pressure of the suction tool 315 against the substrate 318) is flexed by a set amount with high precision, and is the same as the conventional example. In the embodiment of the present invention, not only the load cell 323 but also the compression coil spring 3 is pressed against the suction tool 305.
The reason why 20 is used is to reduce the influence of the displacement of the suction tool in the Z-axis direction on the error in the contact pressure (the spring constant is smaller via the spring than when the load cell is directly used).

The role of the micrometer head 308 is to
It is as follows. Micrometer head 30 of FIG.
When 8 is rotated, the rotary lever 327 of FIG. 4 rotates.
When the rotating lever 327 rotates, the ball spline 306 of FIG. 2 to which the lever 327 is fixed by screws rotates. The ball splines 306 are the ball bearings 30.
It is held rotatably by 7.

When the ball spline 306 in FIG. 2 rotates, the ball spline shaft 310 also rotates, and the bare chip 317 attracted to the suction tool 305 at the lower end of the ball spline shaft 310 also rotates. As a result, the orientation of the bare chip 317 can be matched with the angle of the wiring conductor pattern of the board 318 to be mounted. Chip 3
17 and the pattern of the substrate 318, the angle adjustment and XY
However, the above-mentioned micrometer head 308 plays a role of angle adjustment. By the way, of the alignment in the XY directions, for example, the alignment in the X direction is performed by moving the entire head unit 301 in the X direction, and the alignment in the Y direction is performed by moving the substrate 318 in the Y direction.

FIG. 6 shows an example of the structure of the suction tool 305 in detail. The suction tool 305 is a heating type tool. The suction tool 305 is a ball spline shaft 310.
It is fixed to the bottom edge of. Heating type suction tool 3 of FIG.
At 05, the chip 317 of FIG. 2 is adsorbed to the chip adsorption surface 401 of FIG. 6, and the vacuum port at this adsorption is 402. ON / OFF of the vacuum of the vacuum port 402 is performed by the controller 500 of the entire device.
Thus, the electromagnetic valve 520 provided in the middle of the vacuum circuit connected to the vacuum generator 510 is turned on and off to operate. Cooling air circuit 4 described later
The cooling gas flowing through 04, 405 is also the controller 50.
0 and the electromagnetic valve 520 operate. The adsorbed chip 317 is heated by the heater 403 in FIG. When the adsorbed chips 317 are rapidly cooled, the heat generation of the heater 403 is stopped, and then a cooling gas (dry air at room temperature or N ₂ gas or the like is used) is supplied to the cooling air circuit 404 for use.

The other cooling air circuit 405 provided on the upper side has a role of preventing the residual heat generated by the heat generated by the heater from being transferred to the upper portion of the suction tool 305, and is used as necessary ( There is a case that it is always flushed). The heat insulating material 406 is provided to enhance the cooling ability of the cooling gas described above. Heating type suction tool 30
5 is a fixing screw hole 4 provided in the flange portion 407.
A screw is passed through 08 to be fixed to the lower flange portion of the ball spline shaft 310.

The present invention is not limited to the above embodiment. A mechanism using a solenoid instead of the air cylinder 330 can be adopted to drive the shaft clamper 331 in FIG. Instead of the air cylinder 330 of FIG. 2, a mechanism using a motor (motor and ball screw, etc.) to drive the shaft clamper 331 can also be adopted. Further, the component supply device of the present invention is a camera production device or a V
It can be used for TR substrate manufacturing equipment.

As described above, in the embodiment of the present invention, when the suction tool pressurizing amount is minimized, the ball spline 3 which is the shaft of FIG. 2 is moved when the tool is moved up and down.
In order to prevent 10 from vibrating up and down, FIG.
As shown in, the tool shaft clamp mechanism 500 is provided. This makes it possible to rapidly accelerate and decelerate the vertical movement of the head while realizing a minimal amount of tool pressure.
Tact can be shortened. Moreover, it is possible to prevent the abrasion and the deterioration in accuracy due to the hitting of the clamper and the stopper each time the tool is moved up and down, which has conventionally occurred. And, the height of the suction tool can be controlled with high precision.

[0036]

As described above, according to the present invention, it is possible to rapidly accelerate and decelerate the vertical movement of the head portion while realizing the minimization of the amount of tool pressurization, and shorten the tact time.
It is possible to prevent wear and deterioration of accuracy due to collision of components such as a clamper and a stopper each time the tool moves up and down.

[Brief description of drawings]

FIG. 1 is a view showing a bare chip bonder which is a preferred embodiment of a component mounting apparatus of the present invention.

FIG. 2 is a front view showing a head portion of the component mounting apparatus of FIG. 1 having a partially cutout portion.

FIG. 3 is a side view of the head unit of FIG.

FIG. 4 is a bottom view of the head unit of FIG.

5 is a plan view of the head unit of FIG.

FIG. 6 is a diagram showing an example of a component suction tool.

FIG. 7 is a front view showing a head portion of a conventional bare chip bonder.

8 is a side view showing the conventional head portion of FIG.

9 is a bottom view showing the conventional head unit of FIG. 7. FIG.

FIG. 10 is a plan view showing the conventional head unit of FIG.

[Explanation of symbols]

 301 Head part 302 Motor 303 Z-axis table (base) 304 Moving table 305 Adsorption tool (holding means) 306 Ball spline 307 Ball bearing 308 Micrometer head 309 Stopper 310 Ball spline shaft (holding means) 311 Clamper 312 Linear guide 313 Plate 314 Ball screw 315 Lever 316 Micrometer head 317 Bare chip (component) 318 Substrate (object) 319 Spring seat 320 Compression coil spring 321 Linear guide 322 Load cell block 323 Load cell 324 Micrometer head 325 Linear scale 326 Ball screw nut 327 Rotation lever 328 Compression coil spring ( Weight reducing means) 329 Spring receiver 330 Air cylinder (fluid pressure cylinder) ) 331 shaft damper 600 head clamping mechanism

Claims (5)

[Claims] 1. A component mounting apparatus for supplying a component to an object, comprising: a base; and a head unit movable up and down with respect to the base, wherein the head unit detachably holds the component. And a holding means for holding the component for supplying the component to the object by moving the head part up and down, and a holding means for reducing the amount of pressure applied when supplying the component to the object. A component mounting apparatus comprising: a weight reducing means for reducing the weight of the means, and a clamp means for preventing vibration generated by the weight reducing means when the holding means is moved up and down. 2. The component mounting apparatus according to claim 1, wherein the component is a bare chip, and the object is a substrate. 3. The component mounting apparatus according to claim 1, wherein the clamp means is a fluid pressure cylinder. 4. The component mounting apparatus according to claim 1, wherein the weight reducing means has a compression coil spring. 5. The component mounting apparatus according to claim 1, wherein the holding unit is a suction type tool that sucks and holds the component.