JPH0851299A - Electronic component mounter - Google Patents

Abstract

PURPOSE:To provide a mounter which mounts electronic components with high accuracy without generating solder bridges or floating leads. CONSTITUTION:Visible flat laser generators 63 and 64 are provided to apply linear beams that orthogonally intersects at a desired position on a substrate 4 whereupon an electronic component 1 is mounted. Flat laser beams 61 and 62 are applied from the visible flat laser generators 63 and 64, and reflection position on the substrate 4 is recognized by a CCD camera 65. The electronic component mounter is provided with an optical measuring means, which measures the inclination of the substrate at the desired position by measuring the crossing angle of the linear beams recognized by the CCD camera 65, and a means which adjusts the posture of the electronic component 1, which is held by a mounting nozzle 5, against the substrate 4, based on the measurement results of the optical measuring means. Thus, the descending distances of the leads on each side of the electronic component held by the mounting nozzle are permitted to be uniform to the substrate and pressing nonuniformity is not generated. Therefore solder bridges and floating leads are not generated and highly accurate mounting is allowed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting machine,
In particular, the present invention relates to an electronic component mounting machine that vacuum-sucks an electronic component using a mounting nozzle and mounts it on a printed circuit board.

[0002]

2. Description of the Related Art An electronic component mounting machine drives and mounts a mounting nozzle holding an electronic component on a printed circuit board, and releases the retention to mount and mount the electronic component on a desired position on the printed circuit board.

The structure and general operation of a conventional electronic component mounting machine will be described with reference to FIG. 6, and the detailed structure and operation of the component mounting portion will be described with reference to FIG. The mounting machine is a component mounting unit including a nozzle unit 10 that sucks (holds) the electronic component 1 and a Z-axis drive mechanism that drives the nozzle unit in the Z-axis direction, and an X-axis that drives the component mounting unit in the X-axis direction. Drive mechanism,
The component mounting portion held by the X-axis drive mechanism is configured by a Y-axis drive mechanism or the like that drives in the Y-axis direction.

The Y-axis drive mechanism includes a ball screw 1001 provided on the mount 100 and a motor 10 connected to the ball screw.
No. 02, and the ball screw 1001 has a base 10
The X-axis drive mechanism held in 31 is connected to the rail 1.
003 is moved in the Y-axis direction. The X-axis drive mechanism includes a ball screw 1032 and a motor 10 connected to the ball screw.
The ball screw 1032 is connected to the component mounting portion held on the mount 27, and drives the rail 1034 on the rail 1034 in the X-axis direction.

The operation command of the component mounting section is sent to the control unit 20.
When a command is issued to the Y-axis drive mechanism to move the X-axis drive mechanism holding the component mounting portion in the Y-axis direction, the motor 1002 rotates the ball screw 1001 to cause the component to move. The mounting part moves in the Y-axis direction. Similarly, when the X-axis drive mechanism is instructed to move the component mounting portion in the X-axis direction, the motor 1033 rotates the ball screw 1032 and the component mounting portion moves in the X-axis direction. .

As shown in FIG. 7, the component mounting portion is a nozzle portion 10 for mounting the electronic component 1 held by vacuum suction on the substrate 4, and a motor for rotating the nozzle portion horizontally with respect to the Z axis. 18, a base 19 for holding the nozzle portion and the like. The base 19 is held by a linear guide 21 and is connected to a pedestal 27 holding a ball screw 24 by a nut 23, and a motor 26 is mounted on the upper portion of the ball screw 24 via a coupling 25. Are connected.

The nozzle portion 10 is supported by a shaft 12, a nozzle holder 11 provided at the tip of the shaft, an adsorption nozzle 5 held by the nozzle holder 5, an EL support plate 6 attached to the shaft 12, and the EL support plate. EL
It is composed of an illumination plate 7 and the like, and a motor 18 is connected to an upper portion of the nozzle portion 10 via a coupling 17.

The operation command of the nozzle portion 10 is given by the control device 2
When a command to move the base 19 stored in the linear guide 21 up and down is issued to the motor 26, the nozzle portion 10 moves vertically to the Z-axis direction. Similarly, when a command is issued to the motor 18, the nozzle unit 10 horizontally rotates in the Z-axis direction. The horizontal rotation with respect to the Z-axis direction will be described below as the θ direction.

The control device 20 opens the electromagnetic valve 13 and sends a command to decompress the space 29 in the suction nozzle 5 via a communication pipe (not shown) that communicates the shaft 12 and the interior of the nozzle holder 11 with each other. Then, the electronic component 1 is sucked onto the tip of the suction nozzle 5. The suction position of the sucked electronic component 1 with respect to the suction nozzle 5 is recognized by a recognition camera (not shown) that recognizes the light of the EL illumination plate 7 supported by the EL support plate 6, and the component recognition data is displayed. Stored as a data.

The suction nozzle 5 which sucks the electronic component 1 from various feeders, such as a chip component supplied from the reel 106 by the tape feeder 107 and a large QFP component supplied by the tray 108, The X-axis drive mechanism and the Y-axis drive mechanism move in the X-axis and Y-axis directions, the solder paste 3 is printed by a printing machine (not shown), and the conveyor 1 is installed inside the mounting machine.
The printed circuit board 4 conveyed by 05 reaches an upper portion of a desired portion.

When the nozzle portion 10 reaches the upper portion of the desired position on the substrate 4, the ball screw 24 held on the mount 27 by the motor 26 is rotated by the controller 20 and is fixed by the nut 23. A command is issued for the space 19 to descend a predetermined distance (distance H), and the lead 2 of the electronic component 1 sucked by the suction nozzle 5 is soldered on the board 4.
To contact. A shock caused by vertical vibration generated when the nozzle unit 10 is stopped is absorbed by a spring (not shown) provided above the suction nozzle 5, and then a command to stop the operation of the vacuum pump 15 is issued. Then, the suction is released, and the mounting of the electronic component 1 is completed.

In the above-described conventional mounting machine, assuming that the electronic component 1 attracted to the tip of the suction nozzle 5 and the substrate 4 are parallel, the lead 2 of the electronic component 1 attracted to the tip of the suction nozzle 5 A distance H, which is obtained by measuring the distance from the upper surface of the substrate 4 in advance, is set as the descending distance of the suction nozzle. However, this distance H is a theoretical distance, and the substrate used in the actual manufacturing line is slightly warped and is not constant depending on the individual substrate. Further, even on the same substrate, the descending distance of the suction nozzle 5 is not always constant because it changes depending on the mounting position. That is, since the board 4 is warped, the lead-down distance of the lead of the electronic component held by the suction nozzle may not be uniform depending on the position on the substrate where the electronic component is actually mounted. -There is a problem in that pressure unevenness occurs in the leads on each side of the electronic component that are not placed on the strike, resulting in solder bridges and floating of the leads.

In Japanese Patent Laid-Open No. 5-13991, a board recognition camera for recognizing a solder pattern formed on the board is provided as means for detecting the warp of the board, and based on the recognition information from the board recognition camera. By providing an XY swing head that tilts the mounting head according to the warp of the substrate, it has been proposed to mount the component from a direction perpendicular to the solder pattern and secure the mounting position accuracy.

In the prior art described in the above-mentioned publication, the reference solder pattern length registered in advance is compared with the solder pattern length recognized by the board recognition camera, and the length is shorter than the reference solder pattern length. In this case, the mounting position accuracy is ensured by determining that the board is warped, that is, the board is locally tilted and the tilt of the board is obtained. The above method is premised on that the solder pattern to be recognized is accurately formed.

[0015]

As electronic components have become larger and smaller, the lead spacing has been reduced to 0.3 mm or less, and the solder paste pattern spacing has been made finer even in the pre-mounting process. It has become necessary to form them. As a means for forming a solder pattern on a substrate, there is a printing machine that opens a desired pattern on a printing mask and prints a solder paste on the substrate through the printing mask. Due to the processing accuracy of the opening of the mask, the solder paste remains in the opening, and the amount of solder paste on the substrate decreases, and the desired pattern is generated due to misalignment between the substrate and the printing mask during printing. -Defects such as misaligned printing are generated.

Therefore, it is necessary to distinguish whether the factor that the board recognition camera recognizes that the solder pattern formed on the board is shorter than the reference pattern length is due to the warp of the board or the blur at the time of printing. However, there is a case where the substrate is erroneously recognized as being warped although the main cause is a blur at the time of printing. Therefore, since the inclination of the mounting head is matched with the inclination of the board that is erroneously recognized, the inclination of the mounting head becomes larger than the actual inclination of the board, and the solder pattern
There may be a problem that the leads of the electronic components come into contact with each other in a state where the leads are displaced from each other.

Further, since the electronic parts held by the mounting head are aligned with the inclination of the board based on the erroneous recognition,
The lead of the electronic component collides with the substrate to break the solder paste and the patterns come into contact with each other, so-called bridge occurs, or conversely, one side of the lead of the electronic component is soldered. There may be a problem that the other side is not in contact with the paste but the so-called lead float occurs.

Furthermore, since the shadow is generated by the unevenness of the particles of the solder paste and the swelling of the surface of the solder pattern, an error occurs in the recognition of the solder pattern length in the board recognition camera, and the mounting accuracy is lowered. There were things.

An object of the present invention is to solve the above problems and provide an electronic component mounting machine capable of mounting electronic components on a substrate with high accuracy.

[0020]

The electronic component mounting machine of the present invention is characterized by a light generator for irradiating a desired portion of a substrate on which electronic components are mounted with a linear light beam intersecting with each other. , Optical measuring means for measuring the inclination of the desired portion of the substrate by measuring the crossing angle of the reflected light of the light on the substrate captured by the recognition camera, and according to the inclination of the desired portion of the substrate Attitude adjustment means for adjusting the attitude of the electronic component held by the mounting nozzle.

[0021]

According to the present invention, the light generator irradiates a desired position on the substrate with a line of light intersecting with it, and the recognition camera recognizes the reflected light of the light on the substrate with the line of crossing. ,
When the substrate is tilted, the crossing angle of the linear light recognized by the recognition camera does not match the crossing angle of the irradiated linear light, and thus the recognized line with respect to the crossing angle of the irradiated linear light is recognized. The inclination of the substrate can be recognized by measuring the difference in the crossing angle of the light beams. That is, it is possible to measure the inclination of the desired portion of the board on which the electronic component is to be mounted and adjust the attitude of the electronic component held by the mounting nozzle with respect to the substrate based on the measurement result. The descending distance of the leads on each side is uniform with respect to the substrate, and uneven pressure does not occur. Therefore, the solder can be mounted with high accuracy without causing a bridge or lead floating.

[0022]

1 to 5, one embodiment of the present invention will be described. The same parts as those of the conventional example are designated by the same reference numerals and the description thereof will be omitted. In the present embodiment, a visible flat laser generator is provided as a light generator for radiating intersecting linear light, and a spherical static pressure bearing is mounted on the mounting nozzle as means for adjusting the attitude of the electronic component held by the mounting nozzle with respect to the substrate. In addition, a movable table and a variable table mechanism are provided in the component supply section.

FIG. 1 shows the essential parts of the component supply section and the mounting section of the mounting machine according to the embodiment of the present invention, and the configuration will be described. The parts supply section includes a movable table 31 and a table variable mechanism 3
2 is provided, and transfer means for placing the electronic component 1 housed in the tray 33 on the movable table 31 is provided. The transfer means includes a suction nozzle 34 for sucking (holding) the electronic component 1, a motor 35 for rotating the suction nozzle 34 in the θ-axis direction, a guide 36 for holding the suction nozzle 34, and a button for vertically moving the guide 36. -Roll screw 37 and ball screw 3
7 is a ball screw 39 for driving the motor 38 and the guide 36 provided at the tip of the ball guide 7 in the Y-axis direction, and a motor 40 and a guide 36 provided at the tip of the ball screw 39 are driven in the X-axis direction. The ball screw 41 and a mole installed at the tip of the ball screw 41.
It is configured by the data 42.

From the controller (not shown), the motor 42
The ball screw 41 connected to the motor 42 is rotated by a command to rotate the motor 42, and the guide 43 provided on the ball screw 41 is moved in the X-axis direction to guide the guide 3.
The suction nozzle 34 held by 6 moves in the X-axis direction. Similarly, the ball screw 3 is rotated by the rotation of the motor 40.
9 rotates, the guide 36 moves in the Y-axis direction, and the tray 33
The suction nozzle 34 held by the guide 36 reaches the upper part of the electronic component 1 inside. The suction nozzle 34 is moved up and down by the rotation of a motor 38 provided on the upper portion of the guide 43, and the controller (not shown) issues a command to operate a vacuum pump (not shown) to suck the electronic component 1. To do. By the operation of the motor 35 provided above the suction nozzle 34, the tray-3
The electronic component 1 in 3 rotates in the θ direction (horizontal rotation with respect to the Z-axis direction), is recognized by the CCD camera 30, is adjusted to a posture to be mounted at a desired position on the substrate 4, and is movable.
Place it on the bull 31.

The movable table 31 is a table variable mechanism 3
By operating the motor 44 provided in FIG. 2, the ball screw 45 connected to the motor 44 is rotated and the ball screw 4 is rotated.
The arm 46 provided at 5 moves up and down to change the inclination of the movable table 31.

The component mounting portion sucks (holds) the electronic component 1.
And a Z-axis drive mechanism that drives the nozzle section 50 in the Z-axis direction, and is connected to an X-axis drive mechanism (not shown) and a Y-axis drive mechanism (not shown) via a guide 27. ing. For the X-axis and Y-axis drive mechanisms, see FIG.
Also, since it is similar to the conventional example shown in FIG. 7, description thereof will be omitted.

The nozzle portion 50 includes a shaft 12, a nozzle holder 51 provided at the tip of the shaft 12, a spherical static pressure bearing 52 mounted by the nozzle holder 51, an adsorption nozzle 5 held by the spherical static pressure bearing 52, and the like. A motor 18 is connected to the upper portion of the nozzle portion 50 via a coupling 17.

The guide 27 for holding the nozzle section 50 includes:
The line laser light 61, 6 is obliquely above the substrate 4 from the upper side.
The visible line laser generators 63 and 64 for irradiating 2 are provided, and the CCD camera 65 for recognizing the reflected light of the line laser lights 61 and 62 on the upper portion of the substrate 4 is provided.

The principle of optical measurement in the present invention will be described in detail with reference to FIGS. 2 and 3. FIG. 2 is a cross-sectional view of the mounting portion on the upper surface of the substrate, and FIG. 3 is a top view showing the mounting portion on the upper surface of the substrate. The reflected light on the substrate of the laser light emitted from the generator such as a stick line marker head (model STK-L) manufactured by Applied Planning Co., Ltd. is recognized in a linear shape by a recognition camera. be able to. Guide 27
The visible line laser generator 63 held in FIG. 1 irradiates the line laser light 61 onto the upper surface of the substrate 4 at a predetermined angle θ, and the visible line laser generator 64 causes the line laser light 6 to illuminate.
2 is irradiated at a predetermined angle θ, the image recognized by the CCD camera 65 on the upper surface of the substrate 4 is as shown in FIG. The reflected light of the line laser lights 61 and 62 is
In FIG. 3, it can be shown as a reference line 71 and a reference line 72.

Here, for convenience of description, the visible line laser generators 63 and 64 are guided to the guide 27 so that the intersecting angles of the reference line 71 and the reference line 72 are orthogonal to each other when the upper surface of the substrate 4 is flat. Adjust the fixed position to determine the substrate reference position.

When the irradiation angle θ from the visible line laser generator 63 is 45 °, the component mounting position on the board is ΔZ higher than the board reference position in the X-axis direction, that is, around the Y-axis (+). ΔZx), the irradiated line laser light 6
The reflected light on the upper surface of the substrate 4 of No. 1 is + ΔZ with respect to the reference line 71.
When the position is moved to x (right side in the drawing) and ΔZx is lowered (−ΔZx), − with respect to the reference line 71.
The CCD camera 65 recognizes the position moved to ΔZx (the left side in the drawing), that is, the solid line 73. A straight line 74 is obtained by linearly approximating the solid line 73 recognized by the CCD camera 65 in the control device 20.

Similarly in the Y-axis direction, that is, around the X-axis, the irradiation angle θ from the visible line laser generator 64 is 45.
If the angle is °, the irradiated line laser light 62 moves upward in the drawing with respect to the reference line 72 when it is high in the Y-axis direction, that is, around the X-axis, and is low in the Y-axis direction, that is, around the X-axis. If it is, the CCD camera 65 recognizes it as a position moved up and down with respect to the reference line 72, that is, a solid line 75. A straight line 7 obtained by linearly approximating the solid line 75 recognized by the CCD camera 65 in the control device 20 is the straight line 7.
It is 6.

As described above, when the irradiation angle of the visible line laser generators 63 and 64 is 45 °, when a perpendicular line is drawn from the arbitrary point on the solid line 73 to the reference line 71, the length of the perpendicular line is reduced. It is the height with respect to the reference position of the substrate 4 at an arbitrary point. That is, X of the solid line 73 with respect to the reference line 71
The deviation θx on the Y plane can be replaced with the inclination angle of the substrate 4 around the X axis. Similarly, the deviation θy of the solid line 76 with respect to the reference line 72 on the XY plane can be replaced with the inclination angle of the substrate 4 around the Y axis. For convenience of description, the values obtained by replacing the deviation θx and the deviation θy are set as the angle θx1 and the angle θy1.

The height (absolute position in the Z-axis direction) of the mounting position of the substrate 4 is the distance of the intersection B (the intersection of the straight line 74 and the straight line 76) with respect to the intersection A (the intersection of the reference line 71 and the reference line 72). , That is, the height ΔZ can be measured.

The angle θx1, which indicates the inclination of the substrate 4 described above.
The controller 2 using the angle Δy1 and the height ΔZ indicating the height of the mounting point center (absolute position in the Z-axis direction) as the substrate tilt data.
Store in 0. At the same time, the CCD camera 65 recognizes the positioning mark 81 or the solder pattern 3 formed on the substrate 4 and stores the mounting position data on the substrate surface in the controller 20.

The above-described measurement is performed on the movable table 31.
The upper surface of the movable table 31 is also tilted and the height (absolute position in the Z-axis direction) of the movable table 31 is tilted.
It is stored in the control device 20 as a data. For convenience of explanation,
The inclination of the table surface of the movable table 31 is shown as an angle θx2, the angle θy2, and the table surface height (absolute position in the Z-axis direction) is shown as a height ΔZ2.

The control device 20 compares the substrate tilt data (angle θx1, angle θy1, height ΔZ) with the table tilt data (angle θx2, angle θy2, height ΔZ2). Then, the change amount of the movable table 31 is obtained as a correction value (angle θx correction amount, angle θy correction amount, height ΔZ correction amount).

Variable table 31 and table variable mechanism 3
2 will be described below with reference to FIG. The above correction values (angle θx correction amount, angle θy correction amount, height ΔZ correction amount)
Based on the above, the controller 20 determines the rotation speeds of the motors 44a and 44b provided in the table variable mechanism 32. If the substrate 4 is tilted only in the X-axis direction, that is, around the Y-axis, the movement of the motor 44a causes the guide 45a to support the boat.
The ball screw 46a rotates, the arm 47a provided on the ball screw 46a rises, and the pusher rod 48a supporting the movable table 31 provided on the arm 47a is pushed up. Similarly, the motor whose rotation speed is determined by the control device 20 is selected.
The ball screw 46b supported by the guide 45b is rotated by the operation of the rotor 44b, and the ball screw 46b is provided with an ball screw 46b.
The arm 47b descends and pushes down the pusher rod 48b which supports the movable table 31 provided on the arm 47b.
The control table 20 issues a command to operate the table variable mechanism 32 based on the above correction value, so that the movable table 3 is moved.
The inclination of 1 matches the inclination of the substrate 4.

As described above, the electronic component 1 on the substrate 4
Since the tilt of the movable table 31 and the tilt of the desired position for mounting the same are the same, the movable table 31 is mounted on the movable table 31 by a transfer means (not shown) similarly to the mounting position on the upper part of the substrate. The attitude of the electronic component 1 is the same as the inclination of the substrate.

When electronic components are continuously mounted, the inclination of the movable table 31 is not measured every time, and the inclination of the movable table 31 is measured so as to match the table inclination data. A command for rotating the motors 44a and 44b is sent to the controller 2
0 may be output, and the inclination of the movable table 31 may be calibrated in advance while measuring the inclination of a desired portion on the substrate 4. That is, the amount of change in the movable table 31 may be calculated by always comparing the table tilt data obtained in the first measurement with the substrate tilt data.

When the tilt of the movable table 31 is measured with the electronic component 1 mounted on the movable table 31, the outside of the mounted electronic component 1 is measured and the electronic component 1 is mounted on the movable table 31. The height ΔZ correction amount may be further corrected according to the distance from the suction position to be sucked to change the height of the movable table 31. Here, for convenience of explanation, the height ΔZ correction amount is set to 0, and the descending distance of the mounting nozzle 5 is the same predetermined distance (distance H to both the upper surface of the substrate 4 and the upper surface of the movable table 31).
-Height ΔZ).

FIG. 4 shows the tip of the mounting portion 50, and the suction (holding) of the electronic component 1 in which the inclination and posture of the desired portion of the substrate 4 on the movable table 31 are the same will be described.

A nozzle holder 51 is attached to the tip of the shaft 12.
The spherical static pressure bearing 52 attached by means has a space 53 between the nozzle holder 51 and the spherical static pressure bearing 52 when the electronic component 1 is not adsorbed. A space 54 formed inside the suction nozzle 5 attached to the tip of the spherical static pressure bearing 52 is opened to the space 53 through the space inside the spherical static pressure bearing 52.

The nozzle section 50 descends a predetermined distance (distance H-height ΔZ) based on the substrate tilt data, and the movable table is moved.
When the suction nozzle 5 comes into contact with the upper portion of the electronic component 1 placed on the bull 31, the tip of the suction nozzle 5 holds the suction nozzle 5 along the inclination of the electronic component 1 and the spherical static pressure bearing 5 is held.
2 rotates. When the tip of the suction nozzle 5 maintains the parallelism with the upper part of the electronic component 1, the controller 20 causes the vacuum pump 1 to operate.
Communication pipe 14 for operating 5 to communicate the inside of the shaft 12
When the space 53 is decompressed through the spherical static pressure bearing 5
2 contacts the nozzle holder-51 while maintaining the posture after rotation, and holds the electronic component 1 in a state where the same inclination as the inclination of the substrate 4 is maintained.

The nozzle portion 50 which has reached a desired position on the substrate 4 by an X-axis driving mechanism (not shown) and a Y-axis driving mechanism (not shown) has a predetermined distance (distance H-substrate height ΔZ). And the lead 2 of the electronic component 1 sucked by the suction nozzle 5 comes into contact with the solder paste 3 on the substrate 4. The shock caused by the vertical vibration generated when the nozzle portion 50 is stopped is absorbed by the spring 8 provided above the suction nozzle 5, and the controller 20 issues a command to stop the operation of the vacuum pump 15. , The suction is released, and the mounting of the electronic component 1 is completed.

As described above, a visible flat laser generator is provided as a light generator for irradiating a desired position on a substrate on which electronic parts are to be mounted with a linearly intersecting light beam, and the visible flat laser generator is provided on the substrate. The recognition camera recognizes the reflected light of the light, and the optical measuring means for measuring the state of the desired portion of the board by measuring the crossing angle of the linear light recognized by the recognition camera is used. Means for accurately measuring the state of the substrate without being influenced by the degree of pattern forming accuracy, and adjusting the attitude of the electronic component held by the mounting nozzle with respect to the substrate based on the measurement result of the optical measuring means. By providing a movable table with a variable table mechanism and a suction nozzle using a spherical pressure suppression bearing,
It is possible to maintain the parallelism between the electronic component and the substrate that are attracted to the tip of the suction nozzle.

Furthermore, since the descending distance of the suction nozzle can be changed based on the substrate height of the substrate inclination data, the descending distance of the lead on each side of the electronic component sucked by the suction nozzle can be changed by the above. It becomes uniform with respect to the solder paste provided on the substrate, and the solder paste provided on the substrate can be mounted with high precision without breaking the solder paste and generating a bridge.

In this embodiment, a visible flat ray is used.
Although the generator is configured to be driven in the X-axis and Y-axis directions together with the nozzle portion, it may be configured to be driven individually. Further, the electronic parts may be placed on the movable table by the nozzle portion instead of the transfer means.

[0049]

According to the present invention, a light generator irradiates a desired position on a substrate with a linear light beam and a recognition camera recognizes the reflected light beam on the substrate with a crossing light beam. However, when the substrate is tilted, the intersecting angle of the linear light recognized by the recognition camera does not match the intersecting angle of the irradiated linear light. The inclination of the substrate can be recognized by measuring the difference in the crossing angle of the recognized linear light. That is, it is possible to measure the inclination of a desired portion of the board on which the electronic component is to be mounted, and to adjust the attitude of the electronic component held by the mounting nozzle with respect to the board based on the measurement result.
The descending distance of the lead on each side of the electronic component held by the mounting nozzle is uniform with respect to the substrate, and uneven pressure does not occur.
Therefore, the solder can be mounted with high accuracy without causing a bridge or lead floating.

[Brief description of drawings]

FIG. 1 is a diagram showing a component supply unit and a mounting main part in an embodiment of a mounting machine of the present invention.

FIG. 2 is a cross-sectional view of a mounting portion on the upper surface of the substrate in the embodiment shown in FIG.

FIG. 3 is a top view of a mounting portion on the upper surface of the substrate in the embodiment shown in FIG.

FIG. 4 is a diagram showing details of a movable table and a table variable mechanism in the embodiment shown in FIG.

FIG. 5 is a diagram showing a leading end portion of a mounting main part in the embodiment shown in FIG.

FIG. 6 is a diagram showing an outline of an overall configuration of a conventional mounting machine.

7 is a diagram showing a mounting portion in the conventional mounting machine shown in FIG.

[Explanation of symbols]

1 ... Electronic component 2 ... Lead
3 ... Solder paste 4 ... Substrate 5 ... Suction nozzle
6 ... EL support plate 7 ... EL illumination plate 8 ... Spring 1
0 ... Nozzle part 11 ... Nozzle holder 12 ... Shaft
13 ... Solenoid valve 14 ... Communication pipe 15 ... Vacuum pump
17 ... Coupling 18 ... Motor 19 ... Base
21 ... Linear guide 23 ... Nut 24 ... Ball screw
25 ... Coupling 26 ... Motor 27 ... Stand
29 ... Space 30 ... CCD camera 31 ... Movable table 32 ... Table variable mechanism 33 ... Tray
34 ... Adsorption nozzles 35, 38, 40, 42, 44, 44a, 44b ...
……… Motors 36, 43, 45a, 45b ……………………………………
……… Guides 37, 39, 41, 46, 46a, 46b ………………
……… Ball screw 47, 47a, 47b ……………………………………………
……… Arms 48a, 48b… Pusher rod
50 ... Nozzle part 51 ... Nozzle holder-52 ... Spherical hydrostatic bearing 53, 54 ... Space 61, 62 ... Line laser light 63, 64 ... Visible line laser generator 65 ... CCD camera 71, 72 ... Reference line 73, 75 ... solid line
74, 76 ... Straight line 100 ... Stand 106 ... Reel 107 ... Tape feeder
108 ... Tray 1001 ... Ball screw 1002 ... Motor
1003 ... Rail 1031 ... Base 1032 ... Ball screw
1033 ... Motor

Front page continuation (72) Inventor Tadayuki Saito 5-2 Koyodai, Ryugasaki-shi, Ibaraki Hitachi Techno Engineering Co., Ltd.

Claims (2)

[Claims] 1. An electronic component is mounted on the substrate by driving a mounting nozzle holding the electronic component onto the surface of the substrate and releasing the holding, wherein the substrate on which the electronic component is mounted is mounted. A light generator that irradiates a desired position with intersecting linear light, and the inclination angle of the desired position of the substrate by measuring the intersecting angle of the reflected light of the light on the substrate captured by a recognition camera. And an attitude adjusting means for adjusting the attitude of the electronic part held by the mounting nozzle according to the inclination of the desired part of the board, and mounting the electronic part on the desired part of the board. A machine equipped with electronic parts. 2. The electronic component mounting machine according to claim 1, further comprising a transfer means for mounting the electronic component on a movable table, wherein the optical measuring means has an angle indicating an inclination of the substrate and The height at the center of the mounting location is measured as the board tilt data, the table surface tilt and the height of the movable table are measured as the table tilt data, and the attitude adjusting means is configured to move the board. Tilt data and the
An electronic component mounting machine, characterized in that the amount of change in the movable table is obtained as a correction value by performing a comparison calculation with the bull tilt data.