JPH0848001A - Copper clad laminated sheet - Google Patents
Copper clad laminated sheetInfo
- Publication number
- JPH0848001A JPH0848001A JP18557994A JP18557994A JPH0848001A JP H0848001 A JPH0848001 A JP H0848001A JP 18557994 A JP18557994 A JP 18557994A JP 18557994 A JP18557994 A JP 18557994A JP H0848001 A JPH0848001 A JP H0848001A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- powder
- resin
- clad laminate
- varnish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 26
- 239000010949 copper Substances 0.000 title claims abstract description 26
- 239000000843 powder Substances 0.000 claims abstract description 41
- 239000002966 varnish Substances 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 239000011521 glass Substances 0.000 claims abstract description 25
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 18
- 239000000057 synthetic resin Substances 0.000 claims abstract description 18
- 239000011889 copper foil Substances 0.000 claims abstract description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 11
- 239000003822 epoxy resin Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 10
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 10
- -1 polyethylene Polymers 0.000 claims abstract description 10
- 239000004698 Polyethylene Substances 0.000 claims abstract description 9
- 229920000573 polyethylene Polymers 0.000 claims abstract description 9
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 7
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 7
- 238000010526 radical polymerization reaction Methods 0.000 claims abstract description 7
- 239000004793 Polystyrene Substances 0.000 claims abstract description 6
- 229920002223 polystyrene Polymers 0.000 claims abstract description 6
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 4
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 abstract 1
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 abstract 1
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000004744 fabric Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229920001567 vinyl ester resin Polymers 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical group CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子機器等の部品であ
るプリント配線板等の材料として使用される銅張積層板
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper clad laminate used as a material for a printed wiring board which is a component of electronic equipment or the like.
【０００２】[0002]
【従来の技術】従来、熱硬化性樹脂を含むワニスをガラ
ス基材に含浸した含浸品を複数枚重ねたものと、この重
ねたものの少なくとも一方の表面に配した銅箔を一体化
してなる銅張積層板は、プリント配線板の材料として広
く使用されている。また、上記のワニス中に水酸化アル
ミ等の無機充填材を分散させて、厚み方向の線膨張係数
を低減することも知られている。銅張積層板に使用され
る熱硬化性樹脂の例としては、ビニルエステル樹脂等の
ラジカル重合型樹脂やエポキシ樹脂等があげられる。そ
して、ラジカル重合型樹脂を使用した場合には、ワニス
をガラス基材に含浸させる工程から、含浸品と銅箔とを
一体化する工程までを連続的に行うことが可能であり、
従って長尺のガラス基材と長尺の銅箔とを切断すること
なく一体化できるので、ロスが少なく製造できる利点が
ある。また、エポキシ樹脂を使用した場合には、ワニス
をガラス基材に含浸、加熱して溶剤を除去し、その後所
定寸法に切断してプリプレグを得、次いでこのプリプレ
グを所定枚数だけ積層し、銅箔と一体化して銅張積層板
が製造されている。2. Description of the Related Art Conventionally, copper is obtained by integrating a plurality of impregnated products in which a glass substrate is impregnated with a varnish containing a thermosetting resin and a copper foil arranged on at least one surface of the laminated products. The stretched laminated board is widely used as a material for printed wiring boards. It is also known to disperse an inorganic filler such as aluminum hydroxide in the above varnish to reduce the linear expansion coefficient in the thickness direction. Examples of the thermosetting resin used for the copper clad laminate include radical polymerization type resins such as vinyl ester resin and epoxy resin. Then, when the radical polymerization type resin is used, it is possible to continuously perform from the step of impregnating the glass base material with the varnish to the step of integrating the impregnated product and the copper foil,
Therefore, since the long glass base material and the long copper foil can be integrated without cutting, there is an advantage that manufacturing can be performed with little loss. When an epoxy resin is used, a glass base material is impregnated with varnish, heated to remove the solvent, and then cut into a predetermined size to obtain a prepreg, and then a predetermined number of the prepreg are laminated to form a copper foil. And a copper clad laminate are manufactured.
【０００３】近年、プリント配線板の高密度化が急速に
進んでいる。高密度に微細な配線パターンを形成したプ
リント配線板を歩留り良く製造するには、寸法変化の小
さい銅張積層板であることが望ましく、そのためには銅
張積層板の面方向の線膨張係数を小さく抑えることが求
められている。In recent years, the density of printed wiring boards has been rapidly increased. In order to manufacture a printed wiring board with a fine wiring pattern formed in high density with good yield, it is desirable that the copper-clad laminate has a small dimensional change. For that purpose, the coefficient of linear expansion in the plane direction of the copper-clad laminate is required. It is required to keep it small.
【０００４】[0004]
【発明が解決しようとする課題】上記の事情に鑑み、本
発明は、面方向の線膨張係数が小さくなるように改善さ
れた銅張積層板を提供することを目的としている。SUMMARY OF THE INVENTION In view of the above circumstances, it is an object of the present invention to provide a copper clad laminate having an improved linear expansion coefficient in the plane direction.
【０００５】[0005]
【課題を解決するための手段】本発明の請求項１に係る
銅張積層板は、熱硬化性樹脂を含むワニスをガラス基材
に含浸した含浸品を複数枚重ねたものと、この重ねたも
のの少なくとも一方の表面に配した銅箔を一体化してな
る銅張積層板において、前記ワニスが合成樹脂パウダー
が分散されているワニスであることを特徴としている。The copper-clad laminate according to claim 1 of the present invention is obtained by stacking a plurality of impregnated products obtained by impregnating a glass base material with a varnish containing a thermosetting resin, and by stacking the same. In a copper-clad laminate obtained by integrating copper foils arranged on at least one surface of the product, the varnish is a varnish in which a synthetic resin powder is dispersed.
【０００６】本発明の請求項２に係る銅張積層板は、請
求項１記載の銅張積層板において、熱硬化性樹脂がラジ
カル重合型樹脂であることを特徴としている。A copper clad laminate according to a second aspect of the present invention is characterized in that, in the copper clad laminate according to the first aspect, the thermosetting resin is a radical polymerization type resin.
【０００７】本発明の請求項３に係る銅張積層板は、請
求項１記載の銅張積層板において、熱硬化性樹脂が分子
内に２個以上のエポキシ基を有するエポキシ樹脂である
ことを特徴としている。The copper clad laminate according to claim 3 of the present invention is the copper clad laminate according to claim 1, wherein the thermosetting resin is an epoxy resin having two or more epoxy groups in the molecule. It has a feature.
【０００８】本発明の請求項４に係る銅張積層板は、請
求項１、請求項２または請求項３記載の銅張積層板にお
いて、合成樹脂パウダーがポリエチレンパウダー、架橋
ポリスチレンパウダーまたは架橋アクリル樹脂パウダー
であることを特徴としている。The copper clad laminate according to claim 4 of the present invention is the copper clad laminate according to claim 1, 2 or 3, wherein the synthetic resin powder is polyethylene powder, crosslinked polystyrene powder or crosslinked acrylic resin. It is characterized by being powder.
【０００９】以下、本発明を詳細に説明する。本発明で
使用する熱硬化性樹脂については、特に限定するもので
はないが、例えばラジカル重合型樹脂やエポキシ樹脂等
が使用できる。そしてワニス化については、やはり特に
限定するものではないが、ラジカル重合型樹脂の場合に
は、ビニルエステル樹脂、不飽和ポリエステル樹脂ある
いはこれらの混合物にスチレンモノマー、ラジカル開始
剤を添加してワニスとすることができ、一方、エポキシ
樹脂の場合には、ビスフェノールＡ型エポキシ樹脂等の
分子内に２個以上のエポキシ基を有するエポキシ樹脂と
ジシアンジアミド等の硬化剤とイミダゾール等の硬化助
剤を配合したものを、メチルエチルケトン、プロピレン
セロソルブ、ジメチルホルムアミド等の溶剤に溶解して
ワニスとすることができる。本発明のワニスには、必要
に応じて水酸化アルミ等の無機充填材を分散させておく
こともできる。The present invention will be described in detail below. The thermosetting resin used in the present invention is not particularly limited, but, for example, a radical polymerization type resin or an epoxy resin can be used. The varnishing is not particularly limited, but in the case of a radical polymerization type resin, a styrene monomer and a radical initiator are added to a vinyl ester resin, an unsaturated polyester resin or a mixture thereof to form a varnish. On the other hand, in the case of an epoxy resin, a mixture of an epoxy resin having two or more epoxy groups in the molecule such as bisphenol A type epoxy resin, a curing agent such as dicyandiamide and a curing aid such as imidazole. Can be dissolved in a solvent such as methyl ethyl ketone, propylene cellosolve, or dimethylformamide to form a varnish. If necessary, an inorganic filler such as aluminum hydroxide may be dispersed in the varnish of the present invention.
【００１０】本発明で使用するガラス基材としては、例
えば、ガラス布、ガラスマット、ガラスペーパー等が挙
げられ、バインダー、表面処理剤あるいは合成繊維等を
含んでいるものを使用することもできる。また、本発明
で使用する銅箔については、特に限定はなく、電解銅箔
や圧延銅箔等を使用できる。The glass substrate used in the present invention includes, for example, glass cloth, glass mat, glass paper and the like, and those containing a binder, a surface treating agent, synthetic fibers or the like can also be used. The copper foil used in the present invention is not particularly limited, and electrolytic copper foil, rolled copper foil, etc. can be used.
【００１１】本発明で使用する合成樹脂パウダーとして
はワニスに分散するものであればよく、平均粒径として
は０．０５〜１００μｍであることが良好な分散性を確
保するためには好ましい。合成樹脂パウダーの具体例と
してはポリエチレンパウダー、架橋ポリスチレンパウダ
ー、架橋アクリル樹脂パウダー等が挙げられる。この中
の架橋アクリル樹脂パウダーとしては、シード重合法に
よって得られる架橋ＰＭＭＡパウダーやシェル成分が架
橋ＰＭＭＡで、コア成分がアクリルゴムで構成されてい
るコアシェル構造を有する微粒子を使用することができ
る。本発明ではワニス中に合成樹脂パウダーが分散され
ているが、合成樹脂パウダーの添加割合については、ワ
ニス全配合量に対し、０．５〜２０重量％であることが
好ましい。０．５重量％より少ないと、面方向の線膨張
係数を小さくする効果が顕著でなくなり、２０重量％よ
り多いとワニスの増粘が著しくなり、ガラス基材への均
一な含浸が困難になる場合が生じる。The synthetic resin powder used in the present invention may be any that can be dispersed in a varnish, and the average particle size is preferably 0.05 to 100 μm in order to ensure good dispersibility. Specific examples of the synthetic resin powder include polyethylene powder, crosslinked polystyrene powder, crosslinked acrylic resin powder and the like. As the crosslinked acrylic resin powder in this, crosslinked PMMA powder obtained by a seed polymerization method or fine particles having a core-shell structure in which the shell component is crosslinked PMMA and the core component is acrylic rubber can be used. In the present invention, the synthetic resin powder is dispersed in the varnish, but the addition ratio of the synthetic resin powder is preferably 0.5 to 20% by weight based on the total amount of the varnish. If it is less than 0.5% by weight, the effect of reducing the linear expansion coefficient in the surface direction is not remarkable, and if it is more than 20% by weight, the viscosity of the varnish becomes remarkable and it becomes difficult to uniformly impregnate the glass substrate. There are cases.
【００１２】[0012]
【作用】本発明で、合成樹脂パウダーを分散させたワニ
スをガラス基材に含浸した含浸品を使用することは、銅
張積層板の面方向の線膨張係数を小さくするよう作用す
る。In the present invention, the use of the impregnated product in which the glass substrate is impregnated with the varnish in which the synthetic resin powder is dispersed serves to reduce the linear expansion coefficient in the surface direction of the copper clad laminate.
【００１３】[0013]
【実施例】以下、本発明を実施例及び比較例に基づいて
説明する。EXAMPLES The present invention will be described below based on Examples and Comparative Examples.
【００１４】（実施例１〜実施例４及び比較例１）表１
に示す原材料を、表１に示す割合で配合し、ディスパー
で十分に攪拌して樹脂ワニスを作製した。表１に示す各
原材料の詳細を下記に示す。(Examples 1 to 4 and Comparative Example 1) Table 1
The raw materials shown in Table 1 were mixed in the proportions shown in Table 1 and sufficiently stirred with a disper to prepare a resin varnish. Details of each raw material shown in Table 1 are shown below.
【００１５】ビニルエステル樹脂としては昭和高分子
（株）製の品番Ｓ５１０を使用し、無機充填材として
は、水酸化アルミである住友化学工業（株）製の品番Ｃ
−３０３を使用し、ラジカル開始剤としてはクメンハイ
ドロパーオキサイドを使用した。また、合成樹脂パウダ
ーの１種であるポリエチレンパウダーとしては住友精化
（株）製の商品名「フローセンＵＦ」（平均粒径２０μ
ｍ）を使用し、合成樹脂パウダーの１種である架橋ポリ
スチレンパウダーとしては綜研化学（株）製の品番ＳＧ
Ｐ−７０Ｃ（平均粒径２０μｍ）を使用し、合成樹脂パ
ウダーの１種である架橋アクリル樹脂パウダーとしては
武田薬品工業（株）製の商品名「スタフィロイドＡＣ３
３５５」（平均粒径０．５μｍ）を使用した。As the vinyl ester resin, product number S510 manufactured by Showa High Polymer Co., Ltd. is used, and as the inorganic filler, aluminum hydroxide is product number C manufactured by Sumitomo Chemical Co., Ltd.
-303 was used, and cumene hydroperoxide was used as a radical initiator. As a polyethylene powder, which is one of the synthetic resin powders, a product name “FLOWSEN UF” manufactured by Sumitomo Seika Chemicals Ltd. (average particle size 20 μm
m) is used as a cross-linked polystyrene powder, which is a kind of synthetic resin powder, manufactured by Soken Chemical Co., Ltd.
P-70C (average particle size 20 μm) is used, and as a cross-linked acrylic resin powder which is one kind of synthetic resin powder, Takeda Yakuhin Kogyo Co., Ltd. trade name “Stafloyd AC3
355 "(average particle size 0.5 μm) was used.
【００１６】そして、上記の樹脂ワニスを厚さ２００μ
ｍの平織ガラス布（大きさ３００ｍｍ×３００ｍｍ）及
び単重５１ｇ／ｍ2 、密度０．１４ｇ／ｃｍ3 のガラス
ペーパー（大きさ３００ｍｍ×３００ｍｍ）にそれぞれ
含浸した。次いで、ガラスペーパー含浸品２枚を中央に
して、その上下にガラス布含浸品を各１枚配して、サン
ドイッチ構造に重ねたものを作製し、この重ねたものの
両側の表面に厚さ１８μｍの銅箔（大きさ３００ｍｍ×
３００ｍｍ）を配し、次いでこの積層物を金属プレート
の間にはさみ、平置きの状態で、１１０℃で６０分間加
熱硬化させ、さらに１７０℃で３０分間アフターキュア
ーし、厚さ１．６ｍｍの両面銅張積層板を得た。なお、
ガラス布、ガラスペーパー及び銅箔の連続流れ方向をタ
テ方向とし、積層する際には各材料のタテ方向が同一方
向になるよう積層した。（ヨコ方向はタテ方向と直交す
る方向である。） 得られた銅張積層板の面方向（タテ方向及びヨコ方向）
の線膨張係数を下記の方法で測定し、得られた結果を表
１に示した。 〔線膨張係数の測定方法〕 測定用試料：銅箔をエッチングにより除去した積層板 測定装置 ：理学電機（株）製のＴＭＡ装置（ＴＡＳ−
１００） 測定条件 ：昇温スピード５℃／分、測定温度範囲４０
〜１５０℃Then, the above resin varnish is applied to a thickness of 200 μm.
m of plain woven glass cloth (size 300 mm × 300 mm) and glass paper of single weight 51 g / m 2 and density 0.14 g / cm 3 (size 300 mm × 300 mm) were respectively impregnated. Then, two glass paper-impregnated products were placed at the center, and one glass cloth-impregnated product was placed on each of the upper and lower parts of the glass paper-impregnated product to form a sandwich structure. Copper foil (size 300 mm x
300 mm), and then sandwiching this laminate between metal plates, heat-curing at 110 ° C. for 60 minutes in a flat state, and after-curing at 170 ° C. for 30 minutes to obtain a double-sided sheet having a thickness of 1.6 mm. A copper clad laminate was obtained. In addition,
The continuous flow direction of the glass cloth, the glass paper, and the copper foil was the vertical direction, and when laminating, the vertical directions of the respective materials were the same. (The horizontal direction is the direction orthogonal to the vertical direction.) The plane direction of the obtained copper-clad laminate (the vertical direction and the horizontal direction)
The linear expansion coefficient of was measured by the following method, and the obtained results are shown in Table 1. [Measurement method of linear expansion coefficient] Sample for measurement: Laminated plate with copper foil removed by etching Measuring device: TMA device (TAS- manufactured by Rigaku Denki Co., Ltd.)
100) Measurement conditions: Temperature rising speed 5 ° C / min, measurement temperature range 40
~ 150 ° C
【００１７】[0017]
【表１】 [Table 1]
【００１８】（実施例５）実施例３で使用した樹脂ワニ
スと同一の樹脂ワニスを厚さ２００μｍの平織ガラス布
（大きさ３００ｍｍ×３００ｍｍ）に含浸して含浸品を
作製した。次に、この含浸品を８枚重ね、重ねたものの
両側の表面に厚さ１８μｍの銅箔（大きさ３００ｍｍ×
３００ｍｍ）を配し、次いでこの積層物を金属プレート
の間にはさみ、平置きの状態で、１１０℃で６０分間加
熱硬化させ、さらに１７０℃で３０分間アフターキュア
ーし、厚さ１．６ｍｍの両面銅張積層板を得た。なお、
ガラス布及び銅箔の連続流れ方向をタテ方向とし、積層
する際には各材料のタテ方向が同一方向になるよう積層
した。（ヨコ方向はタテ方向と直交する方向である。） 得られた銅張積層板の面方向（タテ方向及びヨコ方向）
の線膨張係数を実施例１と同様の方法で測定し、得られ
た結果を表２に示した。Example 5 A plain woven glass cloth (size 300 mm × 300 mm) having a thickness of 200 μm was impregnated with the same resin varnish as the resin varnish used in Example 3 to prepare an impregnated product. Next, 8 sheets of this impregnated product were stacked, and copper foil of 18 μm thickness (size 300 mm ×
300 mm), and then sandwiching this laminate between metal plates, heat-curing at 110 ° C. for 60 minutes in a flat state, and after-curing at 170 ° C. for 30 minutes to obtain a double-sided sheet having a thickness of 1.6 mm. A copper clad laminate was obtained. In addition,
The continuous flow direction of the glass cloth and the copper foil was the vertical direction, and when laminating, the vertical directions of the respective materials were the same. (The horizontal direction is the direction orthogonal to the vertical direction.) The plane direction of the obtained copper-clad laminate (the vertical direction and the horizontal direction)
The linear expansion coefficient of was measured by the same method as in Example 1, and the obtained results are shown in Table 2.
【００１９】（比較例２）比較例１で使用した樹脂ワニ
スと同一の樹脂ワニスを厚さ２００μｍの平織ガラス布
（大きさ３００ｍｍ×３００ｍｍ）に含浸して含浸品を
作製した。この含浸品を使用した以外は実施例５と同様
にして厚さ１．６ｍｍの両面銅張積層板を得た。得られ
た銅張積層板の面方向（タテ方向及びヨコ方向）の線膨
張係数を実施例１と同様の方法で測定し、得られた結果
を表２に示した。Comparative Example 2 A 200 μm thick plain woven glass cloth (size 300 mm × 300 mm) was impregnated with the same resin varnish as used in Comparative Example 1 to prepare an impregnated product. A double-sided copper-clad laminate having a thickness of 1.6 mm was obtained in the same manner as in Example 5 except that this impregnated product was used. The coefficient of linear expansion of the obtained copper clad laminate in the plane direction (vertical direction and horizontal direction) was measured by the same method as in Example 1, and the obtained results are shown in Table 2.
【００２０】（実施例６）下記の配合割合で各原材料を
配合した。 エポキシ樹脂：東都化成（株）製の品番ＹＤＢ４００
を１００重量部 硬化剤：ジシアンジアミドを２．６重量部 硬化促進剤：２エチル４メチルイミダゾールを０．１
重量部 ポリエチレンパウダー：住友精化（株）製の商品名
「フローセンＵＦ」（平均粒径２０μｍ）を１０重量部 溶剤：メチルエチルケトンを４６重量部及びジメチル
ホルムアミドを２０重量部 上記の配合物を５０℃、３０分間ディスパーで攪拌混合
し、合成樹脂パウダーを分散させた樹脂ワニスを得た。
この樹脂ワニスを厚さ２００μｍの平織ガラス布（大き
さ３００ｍｍ×３００ｍｍ）に含浸し、次いで１５０
℃、５分間乾燥して溶媒を除去し、プリプレグを得
た。。次に、このプリプレグを８枚重ね、重ねたものの
両側の表面に厚さ１８μｍの銅箔（大きさ３００ｍｍ×
３００ｍｍ）を配し、次いでこの積層物を金属プレート
の間にはさみ、圧力４０ｋｇ／ｃｍ2 、１７０℃、６０
分間の条件でプレス成形を行い、厚さ１．６ｍｍの両面
銅張積層板を得た。得られた銅張積層板の面方向（タテ
方向及びヨコ方向）の線膨張係数を実施例１と同様の方
法で測定し、得られた結果を表２に示した。Example 6 Each raw material was blended in the following blending ratio. Epoxy resin: product number YDB400 manufactured by Tohto Kasei Co., Ltd.
100 parts by weight Curing agent: 2.6 parts by weight of dicyandiamide Curing accelerator: 0.1% of 2 ethyl 4-methylimidazole
Parts by weight Polyethylene powder: 10 parts by weight of the product name "FLOWCEN UF" (average particle size 20 μm) manufactured by Sumitomo Seika Co., Ltd. Solvent: 46 parts by weight of methyl ethyl ketone and 20 parts by weight of dimethylformamide. The mixture was stirred and mixed with a disper for 30 minutes to obtain a resin varnish in which a synthetic resin powder was dispersed.
A 200 μm thick plain woven glass cloth (size: 300 mm × 300 mm) was impregnated with this resin varnish, and then 150
The solvent was removed by drying at 5 ° C for 5 minutes to obtain a prepreg. . Next, eight prepregs were stacked, and copper foil having a thickness of 18 μm (size 300 mm ×
300 mm) and then sandwiching the laminate between metal plates, pressure 40 kg / cm 2 , 170 ° C., 60
Press molding was performed under the condition of 1 minute to obtain a double-sided copper-clad laminate having a thickness of 1.6 mm. The coefficient of linear expansion of the obtained copper clad laminate in the plane direction (vertical direction and horizontal direction) was measured by the same method as in Example 1, and the obtained results are shown in Table 2.
【００２１】（実施例７）実施例６におけるポリエチレ
ンパウダーに代えて、合成樹脂パウダーの１種である架
橋ポリスチレンパウダー〔綜研化学（株）製の品番ＳＧ
Ｐ−７０Ｃ（平均粒径２０μｍ）〕を１０重量部配合す
るようにした以外は実施例６と同様にして厚さ１．６ｍ
ｍの両面銅張積層板を得た。得られた銅張積層板の面方
向（タテ方向及びヨコ方向）の線膨張係数を実施例１と
同様の方法で測定し、得られた結果を表２に示した。(Example 7) Instead of the polyethylene powder in Example 6, a crosslinked polystyrene powder which is one kind of synthetic resin powder [Product No. SG manufactured by Soken Chemical Industry Co., Ltd.]
P-70C (average particle size 20 μm)] was mixed in an amount of 10 parts by weight in the same manner as in Example 6 to obtain a thickness of 1.6 m.
A double-sided copper clad laminate of m was obtained. The coefficient of linear expansion of the obtained copper clad laminate in the plane direction (vertical direction and horizontal direction) was measured by the same method as in Example 1, and the obtained results are shown in Table 2.
【００２２】（実施例８）実施例６におけるポリエチレ
ンパウダーに代えて、合成樹脂パウダーの１種である架
橋アクリル樹脂パウダー〔武田薬品工業（株）製の商品
名「スタフィロイドＡＣ３３５５」（平均粒径０．５μ
ｍ）〕を１０重量部配合するようにした以外は実施例６
と同様にして厚さ１．６ｍｍの両面銅張積層板を得た。
得られた銅張積層板の面方向（タテ方向及びヨコ方向）
の線膨張係数を実施例１と同様の方法で測定し、得られ
た結果を表２に示した。(Example 8) In place of the polyethylene powder in Example 6, a crosslinked acrylic resin powder which is one kind of synthetic resin powder [trade name "Stafloid AC3355" manufactured by Takeda Pharmaceutical Co., Ltd. (average particle size) 0.5μ
m)] was added in an amount of 10 parts by weight.
A double-sided copper-clad laminate having a thickness of 1.6 mm was obtained in the same manner as in.
Surface direction of the obtained copper clad laminate (vertical direction and horizontal direction)
The linear expansion coefficient of was measured by the same method as in Example 1, and the obtained results are shown in Table 2.
【００２３】（比較例３）実施例６においてポリエチレ
ンパウダーを配合しないようにした以外は実施例６と同
様にして厚さ１．６ｍｍの両面銅張積層板を得た。得ら
れた銅張積層板の面方向（タテ方向及びヨコ方向）の線
膨張係数を実施例１と同様の方法で測定し、得られた結
果を表２に示した。Comparative Example 3 A double-sided copper-clad laminate having a thickness of 1.6 mm was obtained in the same manner as in Example 6 except that polyethylene powder was not added in Example 6. The coefficient of linear expansion of the obtained copper clad laminate in the plane direction (vertical direction and horizontal direction) was measured by the same method as in Example 1, and the obtained results are shown in Table 2.
【００２４】[0024]
【表２】 [Table 2]
【００２５】表１及び表２にみるように、実施例１〜４
は比較例１より、実施例５は比較例２より、そして実施
例６〜８は比較例３よりそれぞれ面方向（タテ方向及び
ヨコ方向）の線膨張係数が小さい積層板が得られている
ことが確認された。As shown in Tables 1 and 2, Examples 1 to 4
Indicates that a laminated plate having a smaller linear expansion coefficient in the surface direction (vertical direction and horizontal direction) than in Comparative Example 1, Example 5 in Comparative Example 2, and Examples 6 to 8 in Comparative Example 3 is obtained. Was confirmed.
【００２６】[0026]
【発明の効果】本発明の銅張積層板は合成樹脂パウダー
を分散させたワニスをガラス基材に含浸した含浸品と銅
箔を一体化した構成であるため、本発明によれば面方向
の線膨張係数が小さいという優れた性質を有する銅張積
層板が得られる。The copper-clad laminate of the present invention has a structure in which the impregnated product obtained by impregnating the glass substrate with the varnish in which the synthetic resin powder is dispersed and the copper foil are integrated. A copper clad laminate having the excellent property of having a small linear expansion coefficient can be obtained.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 徳永 嘉則 大阪府門真市大字門真1048番地松下電工株 式会社内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Yoshinori Tokunaga 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works Co., Ltd.
Claims (4)
に含浸した含浸品を複数枚重ねたものと、この重ねたも
のの少なくとも一方の表面に配した銅箔を一体化してな
る銅張積層板において、前記ワニスが合成樹脂パウダー
が分散されているワニスであることを特徴とする銅張積
層板。1. A copper clad laminate in which a plurality of impregnated products obtained by impregnating a glass base material with a varnish containing a thermosetting resin are stacked and a copper foil disposed on at least one surface of the stacked products are integrated. In the plate, a copper-clad laminate characterized in that the varnish is a varnish in which a synthetic resin powder is dispersed.
ることを特徴とする請求項１記載の銅張積層板。2. The copper-clad laminate according to claim 1, wherein the thermosetting resin is a radical polymerization type resin.
キシ基を有するエポキシ樹脂であることを特徴とする請
求項１記載の銅張積層板。3. The copper clad laminate according to claim 1, wherein the thermosetting resin is an epoxy resin having two or more epoxy groups in the molecule.
ー、架橋ポリスチレンパウダーまたは架橋アクリル樹脂
パウダーであることを特徴とする請求項１、請求項２ま
たは請求項３記載の銅張積層板。4. The copper-clad laminate according to claim 1, wherein the synthetic resin powder is polyethylene powder, crosslinked polystyrene powder or crosslinked acrylic resin powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18557994A JPH0848001A (en) | 1994-08-08 | 1994-08-08 | Copper clad laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18557994A JPH0848001A (en) | 1994-08-08 | 1994-08-08 | Copper clad laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0848001A true JPH0848001A (en) | 1996-02-20 |
Family
ID=16173285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18557994A Withdrawn JPH0848001A (en) | 1994-08-08 | 1994-08-08 | Copper clad laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0848001A (en) |
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| WO2008102853A1 (en) | 2007-02-23 | 2008-08-28 | Panasonic Electric Works Co., Ltd. | Epoxy resin composition, prepreg, laminates and printed wiring boards |
| WO2010109861A1 (en) | 2009-03-27 | 2010-09-30 | 三菱瓦斯化学株式会社 | Method of storing resin solution and processes for producing prepreg and laminate |
| WO2012165240A1 (en) | 2011-05-27 | 2012-12-06 | 三菱瓦斯化学株式会社 | Resin composition, prepreg and laminate |
| KR20130018721A (en) | 2010-03-02 | 2013-02-25 | 미츠비시 가스 가가쿠 가부시키가이샤 | Resin composition, prepreg, and laminated sheet |
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-
1994
- 1994-08-08 JP JP18557994A patent/JPH0848001A/en not_active Withdrawn
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2008102853A1 (en) | 2007-02-23 | 2008-08-28 | Panasonic Electric Works Co., Ltd. | Epoxy resin composition, prepreg, laminates and printed wiring boards |
| WO2010109861A1 (en) | 2009-03-27 | 2010-09-30 | 三菱瓦斯化学株式会社 | Method of storing resin solution and processes for producing prepreg and laminate |
| KR20110138232A (en) | 2009-03-27 | 2011-12-26 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | Preservation method of resin solution, prepreg and manufacturing method of laminated board |
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| WO2012165240A1 (en) | 2011-05-27 | 2012-12-06 | 三菱瓦斯化学株式会社 | Resin composition, prepreg and laminate |
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| KR20150072425A (en) | 2012-10-19 | 2015-06-29 | 미츠비시 가스 가가쿠 가부시키가이샤 | Resin composition, prepreg, laminate, and printed wiring board |
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