JPH08320657A - Display device and manufacturing method thereof - Google Patents
Display device and manufacturing method thereofInfo
- Publication number
- JPH08320657A JPH08320657A JP12527295A JP12527295A JPH08320657A JP H08320657 A JPH08320657 A JP H08320657A JP 12527295 A JP12527295 A JP 12527295A JP 12527295 A JP12527295 A JP 12527295A JP H08320657 A JPH08320657 A JP H08320657A
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- display device
- light emitting
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 230000017525 heat dissipation Effects 0.000 claims abstract description 83
- 238000003780 insertion Methods 0.000 claims abstract description 60
- 230000037431 insertion Effects 0.000 claims abstract description 60
- 229920005989 resin Polymers 0.000 claims abstract description 45
- 239000011347 resin Substances 0.000 claims abstract description 45
- 239000011159 matrix material Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 230000000903 blocking effect Effects 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F27/00—Combined visual and audible advertising or displaying, e.g. for public address
- G09F27/008—Sun shades, shades, hoods or louvres on electronic displays to minimise the effect of direct sun light on the display
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
Abstract
(57)【要約】
【目的】 LED表示装置内部の使用時の温度を低下さ
せ、当該装置に高コントラストで寿命が長い表示を行わ
せ、かつ当該装置を連続使用する。
【構成】 LED表示装置11の筺体15の開口部に複
数のLED12がマトリクス状に配置されている。各L
ED12はLED12の駆動回路が実装されたプリント
配線板13に個々に接続されている。プリント配線板1
3およびLED12近傍には、プリント配線板13表面
やLED12のリード線を覆う防水樹脂層を介して、熱
伝導率の高い物質で形成された放熱板16が、マトリク
ス状に配置された複数の挿通孔にLED12を貫通させ
て設置される。プリント配線板13およびLED12か
ら放出される熱は、防水樹脂層、放熱板16、および遮
光板19に伝達され、遮光板19から大気中に放出され
る。放熱板16には、2列の挿通孔毎に列方向に延び、
挿通孔と連通された排水用の溝が形成される。
(57) [Abstract] [Purpose] The temperature inside the LED display device during use is lowered to allow the device to display a high-contrast and long-life display and to continuously use the device. [Structure] A plurality of LEDs 12 are arranged in a matrix in an opening of a housing 15 of an LED display device 11. Each L
The ED 12 is individually connected to the printed wiring board 13 on which the drive circuit of the LED 12 is mounted. Printed wiring board 1
3 and the vicinity of the LED 12, through a waterproof resin layer that covers the surface of the printed wiring board 13 and the lead wires of the LED 12, a heat dissipation plate 16 formed of a substance having a high thermal conductivity is provided in a plurality of insertions arranged in a matrix. The LED 12 is installed through the hole. The heat emitted from the printed wiring board 13 and the LED 12 is transferred to the waterproof resin layer, the heat dissipation plate 16, and the light shielding plate 19, and is emitted from the light shielding plate 19 to the atmosphere. The heat dissipation plate 16 extends in the row direction for every two rows of insertion holes,
A drainage groove is formed in communication with the insertion hole.
Description
【0001】[0001]
【産業上の利用分野】本発明は、道路などの屋外に設置
される情報表示装置として好適に実施される表示装置お
よびその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device suitable for use as an information display device installed outdoors such as on a road, and a manufacturing method thereof.
【0002】[0002]
【従来の技術】以下のようにして構成され、複数の発光
ダイオード(以後、「LED」と略称する)をマトリク
ス状に配置したLED表示装置は、道路などの屋外で使
用されることを主たる目的としている。2. Description of the Related Art An LED display device having a plurality of light emitting diodes (hereinafter abbreviated as "LED") arranged in a matrix, which is constructed as follows, is mainly intended to be used outdoors such as on a road. I am trying.
【0003】図9は、従来例であるLED表示装置の簡
略化した構造を説明するための断面図である。LED表
示装置は、マトリクス上に配置される複数個のLED1
を含んで構成され、LED1はそれぞれ個別的にプリン
ト配線板2の配線に接続されている。プリント配線板2
は、LED1の点灯/非点灯を制御する駆動回路を有す
る。LED1の点灯/非点灯を制御する制御信号、およ
びLED1を点灯するための電力は、筺体3に設けられ
た図示しない開口部を通して、外部からケーブルなどに
よって、プリント配線板2の駆動回路に供給されてい
る。前記プリント配線板2を構成し、前記駆動回路およ
び配線が実装される基板は、たとえば樹脂材料で実現さ
れる。プリント配線板2は、一方面が開口した筺体3内
に収納されている。プリント配線板2に実装されるLE
D1の先端は、前記開口部から筺体3外方に突出してい
る。FIG. 9 is a sectional view for explaining a simplified structure of a conventional LED display device. The LED display device includes a plurality of LEDs 1 arranged in a matrix.
The LED 1 is individually connected to the wiring of the printed wiring board 2. Printed wiring board 2
Has a drive circuit for controlling lighting / non-lighting of the LED 1. A control signal for controlling lighting / non-lighting of the LED 1 and electric power for lighting the LED 1 are externally supplied to a drive circuit of the printed wiring board 2 by a cable or the like through an opening (not shown) provided in the housing 3. ing. The substrate that constitutes the printed wiring board 2 and on which the drive circuit and the wiring are mounted is realized by, for example, a resin material. The printed wiring board 2 is housed in a housing 3 whose one surface is open. LE mounted on the printed wiring board 2
The tip of D1 projects outside the housing 3 from the opening.
【0004】筺体3の開口部には、遮光板4が取付けら
れている。遮光板4は、太陽光が直接LED1に当た
り、LED1による表示のコントラストが低下すること
を防止するために設けられ、上方からの太陽光をLED
1に直接当たらないように遮る庇状の部材4aが、マト
リクス状に配置されたLED1の水平方向の一段毎に形
成される。前記遮光板4は、ポリカーボネイトなどの樹
脂によって実現される。さらに、LED1が配置された
側の面から雨などが筺体3内部に浸入しないように、シ
リコンなどの耐水性の樹脂がプリント配線板2表面とL
ED1の下部との間に充填され、防水樹脂層5を形成し
ている。A light-shielding plate 4 is attached to the opening of the housing 3. The light-shielding plate 4 is provided to prevent sunlight from directly hitting the LED 1 and lowering the display contrast of the LED 1.
Eave-shaped members 4a that block the LEDs 1 from directly hitting the LEDs 1 are formed for each row in the horizontal direction of the LEDs 1 arranged in a matrix. The light shielding plate 4 is realized by a resin such as polycarbonate. Further, a waterproof resin such as silicon is used to prevent the rain from entering the inside of the housing 3 from the surface on which the LED 1 is arranged and the surface of the printed wiring board 2 and L.
The waterproof resin layer 5 is formed between the lower part of the ED 1 and the lower part.
【0005】LED1は、点灯すると発熱し、かつ温度
上昇に伴って明るさが低下するという特性を有する。さ
らに、プリント配線板2の駆動回路は、LED1を点灯
させると熱を生じる。このように、LED1を点灯させ
た際に生じる熱は、LED1の表示のコントラストを低
下させ、LED表示装置の寿命を低下させる原因となっ
ている。これを防止するために、筺体3には、図示しな
い冷却手段が設けられ発熱するLED1およびプリント
配線板2の駆動回路を冷却している。冷却手段には、た
とえば空冷ファンなどが用いられる。The LED 1 has a characteristic that when it is turned on, it generates heat and its brightness decreases as the temperature rises. Further, the drive circuit of the printed wiring board 2 generates heat when the LED 1 is turned on. As described above, the heat generated when the LED 1 is turned on lowers the contrast of the display of the LED 1 and causes the life of the LED display device to be shortened. In order to prevent this, the housing 3 is provided with a cooling means (not shown) to cool the drive circuits of the LED 1 and the printed wiring board 2 which generate heat. As the cooling means, for example, an air cooling fan or the like is used.
【0006】[0006]
【発明が解決しようとする課題】LED表示装置の寿命
を延ばすためには、LED1およびプリント配線板2の
駆動回路を冷却する必要がある。従来用いられている空
冷ファンなどの冷却手段を用いた場合、ファンによって
筺体3内部の空気を撹拌するだけでは、内部の空気その
ものが熱せられているので、LED1や駆動回路は充分
に冷却されない。したがって、LED表示装置の外部か
ら外気を取入れる必要がある。前述したような構成のL
ED表示装置は、主として道路などに設置されているの
で、LED表示装置外部から空気を表示装置内部に取入
れる場合、取入れる空気は排気ガスなどによって汚染さ
れていることが考えられる。汚染された空気をLED表
示装置内部に取入れた場合、筺体3内部のプリント配線
板2やLED1が排気ガスによって汚される。プリント
配線板2が排気ガスによって汚染されると、配設された
配線や駆動回路に断線や短絡が生じるおそれがある。断
線や短絡が生じると、LED1に点灯不良が発生し、表
示のコントラストが低下する。また、LED1に煤が付
着することによっても、表示のコントラストが低下す
る。In order to extend the life of the LED display device, it is necessary to cool the drive circuits for the LED 1 and the printed wiring board 2. When a conventional cooling means such as an air-cooling fan is used, the LED 1 and the drive circuit are not sufficiently cooled because the internal air itself is heated only by stirring the air inside the housing 3 by the fan. Therefore, it is necessary to take in outside air from the outside of the LED display device. L having the above-mentioned configuration
Since the ED display device is mainly installed on a road or the like, when air is taken into the display device from the outside of the LED display device, it is considered that the taken-in air is contaminated by exhaust gas or the like. When the contaminated air is taken into the LED display device, the printed wiring board 2 and the LED 1 inside the housing 3 are polluted by the exhaust gas. When the printed wiring board 2 is polluted by exhaust gas, there is a possibility that the wiring and the drive circuit provided may be broken or short-circuited. When disconnection or short circuit occurs, lighting failure occurs in the LED 1 and the display contrast decreases. Further, the soot adheres to the LED 1 to reduce the display contrast.
【0007】LED表示装置内部を汚染させないため
に、前述した冷却手段を用いずにLEDの温度上昇を防
止するためには、LED1を連続して点灯させないこと
が必要である。この場合、LED表示装置を長時間連続
して使用できず、情報表示装置として有効に利用するこ
とができない。In order to prevent the inside of the LED display device from being contaminated, in order to prevent the temperature rise of the LED without using the above-mentioned cooling means, it is necessary not to turn on the LED 1 continuously. In this case, the LED display device cannot be used continuously for a long time and cannot be effectively used as an information display device.
【0008】本発明の目的は、表示装置の使用時の内部
温度を低下させ、高コントラストで表示の寿命が長く、
かつ連続して使用することができる表示装置およびその
製造方法を提供することである。An object of the present invention is to lower the internal temperature when the display device is used, to provide a high contrast and a long display life,
It is an object of the present invention to provide a display device that can be continuously used and a manufacturing method thereof.
【0009】[0009]
【課題を解決するための手段】本発明は、複数の発光素
子と、前記発光素子がそれぞれ挿通され、マトリクス状
に配列される複数の挿通孔を有し、熱伝導率の高い材料
から成る遮光部材と、前記遮光部材の挿通孔に光出射方
向が同一方向となるようにして挿通された前記複数の発
光素子の端子が所定の配線に接続され、前記光出射方向
側とは反対側に配置されるプリント配線板と、前記発光
素子がそれぞれ挿通され、マトリクス状に配列された複
数の挿通孔を有し、前記遮光部材とプリント配線板との
間であって、一方表面が前記遮光部材に接触して配置さ
れ、熱伝導率の高い材料から成る放熱部材と、前記放熱
部材とプリント配線板との間に充填され、熱伝導率の高
い材料から成る樹脂層とを含むことを特徴とする表示装
置である。また本発明の前記放熱部材は、当該放熱部材
の遮光部材側表面に、互いに平行に配列される複数の溝
を有することを特徴とする。また本発明の前記溝は、放
熱部材が有するマトリクス状に配列された複数の挿通孔
の列方向に沿って形成されることを特徴とする。また本
発明の前記溝は、放熱部材が有するマトリクス状に配列
された複数の挿通孔の列方向に沿って、かつ2列の挿通
孔に一本の溝が対応して形成されることを特徴とする。
また本発明の前記溝の幅は、放熱部材が有する挿通孔の
中心から、当該挿通孔に隣接する挿通孔の中心までの長
さ以下に選ばれることを特徴とする。また本発明の前記
溝の長手方向に直交する断面形状は、略U字状であるこ
とを特徴とする。また本発明の前記複数の溝は、放熱部
材の挿通孔の一部と連通して形成されることを特徴とす
る。また本発明の前記発光素子は、発光ダイオードであ
ることを特徴とする。また本発明の前記遮光部材および
放熱部材は、アルミニウムから成り、前記樹脂層は、シ
リコン樹脂から成る事を特徴とする。また本発明は、プ
リント配線板の所定の配線に、光出射方向が同一方向と
なるようにして、発光素子をマトリクス状に接続し、マ
トリクス状に配列された複数の挿通孔と、当該挿通孔の
一部と連通する互いに平行に配列される複数の溝とを有
する放熱部材を、前記溝が形成された表面が前記発光素
子の光出射方向側となるようにして配置し、かつ前記挿
通孔に前記発光素子をそれぞれ挿通し、前記放熱部材の
溝から樹脂を流し込んで、前記放熱部材と前記プリント
配線板との間に樹脂を充填して樹脂層を形成し、マトリ
クス状に配列された複数の挿通孔を有する遮光部材の挿
通孔に発光素子をそれぞれ挿通し、当該遮光部材と、前
記放熱部材とを接触させることを特徴とする表示装置の
製造方法である。The present invention has a plurality of light emitting elements and a plurality of insertion holes through which the light emitting elements are respectively inserted and arranged in a matrix, and which is made of a material having high thermal conductivity. The members and the terminals of the plurality of light emitting elements that are inserted through the insertion holes of the light shielding member so that the light emitting directions are the same direction are connected to a predetermined wiring, and are arranged on the side opposite to the light emitting direction side. And a printed wiring board having a plurality of insertion holes through which the light emitting elements are respectively inserted and arranged in a matrix, and between the light shielding member and the printed wiring board, and one surface of which is the light shielding member. A heat dissipation member made of a material having a high heat conductivity and disposed in contact with each other; and a resin layer made of a material having a high heat conductivity and filled between the heat dissipation member and the printed wiring board. It is a display device. Further, the heat dissipation member of the present invention is characterized in that it has a plurality of grooves arranged in parallel with each other on a surface of the heat dissipation member on the light shielding member side. Further, the groove of the present invention is characterized in that it is formed along a row direction of a plurality of insertion holes arranged in a matrix of the heat dissipation member. Further, the groove of the present invention is characterized in that one groove is formed along the row direction of the plurality of insertion holes arranged in a matrix of the heat dissipation member and corresponding to the two rows of insertion holes. And
Further, the width of the groove of the present invention is selected to be equal to or less than the length from the center of the insertion hole of the heat dissipation member to the center of the insertion hole adjacent to the insertion hole. The cross-sectional shape of the groove of the present invention orthogonal to the longitudinal direction is substantially U-shaped. Further, the plurality of grooves of the present invention are formed so as to communicate with a part of the insertion hole of the heat dissipation member. The light emitting device of the present invention is a light emitting diode. Further, the light shielding member and the heat radiating member of the present invention are made of aluminum, and the resin layer is made of silicon resin. Further, according to the present invention, light emitting elements are connected in a matrix in a predetermined wiring of a printed wiring board so that the light emitting directions are the same direction, and a plurality of insertion holes arranged in a matrix and the insertion holes. A heat-dissipating member having a plurality of grooves arranged in parallel with each other and communicating with a part of the light-emitting element, the heat-dissipating member having the groove-formed surface on the light emission direction side of the light-emitting element, and the insertion hole. The light emitting elements are respectively inserted into the resin, resin is poured from the groove of the heat dissipation member, and resin is filled between the heat dissipation member and the printed wiring board to form a resin layer. The light emitting element is inserted into each of the through holes of the light blocking member having the through hole, and the light blocking member and the heat radiating member are brought into contact with each other.
【0010】[0010]
【作用】本発明に従えば、複数の発光素子の端子をプリ
ント配線板の所定の配線に接続して発光素子をマトリク
ス上に配置する。熱伝導率の高い材料で形成される放熱
部材に設けられた複数の挿通孔に、前記複数の発光素子
を挿入して、放熱部材を発光素子およびプリント配線板
近傍に配置する。さらに前記放熱部材と前記プリント配
線板との間、および前記放熱部材と前記発光素子との間
の空間に、熱伝導率の比較的高い樹脂を充填して樹脂層
を形成する。最後に、熱伝導率の高い材料で形成される
遮光部材に設けられた複数の挿通孔に前記発光素子をそ
れぞれ挿通させ、その一方表面を放熱部材に接触させ
る。このようにして、表示装置が作成される。According to the present invention, the terminals of the plurality of light emitting elements are connected to the predetermined wirings of the printed wiring board to arrange the light emitting elements on the matrix. The plurality of light emitting elements are inserted into the plurality of insertion holes provided in the heat dissipation member formed of a material having high thermal conductivity, and the heat dissipation member is arranged near the light emitting element and the printed wiring board. Further, a resin layer having a relatively high thermal conductivity is filled in a space between the heat dissipation member and the printed wiring board and a space between the heat dissipation member and the light emitting element to form a resin layer. Finally, the light emitting elements are respectively inserted through a plurality of insertion holes provided in the light shielding member formed of a material having a high thermal conductivity, and one surface of the light emitting element is brought into contact with the heat dissipation member. In this way, the display device is created.
【0011】これによって、放熱部材は樹脂層を介して
発光素子およびプリント配線板に接触し、前記発光素子
と前記プリント配線板とから発生する熱を樹脂層を介し
て吸収し、遮光部材に伝達する。前記遮光部材は、その
表面から前記熱を外気に発散する。したがって、当該装
置の内部の熱を、効率よく外部へ排出することができ
る。As a result, the heat dissipation member comes into contact with the light emitting element and the printed wiring board through the resin layer, absorbs heat generated from the light emitting element and the printed wiring board through the resin layer, and transfers it to the light shielding member. To do. The light shielding member radiates the heat from the surface thereof to the outside air. Therefore, the heat inside the device can be efficiently discharged to the outside.
【0012】また本発明に従えば、前記放熱部材には、
その遮光部材側の表面に、互いに平行に配置される、複
数の溝が形成されている。これによって、放熱部材表面
に付着する雨水などを、効率良く当該装置外部に排出す
ることができる。Further, according to the invention, the heat radiation member includes:
A plurality of grooves, which are arranged in parallel with each other, are formed on the surface of the light shielding member side. As a result, rainwater or the like adhering to the surface of the heat dissipation member can be efficiently discharged to the outside of the device.
【0013】さらにまた本発明に従えば、前記溝は、前
記放熱部材の挿通孔の列方向に沿って形成される。Further, according to the invention, the grooves are formed along the row direction of the insertion holes of the heat dissipation member.
【0014】また本発明に従えば、前記列方向に沿って
かつ2列の挿通孔に一本の溝が対応して形成される。こ
れによって、放熱部材の強度を比較的保持したまま、雨
水などを効率良く外部に排出することができる。Further, according to the present invention, one groove is formed corresponding to the two rows of insertion holes along the row direction. As a result, rainwater or the like can be efficiently discharged to the outside while maintaining the strength of the heat dissipation member relatively.
【0015】さらにまた本発明に従えば、前記溝の幅
は、前記挿通孔の行方向に隣接する挿通孔の中心間の長
さ以下に選ばれる。Still further according to the invention, the width of the groove is selected to be equal to or less than the length between the centers of the insertion holes which are adjacent to each other in the row direction of the insertion holes.
【0016】また本発明に従えば、前記溝の長手方向に
直交する断面形状は、略U字状に形成される。Further, according to the invention, the cross-sectional shape of the groove perpendicular to the longitudinal direction is formed in a substantially U shape.
【0017】さらにまた本発明に従えば、前記溝は、前
記放熱部材に設けられている挿通孔の一部に連通して形
成される。これによって、放熱部材を配置した後に、前
記溝から樹脂を注入して前記樹脂層を容易に形成するこ
とができる。Further, according to the invention, the groove is formed so as to communicate with a part of the insertion hole provided in the heat dissipation member. This allows the resin layer to be easily formed by injecting the resin from the groove after disposing the heat dissipation member.
【0018】また本発明に従えば、前記発光素子は発光
ダイオードで実現される。また前記遮光部材および放熱
部材はアルミニウムで実現され、前記樹脂層はシリコン
樹脂で実現される。これによって、入手が容易な材料
で、当該装置を安価に実現することができる。According to the invention, the light emitting element is realized by a light emitting diode. Further, the light shielding member and the heat radiating member are realized by aluminum, and the resin layer is realized by silicon resin. As a result, the device can be realized at low cost with an easily available material.
【0019】[0019]
【実施例】図1(1)は、本発明の一実施例である、L
ED表示装置11の平面図である。図1(2)は、図1
(1)のLED表示装置11の右側面図である。図2
は、図1(1)のLED表示装置11のA−A断面図で
ある。図3(1)は、放熱板16の平面図である。図3
(2)は、図3(1)の放熱板16のB−B断面図であ
る。図4は、図3(1)の放熱板16の部分斜視図であ
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 (1) is an embodiment of the present invention, L
3 is a plan view of the ED display device 11. FIG. 1 (2) is shown in FIG.
It is a right view of the LED display device 11 of (1). Figure 2
FIG. 2 is a cross-sectional view taken along the line AA of the LED display device 11 of FIG. FIG. 3A is a plan view of the heat dissipation plate 16. FIG.
(2) is a BB sectional view of the heat dissipation plate 16 of FIG. 3 (1). FIG. 4 is a partial perspective view of the heat dissipation plate 16 of FIG.
【0020】表示装置であるLED表示装置11は、複
数の発光素子であるLED12が、マトリクス状に配置
された構造を有する。前記各LED12は、その光出射
方向が同一方向となるように配置され、前記光出射方向
側の反対側に配置されるプリント配線板13の配線に、
それぞれリード線14を介して接続されている。プリン
ト配線板13は、各LED12の点灯/非点灯を制御す
るLED12の駆動回路を有する。LED12は、たと
えば赤および黄緑色の発光色を持つLEDランプを内蔵
した多色発光LEDランプで実現される。プリント配線
板13を構成し前記配線および駆動回路などが実装され
る基板は、たとえばガラス繊維を充填したエポキシ樹脂
製の基板で実現される。The LED display device 11, which is a display device, has a structure in which LEDs 12, which are a plurality of light emitting elements, are arranged in a matrix. The LEDs 12 are arranged so that the light emitting directions thereof are the same, and the wiring of the printed wiring board 13 arranged on the opposite side to the light emitting direction side,
Each is connected via a lead wire 14. The printed wiring board 13 has a drive circuit for the LEDs 12 that controls lighting / non-lighting of each LED 12. LED12 is implement | achieved by the multicolor light emitting LED lamp which contained the LED lamp which has the light emission color of red and yellow green, for example. The substrate that constitutes the printed wiring board 13 and on which the wiring and the drive circuit are mounted is realized by, for example, a substrate made of epoxy resin filled with glass fiber.
【0021】前記プリント配線板13およびLED12
は、一方面に開口部を有する筺体15内部に収納され
る。筺体15の側面15aには、その深さ方向の中間辺
りに段差15bが形成されている。互いに対向する一対
の側面15aの間隔は、段差15bよりも開口部寄りの
部分がプリント配線板13の幅よりも大きく形成され、
段差15bよりも筺体15の底面15c寄りの部分がプ
リント配線板13の幅よりも小さく形成される。前記プ
リント配線板13は、筺体15の側面15a内側に形成
される段差15bに当接して固定される。前記LED1
2は、前記筺体15の開口部から、その先端が突出して
いる。プリント配線板13のLED12が接続される面
の反対側の面と、前記筺体15の底面15cとの間に
は、空間が形成される。この空間内には、プリント配線
板が有する駆動回路などの回路部品が配置される。筺体
15は、たとえばポリカーボネイトで実現される。The printed wiring board 13 and the LED 12
Are housed inside a housing 15 having an opening on one surface. On the side surface 15a of the housing 15, a step 15b is formed around the middle in the depth direction. The space between the pair of side surfaces 15a facing each other is formed such that the portion closer to the opening than the step 15b is larger than the width of the printed wiring board 13.
A portion of the housing 15 closer to the bottom surface 15c than the step 15b is formed smaller than the width of the printed wiring board 13. The printed wiring board 13 is fixed by abutting on a step 15b formed inside the side surface 15a of the housing 15. LED1
2 has a tip protruding from the opening of the housing 15. A space is formed between the surface of the printed wiring board 13 opposite to the surface to which the LED 12 is connected and the bottom surface 15c of the housing 15. In this space, circuit components such as a drive circuit included in the printed wiring board are arranged. The housing 15 is realized by, for example, polycarbonate.
【0022】プリント配線板13とLED12の下部と
の間の空間には、熱伝導率の高い材料、たとえばアルミ
ニウムなどの金属で実現される放熱板16が、そのプリ
ント配線板13側に形成された突出部22をプリント配
線板13の配線が形成されていない領域に当接して配置
される。これによって、放熱板16の突出部22が形成
された側の面は、突出部22以外の領域が、プリント配
線板13と離間するように設置される。前記放熱板16
は、後述するようにLED12およびプリント配線板1
3の駆動回路などから生じる熱を吸収する。放熱板16
には、マトリクス状に配置されるLED12を貫通させ
るために、マトリクス状に複数の挿通孔17が形成され
ている。また、放熱板16の前記挿通孔17が形成され
ていない領域には、放熱板16を固定するためのねじ止
め用の挿通孔23が複数形成されている。In the space between the printed wiring board 13 and the lower portion of the LED 12, a heat dissipation plate 16 made of a material having a high thermal conductivity, for example, a metal such as aluminum is formed on the printed wiring board 13 side. The protruding portion 22 is arranged in contact with the area of the printed wiring board 13 where the wiring is not formed. As a result, the surface of the heat dissipation plate 16 on the side where the protruding portion 22 is formed is installed such that the area other than the protruding portion 22 is separated from the printed wiring board 13. The heat dissipation plate 16
Is the LED 12 and the printed wiring board 1 as described later.
3 absorbs heat generated from the driving circuit of FIG. Heat sink 16
A plurality of insertion holes 17 are formed in a matrix to penetrate the LEDs 12 arranged in a matrix. Further, a plurality of screw-through insertion holes 23 for fixing the heat dissipation plate 16 are formed in a region of the heat dissipation plate 16 where the insertion hole 17 is not formed.
【0023】さらにまた、放熱板16の突出部22が形
成された側の反対側の面である一方面16aには、溝1
8が複数設けられている。溝18は、たとえばLED表
示装置11が屋外で使用される場合に、LED12周辺
に侵入した雨水などを排水するために設けられる。この
ため、LED表示装置11は、溝18が上下方向となる
ように設置されて用いられる。また放熱板16は、前記
溝18が形成された一方面16aがLED12の光出射
方向側となるようにして配置される。Furthermore, the groove 1 is formed in the one surface 16a which is the surface opposite to the side where the protruding portion 22 of the heat dissipation plate 16 is formed.
A plurality of 8 are provided. The groove 18 is provided to drain rainwater or the like that has entered the vicinity of the LED 12 when the LED display device 11 is used outdoors, for example. Therefore, the LED display device 11 is installed and used so that the groove 18 is in the vertical direction. Further, the heat dissipation plate 16 is arranged such that the one surface 16a in which the groove 18 is formed is on the light emitting direction side of the LED 12.
【0024】溝18は、放熱部材16の挿通孔17の列
方向、すなわち図3ではマトリクス状に配列された挿通
孔17の配列方向のうち縦方向に平行な方向に沿って、
かつ2列の挿通孔17の間に形成される。前記溝18の
幅d1は、たとえば隣接する2つの挿通孔17の縁部間
の間隔d2よりも少し大きく設定される。これによっ
て、溝18は挿通孔17と連通する。また、溝18は、
たとえば2列の挿通孔17毎に形成されてもよく、1列
の挿通孔17毎に形成されてもよい。溝18は、図4で
示すように、その長手方向に直交する断面形状が、略U
字状に形成される。また、前記断面形状はたとえばV字
状であってもよい。The grooves 18 are arranged in the row direction of the insertion holes 17 of the heat dissipation member 16, that is, in the arrangement direction of the insertion holes 17 arranged in a matrix in FIG.
And it is formed between the two rows of insertion holes 17. The width d1 of the groove 18 is set to be slightly larger than the distance d2 between the edges of two adjacent insertion holes 17, for example. Thereby, the groove 18 communicates with the insertion hole 17. Also, the groove 18 is
For example, it may be formed for each of the two rows of insertion holes 17 or for each of the one row of insertion holes 17. As shown in FIG. 4, the groove 18 has a cross-sectional shape perpendicular to the longitudinal direction of the groove 18 of approximately U.
It is formed in a letter shape. The cross-sectional shape may be V-shaped, for example.
【0025】図1を参照して、筺体15の開口部には遮
光板19が配置されている。遮光板19は、放熱板16
の前記一方面16aの一部と接触して接続されており、
放熱板16が吸収した熱を外気中に発散する放熱板とし
ての役割も有する。遮光板19の表面は、LED12を
点灯した場合にコントラストが高くなり、表示画面の表
示内容が分かりやすくなるような色、たとえば黒色に塗
装されている。遮光板19はまた放熱板16と同様に熱
伝導率の高い物質、たとえばアルミニウムなどの金属で
実現される。Referring to FIG. 1, a light shielding plate 19 is arranged at the opening of the housing 15. The shading plate 19 is the heat dissipation plate 16
Is in contact with a part of the one surface 16a of the
It also has a role as a heat dissipation plate that dissipates the heat absorbed by the heat dissipation plate 16 into the outside air. The surface of the light shielding plate 19 is painted in a color, for example, black, which has a high contrast when the LED 12 is turned on and makes the displayed contents of the display screen easy to understand. The light shield plate 19 is also made of a material having a high thermal conductivity like the heat dissipation plate 16, for example, a metal such as aluminum.
【0026】遮光板19は、マトリクス状に配列された
LED12の水平方向の各段毎に、庇状の部材19aを
有する。遮光板19は、LED12に太陽光が直接当た
り、LED12内の反射器で反射して、当該装置11の
表示画面の表示のコントラストが低下することを防止す
るために、LED12に太陽光が直接当たらないように
太陽光を遮っている。The light shielding plate 19 has an eaves-shaped member 19a for each horizontal step of the LEDs 12 arranged in a matrix. In order to prevent the light shielding plate 19 from directly hitting the LED 12 and being reflected by the reflector in the LED 12, the display contrast of the display screen of the device 11 is not lowered, and the sunlight is directly applied to the LED 12. The sun is blocked so that there is no light.
【0027】筺体15内部のプリント配線板13と放熱
板16との間、プリント配線板13とLED12との
間、および筺体15の側面15aとLED12との間の
隙間には、樹脂が充填され、防水樹脂層21が形成され
ている。前記樹脂は、LED12の一部、プリント配線
板13表面、プリント配線板13とLED12とを接続
するリード線14などを覆って充填される。防水樹脂層
21は、耐水性に優れ、かつ空気よりも熱伝導率の高
い、たとえばシリコンなどの樹脂で実現される。Resin is filled in the gaps between the printed wiring board 13 and the heat dissipation plate 16 inside the housing 15, between the printed wiring board 13 and the LEDs 12, and between the side surfaces 15a of the housing 15 and the LEDs 12. A waterproof resin layer 21 is formed. The resin is filled so as to cover a part of the LED 12, the surface of the printed wiring board 13, the lead wire 14 connecting the printed wiring board 13 and the LED 12, and the like. The waterproof resin layer 21 is realized by a resin having excellent water resistance and a thermal conductivity higher than that of air, such as silicon.
【0028】図5は、図1(1)のLED表示装置11
の分解断面図である。図5を参照して、本発明のLED
表示装置11の製造方法を説明する。FIG. 5 shows the LED display device 11 of FIG.
FIG. Referring to FIG. 5, the LED of the present invention
A method of manufacturing the display device 11 will be described.
【0029】複数のLED12のリード線14をそれぞ
れプリント配線板13の所定の配線にそれぞれ接続し、
当該LED12をプリント配線板13から距離d3だけ
離して、マトリクス状に配置する。プリント配線板13
は図示しないLED12の駆動回路を有し、当該駆動回
路が前記配線に接続されている。LED12を取付けた
プリント配線板13は筺体15の開口部から筺体15内
部に挿入され、当該配線板13の端部が筺体15側面1
5aの段差15bに当接する位置で固定される。前記プ
リント配線板13は、LED12が実装される面とは反
対の面と筺体15の底面15cとの間に空間を形成する
状態で、筺体15に装着される。The lead wires 14 of the plurality of LEDs 12 are respectively connected to predetermined wirings of the printed wiring board 13,
The LEDs 12 are arranged in a matrix at a distance d3 from the printed wiring board 13. Printed wiring board 13
Has a drive circuit for the LED 12 not shown, and the drive circuit is connected to the wiring. The printed wiring board 13 to which the LED 12 is attached is inserted into the housing 15 through the opening of the housing 15, and the end portion of the wiring board 13 is attached to the side surface 1 of the housing 15.
It is fixed at a position where it abuts on the step 15b of 5a. The printed wiring board 13 is mounted on the housing 15 in such a manner that a space is formed between the surface opposite to the surface on which the LED 12 is mounted and the bottom surface 15c of the housing 15.
【0030】次いで、放熱板16の挿通孔17にLED
12をそれぞれ貫通させ、放熱板16をプリント配線板
13およびLED12近傍に配置する。プリント配線板
13と放熱板16とは、放熱板16のプリント配線板1
3側の面に設けられる突出部22とプリント配線板13
の配線が形成されていない領域だけを接触させて配置さ
れる。これによって、放熱板16とプリント配線板13
とは、プリント配線板13の配線が形成されている領域
では、間隙を空けて配置されるので、プリント配線板1
3の配線の電気的絶縁を保つことができる。放熱板16
は、たとえばねじ止め用の挿通孔23に筺体15の底面
15cからボルトを挿入してナットでねじ止めして、筺
体15に固定される。Next, the LED is inserted in the insertion hole 17 of the heat dissipation plate 16.
The heat radiation plate 16 is arranged in the vicinity of the printed wiring board 13 and the LED 12 by penetrating each of them. The printed wiring board 13 and the heat sink 16 are the printed wiring board 1 of the heat sink 16.
The protrusion 22 and the printed wiring board 13 provided on the surface on the 3 side
Are arranged in contact with only the area where the wiring is not formed. Thereby, the heat sink 16 and the printed wiring board 13
Means that in the area where the wiring of the printed wiring board 13 is formed, the printed wiring board 13 is arranged with a gap, so that the printed wiring board 1
The electrical insulation of the wiring of 3 can be maintained. Heat sink 16
Is fixed to the housing 15 by inserting a bolt into the insertion hole 23 for screwing from the bottom surface 15c of the housing 15 and screwing it with a nut.
【0031】続いて、放熱板16の溝18から、耐水性
の優れる樹脂27を注入する。図6は樹脂27を注入す
る状態を示す部分側面図である。樹脂27は、ノズル2
6から放熱板16の溝18に沿って注入される。溝18
は、その幅d1が隣接する2つの挿通孔17の縁部間の
間隔d2よりも少し広く、放熱板16の挿通孔17の一
部と連通して形成されている。樹脂27は放熱板16の
溝18から挿通孔17を通って放熱板16とプリント配
線板13との間の間隙に充填される。かつ樹脂27は、
LED12とプリント配線板13とを接続するリード線
14の周囲、すなわち放熱板16の挿通孔17にも充填
される。また、筺体15の側面15aとLED12との
間の隙間にも充填される。放熱板16に挿通孔17と連
通する溝18を設けることによって、樹脂27を容易に
充填することができる。Subsequently, a resin 27 having excellent water resistance is injected from the groove 18 of the heat dissipation plate 16. FIG. 6 is a partial side view showing the state of injecting the resin 27. Resin 27 is the nozzle 2
6 is injected along the groove 18 of the heat sink 16. Groove 18
The width d1 is a little wider than the interval d2 between the edge portions of two adjacent insertion holes 17, and is formed so as to communicate with a part of the insertion hole 17 of the heat dissipation plate 16. The resin 27 is filled from the groove 18 of the heat dissipation plate 16 through the insertion hole 17 into the gap between the heat dissipation plate 16 and the printed wiring board 13. And the resin 27 is
The periphery of the lead wire 14 that connects the LED 12 and the printed wiring board 13, that is, the insertion hole 17 of the heat dissipation plate 16 is also filled. In addition, the space between the side surface 15 a of the housing 15 and the LED 12 is also filled. By providing the heat dissipation plate 16 with the groove 18 communicating with the insertion hole 17, the resin 27 can be easily filled.
【0032】最後に、遮光板19を筺体15の開口部に
配置する。前記開口部から突出しているLED12の先
端を遮光板19の挿通孔20に挿入して、かつ遮光板1
9を放熱板16にねじ止めして固定する。遮光板19
は、筺体15の、図2では下方に位置する側面15aと
の間に、溝18に連結された排水用の隙間24が空くよ
うして固定される。Finally, the light shielding plate 19 is placed in the opening of the housing 15. The tip of the LED 12 protruding from the opening is inserted into the insertion hole 20 of the light shielding plate 19, and the light shielding plate 1
9 is fixed to the heat sink 16 by screwing. Light shield 19
2 is fixed so that a gap 24 for drainage connected to the groove 18 is formed between the housing 15 and the side surface 15a located below in FIG.
【0033】以上のような手順によって、LED表示装
置11が完成される。The LED display device 11 is completed by the above procedure.
【0034】図7(1)は、本発明の他の実施例である
LED表示装置の放熱板31の平面図である。図7
(2)は、図7(1)の放熱板31のC−C断面図であ
る。図8は、図7(1)の放熱板31の部分斜視図であ
る。本実施例の放熱板31は、図3の放熱板16と類似
の構成を有し、同一の構成には同一の符号を付け、説明
を省略する。FIG. 7A is a plan view of the heat dissipation plate 31 of the LED display device according to another embodiment of the present invention. Figure 7
7B is a sectional view taken along line CC of the heat dissipation plate 31 of FIG. 7A. FIG. 8 is a partial perspective view of the heat dissipation plate 31 of FIG. 7 (1). The heat dissipation plate 31 of this embodiment has a configuration similar to that of the heat dissipation plate 16 of FIG.
【0035】本実施例の放熱板31は、図3に示される
放熱板16よりも排水用の溝32が幅広く形成されてい
る。排水用の溝32は、広く形成した方が水などの排水
能力が増し、たとえば道路の情報表示装置として、屋外
で当該LED表示装置を使用する際に有効である。また
逆に、溝32をあまり広くすると、放熱板31が吸収し
た熱を遮光板19に伝達する際の熱伝達の効率が悪くな
る。溝32の最大の幅である幅d4は、たとえば放熱板
16の挿通孔17の中心から隣接する挿通孔17の中心
までの間隔d5とすることが好ましい。The heat dissipation plate 31 of this embodiment has a wider drainage groove 32 than the heat dissipation plate 16 shown in FIG. The drainage groove 32 has a larger drainage capacity for water or the like when formed wider, and is effective when the LED display device is used outdoors, for example, as a road information display device. On the contrary, if the groove 32 is made too wide, the efficiency of heat transfer when transferring the heat absorbed by the heat dissipation plate 31 to the light shielding plate 19 becomes poor. The width d4, which is the maximum width of the groove 32, is preferably a distance d5 from the center of the insertion hole 17 of the heat dissipation plate 16 to the center of the adjacent insertion hole 17, for example.
【0036】本実施例のLED表示装置11と、従来技
術の放熱板16を持たないLED表示装置とをそれぞれ
駆動させて比較する駆動試験を行った結果について説明
する。本試験で用いたLED表示装置の大きさは160
mm×160mmである。使用されるLEDは256個
である。遮光板19および放熱板16はアルミニウムで
実現される。また本実施例のLED表示装置11および
従来技術のLED表示装置の周囲の温度は25℃であ
り、無風状態の中で設置したとする。このような条件に
おいて、本実施例のLED表示装置11と、従来技術の
LED表示装置とを30分間点灯した後に、LEDおよ
びプリント配線板の温度を測定した。The results of a drive test in which the LED display device 11 of this embodiment and the LED display device of the prior art which does not have the heat sink 16 are driven and compared with each other will be described. The size of the LED display device used in this test is 160
It is mm × 160 mm. There are 256 LEDs used. The light shielding plate 19 and the heat dissipation plate 16 are realized by aluminum. Further, it is assumed that the LED display device 11 of the present embodiment and the LED display device of the prior art have an ambient temperature of 25 ° C. and are installed in a windless state. Under these conditions, the LED display device 11 of this example and the LED display device of the conventional technique were lighted for 30 minutes, and then the temperatures of the LED and the printed wiring board were measured.
【0037】この結果、本実施例のLED表示装置11
は従来技術のLED表示装置と比較して、LED12お
よびプリント配線板13の温度上昇を約10%低減する
ことができた。さらに、LED12の輝度低下を、従来
技術のLED表示装置のLEDと比較して、赤色で約1
0%改善することができた。さらにまた、当該装置11
の表示の寿命は従来のLED表示装置と比較して約2倍
に延びた。LED表示装置の表示の寿命とは、使用開始
から、装置の使用を続けている間にLEDの輝度が低下
し、設計時に定められた距離から当該装置の表示が視認
できなくなるまでの期間である。As a result, the LED display device 11 of this embodiment is obtained.
Was able to reduce the temperature rise of the LED 12 and the printed wiring board 13 by about 10% as compared with the conventional LED display device. Furthermore, the decrease in the brightness of the LED 12 is about 1 in red as compared with the LED of the LED display device of the prior art.
It was possible to improve by 0%. Furthermore, the device 11
The display life of the display has been doubled as compared with the conventional LED display device. The display life of the LED display device is a period from the start of use to the time when the brightness of the LED decreases during continuous use of the device and the display of the device becomes invisible from a distance determined at the time of design. .
【0038】また、本実施例のLED表示装置11は、
放熱板16で吸収した熱を表示装置11の外部に露出し
ている遮光板19に伝達させて、遮光板19から外気中
に放出するので、遮光板19が常に冷却されるような環
境、たとえば屋外のような風のある環境で用いると、さ
らにLED表示装置11内部の冷却効率を高めることが
できる。Further, the LED display device 11 of this embodiment is
The heat absorbed by the heat dissipation plate 16 is transmitted to the light shield plate 19 exposed to the outside of the display device 11 and is released into the outside air from the light shield plate 19, so that the environment where the light shield plate 19 is constantly cooled, for example, When used in the windy environment such as outdoors, the cooling efficiency inside the LED display device 11 can be further enhanced.
【0039】なお、本実施例では、防水樹脂層21を形
成するための樹脂27の注入を容易とするために、放熱
板16の溝18と挿通孔17とを連通して形成したけれ
ども、溝18と挿通孔17とを連通しないように形成し
た場合であっても、溝18は雨水などをの排水のために
有効に利用できる。In this embodiment, in order to facilitate the injection of the resin 27 for forming the waterproof resin layer 21, the groove 18 of the heat dissipation plate 16 and the insertion hole 17 are formed so as to communicate with each other. Even when the groove 18 and the insertion hole 17 are formed so as not to communicate with each other, the groove 18 can be effectively used for draining rainwater and the like.
【0040】また、発光素子として、発光ダイオード以
外の素子を用いることも可能である。It is also possible to use an element other than the light emitting diode as the light emitting element.
【0041】[0041]
【発明の効果】以上のように本発明によれば、表示装置
は、複数の発光素子がマトリクス状に配列され、各発光
素子が点灯/非点灯の状態のいずれか一方の状態になる
ことによって表示を行う。発光素子とプリント配線板と
には、熱伝導率の高い材料から成る樹脂層を介して、熱
伝導率の高い材料で形成される放熱部材が接触され、前
記放熱部材が前記発光素子およびプリント配線板から放
出される熱を吸収する。吸収された熱は、放熱部材から
熱伝導率の高い材料で形成される遮光部材に伝播され、
遮光部材から外気中に放出される。これによって、前記
発光素子およびプリント配線板の温度上昇を防止するこ
とができる。したがって、表示装置の表示の寿命が延
び、耐久性が向上する。かつ、発光素子の輝度低下を防
止して、コントラストの高い良好な表示を行うことがで
きる。また、発光素子を連続して点灯することが可能と
なる。As described above, according to the present invention, in a display device, a plurality of light emitting elements are arranged in a matrix, and each light emitting element is turned on or off. Display. The light emitting element and the printed wiring board are in contact with a heat dissipation member formed of a material having a high heat conductivity via a resin layer made of a material having a high heat conductivity, and the heat dissipation member is connected to the light emitting element and the printed wiring board. It absorbs the heat released from the plate. The absorbed heat is propagated from the heat dissipation member to the light shielding member formed of a material having high thermal conductivity,
It is released into the outside air from the light shielding member. This can prevent the temperature rise of the light emitting element and the printed wiring board. Therefore, the display life of the display device is extended and the durability is improved. In addition, it is possible to prevent a decrease in the brightness of the light emitting element and perform a good display with high contrast. Further, the light emitting element can be continuously turned on.
【0042】また本発明によれば、前記放熱部材にの遮
光部材側表面には溝が設けられる。これによって、放熱
部材などに付着する水などを効率的に排出することがで
き、当該装置内部の腐食などを防止することができる。Further, according to the present invention, a groove is provided on the surface of the heat dissipation member on the side of the light shielding member. As a result, water or the like adhering to the heat dissipation member or the like can be efficiently discharged, and corrosion inside the device can be prevented.
【0043】前記溝は、放熱部材の複数の挿通孔の列方
向に沿って形成される。また前記溝は、前記列方向に沿
って、かつ2列の挿通孔に1本の溝が対応して形成され
る。また前記溝の幅は、放熱部材の挿通孔の行方向に隣
接する挿通孔の中心間の長さ以下に選ばれる。これによ
って。放熱部材の強度を高く保持しながら、付着した水
を効率的に排出することができる。また前記溝の長手方
向に直交する断面形状は、略U字状に形成される。The grooves are formed along the row direction of the plurality of insertion holes of the heat dissipation member. Further, the groove is formed along the row direction, and one groove is formed corresponding to the two rows of insertion holes. The width of the groove is selected to be equal to or less than the length between the centers of the insertion holes adjacent to each other in the row direction of the insertion holes of the heat dissipation member. by this. The adhered water can be efficiently discharged while keeping the strength of the heat dissipation member high. Further, the cross-sectional shape of the groove perpendicular to the longitudinal direction is formed in a substantially U shape.
【0044】さらに本発明によれば、前記溝は放熱部材
の挿通孔の一部と連通するようにして形成される。した
がって、本発明の表示装置の製造方法において、樹脂層
を前記溝から注入することによって、容易に形成するこ
とができる。Further, according to the present invention, the groove is formed so as to communicate with a part of the insertion hole of the heat dissipation member. Therefore, in the display device manufacturing method of the present invention, it can be easily formed by injecting the resin layer from the groove.
【0045】また本発明によれば、前記装置は、発光素
子に発光ダイオードを用いる。また放熱部材および遮光
部材をアルミニウムで形成し、樹脂層をシリコン樹脂で
形成する。これによって、入手が容易な材料で各部材を
形成するので、製造が容易となる。また、安価に作成す
ることができる。According to the invention, the device uses a light emitting diode as a light emitting element. The heat dissipation member and the light shielding member are made of aluminum, and the resin layer is made of silicon resin. As a result, each member is formed of a material that is easily available, which facilitates manufacturing. Also, it can be manufactured at low cost.
【図1】本発明の一実施例であるLED表示装置11の
平面図および側面図である。FIG. 1 is a plan view and a side view of an LED display device 11 that is an embodiment of the present invention.
【図2】図1のLED表示装置11のA−A断面図であ
る。2 is a cross-sectional view taken along the line AA of the LED display device 11 of FIG.
【図3】図1のLED表示装置11に用いられる放熱板
16の平面図およびB−B断面図である。3A and 3B are a plan view and a BB sectional view of a heat dissipation plate 16 used in the LED display device 11 of FIG.
【図4】図3の放熱板16の部分斜視図である。FIG. 4 is a partial perspective view of the heat dissipation plate 16 of FIG.
【図5】図1のLED表示装置11の分解断面図であ
る。5 is an exploded sectional view of the LED display device 11 of FIG.
【図6】樹脂27を注入する状態を説明するための部分
側面図である。FIG. 6 is a partial side view for explaining a state of injecting a resin 27.
【図7】本発明の他の実施例であるLED表示装置に用
いられる放熱板31の平面図およびC−C断面図であ
る。7A and 7B are a plan view and a CC sectional view of a heat dissipation plate 31 used in an LED display device according to another embodiment of the present invention.
【図8】図7の放熱板31の部分斜視図である。8 is a partial perspective view of the heat dissipation plate 31 of FIG.
【図9】従来技術のLED表示装置の断面図である。FIG. 9 is a cross-sectional view of a conventional LED display device.
11 LED表示装置 12 LED 13 プリント配線板 14 リード線 15 筺体 16,31 放熱板 18,32 溝 19 遮光板 11 LED Display Device 12 LED 13 Printed Wiring Board 14 Lead Wire 15 Housing 16,31 Heat Dissipating Plate 18,32 Groove 19 Light-Shielding Plate
───────────────────────────────────────────────────── フロントページの続き (71)出願人 593065534 株式会社ドーシス 東京都中央区八丁堀4丁目10番4号 (72)発明者 村田 和久 大阪府大阪市阿倍野区長池町22番22号 シ ャープ株式会社内 (72)発明者 小野寺 浩 愛知県海部郡美和町大字篠田字面徳29−1 名古屋電機工業株式会社美和工場内 (72)発明者 中島 賛太郎 京都府城陽市寺田新池36番地 星和電機株 式会社内 (72)発明者 酒井 満 神奈川県横浜市戸塚区前田町100番地 小 糸工業株式会社内 (72)発明者 関 武久 東京都中央区八丁堀4丁目10番4号 株式 会社ドーシス内 ─────────────────────────────────────────────────── ─── Continuation of front page (71) Applicant 593065534 Dorsis Co., Ltd. 4-10-4 Hatchobori, Chuo-ku, Tokyo (72) Inventor Kazuhisa Murata 22-22 Nagaike-cho, Abeno-ku, Osaka, Osaka Prefecture (72) Inventor Hiroshi Onodera 29-1, Mita-cho, Miwa-cho, Kaifu-gun, Aichi Prefecture Mita Factory, Nagoya Electric Industrial Co., Ltd. In-house (72) Inventor Mitsuru Sakai 100 Maeda-cho, Totsuka-ku, Yokohama-shi, Kanagawa Koito Kogyo Co., Ltd. (72) Inventor Takehisa Seki 4-10-4 Hatchobori, Chuo-ku, Tokyo Within Dorsys Inc.
Claims (10)
される複数の挿通孔を有し、熱伝導率の高い材料から成
る遮光部材と、 前記遮光部材の挿通孔に光出射方向が同一方向となるよ
うにして挿通された前記複数の発光素子の端子が所定の
配線に接続され、前記光出射方向側とは反対側に配置さ
れるプリント配線板と、 前記発光素子がそれぞれ挿通され、マトリクス状に配列
された複数の挿通孔を有し、前記遮光部材とプリント配
線板との間であって、一方表面が前記遮光部材に接触し
て配置され、熱伝導率の高い材料から成る放熱部材と、 前記放熱部材とプリント配線板との間に充填され、熱伝
導率の高い材料から成る樹脂層とを含むことを特徴とす
る表示装置。1. A plurality of light emitting elements, a light blocking member which has a plurality of through holes through which the light emitting elements are respectively inserted and is arranged in a matrix, and which is made of a material having a high thermal conductivity, and through which the light blocking member is inserted. A printed wiring board, in which terminals of the plurality of light emitting elements that are inserted in the holes so that the light emitting directions are the same direction are connected to a predetermined wiring, and the light emitting direction side is arranged on the opposite side, The light emitting elements are respectively inserted and have a plurality of insertion holes arranged in a matrix, and are arranged between the light shielding member and the printed wiring board, one surface of which is in contact with the light shielding member, and heat conduction is performed. A display device comprising: a heat dissipation member made of a material having a high thermal conductivity; and a resin layer made of a material having a high thermal conductivity, which is filled between the heat dissipation member and the printed wiring board.
材側表面に、互いに平行に配列される複数の溝を有する
ことを特徴とする請求項1記載の表示装置。2. The display device according to claim 1, wherein the heat dissipation member has a plurality of grooves arranged in parallel with each other on a surface of the heat dissipation member on the light shielding member side.
状に配列された複数の挿通孔の列方向に沿って形成され
ることを特徴とする請求項2記載の表示装置。3. The display device according to claim 2, wherein the groove is formed along a row direction of a plurality of insertion holes arranged in a matrix of the heat dissipation member.
状に配列された複数の挿通孔の列方向に沿って、かつ2
列の挿通孔に一本の溝が対応して形成されることを特徴
とする請求項2記載の表示装置。4. The groove is formed along a row direction of a plurality of insertion holes arranged in a matrix of the heat dissipation member, and
3. The display device according to claim 2, wherein one insertion groove is formed corresponding to each row insertion hole.
の行方向に隣接する挿通孔の中心間の長さ以下に選ばれ
ることを特徴とする請求項4記載の表示装置。5. The display device according to claim 4, wherein the width of the groove is selected to be equal to or less than the length between the centers of the insertion holes adjacent to each other in the row direction of the insertion holes of the heat dissipation member.
は、略U字状であることを特徴とする請求項2記載の表
示装置。6. The display device according to claim 2, wherein a cross-sectional shape of the groove orthogonal to the longitudinal direction is a substantially U shape.
部と連通して形成されることを特徴とする請求項2記載
の表示装置。7. The display device according to claim 2, wherein the plurality of grooves are formed in communication with a part of the insertion hole of the heat dissipation member.
ことを特徴とする請求項1記載の表示装置。8. The display device according to claim 1, wherein the light emitting element is a light emitting diode.
ニウムから成り、 前記樹脂層は、シリコン樹脂から成ることを特徴とする
請求項1記載の表示装置。9. The display device according to claim 1, wherein the light shielding member and the heat radiating member are made of aluminum, and the resin layer is made of silicon resin.
射方向が同一方向となるようにして、発光素子をマトリ
クス状に接続し、 マトリクス状に配列された複数の挿通孔と、当該挿通孔
の一部と連通する互いに平行に配列される複数の溝とを
有する放熱部材を、前記溝が形成された表面が前記発光
素子の光出射方向側となるようにして配置し、かつ前記
挿通孔に前記発光素子をそれぞれ挿通し、 前記放熱部材の溝から熱伝導率の高い樹脂を流し込ん
で、前記放熱部材と前記プリント配線板との間に樹脂を
充填して樹脂層を形成し、 マトリクス状に配列された複数の挿通孔を有する遮光部
材の挿通孔に発光素子をそれぞれ挿通し、当該遮光部材
と前記放熱部材とを接触させて固定することを特徴とす
る表示装置の製造方法。10. A plurality of insertion holes arranged in a matrix, the light emitting elements being connected in a matrix in a predetermined wiring of a printed wiring board so that the light emitting directions are the same direction, and the insertion holes. A heat-dissipating member having a plurality of grooves arranged in parallel with each other and communicating with a part of the light-emitting element, the heat-dissipating member having a groove-formed surface on the light emission direction side of the light-emitting element; Each of the light emitting elements is inserted into a groove, and a resin having a high thermal conductivity is poured from a groove of the heat dissipation member, and a resin layer is formed by filling the resin between the heat dissipation member and the printed wiring board to form a matrix shape. A method of manufacturing a display device, comprising: inserting a light emitting element into each of the through holes of a light blocking member having a plurality of through holes arranged in the above, and fixing the light blocking member and the heat radiating member in contact with each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12527295A JP3247821B2 (en) | 1995-05-24 | 1995-05-24 | Display device and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12527295A JP3247821B2 (en) | 1995-05-24 | 1995-05-24 | Display device and method of manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH08320657A true JPH08320657A (en) | 1996-12-03 |
JP3247821B2 JP3247821B2 (en) | 2002-01-21 |
Family
ID=14905977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12527295A Expired - Lifetime JP3247821B2 (en) | 1995-05-24 | 1995-05-24 | Display device and method of manufacturing the same |
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JP (1) | JP3247821B2 (en) |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000267576A (en) * | 1999-03-12 | 2000-09-29 | Nec Eng Ltd | Display module |
GB2324598B (en) * | 1997-04-21 | 2001-04-18 | Microsense Systems Ltd | A display |
GB2324363B (en) * | 1997-04-16 | 2001-05-16 | Siemens Plc | Improvements in or relating to variable message displays |
JP2001337626A (en) * | 2000-05-24 | 2001-12-07 | Avix Inc | Panel type LED display module |
US6329593B1 (en) * | 2000-05-01 | 2001-12-11 | Formosa Industrial Computing Inc. | Waterproof led display |
FR2811798A1 (en) * | 2000-07-12 | 2002-01-18 | Simon Elkrief | Seal unit for LED image display, has ribs projecting outwards between rows of diodes for protection |
FR2819616A1 (en) * | 2000-12-26 | 2002-07-19 | Simon Elkrief | Display module having electroluminescent screen with electrically isolated/thermally conducting sheet between support card internal face and chassis reception face. |
JP2005018048A (en) * | 2003-05-30 | 2005-01-20 | Nichia Chem Ind Ltd | Led display unit |
JP2005038870A (en) * | 2003-07-15 | 2005-02-10 | Iwasaki Electric Co Ltd | Light emitting diode lamp |
WO2006133638A1 (en) * | 2005-06-14 | 2006-12-21 | Mingleung Edward Tam | An antifogging perspective screen |
KR100749722B1 (en) * | 2007-05-15 | 2007-08-16 | (주)아이에스피 | Display module for cassette-type electronic board with high heat dissipation |
WO2002061714A3 (en) * | 2001-02-02 | 2007-11-15 | Sunamic Visualisierung Und Net | Graphic displaying module for outdoors |
JP2011254008A (en) * | 2010-06-03 | 2011-12-15 | Sharp Corp | Display device and method of manufacturing the same |
WO2012029680A1 (en) * | 2010-08-30 | 2012-03-08 | 三洋電機株式会社 | Display device |
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JP2012163699A (en) * | 2011-02-04 | 2012-08-30 | Sanwa Signworks Co Ltd | Display |
GB2471033B (en) * | 2008-02-27 | 2012-09-26 | 3A Technology & Man Ltd | Support plate for light-emitting points and related facade system |
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1995
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Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2324363B (en) * | 1997-04-16 | 2001-05-16 | Siemens Plc | Improvements in or relating to variable message displays |
GB2324598B (en) * | 1997-04-21 | 2001-04-18 | Microsense Systems Ltd | A display |
JP2000267576A (en) * | 1999-03-12 | 2000-09-29 | Nec Eng Ltd | Display module |
US6329593B1 (en) * | 2000-05-01 | 2001-12-11 | Formosa Industrial Computing Inc. | Waterproof led display |
JP2001337626A (en) * | 2000-05-24 | 2001-12-07 | Avix Inc | Panel type LED display module |
FR2811798A1 (en) * | 2000-07-12 | 2002-01-18 | Simon Elkrief | Seal unit for LED image display, has ribs projecting outwards between rows of diodes for protection |
FR2819616A1 (en) * | 2000-12-26 | 2002-07-19 | Simon Elkrief | Display module having electroluminescent screen with electrically isolated/thermally conducting sheet between support card internal face and chassis reception face. |
WO2002061714A3 (en) * | 2001-02-02 | 2007-11-15 | Sunamic Visualisierung Und Net | Graphic displaying module for outdoors |
JP2005018048A (en) * | 2003-05-30 | 2005-01-20 | Nichia Chem Ind Ltd | Led display unit |
JP2005038870A (en) * | 2003-07-15 | 2005-02-10 | Iwasaki Electric Co Ltd | Light emitting diode lamp |
WO2006133638A1 (en) * | 2005-06-14 | 2006-12-21 | Mingleung Edward Tam | An antifogging perspective screen |
KR100749722B1 (en) * | 2007-05-15 | 2007-08-16 | (주)아이에스피 | Display module for cassette-type electronic board with high heat dissipation |
GB2471033B (en) * | 2008-02-27 | 2012-09-26 | 3A Technology & Man Ltd | Support plate for light-emitting points and related facade system |
JP2011254008A (en) * | 2010-06-03 | 2011-12-15 | Sharp Corp | Display device and method of manufacturing the same |
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JP2012163699A (en) * | 2011-02-04 | 2012-08-30 | Sanwa Signworks Co Ltd | Display |
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US20130272740A1 (en) * | 2012-02-13 | 2013-10-17 | Canon Kabushiki Kaisha | Optical sensor and image forming apparatus |
CN103208240A (en) * | 2013-04-01 | 2013-07-17 | 长春希达电子技术有限公司 | Integrated LED (light emitting diode) display unit panel with large viewing angle |
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