JPH08306858A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE: To realize reduction in dead space and improvement in mounting efficiency of a substrate, by providing an outer lead support member which has a protrusion having a recess facing the periphery of the substrate. CONSTITUTION: An outer lead 21 is integrally molded by a support member 22, and a recess 26 is provided on the lower side of a right end surface 25 of a protrusion 24 of the exposed outer lead 21. Therefore, an element may be mounted in a space formed by the recess 26 and the surface of a substrate 10, so that improvement in element mounting efficiency of the substrate and reduction in the size of the substrate and the entire device can be realized. Also, by integrally supporting the outer lead 21, the strength of the outer lead can be improved. Even though a support pole is not provided on the support member, and even though the protruding portion is made longer, the support member is not inclined and perfect wire bonding can be performed. Thus, failure in adhesion and bonding between the support member and the substrate can be prevented, so as to improve yield.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device in which external leads and wirings on a substrate are connected by metal wires in order to accommodate a wide variety of connectors.

[0002]

2. Description of the Related Art In a conventional hybrid integrated circuit device, as shown in FIG. 5, a desired wiring pattern 2 is provided on a substrate 1 made of ceramic, a printed circuit board, a metal substrate whose surface is subjected to an insulation treatment, and the like. The pattern 2 is provided with a plurality of circuit elements 3. The wiring pattern includes wiring, electrodes or lands integrated with the wiring, island-shaped lands, and pads to which external leads are fixed. Further, the external leads 4 are fixed to the pads by soldering,
The circuit element 2 and the like are hermetically sealed by the sealing means 5.

In this structure, since the external lead 4 is soldered to the pad, there is a problem that the external lead is separated from the pad portion due to an external force applied to the external lead 4. Therefore, for example, as shown in FIG. 6 of JP-A-2-165694, the one in which the outer lead 4 is integrally molded with the support member 6 made of resin is used. Drawing number 8 here
The portion indicated by is the portion corresponding to the fixing portion 9 with the pad shown in FIG.

However, since the external lead 4 is inserted into, for example, a socket, its size is specified. Particularly, in hybrid integrated circuit devices for cars and the like, there are various types depending on the size of the external lead or each manufacturer, and the thickness of the external lead varies depending on the width of the external lead and the current capacity. Therefore, it is necessary to prepare pads having different intervals, sizes, etc., according to the various types of external leads on the substrate for each model, which is irrational and has a problem of high cost. In addition, since the external leads are soldered, there is a problem in that when soldering, the solder scatters and causes a short circuit, a defect due to flux, or cleaning of flux is required.

Therefore, as shown in FIG. 3, for example, the outer lead 4 is supported by a supporting member 6, and the fixing portion 9 of the outer lead is projected from the supporting member 6 having a V shape when viewed in cross section. The one that was placed on the upper surface 11 of the portion 10 and had the electrical connection region of the lead exposed was used. For example, as shown in FIGS. 3 and 4, if the bonding pads 12 are arranged, the external leads 4 are connected by the fine metal wires 13 regardless of the size. Since the pattern of the board is not changed and the connection is made by wire bonding, there is a feature that the inconvenience caused by solder or flux is eliminated.

[0006]

However, the lower surface 14 of the projecting portion 10 of the supporting member 6 has the substrate 1 as shown in FIG.
The distance from the fixing portion of the external lead 4 to the fixing portion 9 of the upper surface 11 (the portion indicated by the arrow A) needs to be approximately 4 mm or more, though it is fixed to the fixing portion 9 via an adhesive. Also, because of the wire bonding device, the distance from the bonding area of the external lead to the bonding portion of the bonding pad 12 (the portion indicated by arrow B) is also required to be at least about 4.5 mm, and the E portion is the dead space. Therefore, when assembling the same circuit board, the size of the board is rather increased.

Further, the right end portion of the protruding portion in FIG. 3 is shown by a one-dot chain line in FIG. 4, but since nothing is provided between the one-dot chain line and the bonding pad 12, the substrate size is further increased. However, there was a problem that mounting efficiency deteriorated when considering the total.

[0008]

The present invention has been made in view of the above-mentioned problems. First, the bonding area of the external lead extends toward the inside of the substrate and corresponds to the lower layer of the extending portion. The problem is solved by providing an external lead supporting member having a recess facing the periphery of the substrate so that the device can be mounted on the substrate.

Second, the external leads are integrally supported, and the bonding region extends inward above the substrate.
An external lead supporting member in the shape of a letter V having a recess facing the periphery of the substrate so that the element can be mounted on the substrate corresponding to the lower layer of the extending portion; The problem is solved by providing the element provided in the lower layer of the portion with the bonding area of the external lead or the conductive pad provided at an arbitrary distance.

Thirdly, the problem is solved by providing a supporting column on the supporting member. Fourth, the bonding area of the external lead is extended toward the inside of the substrate, and is bonded to the substrate rather than the extended area so that the element can be mounted on the substrate corresponding to the lower layer of the extended portion. The problem is solved by providing an external lead supporting member having a short length.

[0011]

In the first place, by providing the external lead supporting member provided with the recess toward the periphery of the substrate, a bonding area having a sufficient area for bonding is provided on the upper surface of the projection, and the projection Since the device can be mounted on the lower layer of the lower surface, the dead space can be reduced.

Secondly, in addition to the first action, the strength of the external lead can be improved because the external lead is integrally supported. Thirdly, by providing the support member with a column, wire bonding can be performed completely without the support member tilting even if the protruding portion becomes long. Fourth
In addition, by providing the external lead supporting member having a length of a bonding portion with the substrate shorter than that of the extending region, the upper surface of the convex portion is sufficient for bonding, as in the first operation. Since a bonding area having an area is provided and an element can be mounted on the lower layer of the lower surface of the convex portion, the dead space can be reduced.

Further, as shown in FIG. 7, when the protruding portion is inclined, the longer the protruding portion is, the thicker the root portion is,
Strength is increased compared to FIG.

[0014]

Embodiments of the present invention will be described below with reference to FIGS. 1 and 2. First, the insulating-treated first substrate 10
2, a wiring pattern 11 is formed on the surface, and a land 12 is provided on a part of this wiring pattern as shown in FIG. A semiconductor chip 13 is soldered to this land, and a resistance or the like is fixed to the conductive path 11 which is a wiring by printing, or a component is soldered.

Here, the first substrate 10 may be a ceramic substrate, an insulating resin substrate such as a printed substrate or a metal substrate whose surface is subjected to an insulation treatment. Here, the metal substrate 10 in which aluminum oxide is produced by anodizing the surface of the Al substrate
The wiring pattern 11 is made of copper foil and is applied by hot pressing via a resin layer such as polyimide.

Naturally, the semiconductor chip 13 is a diode, a transistor chip and an LSI chip, and in addition, parts such as a resistor 14, a transformer and a capacitor are mounted if necessary. The wiring pattern 11 includes the wiring 15 and an electrode integrated with the wiring (for example, a portion 16 to which a chip resistor is connected).
And bonding pad 17), land 1 integrated with wiring
8. Pads 19 (indicated by hatching in the drawing) which are integrated with wiring but are used for connection with external leads, and lands 13 and the like.

If necessary, the chip and the conductive path 11 are wire-bonded with fine metal wires to achieve a predetermined circuit. Further, in the vicinity of at least one side of the first substrate 10, a pad 19 (a region hatched with diagonal lines) for connection with an external lead 21 extending from the circuit is provided.
Are provided in plural. This arrangement method is a feature of the present invention, but will be described later for convenience of explanation.

The external lead 21 is fixed by an external lead supporting member 22, and at least a connection region is exposed for connection with the pad 19. Here, as is apparent from FIG. 1, the external leads are integrally molded with the support member 22, and only the bonding region is exposed. Since it is integrally molded, even if external force is applied to the external lead 21, the external lead is firmly fixed,
The bonding portion of the wire does not peel off. Further, it is not necessary to integrally form, and the stepped portion (face 23
External leads may be adhesively fixed to the upper surface of the convex portion 24).

The point here is that the main padding region is simply exposed as described in FIG.
The feature of the present invention is that the recess 2 is formed below the right end surface 25 of the protrusion 24.
6 is provided. The bonding region for connecting the external lead 21 and the substrate 10 needs to have a length of at least about 4 mm as described in the section of the problem to be solved by the invention, and accordingly, the supporting member 22 has a length of about 4 mm. The protruding length also becomes longer. However, since the recess 26 is provided, the space formed by the recess 26 and the surface of the substrate 10 is
Since elements (wiring, printing resistors, etc.) can be mounted, the element mounting efficiency of the board can be improved, and the board size and the size of the entire apparatus can be reduced as compared with the structure of FIG.

In FIG. 2, the area extending downward from the point indicated by the arrow D is the conventional type, that is, the portion indicated by the alternate long and short dash line in FIG. The alternate long and short dash line indicated by the arrow E indicates the right side of the joint between the support member 22 and the substrate 10. That is, the various types of wiring patterns described above are provided between the arrows D and E, and it is possible to mount a device having a height such as a chip resistor or a semiconductor chip, depending on the height of the recess.

As the second feature, the arrangement of the pads 19 shown by the diagonal lines will be described below. The position of the pad 12 described with reference to FIG. 4 is arranged at a certain distance from the bonding portion of the external lead 4 in order to perform bonding. Therefore, they are arranged on a straight line. When this structure is applied to FIG. 1 or FIG. 2, the pads arranged on this straight line between the arrows D and E become an obstacle, and it becomes difficult to arrange various types of wiring patterns. There is a problem that worsens.

Therefore, in the present application, the pad positions are not set at a constant distance due to the wiring pattern provided between the arrows D and E or due to the wiring pattern on the right side of the arrow D. In other words, with the wiring pattern provided on the left and right sides of the region D as a boundary, an empty space is searched for and the pad 19 is provided in that region, so that the deterioration of the mounting efficiency in the case of FIG. 4 can be prevented. Also, since the bonding machine has recently been computer-controlled, there is no problem because the distance between the bonding area of the external lead and the pad can be arbitrarily selected. It is also possible to directly bond directly to a semiconductor element such as a transistor.

Here, when it is necessary to lengthen the upper surface of the convex portion due to the specifications of the external leads, the bonding surface between the supporting member and the substrate may be peeled off due to the pressing force of the bonding, or the ultrasonic output may be properly applied to the bonding surface during bonding. It may not be transmitted. In this case, this problem can be solved by providing a column between the lower surface of the convex portion 24 of the support member and the substrate. The support may be integrally formed with the support member or the substrate. It may also be formed as a separate body.
Although it depends on the width of each external lead, at least one external lead may be provided.

On the other hand, a second embodiment will be described with reference to FIG. In this embodiment, there is a surface inclined from the upper corner of the convex portion 24 of the previous embodiment to the right side of the bonding surface with the substrate and inclined to the lower left. Since the wiring pattern is provided in the space formed here as well, since it has a recess although the shape is different, the mounting efficiency can be improved. In both examples, finally, a sealing space for sealing the surface of the substrate with resin is formed by the support member 22 and a frame material or a case material (not shown here) that surrounds the periphery of the substrate. In FIG. 7, since it is inclined to the lower left diagonally, it is difficult to mount a device having a height on the left end, but it is possible to take out the bubbles taken into the resin when the resin is injected to the surface.

For example, silicon gel is injected from above,
Subsequently, a resin such as epoxy is injected and completed. Silicone gel prevents distortion of fine metal wires connected to a semiconductor chip or the like and improves moisture resistance, and is not always required to be injected.

[0026]

As is apparent from the above description, the first
In addition, by providing an external lead supporting member having a convex portion provided with a recess toward the periphery of the substrate, a bonding area having a sufficient area for bonding is provided on the upper surface of the convex portion, and the lower surface of the convex portion is provided. Since the device can be mounted on the lower layer, the dead space can be reduced. Therefore, depending on the size of the external leads, the same board can be developed in many models without changing the pattern design provided on the board, the mounting efficiency of the board is not deteriorated, and an increase in the size of the entire apparatus can be suppressed.

Secondly, in addition to the first effect, since the outer leads are integrally supported, the strength of the outer leads can be improved. Further, the position of the pad to which the other end of the wire connected to the external lead is connected, that is, the position of the pad, sets the length of this wire, that is, the distance between the bonding region of the external lead and the pad. In other words, the pad is provided at an appropriate position (vacant space) due to the wiring pattern of the recessed portion or the wiring pattern provided on the right side of it, so the mounting efficiency is deteriorated due to restrictions on the pad position. There is nothing to do.

Thirdly, by providing the support member with a column, it is possible to perform wire bonding completely without the support member tilting even if the protruding portion becomes long. Therefore, defective adhesion and defective bonding between the support member and the substrate can be prevented, and the yield can be improved. Fourthly, by providing an external lead supporting member having a length of a bonding portion with the substrate shorter than that of the extending region, the upper surface of the convex portion is bonded to the upper surface in the same manner as the first action. Since the bonding region having a sufficient area is provided and the element can be mounted on the lower layer of the lower surface of the convex portion, the dead space can be reduced.

Further, as shown in FIG. 7, when the protruding portion is inclined, the longer the protruding portion is, the thicker the root portion is,
Strength is increased compared to FIG. Further, when the resin is sealed, bubbles taken in can be removed, and in the case of a device in which a large current flows and heat is generated, it is possible to prevent the bubbles from bursting.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a first embodiment of the present invention.

FIG. 2 is a plan view corresponding to FIG.

FIG. 3 is a cross-sectional view of a conventional hybrid integrated circuit device.

FIG. 4 is a plan view corresponding to FIG.

FIG. 5 is an assembly diagram of a conventional hybrid integrated circuit device.

FIG. 6 is a view of a conventional support member integrally molded with external leads.

FIG. 7 is a diagram illustrating a second embodiment of the present invention.

[Explanation of symbols]

 10 First Substrate 11 Wiring Pattern 12 Land 13 Semiconductor Chip 14 Resistor 15 Wiring 17 Bonding Pad 18 Land 19 Pad 21 External Lead 22 External Lead Support Member 26 Recess

Claims (4)

[Claims] 1. A substrate having at least a surface of insulation, a wiring pattern provided on the substrate, a semiconductor element electrically connected to a land which is integral with or separate from the wiring pattern, and the wiring. An external lead to which an input / output signal of a circuit composed of the pattern or the semiconductor element is applied, and a bonding region of the external lead extends toward the inside of the substrate, and corresponds to a lower layer of the extending portion. An external lead supporting member provided with a recess facing the periphery of the substrate so that an element can be mounted on the substrate; connecting means for connecting a conductive pad provided on the substrate to a bonding region of the external lead; and at least the substrate A hybrid integrated circuit device comprising: a sealing means for protecting a surface and a bonding portion. 2. A substrate having an insulating property at least on the surface, a wiring pattern provided on the substrate, a semiconductor element electrically connected to a land which is integral with or separate from the wiring pattern, and the wiring. An external lead to which an input / output signal of a circuit composed of the pattern or the semiconductor element is applied, and the external lead are integrally supported, and a bonding region is extended inward above the substrate. So that the device can be mounted on the substrate corresponding to the lower layer of the part,
The outer lead supporting member having a V shape having a recess facing the periphery of the substrate, and the element provided on the substrate and below the extending portion, allow a bonding area of the outer lead or an arbitrary distance. A hybrid integrated circuit device, comprising: a conductive pad provided on the substrate; a connecting means for connecting the conductive pad and a bonding region of the external lead; and a sealing means for protecting at least the substrate surface and the bonding portion. . 3. The hybrid integrated circuit device according to claim 1, wherein a pillar is provided in the recess of the substrate supporting member. 4. A substrate having an insulating property at least on the surface, a wiring pattern provided on the substrate, a semiconductor element electrically connected to a land formed integrally with or separately from the wiring pattern, and the wiring. An external lead to which an input / output signal of a circuit composed of the pattern or the semiconductor element is applied, and a bonding region of the external lead extends toward the inside of the substrate, and corresponds to a lower layer of the extending portion. An external lead supporting member having a length of a bonding portion with the substrate shorter than that of the extending region so that an element can be mounted on the substrate, and a bonding region between the conductive pad provided on the substrate and the external lead. A hybrid integrated circuit device, comprising: a connecting means for connecting the substrate and a sealing means for protecting at least the substrate surface and the bonding portion.