JPH08302309A - Adhesive sheet and method for stripping resist - Google Patents

Abstract

PURPOSE: To completely strip and remove a resist material on an unnecessary article by providing a curable, pressure-sensitive adhesive comprising a pressure- sensitive adhesive polymer having a particular property and a nonvolatile compd. having one or more unsatd. double bonds in its molecule on a substrate film. CONSTITUTION: 10 to 200 pts.wt. volatile unsatd. compd. having one or more unsatd. double bonds in its molecule, 0.1 to 10 pts.wt. polymn. initiator, and optionally a crosslinking agent or a filler are added to 100 pts.wt. pressure- sensitive adhesive polymer comprising 20 to 100wt.%, based on the whole polymer, homopolymer of a hydrophilic monomer having a solubility of not less than 30g in 100g of water at 20 deg.C, or copolymer of a monomer mixture contg. the above hydrophilic monomer in an amt. of not less than 20wt.% to prepare a curable, pressure-sensitive adhesive. An about 10 to 180μm-thick resin film is coated with the adhesive, and the coating is dried to form an adhesive sheet for stripping. This sheet is applied onto an unnecessary article with a resist pattern and heated and pressed to strip off the resist material.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is intended for peeling and removing a resist material on an unnecessary article when manufacturing finely processed parts such as semiconductors, circuits, various printed boards, various masks and lead frames. And the peeling method of the above resist material.

[0002]

2. Description of the Related Art In the manufacture of semiconductor devices, a resist material is applied onto a silicon wafer, and an image consisting of a predetermined resist pattern is formed by a normal photo process. The resist material thus removed is removed to form a predetermined circuit. Further, in order to form the next circuit, the resist material is applied again, and the cycle of image formation-etching-resist material removal is repeated. Also, when forming a circuit on various substrates, the unnecessary resist material is removed after the resist pattern is formed.

[0003] Here, the unnecessary resist material is generally removed by an asher (ashing means), a solvent, a chemical or the like. However, it is not preferable to use an asher for removing the resist material, because it may take a long time for the work and impurity ions in the resist material may be injected into the wafer. Further, the use of a solvent or a chemical causes a problem that the working environment is harmed.

Therefore, in order to remove the resist material which has become unnecessary, sheet-shaped or tape-shaped adhesive sheets have been used recently, which are attached to the upper surface of the resist pattern and heated or A method has been proposed in which the adhesive sheet and the resist material are integrally peeled off after being irradiated with light such as ultraviolet rays to be cured. This method is expected to be put to practical use as a simple and reliable removal method without the problem that the impurity ions in the resist material are implanted into the wafer or the working environment is damaged.

[0005]

However, according to the study by the present inventors, in the method using the above-mentioned adhesive sheets, a part or a minute part of the resist pattern to be removed is not peeled off, It may remain on the article as it is. Therefore, it is necessary to repeat the steps of attaching and peeling the adhesive sheets twice and three times, and even if it is repeated in this way, the resist material is completely removed. In many cases, peeling and removal cannot be performed.

Therefore, the present invention overcomes the above-mentioned problem of poor releasability when peeling and removing an unnecessary resist material using adhesive sheets, and easily and surely removes the resist material. The purpose is to do.

[0007]

In order to overcome the above problems, the inventors of the present invention have conducted extensive studies and as a result, as a result of resist peeling adhesive sheets, a curable pressure-sensitive adhesive provided on a film base material. Knowing that by using the agent made of a specific pressure-sensitive adhesive polymer, the peeling performance of the resist material is dramatically improved, and the resist material on the unnecessary article can be peeled off easily and surely, This invention was completed.

That is, the first aspect of the present invention (claim 1)
Is a curable pressure-sensitive adhesive containing a pressure-sensitive adhesive polymer and a non-volatile compound having at least one unsaturated double bond in the molecule on a film substrate. The adhesive polymer is a homopolymer of a hydrophilic monomer having a solubility in water (maximum weight that can be dissolved in 100 g of water) of 30 g or more at 20 ° C., or exceeds 20% by weight of the above hydrophilic monomer. Monomer comprising in proportion
20 to 100% by weight of the copolymer of the mixture in the total polymer
The present invention relates to a sheet-shaped or tape-shaped adhesive sheet for resist stripping, which is characterized in that it is contained in the following ratio.

In the resist stripping adhesive sheet according to the first aspect of the invention, in particular, the copolymerization ratio of the hydrophilic monomer in the above copolymer is 25 to 60% by weight (claim). 2), the hydrophilic monomer is an amide-based monomer or an amine-based monomer (claim 3), and the hydrophilic monomer is a carboxyl group-containing monomer, a hydroxyl group-containing monomer or a polyglycol-based monomer The aspect which is a monomer (claim 4) is each a preferable aspect.

The second aspect of the present invention (claim 5) is as follows.
A resist stripping method using the resist stripping adhesive sheet having the above-mentioned configuration, wherein the resist stripping adhesive sheet having the above-mentioned configuration is pasted on an article having a resist pattern, and the adhesive sheet The present invention relates to a resist stripping method, characterized in that the adhesive sheet and the resist material are stripped together after the pressure-sensitive adhesive of the sheet is cured.

[0011]

In the present invention, as the film substrate, a resin film made of polyethylene, polypropylene, polyethylene terephthalate, acetyl cellulose or the like and having a thickness of usually about 10 to 100 μm is used. When the adhesive is cured by light irradiation, a material that transmits light such as ultraviolet rays is selected and used.

The curable pressure-sensitive adhesive provided on the film substrate comprises a pressure-sensitive adhesive polymer and a non-volatile compound having at least one unsaturated double bond in the molecule, and A homopolymer of a hydrophilic monomer having a solubility in water (maximum weight soluble in 100 g of water; the same applies hereinafter) of 30 g or more at 20 ° C. as a part or all of the pressure-sensitive adhesive polymer Hydrophilic monomer of
It is characterized in that a hydrophilic polymer composed of a copolymer of a monomer mixture containing at least 20% by weight is used.

Such a hydrophilic polymer has a good affinity with the resist material, and when the adhesive sheets are attached to the surface of the resist material on the article, the resist material and the adhesive The above-mentioned resist material is surely peeled off from the article by performing a peeling operation after the integration by the subsequent curing treatment after the integration. That is, the use of the above hydrophilic polymer has an effect of significantly improving the resist peeling performance.

Such a hydrophilic polymer may be obtained by polymerizing or copolymerizing a hydrophilic monomer having a solubility in water of 30 g or more at 20 ° C. by itself or by modifying the hydrophilic monomer with other hydrophilic monomers. It is produced by copolymerizing a monomer mixture consisting of a monomer and a hydrophilic monomer in a proportion of at least 20% by weight. The polymerization can be performed by a known method such as solution polymerization, emulsion polymerization, suspension polymerization, bulk polymerization and the like.

The hydrophilic monomer used here has a solubility in water, that is, a maximum weight that can be dissolved in 100 g of water,
It is a monomer that weighs 30 g or more at 20 ° C., and typical examples thereof include an amide-based monomer and an amine-based monomer. In addition, a carboxyl group-containing monomer, a hydroxyl group-containing monomer or a polyglycol-based monomer may be used.

Examples of the amide-based monomer include (meth) acrylamide, N-vinyl-2-pyrrolidone,
Examples thereof include N, N-dimethyl (meth) acrylamide and N, N-dimethylaminopropyl (meth) acrylamide. Further, amine-based monomers include, for example, N, N-
Dimethylaminoethyl (meth) acrylate, N, N-
Dimethylaminopropyl (meth) acrylate, N, N
-Diethylaminoethyl (meth) acrylate, N, N
-Diethylaminopropyl (meth) acrylate, (meth) acryloylmorpholine and the like.

Examples of the carboxyl group-containing monomer include (meth) acrylic acid, maleic acid and itaconic acid.
Examples of the hydroxyl group-containing monomer include hydroxyethyl (meth) acrylate and hydroxypropyl (meth) acrylate. Polyglycol-based monomers include diethylene glycol mono (meth) acrylate, triethylene glycol mono (meth) acrylate, tetraethylene glycol mono (meth) acrylate, polyethylene glycol mono (meth). Acrylate, methoxydiethylene glycol (meth) acrylate, methoxytriethylene glycol (meth) acrylate, methoxypolyethylene glycol mono (meth) acrylate, polypropylene glycol (meth) acrylate , Methoxy polypropylene glycol (meth) acrylate, etc.

As described above, these hydrophilic monomers can be used alone, but more preferably, they are used as a mixture with a modifying monomer. Examples of the modifying monomer include esters of acrylic acid or methacrylic acid with alcohols having a carbon number of usually 12 or less, vinyl acetate, vinyl propionate, styrene, and (meth) acrylonitrile. These reforming monomers
Can function as a component that imparts desired pressure-sensitive adhesive properties to the adhesive.

When a monomer mixture consisting of a hydrophilic monomer and a modifying monomer is used, the copolymerization ratio of the hydrophilic monomer is set so as not to prevent the effect of improving the resist stripping performance based on the hydrophilic monomer. The proportion should be at least 20% by weight, and the copolymerization ratio of the hydrophilic monomer is preferably 25 to 60% by weight in consideration of the adhesion-imparting function of the modifying monomer. More preferably, it should be 30 to 50% by weight.

The hydrophilic polymer composed of such a monomer has a weight average molecular weight of usually 100,000 to 100,000.
It is preferably 2 million. If the molecular weight is too low, the viscosity of the non-volatile compound will be low when blended with the non-volatile compound, and problems such as flowing during storage tend to occur. If the molecular weight is too high, handling problems will easily occur.

In the present invention, as the pressure-sensitive adhesive polymer, the above-mentioned hydrophilic polymer may be used alone, or may be used in combination with another modifying polymer.
As the modifying polymer, an acrylic polymer known as a general-purpose pressure-sensitive adhesive polymer, that is, an ester of acrylic acid or methacrylic acid and an alcohol having a carbon number of 12 or less as a main component is used as a main component. If necessary, the above-mentioned hydrophilic monomer such as a carboxyl group-containing monomer is used together in a proportion such that the copolymerization ratio thereof is 20% by weight or less, and if necessary, the above-mentioned other modifying monomer or the like is used as a copolymerization component. The acrylic polymer described above is preferably used.

Such a modifying polymer is used to adjust the pressure-sensitive adhesive property of the adhesive, but if too much is used, the good resist peeling performance of the hydrophilic polymer is impaired. There is a risk. Therefore, when using this modifying polymer, all polymer
The proportion of the hydrophilic polymer in the composition is 20% by weight or more, preferably 40% by weight or more, more preferably 50% by weight.
It is better to be above. Needless to say, when sufficient pressure-sensitive adhesive properties and the like can be obtained with the hydrophilic polymer alone, the hydrophilic polymer alone, that is, the hydrophilic polymer, is used in a proportion of 100% by weight in the total polymer.

The non-volatile compound compounded in the pressure-sensitive adhesive polymer is adhered to an article having a resist pattern, and then dissolved in the resist material by this compound.
Due to phenomena such as swelling, migration, and diffusion, it has the function of promoting the integration of the resist material and the adhesive and then curing. Therefore, this non-volatile compound has one or more unsaturated double bonds in the molecule, has good affinity with the resist material, and has good compatibility with the pressure-sensitive adhesive polymer during storage. It is hoped that it will not flow. Nonvolatile means that the compound does not volatilize during the manufacturing process of the adhesive sheet, for example, during the coating and drying processes.

Examples of such non-volatile compounds include phenoxy polyethylene glycol (meth) acrylate,
ε-caprolactone (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) ) Acrylate, urethane (meth) acrylate, epoxy (meth) acrylate, oligoester (meth) acrylate, and the like.
Also included are the monomers constituting the hydrophilic polymer described above, that is, amide-based monomers, amine-based monomers, carboxyl copolymer-containing monomers, hydroxyl group-containing monomers, and polyglycol-based monomers.

As the non-volatile compound, one kind or two or more kinds are selected from the above-mentioned various compounds depending on the kind of the pressure-sensitive adhesive polymer to be used, the resist material to be used, and the like. can do. The amount used is 100 parts by weight of the pressure-sensitive adhesive polymer,
Usually, it is preferable that the amount is 10 to 200 parts by weight. If the amount used is too small, the resist peeling effect is insufficient, and if too large, the adhesive flows out during storage, which is not preferable.

The curable pressure-sensitive adhesive used in this invention is
In addition to containing the pressure-sensitive adhesive polymer and the non-volatile compound as essential components, a polymerization initiator suitable for the curing means is added. For example, in the case of thermosetting, a thermal polymerization initiator such as benzoylperoxide or azobisisobutyronitrile that generates a radical by heating is used, and in the case of photocuring such as ultraviolet rays, benzoin or benzoinethyl ether. A photopolymerization initiator that generates a radical by light irradiation such as tellurium or dibenzyl is used. These polymerization initiators are usually used in the range of 0.1 to 10 parts by weight with respect to 100 parts by weight of the pressure-sensitive adhesive polymer.

Further, the curable pressure-sensitive adhesive includes a cross-linking agent for cross-linking the pressure-sensitive adhesive polymer to enhance cohesive force as an adhesive, such as polyisocyanate, polyepoxy, and various metal salts. A chelate compound or the like may be included. For the same purpose, a filler such as finely divided silica may be included. Further, various known additives such as tackifying resins, colorants, and anti-aging agents may be contained in the curable pressure-sensitive adhesive as required.

In the present invention, such a curable pressure-sensitive adhesive is applied onto the above-mentioned film base material by an appropriate coating means and dried to obtain a sheet shape or a tape shape. Manufacture adhesive sheets for resist stripping. The amount of adhesive applied is usually about 10 to 180 μm after drying.
It should be so.

In the resist stripping method of the present invention,
First, the resist peeling adhesive sheet having the above-described structure is attached onto an article having a resist pattern. At this time, the resist material and the adhesive are integrated with each other with good affinity, but in order to promote the integration, it is preferable to apply heat and pressure during the attachment. After this attachment, it is subjected to a curing treatment by heating or irradiation with light such as ultraviolet rays.

By this curing treatment, the adhesive is cured in a state where it is integrated with the resist material, and the elastic modulus is remarkably increased, and along with this, the adhesive force between the resist material and the article is significantly reduced. As a result, by performing the peeling operation of the adhesive sheets after the curing, the resist material on the article is easily and completely peeled and removed together with the adhesive sheets. At that time, there is no concern that the work will take a long time, unlike the conventional method using an assuring method, and that impurity ions in the resist material will not be injected into the wafer, and that the work environment will deteriorate as in the conventional method using a solvent. Nor.

[0031]

As described above, in the present invention, the use of the specific curable adhesive sheet in which a part or all of the pressure-sensitive adhesive polymer is a hydrophilic polymer,
By sticking this to the resist material on the article, after the adhesive is cured, the adhesive sheet and the resist material are integrally peeled off, without causing the problem of peeling failure as already proposed, The resist material can be removed easily and reliably.

[0032]

EXAMPLES Next, examples of the present invention will be described to explain more specifically. In addition, in the following, "solubility (20
"° C / water)" means the solubility in water at 20 ° C, ie the maximum weight that can be dissolved in 100 g of water.

Example 1 In a flask equipped with a 1-liter stirrer, the solubility (20 ° C.) was measured.
/ Water) is 30 g or more N-vinyl-2-pyrrolidone (hereinafter referred to as NVP) 40 g, solubility (20 ° C / water)
60 g of 2-methoxyethyl acrylate (hereinafter referred to as MEA) having a content of 0.75 g, 150 g of methanol,
100 g of ion-exchanged water was charged, the temperature was raised to 60 ° C. under a nitrogen atmosphere, and then 0.175 g of azobisisobutyronitrile (hereinafter referred to as AIBN) was added as a polymerization initiator, and polymerization was carried out for 8 hours. The polymerization rate was almost 100%, and the weight average molecular weight of the obtained hydrophilic polymer was 640,000 (converted to polyethylene glycol).

Polymer solution 10 thus obtained
To 0 g, 5.6 g of tetraethylene glycol dimethacrylate, 5.6 g of octaethylene glycol diacrylate, 7.2 g of tetramethyl methane triacrylate, and Irgakiure-184 as a photopolymerization initiator
0.8 g of 1-hydroxycyclohexyl phenyl ketone (trade name, manufactured by Ciba-Geigy Co., Ltd.) and 13 g of methanol were uniformly mixed to prepare a curable pressure-sensitive adhesive solution. Next, this curable pressure-sensitive adhesive solution was applied on a polyester film having a thickness of 50 μm so that the thickness after drying would be 40 μm, and dried at 145 ° C. for 5 minutes to obtain a resist peeling adhesive sheet. -I made a gut.

Example 2 NVP 15 g as a polymerization raw material, solubility (20 ° C./water)
Is 30 g or more, 15 g of dimethylaminopropylacrylamide, 70 g of n-butyl acrylate having a solubility (20 ° C./water) of 0.32 g, 150 g of ethyl acetate, A
Polymerization was carried out for 12 hours in the same manner as in Example 1 using 0.175 g of IBN, and then adjusted to a solid content concentration of 25% by weight with ethyl acetate. The weight average molecular weight of the obtained hydrophilic polymer was 410,000 (converted to polyethylene glycol). Using the polymer solution thus obtained, a curable pressure-sensitive adhesive solution was prepared in the same manner as in Example 1 below, and further an adhesive sheet for resist stripping was prepared.

Example 3 Using 50 g of NVP, 50 g of MEA, 200 g of ethyl acetate and 0.175 g of AIBN as polymerization raw materials, polymerization was carried out for 7 hours in the same manner as in Example 2, and then the solid content concentration was 25% by weight with ethyl acetate. Thus, a polymer solution A was obtained. The weight average molecular weight of the hydrophilic polymer thus obtained was 700,000 (calculated as polyethylene glycol).

Separately, 95 g of n-butyl acrylate as a raw material for polymerization, 5 g of acrylic acid having a solubility (20 ° C./water) of 30 g or more, 150 g of ethyl acetate, benzoylperoxide (hereinafter referred to as BPO). 175
Polymerization was carried out in the same manner as in Example 2 using g, and then adjusted to a solid content concentration of 25% by weight with ethyl acetate,
A polymer solution B was obtained. The modifying polymer thus obtained had a weight average molecular weight of 650,000 (in terms of polyethylene glycol).

Next, 50 g of the above-mentioned polymer solution A and 50 g of the polymer solution B were uniformly mixed, and using this mixed polymer solution, a curable pressure-sensitive adhesive solution was prepared in the same manner as in Example 1 below. The adhesive sheet for resist peeling was prepared and further prepared.

Example 4 90 g of the polymer solution A obtained in Example 3 and the polymer solution B
10 g was uniformly mixed, and using this mixed polymer solution, a curable pressure-sensitive adhesive solution was prepared in the same manner as in Example 1, and further an adhesive sheet for resist stripping was prepared.

Example 5 As a polymerization raw material, 20 g of methacrylic acid having a solubility (20 ° C./water) of 30 g or more and a solubility (20 ° C./water) of 30 were used.
5 g of 2-hydroxyethyl acrylate having a weight of at least g,
Acrylic acid 2 whose solubility (20 ° C / water) is 0.01 g
-Ethylhexyl 75 g, ethyl acetate 150 g, BPO
Polymerization was carried out for 12 hours in the same manner as in Example 2 using 0.175 g, and the solid content concentration was adjusted to 25% by weight with ethyl acetate. The weight average molecular weight of the obtained hydrophilic polymer was 600,000 (calculated as polyethylene glycol).

Polymer solution 10 thus obtained
To 0 g, 2.5 g of epoxy acrylate, 3 g of dodecaethylene glycol diacrylate, diethylene glycol
A curable pressure-sensitive adhesive solution was prepared by uniformly dissolving and mixing 1 g of ludymethacrylate and 0.75 g of Irgakiure-184 (photopolymerization initiator). Using this solution, an adhesive sheet for resist stripping was produced in the same manner as in Example 1 below.

Example 6 As a polymerization raw material, methoxytetraethylene glycol acrylate 3 having a solubility (20 ° C./water) of 30 g or more was used.
0g, MEA 50g, solubility (20 ° C / water) 1.5g
20 g of ethyl acrylate, 200 g of ethyl acetate,
Using 0.175 g of AIBN, 12 as in Example 1
After polymerizing for a period of time, the solid concentration was adjusted to 25% by weight with ethyl acetate. The weight average molecular weight of the obtained hydrophilic polymer was 320,000 (converted to polyethylene glycol). Using the polymer solution thus obtained, a curable pressure-sensitive adhesive solution was prepared in the same manner as in Example 1 below, and further an adhesive sheet for resist stripping was prepared.

Comparative Example 1 MEA 100 g and ethyl acetate 150 as polymerization raw materials
Polymerization was carried out for 12 hours in the same manner as in Example 1, using 0.175 g of AIBN and AIBN, and the solid content concentration was adjusted to 2 with ethyl acetate.
It was adjusted to be 5% by weight. The weight average molecular weight of the obtained polymer was 450,000 (converted to polyethylene glycol). Using the polymer solution thus obtained, a curable pressure-sensitive adhesive solution was prepared in the same manner as in Example 1 below, and further an adhesive sheet for resist stripping was prepared.

Comparative Example 2 Example 1 was carried out using only the polymer solution B obtained in Example 3.
A curable pressure-sensitive adhesive solution was prepared in the same manner as above, and an adhesive sheet for resist stripping was prepared.

Comparative Example 3 10 g of the polymer solution A obtained in Example 3 and the polymer solution B
90 g was uniformly mixed, and using this mixed polymer solution, a curable pressure-sensitive adhesive solution was prepared in the same manner as in Example 1 below, and a resist peeling adhesive sheet was prepared.

In order to examine the resist peeling performance of the resist peeling adhesive sheets prepared in Examples 1 to 6 and Comparative Examples 1 to 3 above, resist pattern films A and B formed by the following method were used. On the other hand, a resist peeling test was conducted in the following manner. These results are shown in Table 1 below.
It was as shown in.

<Formation of resist pattern film> A resist material consisting of novolak and quinone diazide was applied to the surface of a silicon wafer (semiconductor substrate), and heating, exposure and development were performed to form a resist pattern on the entire surface of the wafer. . This was used as a resist pattern film A. Next, As ions were implanted into the entire surface of the film at an acceleration energy of 80 KeV and a dose amount of 1 × 10 ¹⁶ ions / cm ² , to obtain a resist pattern film B.

<Resist Peeling Test> Examples 1 to 6 were formed on the entire surfaces of the resist pattern films A and B thus formed.
And the adhesive peeling adhesive sheets produced in Comparative Examples 1 to 3.
After pressure bonding at room temperature and pasting, heat at 120 ° C for 3 minutes, and use a high-pressure mercury lamp to apply 1 J / cm ^{2 of} ultraviolet light.
The pressure sensitive adhesive was cured by irradiating the pressure sensitive adhesive.

After this curing, the adhesive sheet was peeled off, and the surface of the silicon wafer was observed with a fluorescence microscope. When the resist material was not recognized at all, ⊚, when the trace amount of the resist material was recognized, ○, the resist material Was evaluated as "x" when no peeling was observed or most resist materials were observed. For the resist pattern film B, the removing operation including the above-mentioned pasting, curing and peeling treatment was repeated three times.

[0050]

[Table 1]

As is clear from the results shown in Table 1 above, according to the resist stripping adhesive sheets of Examples 1 to 6 of the present invention, the resist pattern films A and B on the silicon wafer were compared with each other. It can be seen that the adhesive sheet can be removed more reliably and easily than the adhesive sheets 1 to 3 for removing resist.

Continuation of front page (51) Int.Cl. ⁶ Identification number Internal reference number FI Technical indication H01L 21/027 H01L 21/30 572Z (72) Inventor Ryo Namikawa 1-2-1, Shimohozumi, Ibaraki-shi, Osaka Nitto Denko Corporation

Claims (5)

[Claims] 1. A pressure-sensitive adhesive polymer on a film substrate.
And a non-volatile compound having at least one unsaturated double bond in the molecule, and a curable pressure-sensitive adhesive is provided, and the pressure-sensitive adhesive polymer has a solubility in water (water 10
(A maximum weight that can be dissolved in 0 g) is 30 g or more at 20 ° C., or a homopolymer of a hydrophilic monomer, or a copolymer of a monomer mixture containing at least 20% by weight of the above hydrophilic monomer. An adhesive sheet for resist stripping, characterized by being contained in a proportion of 20 to 100% by weight in all polymers. 2. The adhesive peeling adhesive sheet according to claim 1, wherein the copolymerization ratio of the hydrophilic monomer in the copolymer is 25 to 60% by weight. 3. The resist peeling adhesive sheet according to claim 1, wherein the hydrophilic monomer is an amide-based monomer or an amine-based monomer. 4. The adhesive peeling sheet according to claim 1, wherein the hydrophilic monomer is a carboxyl group-containing monomer, a hydroxyl group-containing monomer or a polyglycol-based monomer. 5. An article on which a resist pattern is present,
The adhesive sheet for resist stripping according to any one of claims 1 to 4 is attached, the pressure-sensitive adhesive of the adhesive sheet is cured, and then the adhesive sheet and the resist material. A method for removing a resist, which comprises: