JPH08299860A - Spray fluxer - Google Patents

Abstract

PURPOSE: To simply adjust the solid content of flux supplied to a spray fluxer to an appropriate percentage corresponding to a soldering device, etc. CONSTITUTION: An original liquid tank 31 containing flux original liquid A and a diluted liquid tank 32 containing diluted liquid B are installed. A tank pressure controlling circuit 46 for taking out necessary amounts of the liquid A and the liquid B from tanks 31, 32 is provided. A preparation tank 33 is installed in which the liquids A, B which are taken out from the tanks 31, 32 by air pressure from the circuit 46 are mixed in a set ratio to prepare flux F. The tank 33 is also connected to the circuit 46, and the flux F which is taken out from the tank 33 by air pressure from the circuit 46 is supplied to nozzles 12a, 12b through a pipeline 99 to be sprayed as flux mist (f) to a work.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a spray fluxer.

[0002]

2. Description of the Related Art As shown in FIG. 2, a jet type soldering apparatus has a nozzle 12 of a spray fluxer, a preheater 13 and a jet type solder bath 14 along a conveyor 11 which conveys a component mounting board as a work. Is an array of.
The preheater 13 and the jet solder bath 14 are covered with a chamber 15.

In the spray fluxer, a pipe 22 is inserted into the flux F contained in the pressure tank 21, the pipe 22 is connected to the nozzle 12, and the air is supplied from the air pressure source 20 into the pressure tank 21. By pressurizing the flux surface with compressed air, the flux F in the pressure tank 21 is passed through the pipe 22 and the nozzle.
It is supplied to the nozzle 12, the flux mist f is sprayed from the nozzle 12 to the component mounting board, and the flux is applied.

The flux mist that has not been applied to the substrate is sucked through the hood 23 and the duct 24 and collected by the dust collector 25.

In such a soldering apparatus, a case where soldering is performed in the atmosphere while leaving the chamber 15 in the atmosphere, and a case where nitrogen is supplied into the chamber 15 and soldering is performed in a nitrogen atmosphere There is.

In the case of performing soldering with molten solder jetted from the solder jet nozzle of the jet type solder bath 14 in the atmosphere, a flux F having a solid content of 8 to 15% (for example, 10%) is suitable, and in a nitrogen atmosphere. When soldering is performed with a jetted molten solder, the solid content is 1 to 5% (for example, 5%).
%) Flux F is suitable.

On the other hand, even when the soldering in the nitrogen atmosphere is switched to the soldering in the air, the flux F having a solid content of 5% for the nitrogen atmosphere may be used as it is for the air. In the case of this atmosphere, since the solid content is insufficient, it is necessary to apply a larger amount of flux than in the case of nitrogen atmosphere.

[0008]

When a large amount of flux is applied in this manner, as shown in FIG. 3, due to the flux Fa bleeding up onto the upper surface of the component mounting board P as a work, there is a poor appearance and mounting. There is a risk of reliability deterioration such as corrosion of the component W, and the excess flux Fb drops off from the rear end of the substrate P conveyed in an ascending slope, resulting in wasted flux, and the device is easily soiled. There is a problem that unevenness is likely to occur and problems such as unfavorable for soldering occur in too much flux application part Fc.

For this reason, conventionally, the user has previously purchased and prepared the respective fluxes F which have been prepared in advance to have solid contents of 10%, 5% or 3.3% by the flux manufacturer. A suitable one is selected from these and used, but the flux replacement work for that purpose places a heavy burden on the operator.

In the flux F, the solid content ratio is changed by adjusting the mixing ratio of the flux stock solution and the diluting solution.

The present invention has been made in view of the above circumstances, and an object thereof is to make it possible to freely supply a flux having a solid content of an appropriate ratio according to a soldering apparatus or a work. is there.

[0012]

According to the present invention, in a spray fluxer for spraying flux supplied to a nozzle from a nozzle and applying it to a work, a stock solution tank containing a stock solution of flux and a diluent solution containing a diluent solution are provided. A tank, a stock solution supply means for taking out a necessary amount of flux stock solution from the stock solution tank, a diluting solution supply means for taking out a necessary amount of diluting solution from the diluting solution tank, and a diluting solution supply means and a diluting solution supply means It is a spray fluxer having a configuration tank that mixes each liquid to prepare a flux of a preset ratio, and a flux supply means that is provided from the formulation tank to the nozzle.

[0013]

According to the present invention, the required amount of the stock flux solution is taken out from the undiluted solution tank by the undiluted solution supply means, and the required amount of the diluted solution is taken out from the diluted solution tank by the diluted solution supply means, and these solutions are mixed in the preparation tank. Then, a flux having a ratio set by is prepared, and the flux is supplied from the preparation tank to the nozzle by the flux supply means, and the flux mist is sprayed from the nozzle and applied to the work.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the embodiment shown in FIG.

A stock solution tank 31 containing a stock solution A of flux such as rosin, a diluent solution tank 32 containing a solution B of diluent such as isopropyl alcohol, and these stock solution tanks 31.
And a preparation tank 33 for mixing the respective liquids A and B supplied from the diluting liquid tank 32 to prepare a flux F having a set ratio.

The preparation tank 33 is supplied with the flux stock solution A and the dilution solution B from the stock solution tank 31 and the diluent solution tank 32 by the following pneumatic circuit, and the flux F in the preparation tank 33 is as follows. The air pressure circuit supplies the nozzles 12a and 12b of the spray fluxer, and the flux mist f sprayed from these nozzles 12a and 12b is applied to the lower surface of the work (component mounting board).

Explaining the pneumatic circuit, the atomization pressure control circuit 43 for controlling the particle size of the flux mist through the valve 41 and the filter 42 in the pneumatic pressure source 20 and the flux mist f.
A shape pressure control circuit 44 for controlling the diffusion shape of the nozzles, a valve operating pressure control circuit 45 for mainly operating the needle valve for controlling the opening and closing of the spray holes of the nozzles 12a, 12b, and the stock solution tank 31, the diluent tank. A tank pressurization control circuit 46 for pressurizing the inside of each of the tanks 32 and 33 and extruding the liquid inside is connected to each tank.

In the atomizing pressure control circuit 43, a line 53 passing through a pressure reducing valve 51 and a pressure gauge 52 is connected to an input port 54P of a solenoid / pneumatically operated three-port switching valve 54, and the output of this switching valve 54. The port 54A communicates with the atomizing pressure introduction port for controlling the particle size of the nozzles 12a and 12b via the pipe 55.

In the shape pressure control circuit 44, a line 58 passing through a pressure reducing valve 56 and a pressure gauge 57 is connected to an input port 59P of a solenoid / pneumatically operated three-port switching valve 59, and an output port of this switching valve 59. 59A communicates with the shape pressure introducing port for controlling the mist shape of the nozzles 12a and 12b via the pipe line 60. The shape pressure is
It acts from the side of the flux mist f to control the mist diffusion shape to be elliptical.

The valve operating pressure control circuit 45 includes two pilot pipe lines 64, which supply the switching pilot pressures from the main pipe line 63 passing through the pressure reducing valve 61 and the pressure gauge 62 to the pilot portions of the switching valves 54, 59, respectively. When 65 is pulled out, the main pipe 63 is communicated with the input port 66P of the electromagnetic / pneumatically operated 3-port switching valve 66, and the output port 66A of this switching valve 66 is communicated with one inlet 67in of the shuttle valve 67. And the shuttle valve 67
An outlet 67out of the valve is communicated with a valve operating pressure introducing port of the nozzles 12a and 12b via a pipe line 68.

A valve 69 is provided in the conduit to one nozzle 12a.
Is provided, and it is possible to select the use or non-use of the nozzle 12a according to the width dimension of the substrate as a work. The valve actuation pressure actuates the piston integrated with the needle valve in the nozzle 12a, 12b.

The tank pressurization control circuit 46 includes two pipelines drawn from a main pipeline 73 passing through a pressure reducing valve 71 and a pressure gauge 72.
74 and 75 are connected to the other ports 54R and 59R of the switching valves 54 and 59 via the flow control valves with check valves 76 and 77, respectively.

Further, the main pipe line 73 of the tank pressurizing control circuit 46 is an input port of an electromagnetically actuated three-port switching valve 78 which constitutes a stock solution supply means for taking out a necessary amount of the flux stock solution A from the stock solution tank 31. 78P and the input port 79P of the electromagnetically actuated three-port switching valve 79 that constitutes the diluent supply means for extracting the required amount of the diluent B from the diluent tank 32. Output port 78A
, 79A are communicated with the upper portions of the stock solution tank 31 and the diluting solution tank 32 by the pipe lines 81 and 82 connected to them, respectively.

The stock solution supply means and the diluting solution supply means are the tank pressurization control circuit 46 having the switching valves 78 and 79.
In addition, the pipes 83 and 84 are inserted to the vicinity of the bottoms of the stock solution tank 31 and the diluting solution tank 32, and the pipes 83 and 84 and the pipes 85 and 86 inserted into the preparation tank 33 are connected to the line 87. , 88, respectively, and a circuit configuration in which flowmeters 91, 92 for flux preparation and check valves 93, 94 for backflow prevention are interposed in the respective pipe lines 87, 88, respectively.

A flux for preparing the flux F in the preparation tank 33 by mixing the respective liquids A and B supplied from the undiluted solution supply means and the diluted solution supply means in the preparation tank 33 to prepare a flux F having a set ratio. As a preparation means, the flow meter
Along with 91 and 92, a hydrometer 96 equipped with a fully submerged float 95 for measuring the specific gravity of the flux F, and when the stock solution A and the diluting solution B are supplied to the preparation tank 33, the preparation tank 33 is exposed to the atmosphere. Electromagnetic / pneumatically operated 3-port switching valve for opening
97 and are provided.

The pycnometer 96 measures the height level of the float 95 that moves up and down according to the specific gravity of the flux F by a position detector such as a variable resistor, and accurately measures the specific gravity of the flux F. Thus, it is possible to detect the mixing ratio of the two liquids A and B having different specific gravities that are supplied from the stock solution tank 31 and the diluting solution tank 32 into the preparation tank 33 and mixed.

Further, from the preparation tank 33 to the nozzle
As a flux supply means for supplying the flux F over 12a and 12b, the tank pressurizing control circuit 46 and the upper part of the preparation tank 33 are connected by a pressurizing conduit 98, and a pipe inserted up to near the bottom of the preparation tank 33. 99a is connected to the flux supply ports of the nozzles 12a and 12b via a pipe line 99.

The detection signal lines 101, 102 and 103 drawn from the flowmeters 91 and 92 and the specific gravity meter 96 are connected to the controller 104.
Is connected to the input section. This controller 104
By setting the ratio of the solid content in the flux F, the mixing ratio of the flux stock solution A and the diluting solution B is controlled, and the output line from the controller 104 is set.
105, 106 and 107 are connected to respective solenoids of the stock solution switching valve 78, the diluent switching valve 79 and the opening switching valve 97. The other switching valves 54, 59, 66, etc. are also controlled by the output signals from the controller 104, but their signal lines are omitted.

Next, the operation of the embodiment shown in FIG. 1 will be described.

The air pressure supplied from the air pressure source 20 is supplied to the atomization pressure control circuit 43, the shape pressure control circuit 44, the valve actuation pressure control circuit 45 and the tank pressurization control circuit 46, respectively.

From the valve operating pressure control circuit 45 to the two switching valves 54,
Since the pilot pressure supplied to the pilot action part of 59 switches each switching valve 54, 59 to the upper path, the atomization pressure control circuit
The air pressures of 43 and the shape pressure control circuit 44 are supplied to the nozzles 12a and 12b via the switching valves 54 and 59, respectively.
The atomization pressure and shape pressure in 12b are controlled respectively.

Since the pneumatic pressure supplied to the valve operating pressure control circuit 45 acts on the switching valve 66, the switching valve 66 is switched to the upper path by a solenoid drive signal or the like, so that the switching valve 66 is switched to the shuttle valve 67. The valve operating pressure can be supplied to the needle valves in the nozzles 12a and 12b via the valve. On the other hand, when the switching valve 66 is returned to its original position, the nozzle pressure of the return spring in the nozzle causes the needle valve in the nozzle to return and the nozzle 12
The working pressure in a and 12b is exhausted from the exhaust port EXH of the shuttle valve 67 via the pipe 68.

In this way, the spray holes of the nozzles 12a and 12b are controlled to be opened and closed by the needle valve that moves forward and backward through the spray holes, thereby controlling the continuous spraying or the intermittent spraying of the flux mist f.

The tank pressurization control circuit 46 includes the controller 10
The switching valve 78 is switched to the upper path by the control signal from 4 to pressurize the inside of the stock solution tank 31, and the pressurizing time allows the flux stock solution A to flow from the stock solution tank 31 by a necessary amount.
It can be extruded into the preparation tank 33 via 87 and the flow meter 91.

Similarly, the diluting liquid tank 32 is pressurized by switching the switching valve 79 to the upper path in response to a control signal from the controller 104, and the diluting liquid tank 32 is pressurized by this pressurizing time.
The required amount of the diluent B can be extruded from 32 into the preparation tank 33 via the line 88 and the flow meter 92.

The absolute amounts of the stock flux A and the diluent B supplied into the preparation tank 33 are respectively flowmeters 91 and 92.
And the controller 104 can add up. The relative mixing ratio of the two liquids A and B supplied into the preparation tank 33 is detected by the hydrometer 96 and input to the controller 104.

Therefore, the flux stock solution A and the diluent solution B
Can be adjusted to a ratio set by the controller 104, and the ratio of the solid content in the flux F can be adjusted to, for example, 10% depending on the soldering device and the work.
It can be adjusted to 5% or 3.3%.

In this way, the flux stock solution A and the diluting solution B are supplied into the preparation tank 33, and the controller 10
The flux F having the ratio set in 4 is prepared. At the time of preparing the flux, the preparation tank 33 is opened to the atmosphere by switching the preparation tank switching valve 97 to the upper open position. Prevent pressure increase in the tank 33. This is because if the pressure in the preparation tank 33 rises, the pressurized supply from the stock solution tank 31 and the diluting solution tank 32 cannot be performed.

On the other hand, from the preparation tank 33 to the nozzle 12a,
When supplying the flux F to the flux 12b, the stock solution and diluting solution switching valves 78 and 79 are switched to the lower position, and the stock solution tank 31 and the diluting solution tank 32 are opened to the atmosphere. While stopping the pressurized supply of A and the diluent B, the switching valve 97 for the preparation tank is switched to the closed position, and the preparation tank 33 is closed by this switching valve 97 and the check valves 93, 94, and the tank is added. By supplying air pressure from the pressure control circuit 46 to the inside of the preparation tank 33 via the pipe 98 to increase the pressure inside the preparation tank 33, the flux F in the preparation tank 33 is extruded to the pipe 99 and is supplied to the nozzles 12a and 12b. Supply,
Flux mist f is sprayed from the nozzles 12a and 12b and applied to the work.

In the above embodiment, each tank is pneumatically operated.
Although the liquid supply method of extruding the liquid from 31, 32, 33 has been described, the present invention is not limited to this method and includes a method of pressure feeding by a hydraulic pump. Further, the flux stock solution is not limited to a solution close to 100%, and may have a diluted concentration to some extent.

[0041]

According to the present invention, the required amount of the flux stock solution is taken out from the stock solution tank by the stock solution supply means, and the necessary amount of the diluting solution is taken out from the diluting solution tank by the diluting solution supply means to prepare each of these solutions. The flux is mixed in the tank to prepare the set flux, so the solid content in the flux can be freely adjusted to an appropriate ratio according to the soldering equipment and work, and the flux for spraying flux from this preparation tank can be prepared. Can be supplied to the nozzle.

[Brief description of drawings]

FIG. 1 is a pneumatic circuit diagram showing an embodiment of a spray fluxer according to the present invention.

FIG. 2 is a schematic view of a soldering device incorporating a conventional spray fluxer.

FIG. 3 is a cross-sectional view of a component mounting board for explaining conventional problems.

[Explanation of symbols]

 F Flux A Flux stock solution B Diluted solution 12a, 12b Nozzle 31 Stock solution tank 32 Diluted solution tank 33 Preparation tank 78 Switching valve that constitutes the stock solution supply means 79 Switch valve that constitutes the solution supply means 99 Pipeline that forms the flux supply means

Claims (1)

[Claims] 1. A spray fluxer for spraying a flux supplied from a nozzle from a nozzle to apply it to a work, a stock solution tank containing a stock solution of flux, a diluent tank containing a diluent solution, and a flux from the stock solution tank. A stock solution supply means for taking out a necessary amount of the stock solution, a diluting solution supply means for taking out a necessary amount of the diluting solution from the diluting solution tank, and a set ratio by mixing the respective solutions supplied from the stock solution supplying means and the diluting solution supplying means. 2. A spray fluxer comprising: a preparation tank for preparing the flux of 1. and a flux supply means provided from the preparation tank to the nozzle.