JPH08272487A - Electronic equipment - Google Patents
Electronic equipmentInfo
- Publication number
- JPH08272487A JPH08272487A JP7075775A JP7577595A JPH08272487A JP H08272487 A JPH08272487 A JP H08272487A JP 7075775 A JP7075775 A JP 7075775A JP 7577595 A JP7577595 A JP 7577595A JP H08272487 A JPH08272487 A JP H08272487A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic device
- electronic equipment
- fan
- device body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は発熱体を有する電子機器
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a heating element.
【0002】[0002]
【従来の技術】従来、ワ−ドプロセッサやパ−ソナルコ
ンピュ−タなどの電子機器では、放熱対策として、一般
的に機器本体の筐体に空気の逃げる穴(空気穴)を設
け、機器本体内の空気の自然対流による機器本体外への
放熱か、または機器本体内にファンを設け、ファンによ
る機器本体外への強制放熱という構造が広く採用されて
きた。2. Description of the Related Art Conventionally, in electronic equipment such as word processors and personal computers, as a heat radiation measure, generally a hole (air hole) through which air escapes is provided in the housing of the equipment main body. The structure of radiating heat to the outside of the device body by natural convection of the inside air or providing a fan inside the device body and forcibly radiating heat to the outside of the device body by the fan has been widely adopted.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、上記従
来例のような構造では、今後、高速化のためCPUが更
に高密度実装化され、素子の発熱が更に大きくなるであ
ろうことから、自然対流を利用した放熱だけでは対応し
きれなくなる。また、小型化、省エネ、コストダウンを
推進するという立場から、ファンの利用はなるべく避け
たいというのが現状である。However, in the structure as in the above-mentioned conventional example, the CPU will be mounted at a higher density to increase the speed in the future, and the heat generation of the element will be further increased. It will not be possible to deal with it only by heat dissipation using. In addition, from the standpoint of promoting miniaturization, energy saving, and cost reduction, the current situation is to avoid using fans as much as possible.
【0004】このように機器本体の内部温度対策では、
放熱の効率を向上させ、いかに熱を外に逃がすかという
ことが機器の設計をするのにあたっての重要な課題とな
ってくる。As described above, as a measure against the internal temperature of the device body,
How to improve the efficiency of heat dissipation and let the heat escape to the outside is an important issue when designing equipment.
【0005】[0005]
【課題を解決するための手段及び作用】上記の課題を解
決するために、本発明に係る電子機器においては、表示
部を有するラップトップ型の電子機器であって、発熱体
と、前記表示部の開閉に連動して動き、前記表示部が開
いている場合に、機器本体外に露出して前記発熱体より
発生した熱を前記機器本体外に放熱する放熱材とを設け
た。In order to solve the above-mentioned problems, an electronic device according to the present invention is a laptop type electronic device having a display section, wherein a heating element and the display section are provided. And a heat radiating member that is exposed to the outside of the device body and radiates heat generated by the heating element to the outside of the device body when the display unit is opened.
【0006】このような構成によれば、放熱のために機
器本体外の物質を利用しているため、放熱効果が大幅に
向上する。According to this structure, since the substance outside the main body of the device is used for heat dissipation, the heat dissipation effect is greatly improved.
【0007】[0007]
(実施例1)以下、図面に基づいて本発明の実施例1を
詳細に説明する。(Embodiment 1) Hereinafter, Embodiment 1 of the present invention will be described in detail with reference to the drawings.
【0008】図1は本発明の実施例1に係る未使用時の
電子機器の概略的な断面を示している。図1に示した電
子機器は、機器本体の筐体1と表示部の筐体2から構成
されている。FIG. 1 shows a schematic cross section of an electronic device according to a first embodiment of the present invention when not in use. The electronic device shown in FIG. 1 includes a housing 1 of a device body and a housing 2 of a display unit.
【0009】この機器本体の筐体1は、文書情報等を入
力するキ−ボ−ド4、機器本体を支えるゴム足5、様々
な素子を載せたPCB(パーソナルコンピュータボー
ド)7、PCB7の支持材8、機器本体内部の主要な発
熱部10、熱伝導率が230W・m-1・K-1前後と高い
アルミニウムなどの材質を使用した放熱材11、22、
熱を機器本体外に放出する放熱穴12、13、放熱用の
ファン14、機器本体の内部温度を感知する温度感知器
15、キ−ボ−ド4の支持材16、互いに連動して回転
する歯車18、19、歯車19に取りつけてある押し棒
20、熱伝導率が400W・m-1・K-1前後と高く弾性
率が大きい銅版などの材質を使用した板材21、ファン
の動作を制御するファン制御装置24を有しており、発
熱部10に放熱材11が、放熱材11に板材21が、板
材21に放熱材22が密着する形で取り付けられてい
る。The housing 1 of the device body supports a keyboard 4 for inputting document information, rubber feet 5 for supporting the device body, a PCB (personal computer board) 7 on which various elements are mounted, and a PCB 7. Material 8, main heat generating part 10 inside the device body, heat dissipation materials 11, 22 using materials such as aluminum having high thermal conductivity of around 230 W · m −1 · K −1,
Heat dissipation holes 12 and 13 for releasing heat to the outside of the device main body, a fan 14 for heat dissipation, a temperature sensor 15 for detecting the internal temperature of the main body of the device, a support member 16 for the keyboard 4, and rotating in conjunction with each other. Gears 18, 19, a push rod 20 attached to the gear 19, a plate member 21 made of a material such as a copper plate having a high thermal conductivity of about 400 W · m −1 · K −1 and a large elastic modulus, and the operation of the fan is controlled. The fan control device 24 is provided, and the heat dissipating member 11 is attached to the heat generating portion 10, the plate member 21 is attached to the heat dissipating member 11, and the heat dissipating member 22 is attached to the plate member 21.
【0010】また、表示部の筐体2は、文書情報等を表
示する表示器3、回転軸9、回転軸9に取りつけられて
いて表示部の筐体2の開閉時の動きを機器本体の筐体1
内部の歯車18に伝える歯車17を有している。Further, the casing 2 of the display unit is attached to the display unit 3 for displaying document information and the like, the rotating shaft 9, and the rotating shaft 9 so that the movement of the display unit casing 2 at the time of opening and closing of the device body can be prevented. Case 1
It has a gear 17 that communicates with an internal gear 18.
【0011】この図1において、表示部の筐体2をA方
向へ回転軸9を軸として回転させ、電子機器を未使用状
態から使用状態にセットすると、回転軸9に取りつけら
れている歯車17はC方向へ回転を始め、それと同時に
歯車18はD方向に回転し、歯車19はE方向に回転を
始める。この時、歯車19に取りつけてある押し棒20
がF方向に回転を始める。ここで押し棒20がF方向に
動くと板材21に当たり、板材21が下方に押し下げら
れる。すると図2のように放熱材22が床面6に押しつ
けられた状態になる。ここで熱の伝わる経路は、発熱部
10、放熱材11、板材21、放熱材22、床面6とい
うような流れになる。In FIG. 1, when the casing 2 of the display section is rotated in the direction A about the rotary shaft 9 as an axis to set the electronic device from the unused state to the used state, the gear 17 attached to the rotary shaft 9 is rotated. Starts rotating in the C direction, at the same time, the gear 18 starts rotating in the D direction, and the gear 19 starts rotating in the E direction. At this time, the push rod 20 attached to the gear 19
Starts rotating in the F direction. Here, when the push rod 20 moves in the F direction, it hits the plate member 21, and the plate member 21 is pushed down. Then, as shown in FIG. 2, the heat radiation material 22 is pressed against the floor surface 6. Here, the heat transmission path is a flow such as the heat generating portion 10, the heat dissipation material 11, the plate material 21, the heat dissipation material 22, and the floor 6.
【0012】なお、床面6が熱伝導率が100W・m-1
・K-1前後と高い金属製の事務机などの場合では、放熱
材22の働きのみで十分な放熱をすることができるが、
床面6が熱伝導率が0.14〜0.18W・m-1・K-1
と低い木の机などの場合はもちろんのこと、床面6が金
属製の事務机の場合でも、その上に紙などが置いてある
場合などでは熱伝導率が大変低くなるため、思うように
放熱をすることができなくなる。The floor surface 6 has a thermal conductivity of 100 W · m −1.
・ In the case of an office desk made of metal, which is as high as around K-1, heat can be dissipated only by using the heat dissipating material 22.
The thermal conductivity of the floor surface 6 is 0.14 to 0.18 W ・ m-1 ・ K-1
Not only in the case of a low wooden desk, but also in the case of an office desk made of metal on the floor 6, the thermal conductivity will be extremely low if paper etc. is placed on it. It becomes impossible to radiate heat.
【0013】このように、思うように機器本体外に放熱
することができず、機器本体の内部温度が素子破壊の限
界温度を越えそうになった時には、ファン14を動作さ
せることが必要となってくる。その場合のファンの動作
に関するブロック図を図3に、フロ−チャ−トを図4に
示す。As described above, when it is not possible to radiate heat to the outside of the device body as desired, and when the internal temperature of the device body is about to exceed the element destruction limit temperature, it is necessary to operate the fan 14. Come on. A block diagram relating to the operation of the fan in that case is shown in FIG. 3, and a flow chart is shown in FIG.
【0014】図3からも明らかなように、温度を検知す
る温度検知器15からの信号に基づいて、ファン制御装
置24がROM25に内蔵されている図4のフローチャ
ートで表現されるプログラムに従って、ファン14の動
作を制御する。As is apparent from FIG. 3, the fan controller 24 is built in the ROM 25 based on the signal from the temperature detector 15 for detecting the temperature of the fan according to the program represented by the flowchart of FIG. 14 to control the operation.
【0015】図4のフローチャートに基づいて、この処
理の手順を以下に説明する。まずステップS1に進み、
温度感知器15が、機器本体の内部温度が性能維持限界
値に達したかどうかを判別する。達していない場合には
スタ−トに戻り、達した場合にはステップS2に進んで
ファン14のSW(スイッチ)をONにする。次にステ
ップS3に進み、再度、温度感知器15が、機器本体の
内部温度が性能維持限界値に達したかどうかを判別す
る。達した場合にはステップS3に戻り、達しない場合
はステップS4に進んでファン14のSWをOFFにし
てステップS1に戻る。The procedure of this process will be described below with reference to the flowchart of FIG. First, go to step S1,
The temperature sensor 15 determines whether the internal temperature of the device body has reached the performance maintaining limit value. If not reached, the process returns to the start, and if reached, the process proceeds to step S2 to turn on the SW (switch) of the fan 14. Next, in step S3, the temperature sensor 15 determines again whether or not the internal temperature of the device body has reached the performance maintaining limit value. When it reaches, it returns to step S3, and when it does not reach, it progresses to step S4, turns off the SW of the fan 14, and returns to step S1.
【0016】なお、この電子機器を使用状態から未使用
状態に戻すには、図2に示すように表示部の筐体2をB
方向に回転させる。すると回転軸9に取り付けられてい
る歯車17がG方向に回転し、歯車18はH方向、歯車
19はI方向に回転する。この時歯車19に取り付けて
ある押し棒20はJ方向に回転し、板材21の押えつけ
を解除する。前述したように、板材21は弾性率が大き
い銅版などの材質を使用しているので、図2において変
形していた板材21も、直ちに図1に示すような元の状
態に回復する。Incidentally, in order to return the electronic device from the used state to the unused state, as shown in FIG.
Rotate in the direction. Then, the gear 17 attached to the rotating shaft 9 rotates in the G direction, the gear 18 rotates in the H direction, and the gear 19 rotates in the I direction. At this time, the push rod 20 attached to the gear 19 rotates in the J direction to release the pressing of the plate member 21. As described above, since the plate member 21 is made of a material such as a copper plate having a large elastic modulus, the plate member 21 deformed in FIG. 2 is immediately restored to the original state as shown in FIG.
【0017】(実施例2)図5は本発明の実施例2に係
る電子機器の断面図である。実施例1と共通、もしくは
対応する部分には図1、図2と共通の符号を付してあ
る。また、共通部分の説明は省略する。(Embodiment 2) FIG. 5 is a sectional view of an electronic device according to Embodiment 2 of the present invention. The parts common to or corresponding to those in the first embodiment are designated by the same reference numerals as those in FIGS. 1 and 2. Further, the description of the common part is omitted.
【0018】図5に示すように、発熱部10には熱伝導
率が230W・m-1・K-1前後と高いアルミニウムなど
の材質を使用した放熱材11が密着して取りつけられて
おり、放熱材11には、機器本体の筐体1を支える支持
足の機能を兼ね、放熱材11と同様に熱伝導率が230
W・m-1・K-1前後と高いアルミニウムなどの材質を使
用した放熱材23が取りつけられている。放熱材23は
床面6と常に接しており、熱の伝わる流れとしては、発
熱部10、放熱材11、放熱材23、床面6という順序
となる。As shown in FIG. 5, a heat radiating material 11 made of a material such as aluminum having a high thermal conductivity of around 230 W · m −1 · K −1 is closely attached to the heat generating portion 10, The heat dissipating material 11 also functions as a supporting leg that supports the housing 1 of the device body, and has a thermal conductivity of 230% like the heat dissipating material 11.
A heat radiating material 23 made of a material such as aluminum, which is as high as around W · m −1 · K −1, is attached. The heat radiating material 23 is always in contact with the floor surface 6, and the flow of heat is in the order of the heat generating portion 10, the heat radiating material 11, the heat radiating material 23, and the floor surface 6.
【0019】[0019]
【発明の効果】以上説明したように、本発明によれば、
機器本体の使用状態時に発生する熱を機器本体外の物質
に伝え、機器本体外の物質を放熱に利用しているため、
放熱効果が大幅に向上し、ファンなどを使わないで自然
対流で放熱を行っていた機器の、小型軽量化、高密度実
装化が可能となる範囲が従来よりも広がり、またファン
を使って放熱をせざるをえないような機器においても、
ファンに対する依存度を減少させることができ、それに
よって省電力化も可能となる。As described above, according to the present invention,
Since the heat generated when the device is in use is transferred to the substance outside the device body and the substance outside the device body is used for heat dissipation,
The heat radiation effect has been greatly improved, and the range of devices that used natural convection to radiate heat without using a fan has become wider than before, and it is possible to achieve high-density mounting. Even in equipment that is forced to
Reliance on the fan can be reduced, and power consumption can be reduced accordingly.
【図1】本発明の実施例1に係る未使用時の電子機器の
断面図である。FIG. 1 is a cross-sectional view of an unused electronic device according to a first embodiment of the present invention.
【図2】本発明の実施例1に係る使用時の電子機器の断
面図である。FIG. 2 is a cross-sectional view of an electronic device when in use according to the first embodiment of the present invention.
【図3】本発明の実施例1に係る電子機器内のファンの
動作制御に関するブロック図である。FIG. 3 is a block diagram related to operation control of a fan in the electronic device according to the first embodiment of the present invention.
【図4】本発明の実施例1に係る電子機器内のファンの
動作制御に関するフロ−チャ−トである。FIG. 4 is a flowchart relating to operation control of a fan in the electronic device according to the first embodiment of the present invention.
【図5】本発明の実施例2に係る電子機器の断面図であ
る。FIG. 5 is a sectional view of an electronic device according to a second embodiment of the invention.
1 機器本体の筐体 2 表示部の筐体 3 表示器 4 キ−ボ−ド 5 機器本体を支えるゴム足 6 床面 7 PCB(パーソナルコンピュータボード) 8 PCBの支持材 9 回転軸 10 発熱部 11 放熱材 12、13 放熱穴 14 ファン 15 温度検知器 16 キ−ボ−ドの支持材 17、18、19 歯車 20 押し棒 21 板材 22 放熱材 23 放熱材を兼ねる本体を支える支持材 24 ファン制御装置 25 ROM(リードオンリーメモリ) 1 Case of device main body 2 Display case 3 Display 4 Key board 5 Rubber feet supporting device main body 6 Floor 7 PCB (personal computer board) 8 PCB support 9 Rotating shaft 10 Heat generating part 11 Heat dissipation material 12, 13 Heat dissipation hole 14 Fan 15 Temperature detector 16 Key board support material 17, 18, 19 Gears 20 Push rod 21 Plate material 22 Heat dissipation material 23 Support material that supports the body also serving as heat dissipation material 24 Fan control device 25 ROM (Read Only Memory)
Claims (6)
器であって、 発熱体と、 前記表示部の開閉に連動して動き、前記表示部が開いて
いる場合に、機器本体外に露出して前記発熱体より発生
した熱を前記機器本体外に放熱する放熱材とを具備した
ことを特徴とする電子機器。1. A laptop electronic device having a display unit, comprising: a heating element, which moves in conjunction with opening and closing of the display unit, and which is exposed to the outside of the device body when the display unit is open. And a heat radiating member for radiating the heat generated by the heating element to the outside of the device body.
触することを特徴とする請求項1記載の電子機器。2. The electronic device according to claim 1, wherein the heat dissipation material comes into contact with a substance outside the device body.
出することを特徴とする請求項1または請求項2記載の
電子機器。3. The electronic device according to claim 1, wherein the heat dissipation member is exposed at a bottom surface portion of the device body.
手段と、 前記内部温度を調整する温度調整手段と、 前記検知手段が検知した内部温度と所定の温度とに基づ
いて、前記温度調整手段の動作を制御する制御手段とを
具備したことを特徴とする請求項1記載の電子機器。4. The temperature adjusting means based on the detecting means for detecting the internal temperature of the equipment body, the temperature adjusting means for adjusting the internal temperature, and the internal temperature detected by the detecting means and a predetermined temperature. The electronic device according to claim 1, further comprising a control unit that controls the operation of the electronic device.
特徴とする請求項4記載の電子機器。5. The electronic device according to claim 4, wherein the temperature adjusting unit is a fan.
の温度を超える場合に、前記制御手段が前記温度調整手
段を動作させることを特徴とする請求項4または請求項
5記載の電子機器。6. The electronic apparatus according to claim 4, wherein the control unit operates the temperature adjusting unit when the internal temperature detected by the detecting unit exceeds a predetermined temperature.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7075775A JPH08272487A (en) | 1995-03-31 | 1995-03-31 | Electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7075775A JPH08272487A (en) | 1995-03-31 | 1995-03-31 | Electronic equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH08272487A true JPH08272487A (en) | 1996-10-18 |
Family
ID=13585932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7075775A Withdrawn JPH08272487A (en) | 1995-03-31 | 1995-03-31 | Electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08272487A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001142574A (en) * | 1999-11-18 | 2001-05-25 | Hitachi Ltd | Electronic instrument |
JP2002006993A (en) * | 2000-06-23 | 2002-01-11 | Hitachi Ltd | Small computer |
US6515856B2 (en) * | 1997-05-28 | 2003-02-04 | Fujitsu Limited | Apparatus and method for cooling in a personal computer including a tilt stand |
JP2006134329A (en) * | 2004-11-03 | 2006-05-25 | Hewlett-Packard Development Co Lp | Computer heat radiation system |
JP2007164551A (en) * | 2005-12-15 | 2007-06-28 | Nitto Electric Works Ltd | Temperature controller for ventilation fan |
-
1995
- 1995-03-31 JP JP7075775A patent/JPH08272487A/en not_active Withdrawn
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6515856B2 (en) * | 1997-05-28 | 2003-02-04 | Fujitsu Limited | Apparatus and method for cooling in a personal computer including a tilt stand |
US6744629B2 (en) | 1997-05-28 | 2004-06-01 | Fujitsu Limited | Information processing device |
JP2001142574A (en) * | 1999-11-18 | 2001-05-25 | Hitachi Ltd | Electronic instrument |
JP2002006993A (en) * | 2000-06-23 | 2002-01-11 | Hitachi Ltd | Small computer |
JP2006134329A (en) * | 2004-11-03 | 2006-05-25 | Hewlett-Packard Development Co Lp | Computer heat radiation system |
JP2007164551A (en) * | 2005-12-15 | 2007-06-28 | Nitto Electric Works Ltd | Temperature controller for ventilation fan |
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