JPH08272118A - Photoreceptor base body - Google Patents

Abstract

PURPOSE: To provide a photoreceptor base body which is provided with a good machining characteristic and is excellent in precision and in cost performance. CONSTITUTION: A photoreceptor base body is composed of synthetic resin and made of a straight cylinder or a circular column in either of which a diameter is 5-50mm while no tongue-groove part, is formed. A flame proof reinforced resin composition, in which 100 parts by weight of reinforce resin consisting of 45-85% by weight of engineering resin with a thermal deformation temperature of 110 deg.C or more and 55-15 % by weight of reinforced fiber is mixed with 0.5-15 parts by weight of a flame retarder, is suitable for the synthetic resin.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for a photoconductor, and more particularly to a substrate for a photoconductor which is excellent in workability, excellent in accuracy and cost, and suitable for a small-diameter photoconductor.

[0002]

2. Description of the Related Art Electrophotographic copying machines, printers, F
A photoconductor (drum) is used in the AX (hereinafter, referred to as an electrophotographic OA device), but the electrophotographic OA device has a small diameter photoconductor having a diameter of 5 to 50 mm as the size and weight are reduced. Demand is increasing.

[0003]

By the way, as in the case of the conventional large-diameter photosensitive drum raw pipe, when the above-mentioned small-diameter photosensitive drum raw pipe is made of metal such as iron, copper, stainless steel, or aluminum. However, there are drawbacks in terms of accuracy and cost due to poor workability. For example, in the case of aluminum, which is the most typical material, a drawn product called an EI pipe is used as a raw pipe, but when the diameter is 30 mm or less, the runout of the jig during the drawing work becomes large and the accuracy is high. descend. As a result, when the photosensitive drum is used, there is a problem that uneven development or cleaning failure due to the cleaning blade occurs.

On the other hand, since the thermoplastic resin composition is lighter in weight than metal and has better moldability, various attempts have been made to injection mold the thermoplastic resin composition to obtain a resin material pipe for a small-diameter photosensitive drum. ing.

However, when the inner surface of the end portion of the blank pipe is spigoted for mounting the flange gear as in the case of the conventional aluminum blank pipe, the precision of the blank pipe deteriorates depending on the machining. In addition, the spigot machining requires high machining accuracy because the coaxiality with the outer surface is required, resulting in higher cost.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate for a photoconductor which has good workability and is excellent in accuracy and cost.

[0007]

As a result of various studies to solve the above-mentioned problems, the inventors of the present invention have made a spigot on the resin flange gear side if necessary for mounting the flange gear. I got the idea that. As a result of further studies based on such an idea, a straight cylindrical or columnar resin base body without a spigot portion was used, and its outer peripheral portion and / or end face portion was fitted with a flange gear. I confirmed that is possible. Further, in the case of the resin base body having such a structure, it is not necessary to perform difficult and high-cost spigot processing on the base side, and therefore, the photoconductor can be manufactured at low cost and with high accuracy.

The present invention has been completed based on the above findings, and its gist is that it is composed of a synthetic resin and has a diameter of 5 to 50 mm and a straight cylinder or column without a spigot portion. And a substrate for a photoreceptor.

The present invention will be described in detail below. The synthetic resin used in the present invention is not particularly limited as long as it can be extruded, but a flame retardant thermoplastic resin composition to which a flame retardant is added is preferable because the photoreceptor is required to have flame retardancy. .
Further, since the photoreceptor needs to have rigidity, a fiber-reinforced thermoplastic resin composition containing reinforcing fibers is suitable.

Further, in the production of a photoreceptor, a charge generating layer (CGL) / charge transfer layer (CTL) is coated on a substrate, and in the case of an insulating substrate, a conductive layer is coated in advance. Made wet, 80
A drying process of several tens of minutes at -100 ° C is required. Therefore,
As the resin constituting the thermoplastic resin composition, a resin having a heat distortion temperature (HDT) of 110 ° C. or higher is preferable, and 130
A resin having a temperature of ℃ or more is more preferable. From the viewpoint of cost and moldability, engineering resin is preferable as the thermoplastic resin.

From the above circumstances, the thermoplastic resin composition used in the present invention has a heat distortion temperature (HDT) of 110 ° C.
A flame-retardant reinforced resin composition obtained by mixing 0.5 to 9 parts by weight of a flame retardant with 100 parts by weight of a reinforced resin composed of 45 to 85% by weight of the engineering resin and 55 to 15% by weight of reinforcing fibers is preferable. is there.

Specific examples of the engineering resin include polyethylene terephthalate (PET), polybutylene terephthalate (PBT) and polycarbonate (P
Ca), polyphenylene oxide (PPO) and the like. Such an engineering resin can be obtained relatively inexpensively. The engineering resin may be used alone or in combination of two or more kinds, and may be an alloy with other resins within a range not impairing the properties.

Examples of the reinforcing fiber include glass fiber (GF), carbon fiber (CF), alumina fiber (AF) and the like. The reinforcing fibers may be used alone or in combination of two or more. The reinforcing fiber containing glass fiber as a main component is advantageous in terms of cost.

Reinforcing fibers are used to increase the rigidity of the resin composition. When the rigidity of the resin composition is low, it is necessary to make the base material thicker in order to prevent flexure during use of the photoconductor, and as a result, not only the material cost increases but also the weight reduction cannot be achieved. In the present invention, from such a viewpoint and from the viewpoint of moldability of the resin composition, the ratio of the engineering resin to the total amount of the engineering resin and the reinforcing fiber is 45 to 85% by weight, and the ratio of the reinforcing fiber is 15 to 55. It is preferably in the range of% by weight. A particularly preferable ratio of the reinforcing fiber is in the range of 20 to 50% by weight.

As the flame retardant, P, halogen, N, S,
Various compounds containing elements such as Sb and B are listed, and the kind thereof is not particularly limited. The flame retardant can be used alone or 2
It may be a combination of two or more species.

The proportion of the flame retardant used is preferably selected so that the flame retardancy of the resin composition is equivalent to V0 in the UL94 standard. However, if the proportion of the flame retardant used is too large, the strength of the resin composition decreases. Therefore, in the present invention, it is preferable to add 0.5 to 15 parts by weight of a flame retardant to 100 parts by weight of a reinforcing resin composed of an engineering resin and a reinforcing fiber. A particularly preferable usage rate of the flame retardant is
It is in the range of 1 to 12 parts by weight with respect to 100 parts by weight of the reinforcing resin. In addition, in the present invention, a filler other than the above and other additive components may be added within a range not impairing the properties of the flame-retardant reinforcing resin composition.

The molding of the thermoplastic resin composition is preferably extrusion molding, and this extrusion molding is carried out by mounting an annular die on the extruder so that the molded product has a cylindrical or columnar shape. The extruder can be provided with an in-line cutter if necessary.

If the diameter of the cylinder or the cylinder is too large, it is not advantageous in terms of material cost and the value as a small diameter is impaired. On the contrary, if the diameter is too small, peripheral parts cannot be incorporated as a photosensitive unit. Therefore, in the present invention, the diameter of the cylinder or the cylinder is 5 to 50 mm. A particularly preferred diameter is in the range of 10-40 mm.

The formed cylinder or cylinder is usually used as a substrate for a photoreceptor by roughly polishing the outer diameter portion and the end surface portion. Then, in order to reduce the surface roughness, precision polishing may be performed by puff polishing or the like, if necessary.

[0020]

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to the following examples as long as the gist thereof is not exceeded. The evaluation methods in the following examples are as shown in Table 1 below.

[0021]

[Table 1] (1) Heat distortion temperature: Measured under the condition of 4.6 Kg / cm ² in accordance with ASTM D-648. (2) Flame retardancy: evaluated according to UL-94 standard. (3) Dimensional accuracy: Measured by a coordinate measuring machine. (4) Surface roughness: Measured with a surface roughness meter.

The raw material components of the resin compositions used in Examples and Comparative Examples are shown in Table 2 below.

[Table 2] (1) PCa: "Novamate 8" manufactured by Mitsubishi Engineering Plastics
825B "(HDT = 140 ° C) (2) PPO: Mitsubishi Engineering Plastics" Yupiace AH80 "
(HDT = 150 ° C) (3) PBT: Mitsubishi Engineering Plastics' Novador 5010
(HDT = 155 ° C) (4) PET: "Remappet 150" manufactured by Mitsubishi Engineering Plastics
(HDT = 160 ° C) (5) GF: Asahi Fiber Glass "Glosslon TM
F200 "(6) Flame retardant:" Pyrocheck 68P "made by Nissan Fellow
B "(brominated polystyrene powder)

The resin compositions used in Examples and Comparative Examples are shown in Table 3 below.

[Table 3]

Example 1 The resin composition of the compound No. 1 was extruded into a cylindrical shape by extrusion molding and cut into a length of 260.1 ± 0.1 mm with an in-line cutter. Outer diameter is 20.1 ± 0.1m
m, cylindricity is 80 μm, maximum surface roughness (Rmax) is 1
The average surface roughness (Ra) was 5 μm, the diameter of the inner diameter portion was 16.0 ± 0.1 mm. The outer diameter portion and the end surface portion were roughly polished to obtain a photoreceptor substrate. By rough polishing, length 260.00 ± 0.03mm, outer diameter is 1
9.93 ± 0.01 mm, cylindricity is 20 μm, Rmax
Was 3 μm and Ra was 0.4 μm.

Acrylic emulsion YJ-2751D (60% by weight) manufactured by Mitsubishi Chemical BASF and tin oxide fine powder (40% by weight) were diluted with water to 1000 centipoise (cP) on the surface of the above substrate. Apply mixture 6
It was dried at 0 ° C. for 1 hour to form a conductive layer having a thickness of 50 μm.
Then, a mixture of the same weight of polyvinyl butyral and phthalocyanine dispersed and diluted in isopropanol to 10 cP was applied on the surface of the conductive layer to form a charge generation layer (CGL) having a thickness of 0.5 μm. Further, a mixture of hydrazone-based charge transporting agent having the same weight as that of polymethyl methacrylate was dissolved and diluted in methyl ethyl ketone (MEK) to make 100 cP, and the mixture was applied on the surface of CGL and dried at 80 ° C. for 30 minutes to give a thickness of 17. A 5 μm charge transfer layer (CTL) was provided to obtain a photoreceptor.

The outer diameter of the photoconductor is 20.00 ± 0.01 m.
m, cylindricity was 20 μm, Rmax was 0.6 μm, and Ra was 0.2 μm, and there was no deterioration in dimensions due to coating.
Attaching a flange gear made of injection-molded thermoplastic resin with a spigot to this photoconductor,
As a result of conducting a confirmation test of 0,000 sheets, no abnormality such as uneven development or defective cleaning was observed.

Example 2 A resin composition having the composition No. 2 was extruded into a cylindrical shape by extrusion molding and cut into a length of 260.1 ± 0.1 mm with an in-line cutter. Outer diameter is 20.1 ± 0.1m
m, cylindricity is 60 μm, Rmax is 12 μm, Ra is 1.4 μm, and the inner diameter is 16.0 ± 0.1 m.
It was m. The outer diameter portion and the end surface portion were roughly polished to obtain a photoreceptor substrate. By rough polishing, the length is 260.00 ±
The outer diameter was 0.03 mm, the outer diameter was 19.93 ± 0.01 mm, the cylindricity was 17 μm, the Rmax was 2 μm, and the Ra was 0.2 μm.

A photoconductor was prepared in the same manner as in Example 1 and its dimensions were measured. The outer diameter of the photoconductor is 20.00 ± 0.01m
m, cylindricity was 17 μm, Rmax was 0.6 μm, and Ra was 0.2 μm. In the same manner as in Example 1, the flange
An image confirmation test was carried out with a gear attached, but no abnormalities such as uneven development or defective cleaning were observed.

Example 3 The resin composition of formulation No. 3 was extruded into a cylindrical shape by extrusion molding and cut into a length of 260.1 ± 0.1 mm with an in-line cutter. Outer diameter is 20.1 ± 0.1m
m, cylindricity is 90 μm, Rmax is 18 μm, Ra is 2.0 μm, and the inner diameter is 16.0 ± 0.1 m.
It was m. The outer diameter portion and the end surface portion were roughly polished to obtain a photoreceptor substrate. By rough polishing, the length is 260.00 ±
The outer diameter was 0.03 mm, the outer diameter was 19.93 ± 0.01 mm, the cylindricity was 25 μm, the Rmax was 5 μm, and the Ra was 0.7 μm.

A photoconductor was prepared in the same manner as in Example 1 and its dimensions were measured. The outer diameter of the photoconductor is 20.00 ± 0.01m
m, cylindricity was 25 μm, Rmax was 0.8 μm, and Ra was 0.3 μm. In the same manner as in Example 1, the flange
An image confirmation test was carried out with a gear attached, but no abnormalities such as uneven development or defective cleaning were observed.

Example 4 The resin composition of formulation No. 4 was extruded into a cylindrical shape by extrusion molding and cut into a length of 260.1 ± 0.1 mm with an in-line cutter. Outer diameter is 20.1 ± 0.1m
m, cylindricity is 80 μm, maximum surface roughness (Rmax) is 1
6 μm, Ra is 1.8 μm, and the inner diameter is 1
It was 6.0 ± 0.1 mm. The outer diameter portion and the end surface portion were roughly polished to obtain a photoreceptor substrate. By rough polishing, the length is 260.00 ± 0.03 mm and the outer diameter is 19.93 ± 0.
01 mm, cylindricity is 20 μm, Rmax is 4 μm, Ra
Was 0.5 μm.

A photoconductor was manufactured in the same manner as in Example 1 and its dimensions were measured. The outer diameter of the photoconductor is 20.00 ± 0.01m
m, cylindricity was 20 μm, Rmax was 0.7 μm, and Ra was 0.2 μm. In the same manner as in Example 1, the flange
An image confirmation test was carried out with a gear attached, but no abnormalities such as uneven development or defective cleaning were observed.

Example 5 The resin composition having the composition No. 2 was extruded into a columnar shape by extrusion molding and cut into a length of 260.1 ± 0.1 mm with an in-line cutter. Outer diameter is 10.1 ± 0.1m
m, cylindricity was 70 μm, Rmax was 10 μm, and Ra was 1.0 μm. The outer diameter portion and the end surface portion were roughly polished to obtain a photoreceptor substrate. Length is 260.0 due to rough polishing
0 ± 0.03 mm, outer diameter 9.93 ± 0.01 mm, cylindricity 20 μm, Rmax 2 μm, Ra 0.3 μm
Became.

A photoconductor was prepared in the same manner as in Example 1 and its dimensions were measured. The outer diameter of the photoconductor is 20.00 ± 0.01m
m, cylindricity was 20 μm, Rmax was 0.7 μm, and Ra was 0.2 μm. In the same manner as in Example 1, the flange
An image confirmation test was carried out with a gear attached, but no abnormalities such as uneven development or defective cleaning were observed.

[0035]

According to the present invention described above, there is provided a substrate for a small-diameter photoconductor which is excellent in workability and excellent in accuracy and cost. Therefore, the substrate for a photoreceptor of the present invention is an electrophotographic type O
It can fully contribute to the size and weight reduction of the A device.

Front page continuation (72) Inventor Ichigo 1000 Kamoshida-cho, Aoba-ku, Yokohama-shi, Kanagawa Mitsubishi Chemical Corporation Yokohama Research Institute (72) Inventor, Seiichi Ikeda, 4-chome, Nihombashi-muromachi, Chuo-ku, Tokyo Inside the building, Yuka Denshi Co., Ltd.

Claims (3)

[Claims] 1. A synthetic resin having a diameter of 5 to 50.
A substrate for a photoconductor, characterized by comprising a straight cylinder or a cylinder having a diameter of mm and no spigot portion. 2. A flame retardant of 0.5 to 1 is added to 100 parts by weight of a reinforced resin composed of 45 to 85% by weight of an engineering resin having a heat distortion temperature of 110 ° C. or higher and 55 to 15% by weight of a reinforcing fiber.
The photoreceptor substrate according to claim 1, which is composed of a flame-retardant reinforced resin composition in which 5 parts by weight are arranged. 3. The photoreceptor substrate according to claim 2, wherein the engineering resin is any one of polyethylene terephthalate, polybutylene terephthalate, polycarbonate and polyphenylene oxide.