JPH08267760A - Hole forming method - Google Patents

Abstract

PURPOSE: To form a hole having a large inclination angle by using light energy. CONSTITUTION: An irregular part is formed in an energy concentration part of a plate 31 of an article to be processed, by forming a groove 41 in a main face 31a that is to be irradiated with light energy. The irregular part of the article to be processed is formed integrally with other part at the time of ejection forming. Alternatively, the irregular portion may be formed by sand blast processing, chemical etching or a polishing brush. The light energy is preferably laser and, more preferably, excimer laser. The article to be processed may be of organic, inorganic or metallic materials.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hole forming method for forming a hole inclined with respect to the thickness direction of a workpiece by light energy. More specifically, a concavo-convex part is provided in the energy concentration part of the work piece so that the light energy is not reflected even when the incident angle of the light energy exceeds the critical angle, and the hole part has a large inclination angle with respect to the thickness direction of the work piece. The present invention relates to a hole forming method that enables formation of a hole.

[0002]

2. Description of the Related Art In recent years, a so-called on-de-mind type printer, which ejects ink droplets from a nozzle in accordance with a recording signal to record on a recording medium such as paper or film, can be downsized and reduced in cost. Therefore, it is rapidly spreading.

By the way, recently, in addition to characters and figures, there is an increasing demand for outputting color natural images for photographs together with characters and figures. Along with this, it is required to print high-quality natural images, and the reproduction of halftones has become important.

Therefore, in order to enable reproduction of halftones, the present inventors mixed ink and diluent to form an ink solution, changed the concentration of the ink solution, and printed by ejecting the ink solution. We have proposed a printing head that makes it possible to control the density of dots, and prints out a natural image without causing deterioration of resolution.

In such a printing head, a portion for applying a force for ejecting the ink or the diluent to the ink or the diluent (for example, an ink reservoir including a piezo element or a heating element and a diluent reservoir) and the ink or the diluent. It is composed of a nozzle portion (so-called orifice plate) that gives a discharge direction to the.

The orifice plate is formed with a through hole which serves as a nozzle for ink and a through hole which serves as a nozzle for diluting liquid, and these through holes have very small diameters.

Therefore, the method of using a drilling machine or a drill is not suitable for forming the through holes because the minimum size is limited, and the accuracy of the opening size is not good due to abrasion of the cutting edge when producing a plurality of holes. It is impossible. Further, it is difficult to form the through holes even by a method using ultrasonic waves.

It is also possible to use a technique such as reactive ion etching (RIE) or ion milling used in the semiconductor manufacturing process or the like to form the through hole, but the thickness which can be used as an orifice plate is required. If the workpiece is processed by the above methods, it takes a lot of time, and therefore these methods are not suitable.

[0009]

Further, the inventors of the present invention have found that at least one of a through hole which is a nozzle for ink and a through hole which is a nozzle for diluting liquid formed in the orifice plate has a thickness of the orifice plate. Although an orifice plate that is formed obliquely to the direction is also proposed, it is very difficult to form such an oblique through hole by a method using the drilling machine or the drill or a method using ultrasonic waves. .

Therefore, the through hole of the orifice plate, which has a small diameter and may need to be formed in an oblique direction as described above, is formed by irradiating light energy such as a laser. The laser is
Since the beam can be narrowed down and the irradiation diameter can be reduced, it is very suitable for forming a hole portion having a small diameter. Examples of the laser include an excimer laser, a carbon dioxide gas laser, a YAG laser, and the like.

When laser processing is performed as described above,
Laser light having the same inclination angle as that of the through hole to be formed is irradiated from the surface direction of the workpiece to form the through hole in the traveling direction of the laser light.

However, if the inclination angle of the through hole is too large, laser processing becomes impossible. As shown in FIG. 23, when the laser light indicated by the arrow L in the figure is irradiated into the first medium having the refractive index n ₁ and the laser light is made incident on the second medium having the refractive index n ₂ , the laser light is emitted. The inclination angle of the light L in the first medium is θ, and the inclination angle in the second medium is α. At this time, sin θ / sin α = n
₁ / n ₂ holds. When the inclination angle α is 90 °, the laser light L is naturally totally reflected. That is, sin θ = n ₁ / n ₂ , and it becomes impossible to process a through hole having an inclination angle of θ or more satisfying this with a laser. That is, as shown in FIG.
Even when the laser beam shown by the arrow L ₁ in the figure is irradiated from the 01a side, the laser beam is reflected by the surface 101a as shown by the arrow L ₂ in the figure.

Therefore, the present invention has been proposed in view of the conventional circumstances, and an object thereof is to provide a hole forming method capable of forming a hole having a large inclination angle by using light energy. To do.

[0014]

Means for Solving the Problems As a result of intensive studies made by the present inventors in order to achieve the above object, as a result of forming an uneven portion in a portion of the workpiece where the light energy is concentrated, the light energy is reduced. It has been found that, even if the inclination angle of the light energy is large, a wall is formed in the direction in which the light is reflected, or the bite of the light energy is improved and the light energy is not reflected, so that the processing starts as it is.

That is, in the hole forming method of the present invention, a concavo-convex portion is provided in the energy concentration portion of the workpiece, and the concavo-convex portion is irradiated with light energy to incline with respect to the thickness direction of the workpiece. It is characterized by forming a part.

The uneven portion of the work piece may be integrally formed during injection molding of the work piece.

Further, the uneven portion of the workpiece may be formed by a sandblast method, a chemical etching method, or a polishing brush.

Further, the light energy is preferably a laser, more preferably an excimer laser.

Furthermore, the work piece may be an organic material, an inorganic material or a metal material.

The hole forming method of the present invention is suitable for forming the through hole of the orifice plate, and in this case, the thickness of the hole forming portion of the workpiece is 15 μm to 20 μm.
It is preferably 0 μm.

[0021]

In the method of forming a hole of the present invention, the uneven portion is provided in the energy concentration portion of the workpiece, and the uneven portion is irradiated with the light energy, so that the wall is formed in the direction in which the light energy is reflected. Alternatively, the bite of the light energy is improved, the inclination angle of the light energy is large, and even if it exceeds the critical angle, the processing starts without reflection, and the hole that is inclined with respect to the thickness direction of the workpiece is formed. To be done.

If the uneven portions of the work piece are integrally formed during injection molding of the work piece, the work piece can be easily processed in large quantities at one time.

If the uneven portion of the workpiece is formed by a sandblast method, a chemical etching method, or a polishing brush, the uneven portion is processed as a minute uneven portion.

Further, if a laser is used as the above-mentioned light energy, a hole having a small diameter can be easily processed, and if an excimer laser is used as a laser, the work can be processed without generating heat.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments to which the present invention is applied will be described in detail below with reference to the drawings. In this example, an example in which the hole forming method of the present invention is applied to the manufacture of an orifice plate will be described.

The orifice plate manufactured in this embodiment is shown in FIG. The orifice plate includes one surface 11a of the orifice plate 11 to the other surface 11a.
b has a pair of through holes 1 and 2 penetrating to b,
The openings provided on one main surface 11a of the through holes 1 and 2 are liquid supply ports 1a and 2a, and the openings provided on the other main surface 11b are liquid ejection ports 1b and 2b.

In the orifice plate 11, one through hole 2 is formed obliquely with an inclination with respect to the thickness direction of the orifice plate 11, and the other through hole 1 is formed in the thickness of the orifice plate 11. It is formed parallel to the direction. Hereinafter, one through hole 2 is referred to as a first through hole 2, and the other through hole 1 is referred to as a second through hole 1.
Called. Further, as the first through hole 2 approaches the liquid ejection port 2b, it approaches the liquid ejection port 1b of the second through hole 1.

In the above orifice plate, the first through hole 2 is used as an ink nozzle, and the second through hole 1 is used as a diluting liquid nozzle.

Furthermore, the above-mentioned orifice plate 11
In FIG. 1, as shown in FIGS. 1 and 2, the cross-sectional areas of the first and second through holes 2 and 1 decrease from the liquid supply ports 2a and 1a side toward the liquid discharge ports 2b and 1b side. That is, the liquid supply ports 2a, 1a of the first and second through holes 2, 1
When the cross-sectional areas on the side are S2 _a and S1 _a, and the cross-sectional areas on the liquid discharge ports 2b and 1b are S2 _b and S1 _b , respectively, the relationship of S2 _b <S2 _a and S1 _b <S1 _a is established. Becomes

Further, in the above orifice plate, its thickness stabilizes the flight direction of the liquid droplets, and in order to withstand the increased pressure of the liquid, the thickness is 15 to 100.
It is about μm.

Next, a printing head using the orifice plate manufactured according to this embodiment will be shown. As shown in FIG. 3, the printing head has a box-shaped ink reservoir 16 filled with ink 6 inside the first through hole 2 of the orifice plate 11 on the liquid supply port 2a side.
This is a carrier jet type in which a box-shaped diluting liquid reservoir 15 filled with the diluting liquid 5 is arranged on the liquid supply port 1a side of the second through hole 1. The heating element 3 is disposed on the bottom surface 15a of the diluent reservoir 15, and the heating element 4 is disposed on the bottom surface 16a of the ink reservoir 16.

Therefore, when printing is performed by the printing head, first, as shown in FIG. 3, the ink 6 filled in the ink reservoir 16 is filled in the first through hole 2 by a capillary phenomenon. Then, the first meniscus M ₂ is formed, and the diluting liquid 5 filled in the diluting liquid reservoir 15 is filled in the second through hole 1 by the capillary phenomenon to form the second meniscus M ₁ .

Next, as shown in FIG. 4, the ink reservoir 1
A voltage pulse is applied to the heat generating element 4 disposed on the bottom surface 16a of the nozzle 6 to heat the ink 6 inside the ink pool 16 to generate bubbles B ₂ at a position corresponding to the heat generating element 4. Then, as shown in FIG. 4, the pressure inside the ink reservoir 16 increases, and the pressure inside the first through hole 2 increases accordingly, and the ink 6 inside the through hole 2 is pushed out from the liquid ejection port 2b. The droplets adhere to the main surface 11b of the orifice plate 11 in a droplet shape. At this time, the amount of the ink 6 pushed out is controlled by the voltage value or pulse width of the voltage pulse supplied to the heating element 4.

Subsequently, as shown in FIG. 5, a voltage pulse is applied to the heating element 3 disposed on the bottom surface 15a of the diluting liquid reservoir 15 to heat the diluting liquid 5 inside the diluting liquid reservoir 15 to cause the heating element 3 to operate. Bubbles B ₁ are generated at the corresponding positions. Then
As shown in FIG. 5, the pressure inside the diluting liquid reservoir 15 increases, and the pressure inside the second through hole 1 also increases accordingly, and the diluting liquid 5 inside the through hole 1 is pushed out from the liquid discharge port 1b. The droplet 6 is integrated with the ink 6 adhering to the main surface 11b of the orifice plate 11 in the form of a droplet to form a droplet of the ink solution 7
Is formed.

At this time or before the supply of the voltage pulse to the heating element 4 is stopped, bubbles B ₂
Disappears rapidly, and the ink reservoir 16 and the first through hole 2
The internal pressure inside drops. As a result, as shown in FIG. 6, the ink solution 7 and the ink 6 are torn off, the ink 6 is drawn into the first through hole 2, and the meniscus M ₂ is formed again. The ink solution 7 grows in a columnar shape.

Next, the supply of the voltage pulse of the heating element 3 is stopped. Then, as shown in FIG. 7, the bubble B ₁ rapidly disappears, the internal pressure in the diluting liquid reservoir 15 and the second through hole 1 is reduced, and the diluting liquid 5 is in the second through hole 1. Since the ink solution 7 is drawn in, a constriction 7a occurs on the liquid ejection port 1b side.

When the bubble B ₁ is further reduced, as shown in FIG.
As shown in FIG. 9, the ink solution 7 starts to fly, and as shown in FIG. 9, the ink solution 7 jumps out into the air. And
The ink solution 7 adheres to the recording medium and is printed.

At this time, the concentration of the ink solution 7 which is a mixture of the ink and the diluent is determined by the amount of the ink 6 pushed out from the first through hole 2, and the amplitude and pulse width of the voltage pulse applied to the heating element 4. Controlled by. When the amplitude or pulse width is increased, the amount of the ink 6 increases, and when the amplitude or the pulse width is decreased, the amount of the ink 6 decreases.
The concentration of changes. The amplitude of the voltage pulse and the variable range of the pulse width may be experimentally set to optimum values.

The above-described series of operations in the printing head is an example, and the timing and state of each operation, for example, the shape of the ink solution, the filling operation, etc., are structural elements such as the size of the liquid ejection port, the ink, and the like. It changes depending on physical factors such as the viscosity and surface tension of the diluent, and operating conditions such as the discharge frequency.

Next, a method for manufacturing an orifice plate to which the hole forming method of the present invention is applied will be described.

First, a plate which constitutes an orifice plate is prepared. In this embodiment, the plate is made of an organic material such as a polymer material and is formed by injection molding. Then, in the present embodiment, when forming a plate that is a workpiece by injection molding, as shown in FIG. 10, the energy of the plate 31 that irradiates light energy to form an oblique through hole. In the concentrated portion, the groove portion 41 facing the one main surface 31a side which is the light energy irradiation surface is formed.

The groove 41 is a groove having a substantially U-shaped cross section, and the side surface 41a corresponding to the light energy advancing direction is an inclined surface.

Next, as shown in FIG. 11, the plate 31
Light energy of a laser or the like indicated by an arrow M ₁ in the drawing is applied from the one main surface 31a side in the thickness direction of the plate 31. Examples of the laser include an excimer laser, a carbon dioxide gas laser, a YAG laser, and the like. Here, the excimer laser is used.

When the above-mentioned excimer laser is used for processing, a process called an ablation process for breaking a bond of molecules to evaporate and remove a substance is carried out. It is possible to perform high-quality processing only on the area irradiated with.

Then, as shown in FIG. 12, the plate 3
In the thickness direction of 1, the main surface 31 opposite to the one main surface 31a side
A second through hole 32 is formed which penetrates to the b side and has an opening 32a on the one main surface 31a side as a liquid supply port and an opening 32b on the opposite main surface 31b side as a liquid discharge port. At this time, in the second through-holes 32, from being formed by the irradiation of laser or the like, the main surface 31b of direction of the cross-sectional area S32 _a in the one main surface 31a of the side where the light energy is incident opposed greater than the cross-sectional area S32 _b in, holds the relationship S32 _b <S32 _a.

Next, as shown in FIG. 12, the plate 31
Light energy of a laser or the like indicated by an arrow M ₂ in the drawing is irradiated from the one main surface 31a side in a direction oblique to the thickness direction of the plate 31. In addition, the irradiation direction of the above-mentioned light energy was set so as to approach the opening 32b which is the liquid ejection port of the second through hole 32 as it goes from the one main surface 31a side to the main surface 31b side. Also, as the above laser, an excimer laser, a carbon dioxide gas laser, a YAG laser, etc. are exemplified,
Here again, an excimer laser was used.

At this time, in this embodiment, as described above, the groove portion 41 is formed in the energy concentration portion where the light energy in the oblique direction is concentrated to form the oblique through hole in the plate 31 which is the workpiece. Since the concave-convex portion is provided by providing the above, the light energy indicated by the arrow M ₂ is irradiated to the side surface 41a of the groove portion 41 as shown in FIG.

Since the side surface 41a is an inclined surface, the light energy indicated by the arrow M ₂ is the side surface 41a.
The light is incident at an angle almost perpendicular to a, and the incident light energy goes straight to be processed.

As a result, as shown in FIG.
In the thickness direction of 1, the main surface 31 opposite to the one main surface 31a side
A first through hole 33 is formed which penetrates to the b side and has an opening 33a on the one main surface 31a side as a liquid supply port and an opening 33b on the opposite main surface 31b side as a liquid discharge port. As shown in, the orifice plate having the first through holes 33 in the diagonal direction and the second through holes 32 in the thickness direction is completed.

At this time, since the first through-hole 33 is formed by the irradiation of the excimer laser, the cross-sectional area S33 _a of the one main surface 31a on the side where the light energy is incident is opposed to each other. It becomes larger than the cross-sectional area S33 _b on the main surface 31b, and S33 _b <S33 _a
The relationship is established. Further, the first through hole 33 approaches the second through hole 3 as it approaches the opening 33b which is the liquid ejection port.
It is formed as a through hole that approaches the opening 32b which is the liquid discharge port of No. 3.

In the above manufacturing method, the first through hole is formed after forming the second through hole. However, as shown in FIG. 15, the plate 31 is used in the above manufacturing method from one main surface 31a side. The orifice plates may be formed by simultaneously irradiating the light energies shown by the arrows M ₁ and M ₂ in the figure to form the _first and _second through holes at the same time.

Further, in the above manufacturing method, the plate 31 which is the object to be processed is provided with a groove portion having a substantially U-shaped cross section whose side surface in the light energy advancing direction is an inclined surface.
Although the uneven portion is formed in the energy concentration portion of, the uneven portion of the energy concentration portion has a U-shaped cross section facing the one main surface 31a side which is the light energy irradiation surface, as shown in FIG. You may form like the groove part 51.

When the plate 31 having such a groove 51 is irradiated with light energy indicated by an arrow M ₂ in FIG. 16 from the one main surface 31a side, the light energy is reflected in a direction opposite to the incident direction, It is repelled by the side surface 51a serving as a wall, processing is started at this portion, and a small hole portion 52 is formed at the bottom of the groove portion 51 as shown in FIG.
As a result, the biting of the light energy is improved, processing is started in the light energy incident direction, and as shown in FIG. 18, the plate 31 penetrates from the one main surface 31a side to the opposite main surface 31b side in the thickness direction. Then, the opening 3 on the one main surface 31a side
A first through hole 33 is formed in which 3a serves as a liquid supply port and an opening 33b on the opposite main surface 31b side serves as a liquid discharge port. Examples of the light energy include laser light and the like. Examples of the laser light include excimer laser, carbon dioxide gas laser, YAG laser, and the like, and it is preferable to use the excimer laser for the above reason.

In the manufacturing method described so far, the example in which the uneven portion is formed at the same time when the plate is formed by injection molding has been described. However, the vicinity of the uneven portion of the plate is formed by injection molding, and the plate is formed. The uneven portion may be formed on the plate by adhering it to a member to be another portion. At this time, the material forming the member forming the portion near the uneven portion of the plate and the material forming the member forming the other portion may be the same or different.

Further, in the above-mentioned manufacturing method, the example in which the groove portion is formed on the surface of the plate 31 which is the workpiece to form the uneven portion, but the surface of the plate is roughened and the uneven portion is formed on the energy concentration portion. May be formed.

That is, first, a plate which constitutes an orifice plate is prepared. In this embodiment, the plate is made of an organic material such as a polymer material and a polyimide film is used.

Next, as shown in FIG. 19, the surface of one main surface 61a which is the light energy irradiation surface of the plate 61 is roughened by a sandblast method. The sandblast method is a method in which fine particles are vigorously struck against a workpiece, and the surface is physically shaved by the particles. Here, the surface of the extremely smooth polyimide film having the maximum height of the uneven portion of the surface of several tens of angstroms is roughened by the sand blast method to form the fine projections and depressions having the maximum height of about 5 μm.

Next, as shown in FIG. 19, the plate 6
When the light energy indicated by the arrow M ₂ in the drawing is irradiated from the one main surface 61a side of the No. 1, the incident light energy is projected onto the one main surface 61a of the plate 61 by the sandblast method as shown in FIG. At this time, the light energy cannot escape, and the processing starts at this portion, and a small hole portion 63 is formed at the base end portion of the protrusion 62 as shown in FIG. As a result, the biting of the light energy is improved, processing is started in the light energy incident direction, and as shown in FIG. 22, the plate 61 penetrates in the thickness direction of the plate 61 from the one main surface 61a side to the opposite main surface 61b side. Then, the first through hole 33 in which the opening 33a on the one main surface 61a side serves as a liquid supply port and the opening 33b on the opposite main surface 61b side serves as a liquid discharge port is formed.

Then, when a hole is formed in the oblique direction as described above in the polyimide film having the surface not processed and the polyimide film having the surface processed by the sand blast method as described above, the surface is processed. In the unprocessed polyimide film, it was possible to form holes having a maximum inclination angle of 80 °, and in the polyimide film having a roughened surface, it was possible to form holes having a maximum inclination angle of 85 °. .

The light energy may be laser light or the like. The laser light may be excimer laser, carbon dioxide gas laser, YAG laser or the like, and the excimer laser is used for the above reason. Is preferred.

Further, in the above manufacturing method, the example in which the plate surface is roughened by the sandblast method has been described, but the plate surface may be roughened by the chemical etching method or the method using the polishing brush.

In the manufacturing method described above, an organic material such as a polymer material has been used as a material for forming a plate which is a workpiece, but an inorganic material or a metal may be used.

Therefore, in the method of manufacturing an orifice plate to which the hole forming method of the present invention described above is applied, a concavo-convex portion is provided in the energy concentrating portion of the plate to be processed, and light energy is applied to the concavo-convex portion. To irradiate,
A wall is formed in the direction in which the light energy is reflected, or biting of the light energy is improved, which facilitates processing by the light energy. Furthermore, the inclination angle of the light energy is large, and even if it exceeds the critical angle, the processing starts without reflection, and the inclination angle with respect to the thickness direction of the plate has a large inclination angle exceeding the critical angle of the light energy. Through holes can be formed.

If the concavo-convex portion of the plate is integrally formed during the injection molding of the plate as in the above-described embodiment, the plate can be easily processed in a large amount at one time.
Productivity is also good.

If the uneven portion on the surface of the plate is formed by the sandblast method, the chemical etching method or the polishing brush as in the above-mentioned embodiment, the uneven portion is processed as a minute uneven portion.

Further, when a laser is used as the light energy as in the above-mentioned embodiment, a hole having a small diameter can be easily processed, and when an excimer laser is used as the laser, the work is processed without generating heat. Is done
High-quality processing is possible only at the location irradiated with laser light.

[0067]

As is clear from the above description, in the hole forming method of the present invention, since the uneven portion is provided in the energy concentration portion of the workpiece and the uneven portion is irradiated with light energy, A wall is formed in the direction in which energy is reflected, or biting of light energy is improved, the inclination angle of light energy is large, and even if it exceeds the critical angle, processing starts without reflection, It is possible to form a hole having a large inclination angle such that the inclination angle with respect to the thickness direction exceeds the critical angle.

If the irregularities of the work piece are integrally formed during the injection molding of the work piece, the work piece can be easily processed in a large amount at one time, and the productivity can be improved.

If the uneven portion of the workpiece is formed by the sandblast method, the chemical etching method, or the polishing brush, the uneven portion is processed as a minute uneven portion.

Further, if a laser is used as the light energy, it is easy to process a hole having a small diameter, and if an excimer laser is used as a laser, the work is processed without generating heat, and the laser light is used. It is possible to perform high-quality processing only on the area irradiated with.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an orifice plate manufactured by a method for manufacturing an orifice plate to which a hole forming method of the present invention is applied.

FIG. 2 is a plan view showing an orifice plate manufactured by a method for manufacturing an orifice plate to which the hole forming method of the present invention is applied.

FIG. 3 is a schematic view showing in sequence the operation of the printing head using the manufactured orifice plate, and a schematic view showing a state in which a meniscus is formed on the orifice plate.

FIG. 4 is a schematic view showing in sequence the operation of the printing head using the manufactured orifice plate, showing a state in which the ink in the through hole is pushed out.

FIG. 5 is a schematic view showing in sequence the operation of the printing head using the manufactured orifice plate, and is a schematic view showing a state in which the diluent in the through hole is extruded to form an ink solution.

FIG. 6 is a schematic view showing in sequence the operation of the printing head using the manufactured orifice plate, showing a state in which the ink solution grows in a columnar shape.

FIG. 7 is a schematic view showing in sequence the operation of the printing head using the manufactured orifice plate, and is a schematic view showing a state in which a columnar ink solution is constricted.

FIG. 8 is a schematic view showing in sequence the operation of the printing head using the manufactured orifice plate, and is a schematic view showing a state in which the ink solution has started to fly.

FIG. 9 is a schematic view showing in sequence the operation of the printing head using the manufactured orifice plate, and is a schematic diagram showing a state in which the ink solution has jumped out into the air.

FIG. 10 shows an example of a method of manufacturing an orifice plate to which the hole forming method of the present invention is applied in the order of steps,
It is a schematic diagram which expands and shows the process of forming a groove part in a plate.

FIG. 11 shows an example of a method of manufacturing an orifice plate to which the hole forming method of the present invention is applied, in the order of steps,
It is a schematic diagram which shows the state which is irradiating light energy in order to form a 2nd through-hole in a plate.

FIG. 12 shows an example of a method of manufacturing an orifice plate to which the hole forming method of the present invention is applied in the order of steps,
It is a schematic diagram which shows the state which is irradiating light energy in order to form a 1st through-hole in a plate.

FIG. 13 shows an example of a method of manufacturing an orifice plate to which the hole forming method of the present invention is applied, in the order of steps,
It is a schematic diagram which expands and shows the state in which the 1st through-hole was formed in the plate.

FIG. 14 shows an example of a method of manufacturing an orifice plate to which the hole forming method of the present invention is applied in the order of steps,
It is a schematic diagram which shows the state which the orifice plate was completed.

FIG. 15 shows another example of a method of manufacturing an orifice plate to which the hole forming method of the present invention is applied, in which light energy is irradiated to form first and second through holes in the plate. It is a schematic diagram which shows a state.

FIG. 16 shows still another example of the method of manufacturing an orifice plate to which the hole forming method of the present invention is applied, in order of steps, and is a schematic view showing an enlarged step of forming a groove in a plate.

FIG. 17 shows still another example of the method of manufacturing an orifice plate to which the hole forming method of the present invention is applied, in the order of steps, showing an enlarged state in which a hole is formed at the bottom of the groove of the plate. It is a schematic diagram.

FIG. 18 is a view showing still another example of the method of manufacturing the orifice plate to which the hole forming method of the present invention is applied, in order of steps, showing an enlarged view of the state where the first through hole is formed in the plate. It is a figure.

FIG. 19 is a schematic view showing still another example of the method for manufacturing an orifice plate to which the hole forming method according to the present invention is applied, in the order of steps, showing a step of roughening the surface of the plate.

FIG. 20 is a schematic view showing still another example of the method of manufacturing the orifice plate to which the hole forming method of the present invention is applied, in the order of steps, showing a state in which the plate is irradiated with light energy.

FIG. 21 is a view showing still another example of the method of manufacturing an orifice plate to which the hole forming method of the present invention is applied, showing a state in which the hole is formed at the base end of the protrusion of the plate. It is a schematic diagram which shows.

FIG. 22 is a view showing still another example of the method of manufacturing an orifice plate to which the hole forming method of the present invention is applied, in the order of steps, showing an enlarged view of a state where the first through hole is formed in the plate. It is a figure.

FIG. 23 is a schematic diagram showing a tilt angle and a refractive index of laser light.

FIG. 24 is a schematic diagram showing a state in which a workpiece is reflecting laser light.

[Explanation of symbols]

 31, 61 Plates 31a, 61a One main surface 41, 51 Grooves 41a, 51a Side surfaces 52, 63 Holes 62 Projections

Front page continuation (72) Inventor Takaaki Murakami 6-7-35 Kitashinagawa, Shinagawa-ku, Tokyo Sony Corporation

Claims (12)

[Claims] 1. An uneven portion is provided in an energy concentrating portion of a workpiece, and the uneven portion is irradiated with light energy to form a hole portion inclined with respect to a thickness direction of the workpiece. Hole forming method. 2. The hole forming method according to claim 1, wherein the uneven portion of the work piece is integrally formed during injection molding of the work piece. 3. The method for forming a hole according to claim 1, wherein the uneven portion of the workpiece is formed by a sandblast method. 4. The method of forming a hole according to claim 1, wherein the uneven portion of the workpiece is formed by a chemical etching method. 5. The method for forming a hole according to claim 1, wherein the uneven portion of the workpiece is formed by using a polishing brush. 6. The method for forming a hole according to claim 1, wherein the light energy is a laser. 7. The method for forming a hole according to claim 6, wherein the laser is an excimer laser. 8. The method for forming a hole according to claim 1, wherein the workpiece is made of an organic material. 9. The method for forming a hole according to claim 1, wherein the workpiece is made of an inorganic material. 10. The method for forming a hole according to claim 1, wherein the workpiece is made of a metal material. 11. The thickness of the hole forming portion of the workpiece is 15
The hole portion forming method according to claim 1, wherein the hole portion forming diameter is from 200 to 200 μm. 12. The hole forming method according to claim 11, wherein the workpiece is an orifice plate.