JPH08250900A - Multi-chamber substrate, board unit using the multi-chamber substrate, and method for assembling board unit - Google Patents

Abstract

(57) [Abstract] [Purpose] Use a multi-chambered board and a multi-chambered board in which the cutting line does not protrude from the end surface of the board when the board and the margin are divided along the slit to obtain a plurality of boards. It is an object of the present invention to provide a conventional board unit and a method for assembling the board unit. [Structure] By bending an end portion 13a of a slit 13 formed at a boundary between a substrate 11 and a margin 12, a tapered tongue piece 14 is formed toward the substrate 11.
The substrate 11 and the margin 12 are partially connected via the wiring 4. When the substrate 11 and the margin 12 are divided along the slit 13, a jagged cutting line is generated, but this cutting line is located inside the end surface of the substrate 11 and does not project outward. Therefore, the substrate 11 can be mounted on a frame-shaped frame without any trouble.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-faced substrate for obtaining a plurality of substrates by dividing a substrate and a margin along a slit, a substrate unit using the multiple-faced substrate, and a method for assembling the substrate unit. .

[0002]

2. Description of the Related Art The size of a board on which electronic components (hereinafter referred to as "chips") are mounted is large and small, but in recent years, a small board is used particularly in many fields such as personal computers, mobile phones, and video game machines. Are becoming more popular.

As a small-sized substrate, a multi-chambered substrate is often used because of convenience in manufacturing and assembling processes. FIG. 5 is a plan view of a conventional multi-panel substrate. This multi-sided board is a board 1.
Slits 3 are formed at a boundary between the margin 2 and the margin 2, and the substrate 1 and the margin 2 are joined by a thin joint portion 4 between the slits 3. In addition, on both sides of the end surface of the substrate 1, elongated protrusions 5 for mounting a connector in a later process are extended. FIG. 6A is A of FIG.
It is the elements on larger scale of a part. The substrate 1 and the margin 2 are divided by cutting along the slit 3 to obtain two substrates 1.

[0004]

FIG. 6B shows the A portion after cutting. The multi-chambered substrate is generally thinly formed of glass epoxy resin or ceramic, and the cutting line a has a rough surface with a jagged surface as shown in the drawing, and the cutting line a is slightly (distance t) from the end face b of the substrate 1. Easy to get out.

However, the cutting line a is thus formed on the substrate 1
When the substrate 1 is mounted on the frame (not shown) in a later step, the exposed portion is likely to obstruct the mounting and must be discarded as a defective product in some cases. There was a problem.

Therefore, an object of the present invention is to provide a multi-faced substrate in which a cutting line does not protrude from an end face of the substrate, a substrate unit using the multi-faced substrate, and a method of assembling the substrate unit.

[0007]

To this end, the present invention is a multi-faced substrate in which a slit is formed at a boundary between a margin and a substrate, and a plurality of substrates are obtained by dividing the slit from the slit. A tongue piece extending inwardly of the end face is formed, the margin and the substrate are connected via the tongue piece, and the tongue piece is divided.

Further, a slit is formed at the boundary between the margin and the substrate, and a tongue extending from the margin to the inside of the end face of the substrate is formed. The margin and the substrate are joined via the tongue, and the joint is divided. The substrate obtained by
It is mounted on a frame-shaped frame and assembled to form a board unit.

Further, preferably, the tongue piece is tapered toward the substrate.

[0010]

According to the above structure, even if the substrate and the margin are cut from the slit, the cutting line does not protrude from the end face of the substrate. Therefore, it can be mounted on the frame-shaped frame without any trouble.

[0011]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view of a multi-faced substrate according to an embodiment of the present invention. Slits 13 are formed in series at the boundary between the substrate 11 and the margin 12 with a pitch. Reference numeral 15 is an elongated protrusion for mounting connectors extending on both sides of the end surface of the substrate 11.

FIG. 2 (a) is a partially enlarged view of portion B of FIG. The end 13a of the slit 13 is bent toward the substrate 11. The tapered tongue piece 14 that is formed by being bent extends inwardly from the end surface c of the substrate 11, and the tongue piece 1 between the slits 13 is formed.
Substrate 11 and margin 12 are partially connected via 4.

FIG. 2B is a partially enlarged view of the portion B after the substrate 11 and the margin 12 are cut along the slit 13. The cutting line d is jagged and protrudes slightly outward from the base end face (the end face of the end portion 13a) e, but is located inside the end face c of the substrate 11. As described above, in the multi-chambered substrate, the cutting line d does not protrude from the end face c of the substrate 11 even when cut along the slit 13.

FIG. 3 is an exploded view of a substrate unit according to an embodiment of the present invention, and FIG. 4 is a sectional view of the same assembled state. In the figure, 1
1 is a substrate obtained as described above, on the upper surface of which various kinds of chips 21, 22, 23 are mounted,
A connector 24 is attached to the end of the connector. Both sides of the connector 24 are attached to the protrusions 15. Electronic components such as the chips 21 to 23 and the connector 24 are usually mounted on the substrate 11 in a state before division shown in FIG.

Reference numeral 25 is a quadrangular frame, and a flange 26 is projectingly provided on the inner surface thereof. The board 11 is mounted on the flange 26 by a bond or the like. 27
Is a cover plate.

When assembling the board unit as shown in FIG. 4, since there is no protruding portion on the end face of the board 11, the board unit can be easily mounted inside the frame 25. This board unit is mounted on a personal computer, a mobile phone, a video game machine, a card type electronic device, or the like.

Next, a method of assembling the substrate unit of the present invention will be described. First, as shown in FIG. 1, along the boundary between the margin 12 and the substrate 11, the slit 13 having the above-described shape is formed.
Are formed in series. As a means for forming the slit 13, there is a drill, a laser processing machine, or the like. Next, electronic components such as the chips 21, 22, 23 and the connector 24 are soldered and mounted on the substrate 11. Next, the substrate 11 is separated from the tongue piece 14. Next, the substrate 11 is mounted on the frame 25. At this time, since there is nothing protruding from the end face of the substrate 11, the substrate 11 can be easily mounted inside the frame 25.

[0018]

As described above, according to the present invention, even if the board and the margin are divided from the slit, the cutting line does not protrude from the end surface of the board, so that the board can be easily mounted on a frame-shaped frame or the like. can do.

[Brief description of drawings]

FIG. 1 is a plan view of a multi-chambered substrate according to an embodiment of the present invention.

FIG. 2 (a) is a view of a multi-faced substrate according to an embodiment of the present invention.
(B) Partial enlarged view of the multi-chamber substrate of the embodiment of the present invention after cutting

FIG. 3 is an exploded view of a board unit according to an embodiment of the present invention.

FIG. 4 is a sectional view of an assembled state of a board unit according to an embodiment of the present invention.

FIG. 5 is a plan view of a conventional multi-sided board.

FIG. 6 (a) is a partially enlarged view of a portion A of FIG. 5 of a conventional multi-layered substrate. FIG. 6 (b) is a partially enlarged view of a portion A of the conventional multi-layered substrate after cutting.

[Explanation of symbols]

 11 Substrate 12 Margin 13 Slit 13a End 14 Tongue 25 Frame

Claims (6)

[Claims] 1. A multi-chambered substrate, in which a slit is formed at a boundary between a margin and a substrate, and a plurality of substrates are obtained by dividing the slit, and the tongue piece extends from the margin to an inner side of an end face of the substrate. A multi-chamfered substrate is characterized in that the margin is joined to the substrate through the tongue piece, and the tongue piece divides. 2. The multiple chamfered substrate according to claim 1, wherein the tongue is tapered toward the substrate. 3. A slit is formed at the boundary between the margin and the substrate, and a tongue extending from the margin to the inside of the end face of the substrate is formed, and the margin and the substrate are coupled via the tongue. A board unit using a multi-sided board, wherein the board obtained by dividing the tongue piece is mounted on a frame-shaped frame and assembled. 4. A substrate unit using a multi-chambered substrate according to claim 3, wherein the tongue is tapered toward the substrate. 5. A plurality of slits, whose ends are bent inwardly from the end face of the substrate, are formed at the boundary between the substrate and the margin in series along the boundary, whereby the ends of the slits adjacent to each other are formed. A step of forming a tongue extending from the margin to the inside of the end surface of the board between the edge and an end, a step of mounting an electronic component on the board, and a step of mounting the board on which the electronic component is mounted on the tongue. And a step of mounting the board on a frame, the method of assembling a board unit. 6. The method of assembling a board unit according to claim 5, wherein the tongue is tapered toward the board.