JPH08244224A - Liquid jet recording head, manufacture thereof and liquid jet recorder - Google Patents

Abstract

PURPOSE: To obtain a liquid jet recording head in which a resin structure for forming a liquid channel is not isolated from a board. CONSTITUTION: A liquid jet recording head comprises a resin material 5 for forming a liquid channel 6 on a board 1 having a liquid discharge energy generator, wherein the linear expansion coefficient of the material 5 after curing is 1/10 to 10 times as large as that of the board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid jet recording head for producing recording liquid droplets used in an ink jet recording system and a method for manufacturing the same, and more particularly to an edge shooter type liquid jet recording head, a method for manufacturing the same. The present invention relates to a liquid jet recording apparatus.

[0002]

2. Description of the Related Art A liquid jet recording head used in an ink jet recording apparatus (liquid jet recording system) is generally provided in a minute recording liquid discharge port (orifice), a liquid flow path, and a part of the liquid flow path. A liquid discharge energy generation unit is provided. A conventional method for producing such a liquid jet recording head is disclosed in, for example, JP-A-61-154947.
The following process described in JP-A-62-253457 is known (see the schematic view of FIG. 1).

First, a photosensitive resin layer (positive photoresist 2) is formed on the substrate 1 (FIG. 1A), and this is exposed through a mask 3 (FIG. 1B) and developed. Then, the photosensitive resin layer is patterned to form a mold material (resist pattern 4) to be a liquid flow path on the substrate 1 (FIG. 1).
(C)). Next, the patterned mold material 4 is coated with an active energy ray curable or thermosetting liquid flow path forming material 5 (FIG. 1D), and the active energy ray is irradiated or heated to activate the active energy ray. The curable or thermosetting liquid flow path forming material 5 is cured (see FIG. 1).
(E)). Furthermore, the patterned mold material 4 is
It is dissolved and removed using an organic solvent such as a halogen-containing hydrocarbon, a ketone, an ester, an ether, an alcohol or an alkaline aqueous solution such as sodium hydroxide and potassium hydroxide to form a liquid flow path 6 (FIG. 1 (f)).

[0004]

However, when a liquid jet recording head is manufactured by the above method, an active energy ray or thermosetting type liquid flow path forming material 5 and a substrate 1 having a liquid discharge energy generating portion are used. The bonding area is
It becomes smaller as the density of the nozzles increases. Further, in a bubble jet type liquid jet recording head that uses an electrothermal converter that generates heat energy in the liquid discharge energy generation portion, the head temperature rises during operation. Therefore, when the linear expansion coefficient between the resin material and the substrate is extremely different, the stress generated by the difference in the linear expansion coefficient between the substrate and the resin material concentrates on the partition wall between the nozzles, and in the worst case, during printing. There is a problem that the resin structure 5 forming the liquid flow path is separated from the substrate 1.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a highly reliable liquid jet recording head which does not cause such trouble and a method for manufacturing the same.

[0006]

Therefore, in the liquid jet recording head according to the present invention, the resin material is laminated and cured on the substrate having the liquid discharge energy generating portion to form the discharge port and the liquid flow path. A liquid jet recording head, wherein the linear expansion coefficient of the cured resin material is 1/10 or more and 10 times or less of the linear expansion coefficient of the substrate material. It's something you want to achieve.

The resin material laminated on the substrate contains an epoxy group or an acryloyl group or a compound having a cross-linked structure or a polymerized structure thereof, or A liquid jet recording head in which a resin material is laminated on a substrate having a liquid discharge energy generating portion to form a discharge port and a liquid channel is an edge shooter type liquid jet recording head, and In the liquid jet recording head having the above-mentioned structure, the liquid jet recording head is a full-line type in which a plurality of discharge ports are provided over the entire width of the recording area of the recording medium, or a multi-color discharge port is provided. The structure is characterized by being integrally molded, or the liquid discharge energy generation part is an electrothermal converter that generates heat energy. By the liquid jet recording head, which is a body, it is intended to achieve the above object.

Further, a photosensitive resin is patterned to form a liquid flow path forming mold material, and an active energy ray curable material or a thermosetting resin material is laminated on the mold material and cured, and then the liquid flow. According to the method of manufacturing a liquid jet recording head, the liquid flow path is formed by dissolving and removing the channel forming mold material, and an ejection port for ejecting ink is provided facing the recording surface of the recording medium. An object of the present invention is to achieve the above object by a liquid jet recording apparatus comprising at least the liquid jet recording head and a member for mounting the recording head. is there.

[0009]

The above object can be achieved by the above means. That is, in a liquid jet recording head having a structure in which a resin material is laminated on a substrate having a liquid ejection energy generating portion to form an ejection port and a liquid flow path, the resin material laminated on the substrate has a linear expansion coefficient By using a material having a coefficient of linear expansion of 1/10 or more and 10 times or less, the stress generated due to the difference in linear expansion coefficient between the substrate and the resin material can be relaxed, and a sufficient adhesive force can be obtained. It becomes possible.

[0010]

The present invention will be described below in detail with reference to examples.

(Embodiment 1) With reference to the nozzle forming method explanatory diagram shown in FIG. 1, the structure of the liquid jet recording head of Embodiment 1 will be explained by the method of manufacturing the same, and the effect will be explained. .

[0012] A glass substrate (on which a linear expansion coefficient of 5.5 is formed) on which an electrothermal converter which is a liquid discharge energy generating element is formed.
0 × 10 ⁻⁶ ) 1 Positive type photoresist AZ-49
03 (manufactured by Hoechst) was spin-coated to a film thickness of 30 μm, and prebaked at 90 ° C. for 40 minutes in an oven to form a resist layer 2. After pattern exposure on the resist layer 2 through a mask pattern of a nozzle, development is performed using an aqueous solution of sodium hydroxide, followed by rinsing treatment with ion-exchanged water, and an oven at 70 ° C. for 30 minutes.
The resist pattern 4 was obtained by performing post baking for a minute.

Next, the resist pattern 4 was coated with a photocurable material 5 consisting of 99 parts by weight of a silicone-modified epoxy resin, 1 part by weight of triphenylsulfonium hexafluoroantimonate, and the whole surface was exposed and heat-treated to cure it. . Linear expansion coefficient after curing α ₁ = 3.
It was 60 × 10 ⁻⁵ . Then, ultrasonic treatment was performed in the ascent to remove the resist pattern, and a liquid jet recording head of Example 1 having nozzles equivalent to 400 dpi was obtained.

When the nozzle thus formed was observed with an optical microscope, no peeling of the resin material from the substrate was observed between the nozzles.

Next, the present recording head was set on a heat stage, and when the nozzle was observed with an optical microscope while gradually raising the temperature, no peeling of the resin material from the substrate occurred even at 150 ° C.

(Embodiment 2) A positive photoresist A is formed on a glass substrate (coefficient of linear expansion 5.50 × 10 ^-6 ) on which an electrothermal converter which is a liquid discharge energy generating element is formed.
Z-4903 (manufactured by Hoechst) was spin-coated to a film thickness of 30 μm, and prebaked at 90 ° C. for 40 minutes in an oven to form a resist layer. After pattern exposure on this resist layer through a mask pattern of a nozzle, development was performed using an aqueous solution of sodium hydroxide, followed by rinsing treatment with ion-exchanged water and heating at 70 ° C. in an oven at 30 ° C.
Post-baking was performed for 1 minute to obtain a resist pattern.

Next, a resin composition comprising 20 parts by weight of biphenyl type epoxy, 60 parts by weight of spherical silica and 20 parts by weight of hexahydrophthalic anhydride is coated on the resist pattern by a transfer molding method, and heat treatment is performed at 120 ° C. for 90 minutes. Cured. The linear expansion coefficient after curing was α ₁ = 1.50 × 10 ⁻⁶ . Then, ultrasonic treatment was performed in acetone to remove the resist pattern, and a liquid jet recording head of Example 2 having a nozzle corresponding to 400 dpi was obtained.

When the nozzle thus formed was observed with an optical microscope, no peeling of the resin material from the substrate was observed between the nozzles.

Next, when the recording head was set on the heat stage and the nozzle was observed with an optical microscope while gradually raising the temperature, no peeling of the resin material from the substrate occurred even at 150 ° C.

Example 3 A positive photoresist AZ was formed on a glass substrate (coefficient of linear expansion 5.50 × 10 ⁻⁶ ) on which an electrothermal converter as a liquid energy generating element was formed.
-4903 (manufactured by Hoechst) was spin-coated to a film thickness of 30 μm, and prebaked at 90 ° C. for 40 minutes in an oven to form a resist layer. After pattern exposure on this resist layer through a mask pattern of a nozzle, development was performed using an aqueous solution of sodium hydroxide, followed by rinsing treatment with ion-exchanged water and heating at 70 ° C. in an oven at 30 ° C.
Post-baking was performed for 1 minute to obtain a resist pattern.

Next, on the resist pattern, 20 parts by weight of epoxy acrylate, 30 parts by weight of acrylic monomer, 46 parts by weight of glass filler, 3 parts by weight of 2.2-dimethoxy-2-phenylacetophenone, and 1 part by weight of long-wavelength sensitizer were used. Of the conductive material, the whole surface was exposed and heat-treated to cure. Linear expansion coefficient after curing α ₁ = 2.5
It was 0 × 10 ⁻⁵ . Then, ultrasonic treatment was performed in acetone to remove the resist pattern, and a liquid jet recording head having a nozzle corresponding to 400 dpi was obtained.

Next, when the head was set on a heat stage and the nozzle was observed by an optical microscope while gradually raising the temperature, no peeling of the resin material from the substrate occurred even at 150 ° C.

(Comparative Example) A positive photoresist A was formed on a glass substrate (coefficient of linear expansion 5.50 × 10 ^-6 ) on which an electrothermal converter as a liquid discharge energy generating element was formed.
Z-4903 (manufactured by Hoechst) was spin-coated to a film thickness of 30 μm, and prebaked at 90 ° C. for 40 minutes in an oven to form a resist layer. After pattern exposure on this resist layer through a mask pattern of a nozzle, development was performed using an aqueous solution of sodium hydroxide, followed by rinsing treatment with ion-exchanged water and heating at 70 ° C. in an oven at 30 ° C.
Post-baking was performed for 1 minute to obtain a resist pattern.

Next, on the resist pattern, epoxy resin Cyracure UVR-6110 40 parts by weight of Japan Union Carbide Co., Ltd. Cyracure UVR-6200 20 parts by weight Cyracure UVR-6351 40 parts by weight and triphenylsulfonium hexafluoroantimonate 1 part by weight. Was coated with a photo-curable material, and the whole surface was exposed and heat-treated to be cured. Linear expansion coefficient after curing α ₁ = 9.5
It was 0 × 10 ⁻⁵ . Then, ultrasonic treatment was performed in acetone to remove the resist pattern, and a liquid jet recording head having a nozzle corresponding to 400 dpi was obtained.

When the nozzle thus formed was observed with an optical microscope, no peeling of the resin material from the substrate was observed between the nozzles.

Next, when the head was set on a heat stage and the nozzle was observed with an optical microscope while gradually increasing the temperature, peeling of the resin material from the substrate occurred at 70 ° C.

[0027]

As described above, by employing the liquid jet recording head and the manufacturing method thereof according to the present invention, it is possible to provide a liquid jet recording head having highly reliable fine nozzles.

[Brief description of drawings]

FIG. 1 is a schematic view showing a nozzle forming method.

[Explanation of symbols]

 1 substrate 2 positive photoresist 3 mask 4 resist pattern 5 liquid flow path forming material 6 liquid flow path

Claims (8)

[Claims] 1. A liquid jet recording head in which a resin material is laminated and cured on a substrate having a liquid ejection energy generating portion to form an ejection port and a liquid flow path, wherein the line of the cured resin material. A liquid jet recording head having a coefficient of expansion not less than 1/10 and not more than 10 times the coefficient of linear expansion of a substrate material. 2. The liquid jet according to claim 1, wherein the resin material laminated on the substrate contains an epoxy group or an acryloyl group, or a compound having a crosslinked structure or a polymerized structure thereof. Recording head. 3. A liquid jet recording head in which a resin material is laminated on a substrate having a liquid discharge energy generating portion to form a discharge port and a liquid flow path is an edge shooter type liquid jet recording head. The liquid jet recording head according to claim 1. 4. The liquid jet recording head according to claim 1, wherein the liquid jet recording head is a full line type in which a plurality of ejection openings are provided over the entire width of the recording area of the recording medium. 5. The liquid jet recording head according to claim 1, wherein the multi-color ejection ports are integrally formed. 6. The liquid jet recording head according to claim 1, wherein the liquid ejection energy generating section is an electrothermal converter that generates thermal energy. 7. A liquid resin is formed by patterning a photosensitive resin to form a liquid flow path forming mold material, laminating an active energy ray curable material or a thermosetting resin material on the mold material and curing the material. 7. The method for manufacturing a liquid jet recording head according to claim 1, wherein the liquid flow path is created by dissolving and removing the channel forming mold material. 8. A liquid jet recording head according to any one of claims 1 to 6, wherein an ejection port for ejecting ink is provided facing a recording surface of the recording medium. And a member for mounting the liquid ejection recording apparatus.