JPH08236691A - Semiconductor integrated circuit device - Google Patents

Abstract

(57) [Summary] [Object] To provide a package structure suitable for a semiconductor device in a high frequency region such as mobile communication, especially for a microwave monolithic IC to be a multi-chip module, to prevent oscillation, and to improve performance. [Structure] (1) A method of dividing a lead frame for mounting a microwave IC into a plurality of sections, (2) A method of connecting a plurality of divided lead frames with a thin conductor, and (3) a slit provided in the lead frame. A semiconductor integrated circuit device in which a grounding bonding wire of a circuit block connected to an external lead terminal for a signal is connected to each of the divided lead frames. [Effect] It is possible to prevent oscillation by eliminating signal interference between microwave ICs and between circuit blocks in the microwave IC. Further, since the ground of the circuit block connected to the external lead terminal for signal can be connected to the divided lead frame, the external lead can be effectively utilized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in a high frequency region such as mobile communication, and particularly to a microwave I
The present invention relates to a package structure suitable for high performance because it can enhance the multi-chip module of C, prevent oscillation, and enhance isolation between circuit blocks.

[0002]

2. Description of the Related Art Conventionally, a lead frame conductor of a package for mounting a semiconductor device has been one continuous conductor as shown in FIG.

[0003]

In order to complete the grounding which is important in high frequency analog circuits, microwave ICs (low noise amplifiers, variable gain amplifiers, power amplifiers, transmitter / receiver mixers, etc., as shown in FIG. 6 are used. IC with multiple built-in
It is necessary to bond a large number of bonding wires 7 to a lead frame for mounting a single function IC). However, as shown in FIG. 7, there are parasitic inductance components such as the inductances 11 and 13 of the package lead-out leads and the in-plane inductance 12 of the lead frame 2. Signal interference occurs between the circuit blocks 4 and 5 via this parasitic inductance, and particularly in the microwave IC in which the low noise amplifier is arranged in the circuit block 4 and the reception mixer is arranged in the circuit block 5, The voltage generated by the inductance 13 connected to the grounding terminal by the signal of the receiving mixer operated with a large signal is transmitted to the grounding terminal of the circuit block 4 via the inductance 12 and is connected to the grounding point of the low noise amplifier. The generated voltage makes the operation of the low noise amplifier unstable,
Oscillation phenomenon and deterioration of linearity occur. Therefore, as a method of avoiding signal interference between these circuit blocks 4 and 5, in the conventional technique, as shown in FIG. 8, one ground terminal of the circuit block is not a lead frame but an external device for signal input / output. By connecting to the lead terminal, the parasitic inductance 12 shown in FIG. 7 is increased, and the signal flowing through this inductance is reduced to eliminate the signal interference between the circuit blocks. Therefore, by inevitably using a large package with a large number of pins,
We secured a sufficient number of ground terminals and signal lines. As described above, in the related art, the number of pins of the package cannot be effectively used, performance is deteriorated such as linearity, and the number of pins of the package is required to be large, which makes it difficult to reduce the size of the package.

An object of the present invention is to provide a package structure that can effectively utilize the number of pins without using a signal pin for grounding, and is suitable for making a microwave monolithic IC into a multi-chip module, preventing oscillation, and improving performance. Especially.

[0005]

The above-mentioned objects are (1) FIG.
As shown in Fig. 4, a method of dividing the lead frame into which the microwave IC is mounted is divided into a plurality, (2) A method of connecting the divided lead frames with a thin conductor 10 as shown in Fig. 4, and (3) Fig. 2 By the method of providing the slit 9 in the lead frame as shown, the grounding of the circuit block connected to the external lead terminal for signal is connected to each lead frame to achieve the object.

[0006]

The equivalent circuit of the lead frame section can be described by the inductance as shown in FIG. Reference numerals 11 and 13 are inductances of lead-out leads of the package, and reference numeral 12 is an in-plane inductance of the lead frame. The prevention of oscillation and the improvement of linearity can be achieved by reducing the inductance of the ground terminals 11 and 13 connected, but cannot be structurally eliminated. Therefore, in order to reduce the signal interference of the circuit blocks 4 and 5, the inductance 1
When 2 is increased, it becomes difficult for signals to flow, and signal interference between the circuit blocks 4 and 5 is eliminated. To do so,
If the lead frame for mounting the microwave IC is separated as shown in (1), the inductance 12 becomes almost infinitely large, so that no signal flows and signal interference between the circuit blocks 4 and 5 can be prevented. Further, by providing the slits as shown in FIG. 2, the distance between the ground positions of the circuit blocks 4, 5 becomes long, which corresponds to the large inductance 12 shown in FIG. The signal interference between 5 and 5 can be made small.

As shown in FIGS. 1 and 2, by dividing the lead frame and providing slits, it is necessary to connect one grounding bonding wire of the circuit block as shown in FIG. 8 to an external lead for a signal line. Since the bonding wire for grounding can be directly connected to the lead frame, the external lead terminal can be effectively used.

[0008]

Embodiments of the present invention will be described below.

FIG. 1 is a diagram showing a first embodiment of the present invention in which a lead frame for mounting a microwave IC is divided into two and a microwave IC 1 is mounted. Microwave ic
Each of the divided lead blocks of the inner circuit blocks 4 and 5 is connected to the lead frame by a bonding wire 7 for grounding. This eliminates the need to connect the grounding bonding wire to the external lead terminal,
The external leads 6 for signal lines can be effectively used. Further, by separating the lead frame, signal interference between the circuit blocks 4 and 5 is eliminated, and oscillation is prevented.

FIG. 2 is a diagram showing a second embodiment of the present invention in which a slit is provided in the lead frame 2 for mounting the microwave IC, and the microwave IC 1 is mounted. The grounding bonding wires 7 of the circuit blocks 4 and 5 in the microwave IC are provided at positions where they sandwich the slits. As a result, the distance between the grounding positions of the circuit blocks 4 and 5 is widened, so that signal interference is less likely to occur via the lead frame and oscillation is prevented. Further, since it is not necessary to connect the grounding bonding wire 7 to the external lead terminal, the signal line external lead 6 can be effectively used.

FIG. 3 shows that the lead frame for mounting the microwave IC is divided into two, the microwave IC is mounted for each divided frame, and the bonding wire 7 for grounding is provided.
It is a figure which shows Example 3 of this invention which provided. This eliminates the need to connect the grounding bonding wire to the external lead terminal, so that the signal line external lead can be effectively used. Further, by separating the lead frame, the interference between the circuit blocks 4 and 5 is eliminated and the oscillation is prevented.

FIG. 4 shows that the lead frame for mounting the microwave IC is divided into two, and the divided frames are connected by a thin conductor 10 to form a circuit block 4 in the microwave IC.
5 is a diagram showing a fourth embodiment of the present invention in which a ground bonding wire 7 is provided for each lead frame obtained by dividing 5 in FIG.
This eliminates the need to connect the grounding bonding wire to the external lead terminal, so that the signal line external lead can be effectively used. In addition, the thin conductor 10 connecting the separated lead frames has a large inductance component, and the circuit blocks 4, 5 connected to the lead frames are connected by a long slit across the grounding bonding. Signals between the circuit blocks 4 and 5 become difficult to flow, signal interference can be reduced, and oscillation can be prevented. In addition, since the lead frames divided by the thin conductors are connected, the strength is higher than that of the as-divided package.

FIG. 5 shows that a microwave IC 1 having two circuit blocks of a low noise amplifier 14 and a receiving mixer 15 is mounted on a lead frame 2 divided into two, and the low noise amplifier 14 is mounted on each divided lead frame. It is a figure which shows Example 5 of this invention which provided the bonding wire 7 for grounding of the circuit block and the circuit block of the receiving mixer 15, respectively. By dividing the lead frame for mounting the microwave IC into two, there is no signal interference between the two microwave ICs. Therefore, the oscillation phenomenon due to signal interference can be eliminated, and the deterioration of distortion characteristics can be prevented.

[0014]

According to the present invention, since the grounding bonding wire can be connected to the lead frame on which the microwave IC is mounted, the external lead for the signal line can be effectively used, the oscillation of the microwave IC can be prevented, and the plurality of microwaves can be prevented. It is possible to realize a multi-chip module in which ICs are housed in the same package.

[Brief description of drawings]

FIG. 1 is a mounting diagram showing a first embodiment of the present invention.

FIG. 2 is a mounting diagram showing a second embodiment of the present invention.

FIG. 3 is a mounting diagram showing a third embodiment of the present invention.

FIG. 4 is a mounting diagram showing a fourth embodiment of the present invention.

FIG. 5 is a mounting diagram showing a fifth embodiment of the present invention.

[Fig. 6] Microwave is applied to a conventional microwave IC package.
Mounting diagram when the IC is mounted.

FIG. 7 is a simplified equivalent circuit diagram of a lead frame portion on which the microwave IC of the mounting diagram shown in FIG. 6 is mounted.

FIG. 8 is a mounting view of a conventional microwave IC package in which a microwave IC oscillation prevention measure is taken.

[Explanation of symbols]

1 ... Microwave IC, 2 ... Lead frame, 3 ...
..Pads, 4 ... Circuit blocks 1, 5 ... Circuit blocks 2, 6 ... External leads, 7 ... Grounding bonding wires, 8 ... Signal bonding wires, 9 ... Slits 10 ... Thin conductor, 11 ...
・ Parasitic inductance l1, 12 ... Parasitic inductance l3, 13 ... Parasitic inductance l2, 14
..Low noise amplifier circuit block, 15 ... Receiving mixer circuit block

Claims (5)

[Claims] 1. A semiconductor integrated circuit device, comprising: a package having a plurality of pins for mounting a microwave IC, wherein the package has a lead frame obtained by dividing a lead frame portion for mounting the IC. 2. A semiconductor integrated circuit device comprising a package having a plurality of pins for mounting a microwave IC, wherein a lead frame for mounting the IC is provided with a plurality of slits. 3. The semiconductor integrated circuit device according to claim 1, wherein one microwave IC is mounted on each lead frame divided into a plurality of parts to realize a multi-chip module. 4. A semiconductor integrated circuit device according to claim 1, wherein a plurality of divided lead frames are connected by a thin conductor. 5. The package according to claim 1, wherein a ground terminal of a transistor for each stage of a multi-stage amplifier IC can be connected to the divided lead frame for each divided lead frame. Integrated circuit device.