JPH08227746A - Airtight terminal and airtight package - Google Patents
Airtight terminal and airtight packageInfo
- Publication number
- JPH08227746A JPH08227746A JP5796995A JP5796995A JPH08227746A JP H08227746 A JPH08227746 A JP H08227746A JP 5796995 A JP5796995 A JP 5796995A JP 5796995 A JP5796995 A JP 5796995A JP H08227746 A JPH08227746 A JP H08227746A
- Authority
- JP
- Japan
- Prior art keywords
- airtight
- metal base
- terminal
- lead terminal
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 47
- 238000003466 welding Methods 0.000 claims abstract description 19
- 238000003780 insertion Methods 0.000 claims description 12
- 230000037431 insertion Effects 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000007789 sealing Methods 0.000 description 7
- 238000005219 brazing Methods 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Abstract
Description
【0001】[0001]
【発明の技術分野】本発明は気密端子および気密パッケ
ージ、さらに詳細にはカバー封止効率の良好な抵抗熔接
可能な表面実装用の気密端子および気密パッケージに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an airtight terminal and an airtight package, and more particularly to a surface-mountable airtight terminal and an airtight package capable of resistance welding with good cover sealing efficiency.
【0002】[0002]
【従来技術】従来の表面実装用気密端子は、図14に示
すように、枠状の金属リング1の下部に箱状のガラスあ
るいはセラミックなどの絶縁剤製の基部2を設けるとと
もに、前記この金属リング1と基部2によって構成され
る気密空間3にリード端子4が内外を貫通するように封
着された構造になっている。そして、前記リード端子4
は気密空間3に貫通する直立部41と前記絶縁剤基部2
の底部を外側方向に伸長する平行部42とより成ってい
る。2. Description of the Related Art As shown in FIG. 14, a conventional air-tight terminal for surface mounting has a frame-shaped metal ring 1 provided with a base 2 made of an insulating agent such as a glass or ceramic in a box-like shape. A lead terminal 4 is sealed in an airtight space 3 formed by a ring 1 and a base 2 so as to penetrate the inside and outside. And the lead terminal 4
Is an upright portion 41 penetrating the airtight space 3 and the insulating base 2
And a parallel portion 42 extending outward from the bottom of the.
【0003】このような構造の気密端子の前記ベース1
に回路基板、半導体素子、圧電素子(図示せず)などを
搭載するとともに、例えばAu線をワイヤーボンディン
グによって前記回路基板とリード端子4に接続し、カバ
ー5を被せ、前述の回路基板などを気密にパッケージし
た気密パッケージとしている。The base 1 of the airtight terminal having such a structure
A circuit board, a semiconductor element, a piezoelectric element (not shown), etc. are mounted on the circuit board, and, for example, an Au wire is connected to the circuit board and the lead terminal 4 by wire bonding, a cover 5 is covered, and the circuit board is hermetically sealed. The package is an airtight package.
【0004】このようなカバー5を金属リング1に接合
する場合、前記基部2は絶縁剤であるために、ローラー
電極6を使用して、パラレルシール熔接封止を行なう
か、図15に示すように低融点ロー剤、あるいは低融点
ガラス7で封着するか、の方法を採用せざる得なかっ
た。When the cover 5 is bonded to the metal ring 1, since the base 2 is an insulating material, the roller electrode 6 is used to perform parallel seal welding and sealing, or as shown in FIG. In addition, the method of sealing with a low melting point brazing agent or low melting point glass 7 had to be adopted.
【0005】[0005]
【発明が解決する問題点】上述のようなカバー5を封止
する場合に、パラレルシール熔接は、気密性、信頼性が
高く、比較的大型のパッケージ、たとえばハイブリッド
ICやMCMなどの付加価値の高い高価なものに対して
は最適な封止法といえる。When the cover 5 as described above is sealed, parallel seal welding has high airtightness and reliability, and is a value-added product for a relatively large package such as a hybrid IC or MCM. It can be said that this is the most suitable sealing method for expensive and expensive materials.
【0006】しかしながら、封止効率、即ちカバー5と
金属リング1の外周をローラー電極6をローリングさせ
ながら熔接するため、熔接封止時間が掛かり、量産効果
が乏しいという欠点がある。このような欠点を除去する
ためにワークの供給、熔接、排出などを全自動化する装
置も考案されているが、装置全体が高価であり、汎用性
もないことから品種が限定されているのが現状である。However, there is a drawback in that the sealing efficiency, that is, the outer periphery of the cover 5 and the metal ring 1 is welded while the roller electrode 6 is being rolled, so that the welding sealing time is long and the mass production effect is poor. In order to eliminate such defects, a device that fully automates the supply, welding, discharge, etc. of the work has been devised, but the type is limited because the entire device is expensive and not versatile. The current situation.
【0007】一方、低融点ロー剤(Au−Sn系、Au
−Ge系、Au−In系)や低融点ガラス7などによる
封止は、パッケージ全体に高温の熱が負荷されることに
なり、内部の回路基板、素子などへの影響を考慮しなけ
ればならず、耐熱性の限界などから、高気密性、高信頼
性のパッケージにはならないという欠点があった。On the other hand, low melting point brazing agents (Au--Sn type, Au
-Ge-based, Au-In-based) or low-melting-point glass 7 or the like entails high temperature heat being applied to the entire package, and the influence on internal circuit boards, elements, etc. must be considered. However, there is a drawback in that a package with high airtightness and high reliability cannot be obtained due to the limit of heat resistance.
【0008】本発明は上述の問題点に鑑みなされたもの
であり、高気密性、高信頼性を有し、かつ安価に、かつ
効率的にカバーを気密端子に封止可能な気密端子を提供
することを目的とする。The present invention has been made in view of the above problems, and provides an airtight terminal which has high airtightness, high reliability, and is capable of efficiently and inexpensively sealing the cover with the airtight terminal. The purpose is to do.
【0009】[0009]
【問題点を解決するための手段】上記問題点を解決する
ため、本発明による気密端子は、箱状の金属ベースの底
部にリード端子挿通部を設けるとともに、前記リード端
子挿通部にリード端子を貫通し、前記金属ベースの底部
全体を絶縁剤で被い、箱状の金属ベース内外に貫通する
リード端子を封着した気密端子において、前記箱状の金
属ベースの上端面の外周部に外側方向に伸長するフラン
ジを設けたことを特徴とする。In order to solve the above problems, an airtight terminal according to the present invention is provided with a lead terminal insertion portion at the bottom of a box-shaped metal base, and a lead terminal is provided at the lead terminal insertion portion. In an airtight terminal that penetrates and covers the entire bottom of the metal base with an insulating material, and seals lead terminals that penetrate the inside and outside of the box-shaped metal base, the outer direction of the outer periphery of the upper end surface of the box-shaped metal base. It is characterized in that a flange extending to is provided.
【0010】さらに本発明による気密パッケージによれ
ば、箱状の金属ベースの底部にリード端子挿通部を設け
るとともに、前記リード端子挿通部にリード端子を貫通
し、前記金属ベースの底部の少なくとも一部を絶縁剤で
被い、箱状の金属ベース内外に貫通するリード端子を封
着した気密端子において、前記箱状の金属ベースの上端
面の外周部に外側方向に伸長するフランジを設けた気密
端子にカバーを被せるとともに、前記フランジで抵抗熔
接したことを特徴とする。Further, according to the airtight package of the present invention, the lead terminal insertion portion is provided in the bottom portion of the box-shaped metal base, the lead terminal is penetrated through the lead terminal insertion portion, and at least a part of the bottom portion of the metal base is provided. An airtight terminal in which a lead terminal penetrating in and out of a box-shaped metal base is sealed with an insulating agent, and a flange extending outward is provided on the outer peripheral portion of the upper end surface of the box-shaped metal base. It is characterized in that it is covered with a cover and resistance welded by the flange.
【0011】本発明による気密端子によれば、金属ベー
スの上端面外周部に外側方向に伸長するフランジが形成
されているため、このフランジにおいてカバーが接合可
能になる。このため、抵抗熔接によって、前記カバーを
封止することが可能になり、高気密性、高信頼性の気密
パッケージを容易に、効率良く製造可能になるという利
点がある。According to the airtight terminal of the present invention, since the flange extending outward is formed on the outer peripheral portion of the upper end surface of the metal base, the cover can be joined at this flange. Therefore, there is an advantage that the cover can be sealed by resistance welding, and a highly airtight and highly reliable airtight package can be easily and efficiently manufactured.
【0012】[0012]
【実施例】図1は本発明の気密端子の一実施例の断面
図、図2は前記気密端子の裏面斜視図であるが、これら
の図より明らかなように、本発明の気密端子は、箱状の
金属ベース8の底部にリード端子挿通穴9を設けるとと
もに、このリード端子挿通穴9にリード端子4を金属ベ
ース8の内部で構成される気密空間3に貫通するように
挿通し、前記金属ベース8の底部全体を絶縁剤2によっ
て被った構造になっている。そして、前記リード端子4
は金属ベース8と絶縁剤2を気密空間3の内外に貫通す
る直立部41とこの直立部41に熔接などによって接合
され、気密端子の外側方向に伸長する平行部42とより
成っている。1 is a sectional view of an embodiment of the airtight terminal of the present invention, and FIG. 2 is a rear perspective view of the airtight terminal. As is apparent from these figures, the airtight terminal of the present invention is A lead terminal insertion hole 9 is provided in the bottom of the box-shaped metal base 8, and the lead terminal 4 is inserted into the lead terminal insertion hole 9 so as to penetrate the airtight space 3 formed inside the metal base 8. The entire base of the metal base 8 is covered with the insulating agent 2. And the lead terminal 4
Is composed of an upright portion 41 that penetrates the metal base 8 and the insulating material 2 into and out of the airtight space 3, and a parallel portion 42 that is joined to the upright portion 41 by welding or the like and extends in the outward direction of the airtight terminal.
【0013】この実施例の気密端子は、グランド端子1
0を有している。即ち、グランド端子10は金属ベース
1の底部を貫通するとともに、前記金属ベース1と電気
的に導通する直立部101とこの直立部101に熔接な
どによって接合され、気密端子外側方向に伸長する平行
部102を有しており、グランドとして使用される。The airtight terminal of this embodiment is the ground terminal 1.
Has 0. That is, the ground terminal 10 penetrates the bottom of the metal base 1 and is joined to the upright portion 101 electrically connected to the metal base 1 and the upright portion 101 by welding or the like, and a parallel portion extending outward of the airtight terminal. It has 102 and is used as a ground.
【0014】前記金属ベース8の上端面には枠状のフラ
ンジ81が設けられている。このフランジ81は前記金
属ベース8の外周より外側方向に伸長して形成されてい
ており、この実施例においては、前記箱状の金属ベース
8を上端面にロー付けなどによって接合された構造にな
っている。A frame-shaped flange 81 is provided on the upper end surface of the metal base 8. The flange 81 is formed so as to extend outward from the outer periphery of the metal base 8. In this embodiment, the box-shaped metal base 8 is joined to the upper end surface by brazing or the like. ing.
【0015】このような気密端子を製造するには、図3
に示すように直立部41に平行部42を熔接するととも
に、前記直立部41を金属ベース8の底部を被うための
平板状絶縁剤ブロック11の穴111に挿通させるとと
もに、さらにリング状の絶縁剤ブロック12に挿通させ
る。その後、金属ベース8に設けられたリード端子挿通
穴9に前記絶縁剤ブロック12とともに挿通する。一
方、グランド端子10は前記直立部101と平行部10
2を接合した後、平板状絶縁剤ブロック11の穴111
に同様に挿通し、そのまま金属ベース8のグランド端子
装着穴82に挿通し、熔接あるいはロー付けなどの手段
で前記直立部101を金属ベース8に固定する。In order to manufacture such an airtight terminal, the process shown in FIG.
As shown in FIG. 4, the parallel portion 42 is welded to the upright portion 41, and the upright portion 41 is inserted into the hole 111 of the flat plate-shaped insulating material block 11 for covering the bottom portion of the metal base 8, and further the ring-shaped insulation is formed. Insert into the agent block 12. After that, the lead terminal insertion hole 9 provided in the metal base 8 is inserted together with the insulating material block 12. On the other hand, the ground terminal 10 includes the upright portion 101 and the parallel portion 10
After joining the two, the holes 111 of the plate-shaped insulating material block 11
Similarly, it is inserted into the ground terminal mounting hole 82 of the metal base 8 as it is, and the upright portion 101 is fixed to the metal base 8 by means such as welding or brazing.
【0016】次いで、ロー剤プリフォーム13を金属ベ
ース8の上端面に積層するとともに、枠状のフランジ8
1を積層するとともに、加熱して前記絶縁剤ブロック1
1、12およびロー剤プリフォーム13により、グラン
ド端子10、リード端子4、フランジ81を接着させ
る。Next, the brazing agent preform 13 is laminated on the upper end surface of the metal base 8 and the frame-shaped flange 8 is formed.
1 is laminated and heated to produce the insulating block 1
The ground terminal 10, the lead terminal 4, and the flange 81 are adhered to each other by the first and the second 12, and the brazing agent preform 13.
【0017】このような気密端子にカバー5を被せて熔
接する場合、図4に示すように前記カバー5を被せ、前
記フランジ81を上下の抵抗電極14で挾持するように
設置し、加圧して大電流(数百A/mm)を流し、瞬時
(数十msec)に接合させる。When the cover 5 is covered and welded to such an airtight terminal, the cover 5 is covered as shown in FIG. 4, the flange 81 is installed so as to be sandwiched between the upper and lower resistance electrodes 14, and pressure is applied. A large current (several hundred A / mm) is applied to instantly join (several tens of msec).
【0018】図5は、本発明の他の実施例を示す断面図
であるが、この図より明らかなように、フランジ81は
金属ベース8と一体的に形成されている。この場合、一
体的の金属ベース8とフランジ81を製造するため、製
造工程が簡単になるという利点がある。しかしながら、
一方において、第一の実施例のように金属ベース8とフ
ランジ81を別体に形成しておくと、抵抗熔接時に発す
る機械的応力、熱適応力を軽減させる構造を容易に形成
でき、一体加工では困難あるいは不可能な形状、寸法な
どを容易に形成できる。すなわち気密端子の設計の自由
度が増加する。FIG. 5 is a sectional view showing another embodiment of the present invention. As is clear from this figure, the flange 81 is formed integrally with the metal base 8. In this case, since the integrated metal base 8 and the flange 81 are manufactured, there is an advantage that the manufacturing process is simplified. However,
On the other hand, if the metal base 8 and the flange 81 are formed separately as in the first embodiment, it is possible to easily form a structure that reduces the mechanical stress and heat adaptation force generated during resistance welding, and to integrally process the same. It is possible to easily form shapes and dimensions that are difficult or impossible with. That is, the degree of freedom in designing the airtight terminal is increased.
【0019】図6、図7はリード端子4を鈎型に一体的
に製造した場合の断面図および裏面図であり、金属ベー
ス8の中央部は絶縁剤2を貫通して底部が露出した構造
になっている。すなわち、この中央部分はグランド端子
10を構成しており、他の部分の裏面は絶縁剤2で被わ
れている。6 and 7 are a cross-sectional view and a back view of the case where the lead terminal 4 is integrally manufactured in a hook shape. The structure is such that the central portion of the metal base 8 penetrates the insulating agent 2 and the bottom portion is exposed. It has become. That is, the central portion constitutes the ground terminal 10, and the back surface of the other portion is covered with the insulating agent 2.
【0020】図8は前記フランジ81に凸状811を設
けた場合の一部断面図である。このような熔接用の凸状
811を設けることによって、熔接を効率良く行なうこ
とができるという利点を生じる。FIG. 8 is a partial cross-sectional view when the flange 81 is provided with a convex shape 811. By providing such a convex shape 811 for welding, there is an advantage that welding can be performed efficiently.
【0021】図9は前記カバー5に熔接用の凸状51を
設けた場合の一部断面図で、前記図6の場合と同様な効
果がある。FIG. 9 is a partial sectional view of the case where the convex portion 51 for welding is provided on the cover 5, which has the same effect as the case of FIG.
【0022】図10、図11はカバー5の端部の形状に
関するものであり、いずれの形状においても熔接時の機
械的応力を緩和できる利点がある。10 and 11 relate to the shape of the end portion of the cover 5, and any shape has an advantage that the mechanical stress at the time of welding can be relaxed.
【0023】図12はフランジ81を断面鈎型に形成
し、鉤状の下垂部分812で金属ベース8の内壁に接合
した構造をしている。この場合、熔接時の機械的応力を
緩和できるという利点がある。FIG. 12 shows a structure in which the flange 81 is formed in a hook shape in section and is joined to the inner wall of the metal base 8 by a hook-shaped hanging portion 812. In this case, there is an advantage that the mechanical stress at the time of welding can be relaxed.
【0024】図13は、同様に熔接時の機械的応力を緩
和するために断面凸状813に折曲した構造のフランジ
81を示している。Similarly, FIG. 13 shows a flange 81 having a structure bent into a convex shape 813 in cross section in order to relieve mechanical stress during welding.
【0025】[0025]
【発明の効果】以上説明したように、本発明による気密
端子及び気密パッケージによれば、金属ベースの上端外
周囲に外側方向に伸長したフランジを設けたため、抵抗
熔接が可能になる。このため、高気密性で信頼性の大き
な気密パッケージを効率良く、かつ安価に製造可能であ
るという利点がある。As described above, according to the airtight terminal and airtight package of the present invention, since the flange extending outward is provided around the outer periphery of the upper end of the metal base, resistance welding can be performed. Therefore, there is an advantage that an airtight package having high airtightness and high reliability can be efficiently manufactured at low cost.
【図1】本発明による気密端子の一実施例の断面図。FIG. 1 is a sectional view of an embodiment of an airtight terminal according to the present invention.
【図2】本発明による気密端子の前記実施例の裏面斜視
図。FIG. 2 is a rear perspective view of the embodiment of the airtight terminal according to the present invention.
【図3】本発明による気密端子の分解斜視図。FIG. 3 is an exploded perspective view of an airtight terminal according to the present invention.
【図4】本発明による気密端子とカバーを接合するとき
の断面図。FIG. 4 is a cross-sectional view when joining the airtight terminal and the cover according to the present invention.
【図5】本発明による気密端子の他の実施例の断面図。FIG. 5 is a sectional view of another embodiment of the airtight terminal according to the present invention.
【図6】本発明による気密端子の他の実施例の断面図。FIG. 6 is a cross-sectional view of another embodiment of the hermetic terminal according to the present invention.
【図7】本発明による気密端子の上記実施例の裏面図。FIG. 7 is a back view of the above embodiment of the hermetic terminal according to the present invention.
【図8】本発明による気密端子の他の実施例の断面図。FIG. 8 is a sectional view of another embodiment of the hermetic terminal according to the present invention.
【図9】本発明による気密端子の他の実施例の断面図。FIG. 9 is a sectional view of another embodiment of the hermetic terminal according to the present invention.
【図10】本発明による気密端子の他の実施例の断面
図。FIG. 10 is a sectional view of another embodiment of the hermetic terminal according to the present invention.
【図11】本発明による気密端子の他の実施例の断面
図。FIG. 11 is a cross-sectional view of another embodiment of the hermetic terminal according to the present invention.
【図12】本発明による気密端子の他の実施例の断面
図。FIG. 12 is a cross-sectional view of another embodiment of the hermetic terminal according to the present invention.
【図13】本発明による気密端子の他の実施例の断面
図。FIG. 13 is a sectional view of another embodiment of the hermetic terminal according to the present invention.
【図14】従来の気密端子の断面図。FIG. 14 is a sectional view of a conventional airtight terminal.
【図15】従来の気密端子の断面図。FIG. 15 is a sectional view of a conventional airtight terminal.
1 金属リング 2 絶縁剤 3 気密空間 4 リード端子 5 カバー 8 金属ベース 81 フランジ 9 リード端子挿通穴 1 Metal ring 2 Insulating agent 3 Airtight space 4 Lead terminal 5 Cover 8 Metal base 81 Flange 9 Lead terminal insertion hole
Claims (3)
通部を設けるとともに、前記リード端子挿通部にリード
端子を貫通し、前記金属ベースの底部の少なくとも一部
を絶縁剤で被い、箱状の金属ベース内外に貫通するリー
ド端子を封着した気密端子において、前記箱状の金属ベ
ースの上端面の外周部に外側方向に伸長するフランジを
設けたことを特徴とする気密端子。1. A box-shaped metal base is provided with a lead terminal insertion portion at a bottom portion thereof, the lead terminal is penetrated through the lead terminal insertion portion, and at least a part of a bottom portion of the metal base is covered with an insulating agent. A hermetic terminal in which a lead terminal penetrating inside and outside of a metal base is sealed, wherein a flange extending outward is provided on an outer peripheral portion of an upper end surface of the box-shaped metal base.
され、相互に接合されていることを特徴とする請求項1
記載の気密端子。2. The metal base and the flange are formed as separate members and are joined to each other.
Airtight terminal described.
通部を設けるとともに、前記リード端子挿通部にリード
端子を貫通し、前記金属ベースの底部の少なくとも一部
を絶縁剤で被い、箱状の金属ベース内外に貫通するリー
ド端子を封着した気密端子において、前記箱状の金属ベ
ースの上端面の外周部に外側方向に伸長するフランジを
設けた気密端子にカバーを被せるとともに、前記フラン
ジで抵抗熔接したことを特徴とする気密パッケージ。3. A box-shaped metal base is provided with a lead terminal insertion portion at a bottom portion thereof, the lead terminal is penetrated through the lead terminal insertion portion, and at least a part of a bottom portion of the metal base is covered with an insulating agent. In a hermetic terminal in which lead terminals penetrating in and out of a metal base are sealed, a cover is provided on the hermetic terminal provided with a flange extending outward in an outer peripheral portion of an upper end surface of the box-shaped metal base, and the flange is formed. Airtight package characterized by resistance welding at.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5796995A JPH08227746A (en) | 1995-02-22 | 1995-02-22 | Airtight terminal and airtight package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5796995A JPH08227746A (en) | 1995-02-22 | 1995-02-22 | Airtight terminal and airtight package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH08227746A true JPH08227746A (en) | 1996-09-03 |
Family
ID=13070850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5796995A Pending JPH08227746A (en) | 1995-02-22 | 1995-02-22 | Airtight terminal and airtight package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08227746A (en) |
-
1995
- 1995-02-22 JP JP5796995A patent/JPH08227746A/en active Pending
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