JPH08220188A - Socket for semiconductor device - Google Patents

Abstract

(57) [Summary] [Object] To provide a technique capable of preventing a decrease in measurement efficiency even when the number of input / output terminals of a semiconductor device increases remarkably as a result of higher integration. [Structure] By inclining the side surface 1C of the socket body 1, the end portions 2C of the conductive paths 3 exposed from the side surface 1C are formed so as to widen the space between adjacent ones. This makes it possible to facilitate the contact work when the measurement pin 11 is brought into contact with the end portion 2C of the conductive path 3 or when jumper wiring is performed during measurement.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device socket, and more particularly to a technique effective when applied to a semiconductor device socket for measuring a signal waveform of a semiconductor device having a large number of terminals.

[0002]

2. Description of the Related Art In recent LSIs, the number of input / output leads is remarkably increasing as the integration density increases. A typical package of such a highly integrated LSI is, for example, a QFP (Quad Flat Pack).
e), SOP (Small Outlet Pack)
A surface-mounted package such as age) is known. These LSIs have a structure in which leads as terminals are drawn out around the package, and each lead is surface-mounted by being soldered to a conductive layer of a mounting board.

Recently, as a kind of surface mount type LSI, a BGA (Ball Grid Arra) has been developed.
y) A package having a structure is provided.
Such a BGA structure is, for example, issued by Nikkei BP,
"Nikkei Electronics", 1994, No. 2-14, P
59-P73, or the same company, the same magazine, 1994, 2
No. 28, P111 to P117. This BGA structure is a surface mount type LSI in which spherical solder terminals (bumps) are used in place of the leads, and a plurality of these bumps are arranged in a lattice on the back surface of the package.

That is, in an LSI having a BGA structure package, a semiconductor chip having a plurality of pad electrodes formed on its surface is fixed to a wiring board, and the plurality of pad electrodes are attached to a conductive layer of the wiring board through bonding wires. The semiconductor chip and the bonding wires are electrically connected and sealed by a resin package. On the other hand, the conductive layer is extended to the opposite surface (back surface) of the wiring board through the through hole, and bumps are provided on the back surface for conduction to the conductive layer. These bumps are surface-mounted by being soldered to the conductive layer of the mounting substrate as terminals.

Compared to the packages such as QFP and SOP described above, this BGA structure package has bumps as terminals provided on the entire surface without being pulled out to the periphery of the package, so that the LSI is highly integrated. Accordingly, there is an advantage that the area of the package can be reduced when the number of terminals is the same.

Various LSIs having such packages as BGA, QFP, and SOP are used for debugging or functional evaluation before being mounted on mounting boards constituting various electronic devices as electronic components after assembly is completed. , LSI
Is measured. In this case, LS
An LSI socket is used for making electrical contact with a terminal of I and bringing the terminal into conduction with a conductive layer of a wiring board of a measuring apparatus.

For example, "Nikkei Electronics", published by Nikkei BP, 1994, No. 2-14, P72, BG
The socket used for the A structure package is described. When the LSI device socket is used to measure the LSI signal waveform, the measurement pin of the measuring device is normally brought into contact with the terminal of the socket to perform the measurement. Alternatively, in order to change the logic, jumper wiring is performed on the terminals of the sockets that are electrically connected to the desired terminals of the LSI as needed.

[0008]

As described above, in order to measure the signal waveforms of various LSIs after assembly is completed, the LSI
If the number of input / output terminals increases remarkably with the high integration of the device mounted on the measuring device via the socket, the measuring pins may come into direct contact with the socket terminals or jumper wiring may be necessary. Since it becomes difficult to apply, there is a problem that the measurement efficiency decreases.

That is, an LSI having a small number of input / output terminals
In the case of, it is easy to directly contact the pins of the socket with the measuring pins and to make jumper wiring, but as the number of input / output terminals increases, these become difficult. Therefore, the socket merely exerts the function of facilitating the attachment / detachment of the LSI to be measured with respect to the measuring device.

In particular, when bumps which are terminals are provided on the entire surface of the package as in the BGA structure, the tendency is remarkable, and the measurement pins are attached to the wiring board of the measuring device on which the LSI to be measured is mounted. It is necessary to form a special pattern for contacting and jumper wiring. In this case, since a number of measurement patterns corresponding to the terminals of the LSI are also drawn out on the wiring board,
As the number of input / output terminals increases, it becomes difficult to find the dedicated pattern from many patterns. Further, it is necessary to give a troublesome instruction when forming the dedicated pattern.

An object of the present invention is to provide a technique capable of preventing a decrease in measurement efficiency even if the number of input / output terminals of a semiconductor device increases remarkably as the degree of integration increases.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0013]

Among the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

A semiconductor device socket according to the present invention is a semiconductor device socket which electrically contacts with a terminal of a semiconductor device to bring the terminal into conduction with a conductive layer of a wiring board of a measuring device. And a plurality of conductive paths that extend inside the socket body and are insulated from each other by exposing the ends on the front surface, the back surface, and the side surfaces. The terminals of the semiconductor device, the conductive layer of the wiring board, and the measuring pins of the measuring device are in contact with the respective end portions exposed on the front surface, the rear surface, and the side surfaces of the path.

[0015]

According to the above-mentioned means, the socket for a semiconductor device of the present invention has an insulating socket body for supporting the package of the semiconductor device to be measured, and an end portion extending inside the socket body and having its end surface. , A plurality of conductive paths exposed on the back surface and side surfaces and insulated from each other, and the terminals of the semiconductor device and the wiring board at the end portions exposed on the front surface, the back surface, and the side surfaces of these conductive paths, respectively. Since the conductive layer and the measuring pin of the measuring device are in contact with each other, even if the number of input / output terminals of the semiconductor device increases remarkably with high integration, it is possible to prevent the measurement efficiency from decreasing. .

The present invention will now be described in detail with reference to the drawings along with embodiments.

In all the drawings for explaining the embodiments, parts having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted.

[0018]

【Example】

(Embodiment 1) FIG. 1 is a perspective view showing a semiconductor device socket according to Embodiment 1 of the present invention, showing an example applied to an LSI having a BGA structure package. The semiconductor device socket according to the present embodiment has a trapezoidal socket body 1 made of an insulating material such as resin, and an end portion 2A, 2B, and 2C extending inside the socket body 1 on the surface of the socket body 1. 1A, a plurality of conductive paths 3 exposed on the back surface 1B and the side surface 1C.

A rectangular frame 4 is provided on the surface 1A of the socket body 1, and an LSI package whose signal waveform is to be measured is housed in the frame 4. In the case of this embodiment, a BGA structure package is stored. Further, a lid 5 for pressing down the package is detachably attached to the socket body 1.

The plurality of conductive paths 3 are provided in a number equal to the number of terminals of the LSI to be measured. Socket body 1
The side surface 1C is formed so as to be inclined with respect to the front surface 1A and the back surface 1B. As a result, the distance between the adjacent end portions 2C of the conductive paths 3 exposed from the side surface 1C is increased. This facilitates the contact work when the measurement pin is brought into contact with the end portion 2C of the conductive path 3 or when the jumper wiring is applied at the time of measurement. Further, the end 2B of the conductive path 3 exposed from the bottom surface 1B is
It is formed into a ball shape according to the terminals of the applied package.

The socket as described above can be easily manufactured by applying the manufacturing technique of the multilayer wiring board.

2 and 3 show an LSI having the package 6 of the BGA structure in the socket of this embodiment as described above.
7 is a perspective view and a sectional view showing a state in which 7 is inserted. LS
The I6 package 6 is supported by the socket body 1 by being housed in the frame body 4, and the bumps 8 thereof are sufficiently exposed to the ends 2A of the conductive paths 3 exposed from the surface 1A of the socket body 1. It is pressed down by the lid 5 so as to come into contact with.

Next, the socket is mounted on the wiring board 9 of the measuring apparatus as shown in FIG. A conductive layer 10 corresponding to the plurality of conductive paths 3 is formed in advance on the wiring board 9, and the LSI 7 solders the ball-shaped end portion 2B of the conductive path 3 to the conductive layer 10 to form a wiring board. 9 fixed on.

For the socket in which the LSI 7 is inserted in this way, the measuring pin 11 of the measuring device is attached to the socket body 1.
The signal waveform is measured by contacting the end 2C of the conductive path 3 exposed from the side surface 1C of the. Alternatively, jumper wiring is applied to the end portion 2C of the conductive path 3 as needed to change the logic.

According to the first embodiment, the following effects can be obtained.

(1) Since the side surface 1C of the socket body 1 is inclined, the distance between adjacent ones of the end portions 2C of the conductive paths 3 exposed from the side surface 1C is widened. The contact work can be facilitated when the measuring pin 11 is brought into contact with the end portion 2C of the conductive path 3 or when jumper wiring is performed. As a result, even if the number of input / output terminals of the semiconductor device increases remarkably as the degree of integration increases, it is possible to prevent the measurement efficiency from decreasing.

(2) Since it is not necessary to form a dedicated pattern for contacting the measuring pins or for making jumper wiring on the wiring board of the measuring device, it is troublesome to find the dedicated pattern from many patterns. In addition, it becomes unnecessary to give a troublesome instruction when forming the dedicated pattern.

(Embodiment 2) FIG. 5 is a partial perspective view showing a semiconductor device socket according to Embodiment 2 of the present invention, showing an example applied to an LSI having a QFP structure package. The semiconductor device socket of the present embodiment is provided with a plurality of conductive paths 3 corresponding to the leads drawn around the package of the QFP structure, and the end 2A of the conductive path is exposed on the surface 1A of the socket body 1. Has been done. Although not shown in the drawings, similarly to the first embodiment, from the back surface 1B and the side surface 1C of the socket body 1, the end portions 2B and 2C of the conductive path are formed.
Is exposed.

FIG. 6 is a sectional view showing a state in which the LSI 13 having the QFP structure package 12 is inserted into the socket of the present embodiment as described above. In the figure, only one conductive path 3 is shown in order to simplify the description. LSI1
The package 12 of No. 3 is supported by the socket body 1 by being housed in the frame body 4, and its leads 14 are sufficiently exposed to the end 2A of the conductive path 3 exposed from the surface 1A of the socket body 1. It is pressed down by the lid 5 so as to come into contact with. Further, since the lead 14 has a spring property, contact with the end portion 2A of the conductive path 3 is secured.

According to the second embodiment as described above, the first embodiment
Compared with the above, the configuration is the same as that of the first embodiment except that the measurement target is changed to the QFP structure. Therefore, the same effect as that of the first embodiment can be obtained.

As described above, the invention made by the present inventor is
Although the present invention has been specifically described based on the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.

For example, in the above embodiment, the side surface of the socket body is formed to be inclined. However, the side surface does not necessarily have to be inclined, and the side surface is formed to be substantially perpendicular to the front and back surfaces. Is also good.

Further, the plurality of conductive paths can be changed according to the number of terminals of the semiconductor device to be measured. Thus, the socket having the plurality of conductive paths can be manufactured by applying the manufacturing technique of the multilayer wiring board. Can be easily manufactured.

In the above description, the case where the invention made by the present inventor is mainly applied to the technology of the socket for a semiconductor device which is the background field of application has been described, but the invention is not limited thereto. INDUSTRIAL APPLICABILITY The present invention is applicable at least to the condition of measuring the characteristics of an electronic component in which the number of input / output terminals is increasing.

[0035]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

Even if the number of input / output terminals of the semiconductor device increases remarkably as the degree of integration increases, it is possible to prevent the measurement efficiency from decreasing.

[Brief description of drawings]

FIG. 1 is a perspective view showing a semiconductor device socket according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a structure in which an LSI having a BGA structure package is inserted into a semiconductor device socket according to a first embodiment of the present invention.

3 is a cross-sectional view of FIG.

FIG. 4 is a sectional view showing a structure in which a semiconductor device socket according to a first embodiment of the present invention is mounted on a wiring board of a measuring device.

FIG. 5 is a perspective view showing a semiconductor device socket according to a second embodiment of the present invention.

FIG. 6 is a perspective view showing a structure in which an LSI having a QFP structure package is inserted into a semiconductor device socket according to a second embodiment of the present invention.

[Explanation of symbols]

1 ... Socket body, 1A ... Surface of socket body, 1B ...
Back of socket body, 1C ... Side of socket body, 2
A, 2B, 2C ... End of conductive path, 3 ... Conductive path, 4 ... Socket body frame, 5 ... Lid, 6, 12 ... Package,
7, 13 ... LSI, 8 ... Bump, 9 ... Wiring board of measuring device, 10 ... Conductive layer of wiring board, 11 ... Measuring pin, 14
… LSI leads.

Claims (6)

[Claims] 1. A semiconductor device socket for electrically contacting a terminal of a semiconductor device to electrically connect the terminal to a conductive layer of a wiring board of a measuring device, the socket being made of an insulating material for supporting a package of the semiconductor device to be measured. Of the socket body, and a plurality of conductive paths extending inside the socket body and having end portions exposed on the front surface, the back surface, and the side surfaces and insulated from each other, and the front surface, the back surface, and the side surfaces of these conductive paths. A socket for a semiconductor device, characterized in that a terminal of the semiconductor device, a conductive layer of a wiring board, and a measuring pin of a measuring device are brought into contact with each of the exposed end portions. 2. The semiconductor device socket according to claim 1, wherein the plurality of conductive paths are equal in number to the terminals of the semiconductor device. 3. The semiconductor device socket according to claim 1, wherein the side surface of the socket body is formed to be inclined with respect to the front surface and the back surface. 4. The end portions of the plurality of conductive paths exposed on the surface of the socket body are arranged within an area covered by the package of the semiconductor device.
4. The semiconductor device socket according to any one of items 1 to 3. 5. The package of the semiconductor device is BGA
The semiconductor device socket according to any one of claims 1 to 4, wherein the semiconductor device socket comprises a mold. 6. The semiconductor device socket according to claim 1, wherein the socket body has a lid body that presses the package of the semiconductor device against the surface of the socket body.