JPH08211831A - Display device - Google Patents

Abstract

PURPOSE: To provide a display device capable of easily realizing high luminance and high resistance to vibration and an impact by providing a board part, a supporting member and a specified heat radiation member and forming a display panel. CONSTITUTION: Since a heat sink 6 is provided so as to be brought into contact with a first board part (image display board) in the state of being fixed to the supporting member 5, the heat of the board 4 is conducted, and the heat dissipation is performed even when the heat sink 6 is not fixed to the substrate 4, or the board 4 is connected to a second board part (drive circuit board) 7 by the supporting member 5 having high heat conductivity, and by that the heat sink 6 is provided on the board 7 side in the state of being connected to the supporting member 5, the heat in the board 4 is conducted to the heat sink 6 through the supporting member 5 to be dissipated. Thus, the heat radiation of the board is performed efficiently, and the board 4 side becomes lightweight as much, and the strength for supporting the board 4 side by the board 7 side is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device for displaying on a relatively large screen using, for example, a light emitting diode element as a display element.

[0002]

2. Description of the Related Art For example, as a display device with a large screen,
A light emitting diode element (hereinafter, LED (Light Em
Iting diode) is used as a light emitting element to display an image.

The LE used in such a display device
As D, it is considered to use a lead frame type LED as shown in FIG. 10, for example. In the lead frame type LED 3 of this figure, a substantially dish-shaped reflector R is formed on one upper end of one of the electrode leads 3d and 3d, which also serve as two electrodes and lead wires, and a semiconductor PN junction is formed in the reflector R. A light emitting body pellet 3b to be formed is provided. For example, the emission color of the LED is set according to the material and shape of the semiconductor forming the PN junction. In this state, the pellet 3b is connected to the other electrode lead 3d by the bonding wire 3c. Then, the LED element is configured such that the pellet 3b is molded by the resin cover 3a such as epoxy resin. The resin cover 3a in this case is formed in an optical axis symmetric lens shape.

A surface mount type LE as shown in FIG.
It is also considered to use D as a display element. In the surface-mounted LED 2 of this figure, a pellet 2b is provided on one electrode 2d formed on a base 2e, and the pellet 2b is formed.
Is connected to the other electrode 2d by a bonding wire 2c. A block-shaped resin cover 2a is provided so as to mold the pellet 2b. KM is a cathode mark, and indicates that the electrode on the side indicated by this mark is the cathode electrode.

FIGS. 12A and 12B are a front view and a side view showing an example of the structure of a display panel unit using the lead frame type LED as shown in FIG.
For example, such display panel units can be combined in the plane direction to form a display screen of a desired size. In this figure, first, the lead frame type LEDs 3, 3, ...
The LEDs are mounted on the LED mounting panel 8 in a state of being arranged in a matrix of 16 (horizontal) = 256. And
Lead frame type LE mounted on the LED mounting panel 8
The electrode lead D3 (not shown here) is connected to the image display substrate 4 provided on the rear side of the LED mounting panel 8 by a method such as soldering. Further, the image display substrate 4 has small holes (not shown) formed along the outer peripheral portion thereof.
One end of the large number of support wire rods 9, 9, ... Shown in the side view of FIG.
The other end of is connected to the drive circuit board 7. The drive circuit board 7 is a mounted lead frame type LED.
Although a drive circuit for driving 3 is provided, it also has a function as a support substrate. That is, as described above, the image display substrate 4 is fixed to the drive circuit substrate 7 via the support wire 9, so that the lead frame type LED 3, the LED mounting panel 8 and the LED mounting panel 8 connected as described above are provided. The front panel portion including the image display board 4 is supported by the drive circuit board 7 side. Further, in this case, a heat sink 6B as a heat dissipation member is provided on the back surface side of the drive circuit board 7 in order to mainly dissipate heat generated by the drive circuit.

As described above, the unitized display panel, that is, the display panel unit 1A is constructed. For example, by combining a plurality of these display panel units 1A in the plane direction according to the required screen size, a large size can be obtained. A screen is formed, and actually, the display panel unit 1A is fixed to a large screen frame (not shown) by fastening it to a nut N shown in the side view of FIG. By fixing it, a large-screen display device is constructed.

In addition, FIGS. 13A and 13B are front and side views showing an example of the structure of the display panel unit when the surface mount type LED 2 shown in FIG. 11 is used. As the display panel unit 1B in this figure, first, the surface mount type LE is used.
D2, 2, ... Are mounted on the image display substrate 4. Even in this case, the surface-mounted LED 2 has 16
They are arranged in a matrix of (vertical) × 16 (horizontal) = 256.

In this case, connectors (male) C _N (M) and C _N (M) are fixedly attached to the back surface of the image display board 4, and the front side of the drive circuit board 7 is attached. Connectors (female) C _N (F) and C _N (F) are attached. By joining these male / female connectors to each other as shown in the figure, the image display board 4 and the drive circuit board 7 are electrically connected and the image display board 4 is supported by the drive circuit board 7. It will be. However, since the physical strength may not be sufficiently obtained by such a supporting method by connecting the connectors together, for example, as shown in the side view of FIG. 13B, a large transparent plate for protecting the LED is used. 10 is provided on the front surface of the display screen, and a mechanism (not shown) supports the display panel unit 1B together with the connection mechanism by the connector. Also in this figure, a heat sink 6B is provided on the back side of the drive circuit board 7 to radiate the heat of the board. And
As described above with reference to FIG. 12, the display device can be configured by forming a large screen by combining a plurality of display panel units 1B thus configured.

[0009]

By the way, in the display device constituted by the display panel units 1A and 1B as shown in FIGS. 12 and 13, not only the heat generation of the circuit components of the drive circuit board 7 but also the display The heat generated on the image display substrate 4 side due to the light emission of the LED, which is an element, becomes considerable, and the amount of heat generated increases as the brightness is increased. However, in the display panel units 1A and 1B shown in FIGS. 12 and 13, only the heat sink 6B is provided on the back surface of the drive circuit board 7, so that the drive circuit board 7 side radiates heat relatively effectively. However, since the heat dissipation effect on the image display substrate 4 side is thin, there is a problem that it is difficult to achieve high brightness.

Therefore, it is conceivable to provide a heat sink to the image display substrate 4 in the same manner as the drive circuit substrate 7 to suppress the heat generation. For example, as shown in FIG.
2 and the display panel unit (1A, 1B) having the structure shown in FIG.
There is not enough space to install a heat sink between them. Further, even if a heat sink is attached to the image display substrate 4, in this case, there is a problem that the weight of the image display substrate 4 side increases. This image display substrate 4 is
As described above, in both FIG. 12 and FIG. 13, it is in a state of being supported by the drive circuit board 7 side via the support wire 9 or the connector, and therefore it is as light as possible in consideration of its support strength and the like. Required.

Further, particularly in the case of the display panel unit as shown in FIG. 12, connection of the electrode leads of the lead frame type LED 2 and fixing and maintenance of a large number of thin supporting wires 9 by soldering are very troublesome. Have the problem of being.

[0012]

In order to solve the above-mentioned problems, the display device of the present invention includes a first substrate portion on which a display element such as an LED is mounted in a predetermined pattern to display an image, A second substrate portion having a circuit for driving the display element, a support member provided to support the first substrate portion with respect to the second substrate portion side, and a physical member for the first substrate portion. The display panel is formed so as to include a heat dissipation member provided so as to conduct heat on the side of the first substrate while being not directly fixed. The heat dissipating member is configured to be in contact with the first substrate portion directly or via a heat conductor, and to be fixed to the supporting member. Alternatively, the support member is configured to have high thermal conductivity, and the heat dissipation member is attached to the second substrate portion side in a state where the heat of the support member can be conducted.

In the display panel thus constructed, when the support member is formed by combining a plurality of display panels to form one display screen, it is possible to obtain substantially equal intervals in the horizontal and vertical directions on the display screen. I decided to place it.

[0014]

According to the above construction, in a display device using LEDs as the display element, for example, the heat sink is provided so as to come into contact with the first substrate portion in a state of being fixed to the support member. Even if it is not fixed to the first substrate portion, the heat of the first substrate portion can be conducted and the heat can be released. Alternatively, the first and second substrate parts are coupled by a supporting member having high thermal conductivity, and the heat sink is provided on the second substrate part side in a state of being connected to the supporting member, so that heat generation in the first substrate part is generated. Can be conducted to the heat sink through the support member to radiate heat.

Further, when the support members are arranged so as to form a single display screen by combining a plurality of display panels, if the display members are arranged so that substantially equal intervals can be obtained in the horizontal and vertical directions. In the screen, the portions for fixing the supporting members are not concentrated in a specific area but are distributed substantially evenly.

[0016]

EXAMPLE A display device according to an example of the present invention will be described below. In the present embodiment, the surface mount type LED as shown in FIG. 11 is used as the display element, and the surface mount type LED which emits each color of R, G and B is combined as described later. As a result, a full-color image can be displayed.

The front and side views of FIGS. 1 (a) and 1 (b) are
The structure of the display panel unit of the display device of the present embodiment is shown, and the same reference numerals are given to the same portions as previously described. The display panel unit 1 shown in this figure is the same as the display panel unit 1A shown in FIGS.
Similar to the case of 1B, a large-screen display device can be configured by combining a plurality of sheets in the plane direction.

First, the LED in the display device of this embodiment
The array state of will be described. In this embodiment, as shown in FIG. 1A, the image display substrate 4 having a substantially square shape is used.
On the other hand, a large number of surface mount LEDs 2 are arranged and mounted in a matrix in the XY direction. Here, FIG.
2A is an enlarged view of the LED mounting portion A shown in a broken line in FIG. As can be seen from this figure, the surface mount LEDs 2 (R) (G) (B) that emit R, G, and B colors are actually arranged on the image display substrate 4 in combination. In the present embodiment, as shown in the figure, two kinds of pixels, each of which is a pixel P _A and a pixel P _B , are shown two by two. In the pixel P _A , two green LEDs 2 (G) that emit green light are arranged in the vertical direction from the left side of the figure, and one red LED 2 (R) that emits red light is arranged next to the green LED 2 (G). A blue LED 2 (B) that emits blue light is arranged in the background, and a combination of these three color LEDs enables color expression in pixel units. On the contrary,
The pixel P _B has a blue LE as shown in the figure for the reason described later.
D2 (B) can be omitted, and green LED2 (G),
2 (G) and the red LED 2 (R) alone. .

Then, the display panel unit 1 of this embodiment
In the overall arrangement pattern of the pixel P _A and the pixel P _B, as can be seen from Figure 1, they are alternately arranged in the respective row and column directions, and the pixel P _A in the case of FIG. By combining the pixels P _B , 16
(Vertical) × 16 (horizontal) = 256 pixels are provided in a matrix on one LED array substrate 3.

By the way, in the display device of this embodiment, the pixels P _{B in} which the blue LEDs 2 (B) are thinned out are arranged so as to occupy half of the total number of pixels.
This is because the blue has the lowest sensitivity, the red has the second highest sensitivity, and the green has the highest sensitivity as the luminosity characteristics of each light receiver corresponding to the three primary colors of red, green, and blue that are said to be in the retina of the naked eye. It is known that, based on such luminosity characteristics, even if unit pixels in which at least blue elements of red, green, and blue are thinned are appropriately mixed and incorporated in a matrix arrangement, The reason is that the color reproduction of a full-color image can be hardly affected. Therefore, as in this embodiment, the blue LED 2 (B)
It is possible to display a full-color image so that there is no problem in color reproduction even if pixels P _{B in} which P is omitted are mixed.
As a result, it is possible to reduce the number of expensive blue LEDs 2 (B) used and reduce the cost.

In the lower left pixel P _B of FIG. 2, a screw hole 4 for a screw shaft 5b of a support member 5 described later is provided at a position corresponding to a position where the blue LED 2 (B) is omitted.
_H is provided. Such a screw hole _4H is shown in FIG.
As can be seen from the figure, four are provided for one image display board, all of which are blue L as shown in FIG.
It is supposed to be provided by utilizing the omitted position of ED2 (B). The positional relationship between these screw holes 4 _H will be described later.

Further, here, the pixel P _B for the entire screen is
The mixing ratio is set to 50%, but it is naturally possible to change this mixing ratio so as not to affect visual color reproduction. Further, the array pattern of the pixels P _B is not limited to the one in this embodiment, and it is possible to change the array pattern so that it does not affect the color reproduction. Further, a specific mounting method of the surface mount LED 2 forming the pixels P _A and P _B may be a soldering method such as a reflow method. As described above, the resin of the optical axis symmetric lens is used. The mounting process can be simplified as compared with the LED device of the type having the cover 3a (see FIG. 10).

Then, as described above, the surface mount type LE is used.
The image display substrate 4 on which D2 is mounted is supported by the drive circuit substrate 7 as described below. Here, FIG.
The perspective view of shows the shape of the support member 5 for supporting the image display substrate 4 with respect to the drive circuit substrate 7. In the supporting member 5 of this embodiment shown in this figure, a main body 5a is formed, for example, as a hexagonal prism as shown in the drawing, and both ends thereof are provided with screw shafts 5b and 5c having thread grooves. Further, at a predetermined position on one side surface of the hexagonal column-shaped main body portion 5a, a bolt receiving hole 5d whose inside is threaded so that a bolt B described later can be screwed is formed.

The four screw holes 4 _H is provided in the image display substrate 4a as shown in FIG. 1 (a) and (b). Then, for each of these screw holes 4 _H, from the rear side of the image display substrate 4a, so as to penetrate the threaded shaft 5b mounted to the support member 5, for example, protruding on the front side of the image display substrate 4a By tightening the screw shaft 5b with the nut N, the four support members 5 are fixed to the image display substrate 4a. Instead of using a nut N is a fixed method, to form a screw groove in the screw hole 4 _H, the screw shaft 5b and the threaded hole 4 _H of the support member 5 may be allowed to fix screwed directly .

Next, the heat sink in the display device of this embodiment will be described. FIG. 4 is a perspective view showing a heat sink as a heat radiating member used in the display device of the present embodiment. The heat sink 6 has, for example, four heat folds 6a as shown in the drawing. A fixing piece 6b is provided at a position between the two inner heat-dissipating folds 6a, 6a as shown in the figure.
Is provided. The bolt hole 6 _H formed in the fixing piece 6b, when fixing the heat sink 6 in the manner described below with respect to the support member, the axis of the bolt B is to penetrate. Further, in the figure, a hexagonal support member through hole 6d is formed so as to penetrate from the rear surface of the fixed piece 6b to the bottom surface portion 6c. The heat sink 6 of this embodiment is made of a material having high thermal conductivity such as aluminum or copper. The shape of the heat sink 6 shown in FIG. 4 is integrally formed.

Here, FIGS. 5A and 5B respectively show
FIG. 1B is a rear view and a plan view showing the attachment portion of the heat sink 6 shown in the side view of FIG.
As shown in FIGS. 5A and 5B, the procedure for fixing the heat sink 6 of this embodiment to the support member 5 is as follows. First, the support member 5 is penetrated through the support member through hole 6d so that the bottom surface 6c side of the heat sink 6 faces the back surface of the image display substrate 4, and the bottom surface 6c is brought into contact with the back surface of the image display substrate 4. Take. At this time, the bottom surface 6c of the heat sink 6 and the back surface of the image display substrate 4 may be brought into direct contact with each other.
As shown in (b), thermal grease TG is interposed between these contact surfaces. As a result, the degree of contact between the contact surfaces increases, and the thermal conductivity from the image display substrate 4 to the heat sink 6 increases. In the case of this embodiment, as shown in FIG. 5A, the support member through hole 6d is formed.
Is formed so as to be at the center position of the bottom surface 6c of the heat sink 6 having a substantially square shape. Next, in the above state, the bolt through hole 6d of the heat sink 6 and the bolt receiving hole 5 of the support member 5 are
d is matched, and is fixed by screwing to the bolt receiving hole 5d of the support member 5 from above in the drawing through the bolt through hole 6d, for example, like a bolt B shown in FIG. 5 (a). .

In this way, the heat sink 6 is fixed and attached to each support member 5. In this state, the heat sink 6 is attached to the image display substrate 4.
Therefore, the state in which the back surface of the image display substrate 4 is in contact with the back surface of the image display substrate 4 is obtained through the thermal grease TG so that the heat can be absorbed. That is, in the structure of the display panel unit 1 of the present embodiment, when the heat sink 6 that mainly absorbs heat of the image display substrate 4 is provided, the image display substrate 4 is not provided.
The support member 5 is not directly fixed to the side but is fixed to the support member 5, and the image display substrate 4 is simply contacted so that thermal connection can be obtained.

In the case of this embodiment, as can be seen from FIG. 5A, the supporting member through hole 6d is formed corresponding to the center position of the bottom surface 6c of the heat sink 6 having a substantially square shape. The member 5 supports the heat sink 6 while being located at the center of the heat sink 6 when viewed from the front direction.

Next, a procedure for mounting the image display board 4 on which the supporting member 5 and the heat sink 6 are combined as described above to the drive circuit board 7 will be described. It should be noted that the drive circuit board 7 of this embodiment is actually mounted with drive circuit components on the front side thereof, for example. In the drive circuit board 7 of this embodiment, the screw hole 7 _H shown in the side view of FIG.
Is provided so as to correspond to the mounting position of the supporting member 5 with respect to the image display substrate 4a when viewed from the front direction. Then, the respective passed through four support members 5 of the other respective screw shaft 5c for each screw hole 7 _H, tighten the screw shaft 5c with the nut N from the back side of the drive circuit board 7 as shown in FIG. As a result, the four support members 5 are fixed to the drive circuit board 7. As a result, the image display board 4 side of this embodiment is supported and fixed by the drive circuit board 7 via the support members 5. It will be. Although not shown, the image display board 4 and the drive circuit board 7 are actually connected electrically by, for example, being joined by a connector or the like.

The display panel unit 1 of this embodiment is constructed in this manner. For example, when compared with the display panel unit 1A shown in FIG. 12, a large number of fine supporting wire members 9 are unnecessary. Therefore, it is possible to obtain a display panel unit having a corresponding strength with relatively few parts.
Therefore, the manufacturing process is simplified and maintenance is facilitated. Then, by the same procedure, assemble a number of display panel units 1 according to the size of the required display screen,
By combining these, for example, a large-screen LED display device can be configured.

In the display device of this embodiment using the display panel unit 1 as described above, the heat generated on the image display substrate 4 side is
The heat sink 6 in contact with the image display substrate 4 can absorb the heat and efficiently dissipate the heat. In this embodiment, as described with reference to FIGS. 5A and 5B, the heat sink 6 is not directly fixed to the image display substrate 4 and is brought into contact with the image display substrate 4 as in the present embodiment. Since the structure is adopted, the weight of the image display substrate 4 side can be reduced by that much, and since the connector connection is not used for the supporting mechanism but is supported by the supporting member, the supporting strength is also maintained. It is possible to form a display panel unit that is strong against dripping, shock and vibration. Therefore, in this embodiment, it is possible to omit the large and expensive transparent plate 10 which also functions as the support mechanism as shown in FIG. 13, and the number of parts and the cost can be reduced accordingly. Further, since the transparent plate 10 also eliminates light reflection, the image quality is improved accordingly. The material of the support member 5 is
It may be arbitrarily selected in consideration of strength, workability, etc.,
If a material having high thermal conductivity such as aluminum or copper is used similarly to the heat sink 6, the support member 5 and the heat sink 6 are also thermally connected, and the surface area as a heat radiating member is correspondingly increased. It can be improved.

Next, the mounting position of the supporting member 5 of this embodiment, that is, the disposing position of the heat sink 6, which is a heat radiating member, will be described. In this embodiment, four screw holes 4 _H used for fixing the support member 5 are formed in the image display substrate 4 at the positions shown in the front view of FIG. The four screw holes 4 _H of each of these image display substrate 4, as the positional relationship described by the following FIGS. 6 (a) is obtained the position is set.

FIG. 6A conceptually shows the positional relationship of the screw holes 4 _H of the image display substrate 4 when the display panel unit 1 of this embodiment is combined to form one display screen DP. This is illustrated, and here, a case is shown in which 2 (vertical) × 2 (horizontal) = 4 display panel units are combined. Incidentally, it denoted the code for only one threaded hole 4 _H in this figure, entry of code for other screw holes 4 _H is omitted. As shown in this figure, in the screw holes 4 _H that are arranged in the left-right direction, the distance between the two screw holes 4 _H and 3 _H that are arranged in one display panel unit 1 is D ₁ , and the adjacent display panel units are Screw holes 4 lined up in 1
_Assuming that the distance between _H and 3 _H is D ₂ , in this embodiment, the distance D ₁
And the distance D ₂ are such that D ₁ ≈D ₂ , that is, the distance D ₁ and the distance D ₂ have substantially the same dimension. Further, also in the screw holes 4 _H arranged in the vertical direction, the distance between the two screw holes 4 _H and 3 _H arranged in the same display panel unit 1 is D _3, and the screw holes arranged in the adjacent display panel units 1 are arranged. 4 _H , 3
_If the interval of _H is D ₄ , then D ₃ ≈D _4, and the intervals D ₁ and D ₂ are made to have substantially the same size.

Then, in one image display substrate 4, when the display screen DP is formed by the plurality of display panel units 1, the relationship of D ₁ ≈D ₂ and D ₃ ≈D ₄ is obtained. sets the positions of the four screw holes 4 _H. Specifically, in the horizontal direction, the distance D ₅ and the distance D ₆ from each screw hole 4 _H shown in FIG. 6A to the end of the display panel unit 1 in the horizontal direction are substantially equal to the distance D _1. It should be set so that Further, in the vertical direction, the distance D ₇ and the distance D ₈ from the screw hole 4 _H to the end of the display panel unit 1 in the vertical direction may be set to be equal to the distance D _3. Become.
The distance D ₅ and the distance D ₆ or the distance D ₇ and the distance D ₈ do not necessarily have to be the same.

As described above, by setting the positions of the screw holes 4 _H in one image display substrate 4, as shown in FIG. 6A, a plurality of display panel units 1 are formed. On the display screen DP, the screw holes 4 _H adjacent to each other in the vertical / horizontal direction are located with substantially equal intervals. That is, the screw holes 4 _H are evenly distributed on the display screen DP. For example, assuming that the screw holes 4 _H are provided relatively on the edge side of one image display substrate 4, when the display screen DP is formed by combining the display panel units 1, the vicinity of the joint portion is formed. Since the screw holes 4 _H are relatively densely packed, the presence of the screw holes 4 _H is relatively conspicuous on the display screen DP. However, if they are arranged evenly as in the present embodiment, the screw holes 4 _H become inconspicuous and, for example, it is possible to avoid disturbing the viewing of the displayed image, impairing the appearance of the display device itself. It can be prevented.

Further, FIG. 6 (b) shows an arrangement state of the heat sink 6 with respect to the display screen DP. As shown in FIG. 6A, the screw holes 4 _H are arranged for each image display board 4, and as a result, the heat sink 6 provided on the back surface of the image display board 4 with the screw hole 4 _H as the center position. each has, as shown in FIG. 6 (b), the screw hole 4 _H as the center position of the heat absorption, will be distributed substantially uniformly to the display screen DP. Therefore, for example, in the case where the surface mount LEDs 2 are distributed substantially evenly in one display panel unit 1 as in the present embodiment, and the heat generation distribution on the display screen DP is also substantially uniformed, Accordingly, the heat radiation effect of the heat sink 6 can be obtained evenly.

In the above description, the case where four support members 5 are provided for each display panel unit 1 has been described, but the number can be changed, and for example, three support members 5 can be used. It is also possible to configure as.
7A and 7B show the screw holes 4 with respect to the image display substrate 4.
FIG. 6A shows an example of the positional relationship of the screw holes 4 _{H on} the display screen DP when the number of _H is three.
The same parts as those in (b) are designated by the same reference numerals and the description thereof will be omitted.
First, in the case of FIG. 7 (a), two screw holes on the upper side 4 _H
It is formed side by side in the horizontal direction, one of the screw holes 4 _H on the lower side
And the image display substrate 4A on which the
Against A, just two of the three screw holes 4 _H of vertical relationship the image display substrate 4B, which is to be reversed is prepared. In this case, the display panel units 1 having the same type of image display substrate 4A or image display substrate 4B are arranged in the vertical direction, and the image display substrate 4A and the image display substrate 4B are provided in the horizontal direction. The display screen DP is formed by arranging the display panel units 1 alternately. Then, the image display substrate 4A and the image display substrate 4
The positioning of the screw holes 4 _H of B, the distance D ₁₁ of the two screw holes 4 _H image display substrate in the horizontal direction, the interval D of the image display substrate 4A, adjacent across 4B 2 two screw holes 4 _{H With} respect to ₁₂ , the distance D ₁₁ is set so that D ₁₁ ≈D ₁₂ , that is, the distance D ₁₁ and the distance D ₁₂ have substantially the same dimensions. In the vertical direction, the vertical distance D between the screw holes 4 _{H in} the same image display substrate
₁₃ and the vertical distance D ₁₄ between the screw holes 4 _{H that} are adjacent to each other over the same type of image display substrates combined vertically, that is, D ₁₁ ≈D ₁₂ , that is, the distance D ₁₁ and the distance D _{12 are} almost the same. Set so that the dimensions are the same. In the vertical direction, the vertical distance D between the screw holes 4 _{H in} the same image display substrate
₁₃ and the vertical interval D ₁₄ of the screw holes 4 _H adjacent to each other over the same type of image display substrates combined vertically are set to be D ₁₃ ≈D _14, and have substantially the same dimensions. .

For example, if the positions where the three screw holes 4 _H are formed on the image display substrate 4A and the image display substrate 4B are set as described above, the screw holes 4 _H are distributed substantially evenly on the display screen DP. Therefore, as described above with reference to FIGS. 6A and 6B, the screw hole 4 _H can be made inconspicuous on the front surface of the display screen DP, and the heat dissipation effect of the heat sink 6 can be displayed on the display screen. It can be obtained evenly in DP.

Further, due to the arrangement state of the LEDs 2 and the mounting position of the drive circuit provided on the drive circuit board 7, for example, when the heat generation distribution in each display panel unit 1 is relatively concentrated on the upper side, For example, as shown in the display screen DP of FIG. 7B, the arrangement of the screw holes 4 _H can be set.

[0040] That is, three image display substrate 4C formed as screw holes 4 _H forms the apex of the inverse triangle is used in this case. When the display screen DP is formed by combining these, the distance D ₂₁ between the screw holes 4 _H and 3 _H arranged in the upper side in the same image display board 4C in the horizontal direction and the distance D ₂₁ across the image display boards 4C and 3C. The distance D ₂₂ between the adjacent screw holes 4 _H and 3 _H becomes substantially equal (D
₂₁ ≈ D ₂₂ ). Note that the screw hole 4 _H to be one formed on the lower side of the image display substrate 4C, the image display substrate 4C
Since it was formed at the center of the left and right above when straddling image display substrate 4C, the 3C horizontally, the interval D ₂₅ of these screw holes 4 _H, 4 _H, made respectively equal. Then, in the vertical direction, as in the case of FIG. 7A, the vertical distance D ₂₃ between the screw holes 4 _H in the same image display board 4C and the image display boards 4C and 3C aligned in the vertical direction are set. Vertical intervals D ₂₄ of the screw holes 4 _H extending over are almost equal (D
₁₃ ≈ D ₁₄ ).

By doing so, for example, in response to the condition that the amount of heat generated on the upper side of the display panel unit 1 is large,
It is possible to obtain an arrangement pattern of the heat sinks 6A that can evenly obtain the heat dissipation effect. Also, although the number of screw holes 4 _H changes alternately for each row, the arrangement intervals of the screw holes 4 _H in the vertical / horizontal direction (the intervals of D ₂₃₁ and D ₂₄ , D ₂₁ and D ₂₂ , and D ₂₅ ). ) Are made equal, the screw holes 4 _H are not particularly conspicuous on the display screen DP in this case as well.

Incidentally, the above-mentioned FIG. 7 (a) or FIG. 7 (b)
In the case where the screw holes 4 _H are formed in the image display substrate (3A, 3B, 3C) as shown in FIG. 2, the screw holes 4 _H are blue in the pixel P _B as described in FIG. 2, for example. L
It is assumed that ED2 (B) is provided at the thinned position.

Next, another embodiment of the present invention will be described. 8A and 8B are a front view and a side view showing the configuration of a display device as another embodiment, and the same parts as those in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted. In this embodiment, first, the support member 5A is made of a material having high thermal conductivity such as copper or aluminum, and its shape may be the same as that shown in FIG. However, in this embodiment, it is not necessary to provide the bolt receiving hole 5d. Alternatively, although the support member 5A is not shown, a heat pipe may be used. Further, in the present embodiment, the heat dissipation surface 7a formed of a material having high thermal conductivity such as copper or aluminum is provided on the rear surface side of the drive circuit board 7A.
Is provided and has a heat dissipation effect as described later. That is, in this case, the drive circuit board 7A also functions as a heat dissipation member.

9 (a) and 9 (b) are a rear view and a plan view showing the peripheral portion of the heat sink 6A extracted in the display device of this embodiment. Heat sink 6A of this embodiment
As shown in the side views of FIGS. 9 (a) and 9 (b) and FIG. 8 (b), the structure of the image display substrate 4 and the plane portion in the front direction are substantially the same in size. It is large and has a plurality of folds 6a formed on the back side. Then, the recesses 6f, 6 formed between the folds 6a
A screw shaft through hole 6e for allowing the screw shaft 5c of the support member 5 to penetrate is provided in f. And the heat sink 6A
To mount the drive circuit board 7A, the screw shafts 5c of the four supporting members 5A projecting to the back side of the drive circuit board 7A are passed through the screw shaft through holes 6e, and the flat surface on the front surface of the heat sink 6A dissipates heat from the drive circuit board 7A. It is arranged so as to contact the surface 7a (see FIG. 9B). From this state, heat sink 6A
The heat sink 6A is fixed to the drive circuit board 7A by screwing the nuts N onto the screw shafts 5c of the support member 5A projecting from the bottom surface portions 6f and 6f to tighten the nuts N. 9 (a) and 9 (b)). In this way, the display panel unit 1 of this embodiment as shown in FIG. 8 is constructed. Although not shown here, thermal grease TG may be interposed between the flat surface portion of the heat sink 6A and the heat radiating plate surface 7a as shown in the previous embodiment. Further, the method of attaching the supporting member 5A to the image display substrate 4 side may be the same as that described in the previous embodiment.

In the display panel unit 1 of the present embodiment constructed in this way, for example, the heat generated on the image display substrate 4 side is the support member 5 formed of a material having high thermal conductivity.
As a result, the heat is transmitted to the heat radiation surface 7a of the drive circuit board 7A and the heat sink 6A that is in contact with the heat radiation surface 7a, and heat is mainly radiated by the heat radiation surface 7a and the heat sink 6A. For example, in the space between the image display substrate 4 where the supporting member 5 is present and the drive circuit board 7A in the side view of FIG. 8B, circuit components are mounted on the front side of the drive circuit board 7A, for example. Besides, a connector for electrically connecting the image display board 4 and the drive circuit board 7A is arranged, and these parts occupy a corresponding space. Therefore, if the heat sink 6A is provided on the back side of the drive circuit board 7A as in the present embodiment, the structure shown in FIG.
Also, since the large heat sink 6A as shown in FIGS. 9A and 9B can be easily attached, the surface area of the heat radiating portion is increased correspondingly, and the heat radiation efficiency can be improved. Therefore, similarly to the previous embodiment, it is possible to easily realize high brightness in the display device of this embodiment. Also in this embodiment, the image display substrate 4 side is thermally connected to the heat sink 6A via the supporting member 5A, but the heat sink 6A is directly fixed and attached to the image display substrate 4. Image display board 4 supported by the drive circuit board 7A
The unit on the side is made lighter to improve its support strength.

The image display substrate 4 is also used in this embodiment.
Since the positions of the four screw holes 4 _H formed on the display screen DP are set as described with reference to FIG. 6A, the presence of the screw holes 4 _{H on} the entire display screen DP is the same as in the previous embodiment. It is made inconspicuous. Further, the screw hole 4 _H is the mounting position of the heat sink 6 A, and is therefore the center position of heat absorption for the image display substrate 4. In this embodiment, the central positions of the heat absorption (screw holes _4H ) are distributed substantially evenly in the horizontal / vertical directions of the display screen DP, so that the heat dissipation effect is also displayed on the display screen D.
It will be obtained evenly in P. Furthermore, FIG.
As shown in (a) and (b), it is possible to configure the display device by setting the positions of the three screw holes 4 _H formed in the image display substrate 4. Further, in the present embodiment, only one heat sink is required for one display panel unit, so that the number of parts constituting the display device is further reduced, and, for example, the manufacturing efficiency is further improved.

In each of the above embodiments, R, G,
The display device has been described as a display device capable of full color image display using LEDs of three different emission colors corresponding to B.
For example, a display device configured to display an image in two colors or a single color by using LEDs of a smaller number of types of light emission colors,
Alternatively, the present invention can be applied to a display device including LEDs corresponding to a larger number of emission colors. Further, in each of the above-described embodiments, an example in which the surface mount type LED is used for the display element has been described, but in some cases, a lead frame type LED as shown in FIG. 10 may be used. Furthermore, it is possible to mount a display element other than the LED on the image display substrate or the like.

The number of supporting members for supporting the image display substrate for each display panel unit is four or three in each of the above embodiments, but other number may be selected depending on the use conditions. The number can be changed. Furthermore, the present invention is not limited to the configuration shown in each of the above embodiments even in other parts and the like, and various changes can be made to the specific size and shape of the heat sink, for example.

[0049]

As described above, in the display device of the present invention, the heat sink, which is the heat dissipation member, is not directly fixed to the image display substrate on which the LED of the display element is mounted, and the display device of the image display substrate is not fixed. Since it is provided so that heat can be conducted, heat can be dissipated efficiently from the image display board, and the image display board side is lighter by that amount, and the drive circuit board side supports the image display board side. Strength is improved. As a result, it is possible to easily realize high brightness, and it is possible to obtain a display device that is resistant to vibration and shock.

Further, as a positional interval for each supporting member in each image display substrate, that is, an interval between screw holes for mounting the supporting members, a plurality of display panels are combined to form one.
When forming a single display screen, the settings were made so that the display screen can have substantially even intervals in the horizontal and vertical directions. It will be distributed, which makes the screw holes inconspicuous on the front panel,
For example, it is possible to prevent the display image from being obstructed at the time of viewing the display image, and also not to impair the aesthetic appearance of the display device itself. Furthermore, since the mounting position of the support member, which is the center position of heat absorption, is evenly distributed in each of the horizontal and vertical directions according to the distribution of the heat generation amount of the entire display screen, the connection with the support member is made. Dissipation of heat by the heat sink is evenly performed, and the reliability of the device is improved. Furthermore, since the display device can be configured with a relatively small number of parts, the manufacturing process can be simplified and maintenance can be simplified.

[Brief description of drawings]

FIG. 1 is a front view and a side view showing a configuration of a display panel unit of a display device in an embodiment of the present invention.

FIG. 2 is an enlarged view showing an arrangement state of the surface mount LEDs of this embodiment.

FIG. 3 is a perspective view showing the shape of a support member of this embodiment.

FIG. 4 is a perspective view showing the shape of a heat sink of this embodiment.

5A and 5B are a rear view and a plan view showing a mounted state of a heat sink in the present embodiment.

FIG. 6 is an explanatory diagram showing a positional relationship of screw holes with respect to a display screen and a heat sink distribution state in the present embodiment.

FIG. 7 is an explanatory diagram showing a modified example of arrangement of screw holes with respect to a display screen in the present embodiment.

FIG. 8 is a front view and a side view showing a configuration of a display panel unit of a display device according to another embodiment.

9A and 9B are a rear view and a plan view showing a mounted state of a heat sink in another embodiment.

FIG. 10 is a perspective view showing a lead frame type LED.

FIG. 11 is a perspective view showing a surface mount LED.

FIG. 12 is a front view and a side view showing a configuration example of a display panel unit of a display device using a lead frame type LED.

FIG. 13 is a front view and a side view showing a configuration example of a display panel unit of a display device using surface-mounted LEDs.

[Explanation of symbols]

1 Display Panel Unit 2 Surface Mount LED 4 Image Display Board 4 _H Screw Hole 5 Supporting Member 6 Heat Sink 7 Drive Circuit Board 7a Heat Dissipating Surface

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[Procedure amendment]

[Submission date] March 31, 1995

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 7

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] 0025

[Correction method] Change

[Correction content]

Next, the heat sink in the display device of this embodiment will be described. FIG. 4 is a perspective view showing a heat sink as a heat radiating member used in the display device of the present embodiment. The heat sink 6 has, for example, four heat folds 6a as shown in the drawing. A fixing piece 6b is provided at a position between the two inner heat-dissipating folds 6a, 6a as shown in the figure.
Is provided. The bolt hole 6 _H formed in the fixing piece 6b, when fixing the heat sink 6 in the manner described below with respect to the support member, the axis of the bolt B is to penetrate. Further, in the figure, a hexagonal support member through hole 6d is formed so as to penetrate from the front surface of the fixed piece 6b to the bottom surface portion 6c. The heat sink 6 of this embodiment is made of a material having high heat conductivity such as aluminum or copper, and is integrally formed with the shape shown in this figure .

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0031

[Correction method] Change

[Correction content]

As described above, in the display device of this embodiment using the display panel unit 1, the heat generated on the image display substrate 4 side is
The heat sink 6 in contact with the image display substrate 4 can absorb the heat and efficiently dissipate the heat. And in this embodiment, it has a structure that is contacted in terms of obtaining the state not fixed directly heating <br/> sink 6 as described with reference to FIG. 5 (a) (b) the image display substrate 4 Therefore, it is possible to reduce the weight of the image display substrate 4 side by that much, and since the support member is supported without using the connector connection for the support mechanism, the support strength is maintained and the impact is reduced. -It is possible to form a display panel unit that is resistant to vibration. Therefore, in the present embodiment, as shown in FIG.
It is also possible to omit the large-sized and expensive transparent plate 10 that also functions as the support mechanism as shown in FIG. 3, and the number of parts and the cost can be reduced accordingly. Since also eliminated by that <br/> light reflected to the transparent plate 10, it will also increase correspondingly image quality. The material of the support member 5 may be arbitrarily selected in consideration of strength, workability and the like, but if the material having high thermal conductivity such as aluminum or copper is used as in the heat sink 6, the support member 5 is formed. The heat sink 6 and the heat sink 6 are also thermally connected to each other, and the surface area of the heat radiating member is accordingly increased, so that the heat radiating effect can be further improved.

[Procedure amendment 4]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 2

[Correction method] Change

[Correction content]

[Fig. 2]

[Procedure Amendment 5]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 3

[Correction method] Change

[Correction content]

[Figure 3]

[Procedure correction 6]

[Document name to be corrected] Drawing

[Name of item to be corrected] Fig. 4

[Correction method] Change

[Correction content]

[Figure 4]

Claims (10)

[Claims] 1. A first substrate portion on which a display element is mounted in a predetermined pattern to display an image, a second substrate portion having a circuit for driving the display element, and the second substrate portion. And a supporting member provided so as to support the first substrate portion, and the heat on the first substrate portion side while not being directly physically fixed to the first substrate portion. A display device comprising: a heat dissipation member provided so as to conduct electricity; and a display panel formed. 2. The heat dissipating member is configured to come into contact with the first substrate portion directly or via a heat conductor, and is fixed to the support member. The display device according to claim 1. 3. The support member is arranged so that, when a plurality of the display panels are combined to form one display screen, substantially equal intervals can be obtained in the horizontal and vertical directions on the display screen. The display device according to claim 2, wherein the display device is a display device. 4. A red color for full-color image display,
3. The display elements capable of expressing green and blue are arranged in a predetermined pattern.
Alternatively, the display device according to claim 3. 5. A display device according to claim 2, 3 or 4, wherein a light emitting diode element is used as the display element. 6. The support member is configured to have high thermal conductivity, and the heat dissipation member is attached to the second substrate portion side in a state where heat of the support member can be conducted. The display device according to claim 1, wherein the display device is provided. 7. The display device according to claim 6, wherein a heat dissipation surface is formed on the second substrate portion, and the heat dissipation member is in contact with the heat dissipation surface. . 8. The support member is arranged such that, when a plurality of the display panels are combined to form one display screen, substantially equal intervals can be obtained in the horizontal and vertical directions on the display screen. The display device according to claim 6, wherein the display device is a display device. 9. A red color for displaying a full-color image,
7. The display element capable of expressing green and blue is arranged in a predetermined pattern.
Alternatively, the display device according to claim 7 or claim 8. 10. The light emitting diode device is used as the display device, as claimed in claim 6 or 7.
Alternatively, the display device according to claim 8 or 9.