JPH0820803A - Production of sintered compact - Google Patents
Production of sintered compactInfo
- Publication number
- JPH0820803A JPH0820803A JP5315970A JP31597093A JPH0820803A JP H0820803 A JPH0820803 A JP H0820803A JP 5315970 A JP5315970 A JP 5315970A JP 31597093 A JP31597093 A JP 31597093A JP H0820803 A JPH0820803 A JP H0820803A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- degreasing
- organic binder
- composition
- metal powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 239000000843 powder Substances 0.000 claims abstract description 59
- 239000000203 mixture Substances 0.000 claims abstract description 35
- 239000011230 binding agent Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 238000000465 moulding Methods 0.000 claims abstract description 15
- 238000005245 sintering Methods 0.000 claims abstract description 14
- 229920006324 polyoxymethylene Polymers 0.000 claims abstract description 13
- 239000000919 ceramic Substances 0.000 claims abstract description 12
- 229930182556 Polyacetal Natural products 0.000 claims abstract description 11
- 238000002844 melting Methods 0.000 claims abstract description 11
- 230000008018 melting Effects 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000004898 kneading Methods 0.000 claims abstract description 9
- 229920001515 polyalkylene glycol Polymers 0.000 claims abstract description 9
- 230000001590 oxidative effect Effects 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000011812 mixed powder Substances 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 238000005238 degreasing Methods 0.000 abstract description 34
- 229920001223 polyethylene glycol Polymers 0.000 abstract description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 abstract description 3
- 229920001519 homopolymer Polymers 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 238000009423 ventilation Methods 0.000 abstract description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 238000005336 cracking Methods 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- -1 polypropylene Polymers 0.000 description 10
- 238000001746 injection moulding Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 7
- 239000004743 Polypropylene Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 230000003405 preventing effect Effects 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical class C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 229910000997 High-speed steel Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920001030 Polyethylene Glycol 4000 Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- 150000004862 dioxolanes Chemical class 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- HKUFIYBZNQSHQS-UHFFFAOYSA-N n-octadecyloctadecan-1-amine Chemical compound CCCCCCCCCCCCCCCCCCNCCCCCCCCCCCCCCCCCC HKUFIYBZNQSHQS-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 239000012169 petroleum derived wax Substances 0.000 description 1
- 235000019381 petroleum wax Nutrition 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000090 poly(aryl ether) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Powder Metallurgy (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は金属粉末または金属粉末
とセラミック粉末の混合粉と有機バインダーからなる成
形用組成物を用いた焼結体の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a sintered body using a molding composition comprising metal powder or a mixed powder of metal powder and ceramic powder and an organic binder.
【0002】[0002]
【従来の技術】金属粉末あるいはセラミック粉末と有機
バインダーからなる従来の成形用組成物としては、有機
バインダーとして、ポリプロピレン、メタクリル酸エス
テル、ポリスチレン、エチレン−酢酸ビニル共重合体お
よび低密度ポリエチレンなどの熱可塑性樹脂、あるいは
これらとパラフィンワックス、ジエチルフタレート、ス
テアリン酸などの可塑剤や滑剤を併用したものが知られ
ている。またこのような組成物を射出成形し、成形体か
ら有機バインダーを除去し(これを脱脂と称す)、次い
で焼結を行うことにより焼結体を得る方法も知られてい
る(例えば、USP2593943、特開昭58−22
3662号公報)。2. Description of the Related Art As a conventional molding composition comprising a metal powder or ceramic powder and an organic binder, there are used organic binders such as polypropylene, methacrylic acid ester, polystyrene, ethylene-vinyl acetate copolymer and low density polyethylene. Known are plastic resins, or those in which a plasticizer such as paraffin wax, diethyl phthalate, stearic acid or a lubricant is used in combination. A method is also known in which such a composition is injection-molded, an organic binder is removed from the molded body (this is referred to as degreasing), and then sintering is performed to obtain a sintered body (for example, USP 2593943, JP-A-58-22
No. 3662).
【0003】[0003]
【発明が解決しようとする課題】しかしながら従来の組
成物では、脱脂の際、成形体が自重により変形したり、
分解ガスにより割れや膨れを生じたりしやすいため、成
形体をセラミック粉や金属粉中に埋めて変形を防いだ
り、通常 1〜10℃/hrのゆっくりした昇温速度で分解ガ
ス発生量を押さえて脱脂を行う必要があった。そのた
め、焼結に移る前に成形体の表面に付着した粉を払い落
とす工程が必要であったり、脱脂に長時間を要するな
ど、工業的に生産を困難にしていた。本発明は、上記の
ような従来技術の欠点を解消するために創案されたもの
であり、脱脂時に熱変形せずかつ短時間で脱脂できる組
成物を用いて変形や、割れ、膨れ等の欠陥のない焼結体
を効率よく製造する方法を提供することを目的とする。However, in the conventional composition, the molded body is deformed by its own weight during degreasing,
Since cracks and swelling easily occur due to decomposition gas, the molded body is embedded in ceramic powder or metal powder to prevent deformation, and the amount of decomposition gas generated is usually controlled at a slow heating rate of 1 to 10 ° C / hr. It was necessary to degrease it. Therefore, industrial production has been difficult because a step of removing powder adhering to the surface of the molded body is required before proceeding to sintering, and it takes a long time for degreasing. The present invention was devised in order to eliminate the drawbacks of the prior art as described above, using a composition that can be degreased in a short time without thermal deformation during degreasing, defects such as cracks, swelling, etc. It is an object of the present invention to provide a method for efficiently producing a sintered body free of impurities.
【0004】[0004]
【課題を解決するための手段】本発明は、金属粉末また
は金属粉末とセラミック粉末の混合粉と、熱変形温度1
30℃以上のポリアセタール(A成分)と融点30〜1
00℃のポリアルキレングリコール類(B成分)からな
る有機バインダーを熔融混練して成形用組成物を作成
し、この組成物を所望の形状に成形し、次いでこの成形
体から有機バインダーを加熱除去し、得られた脱脂体を
焼結することを特徴とする焼結体の製造方法である。こ
こで、熱変形温度はASTMD648に従い、荷重4.
6Kg/cm2で測定された値で示されるものとする。According to the present invention, a metal powder or a mixed powder of a metal powder and a ceramic powder, and a heat distortion temperature 1
Polyacetal (A component) of 30 ° C or higher and melting point 30 to 1
An organic binder composed of polyalkylene glycols (component B) at 00 ° C. is melt-kneaded to prepare a molding composition, the composition is molded into a desired shape, and then the organic binder is removed by heating from the molded body. A method for producing a sintered body, which comprises sintering the obtained degreased body. Here, the heat distortion temperature is in accordance with ASTM D648 and the load is 4.
It shall be indicated by the value measured at 6 Kg / cm 2 .
【0005】本発明の製造方法において用いるバインダ
ーのA成分である熱変形温度130℃以上のポリアセタ
ールとしては、トリオキサンのみからなるホモポリマ
ー、およびトリオキサンとエチレンオキサイド、ジオキ
ソラン、置換ジオキソラン、1,4−ジオキサンなどと
のコポリマーなどがあり、これらのうちから1種もしく
は2種以上を適宜混合して用いることができる。これら
のうち好ましいのは熱変形温度が150℃以上のもので
ある。ポリアセタールは溶融粘度が低くて成形しやす
く、かつ熱分解も良好である。As the polyacetal having a heat distortion temperature of 130 ° C. or higher, which is the component A of the binder used in the production method of the present invention, a homopolymer consisting only of trioxane, trioxane and ethylene oxide, dioxolane, substituted dioxolane, and 1,4-dioxane. And the like, and of these, one kind or two or more kinds can be appropriately mixed and used. Of these, those having a heat distortion temperature of 150 ° C. or higher are preferable. Polyacetal has a low melt viscosity, is easy to mold, and has good thermal decomposition.
【0006】B成分である融点30〜100℃のポリア
ルキレングリコール類としては、ポリエチレングリコー
ル、ポリテトラメチレングリコール、エチレンオキサイ
ド−プロピレンオキサイド共重合体などの通常分子量10
00〜 2万のものなどがあり、これらのうちから1種ある
いは2種以上を適宜混合して用いることができる。The polyalkylene glycols having a melting point of 30 to 100 ° C., which is the component B, have a usual molecular weight of 10 such as polyethylene glycol, polytetramethylene glycol, ethylene oxide-propylene oxide copolymer and the like.
There are 000 to 20,000 and the like, and one kind or two or more kinds of them can be appropriately mixed and used.
【0007】A成分としてのポリアセタールに対し、B
成分のポリアルキレングリコール類は相溶性が優れてい
る。ポリアルキレングリコール類のうちポリエチレング
リコールが好ましい。ポリエチレングリコールの分子量
は通常1000〜2万が用いられるが、成形性と脱脂時
の変形防止効果に優れることから、分子量1000〜1
万のものがより好ましい。In contrast to polyacetal as the A component, B
The component polyalkylene glycols have excellent compatibility. Of the polyalkylene glycols, polyethylene glycol is preferred. The molecular weight of polyethylene glycol is usually 1,000 to 20,000, but since it is excellent in moldability and the effect of preventing deformation during degreasing, it has a molecular weight of 1,000 to 1
Thousands are more preferable.
【0008】有機バインダーには、A、B成分の他に成
形性を改善するため第3成分(C成分)を加えてもよ
い。このようなC成分としては、ポリカーボネート、ポ
リフェニレンオキサイド、ポリフェニレンサルファイ
ド、ポリフッ化ビニリデン、ポリアミド(例えば、ナイ
ロン6、11、12、66あるいはこれらの共重合体)
ポリエステル(例えばポリエチレンテレフタレート、ポ
リブチレンテレフタレート)、ポリアリールサルフォ
ン、ポリアリールエーテル、ポリエーテルサルホン、ポ
リエーテルエーテルケトン、ワックス類(石油ワック
ス、天然ワックス、合成エアックスなど)、常温で固体
の各種低分子量化合物(ステアリン酸などの金属石鹸、
ジステアリルアミンなどの脂肪族アミン、各種界面活性
剤)、ポリエチレン、ポリプロピレン、ポリ−4−メチ
ルペンテン−1、ポリスチレン、ポリ−α−メチルスチ
レン、エチレン−酢酸ビニル共重合体、ポリメタクリル
酸エステル、ポリエチレンオキサイドなどがあげられ
る。相溶性の点からポリエチレンオキサイドが好まし
い。有機バインダーはさらに、常温で液状の可塑剤(ジ
エチルフタレート、ジブチルフタレートなど)や金属粉
末に対するバインダーの濡れ性を良くするための界面活
性剤や各種カップリング剤等を通常使用される範囲で含
有していてもよい。In addition to the components A and B, a third component (component C) may be added to the organic binder in order to improve moldability. Examples of such C component include polycarbonate, polyphenylene oxide, polyphenylene sulfide, polyvinylidene fluoride, polyamide (for example, nylon 6, 11, 12, 66 or copolymers thereof).
Polyester (eg polyethylene terephthalate, polybutylene terephthalate), polyaryl sulfone, polyaryl ether, polyether sulfone, polyether ether ketone, waxes (petroleum wax, natural wax, synthetic ax, etc.), various low-temperature solids at room temperature Molecular weight compound (metal soap such as stearic acid,
Aliphatic amines such as distearylamine, various surfactants), polyethylene, polypropylene, poly-4-methylpentene-1, polystyrene, poly-α-methylstyrene, ethylene-vinyl acetate copolymer, polymethacrylic acid ester, Examples include polyethylene oxide. Polyethylene oxide is preferable from the viewpoint of compatibility. The organic binder further contains a plasticizer (diethyl phthalate, dibutyl phthalate, etc.) which is liquid at room temperature, a surfactant for improving the wettability of the binder with respect to the metal powder, various coupling agents, etc. within the range usually used. May be.
【0009】有機バインダー中の熱変形温度130℃以
上のポリアセタール(A成分)は組成物に流動性を付与
すると共に、脱脂時の変形を防止する役目を果たす。熱
変形温度が130℃未満では変形防止効果が不十分とな
る。バインダー中に占めるA成分の量は通常20〜60
重量%、好ましくは30〜60重量%である。A成分の
量が20重量%より少ないと、成形体の強度が不足しハ
ンドリングが困難となる。融点30〜100℃のポリア
ルキレングリコール類(B成分)は組成物の流動性を増
して、射出成形を容易にするとともに、脱脂時の変形防
止効果をさらに高め、脱脂速度を早める役目を果たして
いる。その融点が30℃以下では成形体の強度が弱くな
り、100℃を超えると変形防止効果が不十分となる。
バインダー中のB成分の量は、通常40〜80重量%、
好ましくは40〜70重量%である。B成分の量が80
重量%を超えると成形体の強度が不足する。バインダー
中に占めるC成分の量は通常0〜60重量%、好ましく
は0〜30重量%である。C成分の量が60%を超える
と脱脂中に成形体が変形しやすくなる。The polyacetal (component A) having a heat distortion temperature of 130 ° C. or higher in the organic binder serves to impart fluidity to the composition and to prevent deformation during degreasing. If the heat distortion temperature is lower than 130 ° C, the deformation preventing effect becomes insufficient. The amount of component A in the binder is usually 20 to 60
%, Preferably 30 to 60% by weight. When the amount of the component A is less than 20% by weight, the strength of the molded product is insufficient and handling becomes difficult. The polyalkylene glycol (component B) having a melting point of 30 to 100 ° C. serves to increase the fluidity of the composition, facilitate injection molding, further enhance the deformation preventing effect during degreasing, and accelerate the degreasing speed. . When the melting point is 30 ° C. or lower, the strength of the molded article becomes weak, and when it exceeds 100 ° C., the deformation preventing effect becomes insufficient.
The amount of component B in the binder is usually 40 to 80% by weight,
It is preferably 40 to 70% by weight. The amount of B component is 80
If the content is more than wt%, the strength of the molded product will be insufficient. The amount of C component in the binder is usually 0 to 60% by weight, preferably 0 to 30% by weight. If the amount of C component exceeds 60%, the molded body is likely to be deformed during degreasing.
【0010】本発明の製造方法において用いる金属粉末
としては、鉄、アルミニウム、銅、チタン、モリブデ
ン、ジルコニウム、コバルト、ニッケル、クロムなどの
金属粉およびこれらの金属を主成分とする合金粉(例え
ば、ステンレス粉、高速度鋼粉、超硬合金粉、磁性材料
粉など)があり、これらのうち1種または2種以上を必
要に応じて適宜混合して使用することができる。またこ
れらの金属粉末には0〜95重量%の範囲でセラミック
粉末を加えてもよい。かかるセラミック粉末としては酸
化物(酸化アルミニウム、酸化ケイ素、酸化ジルコニ
ア、酸化チタニウム、ムライト、コーヂュライトな
ど)、炭化物(炭化ケイ素、炭化ホウ素、炭化ジルコニ
アなど)、窒化物(窒化ケイ素、窒化アルミニウム、窒
化ホウ素、窒化チタニウムなど)などの粉末がある。こ
れらの粉末には、粉末のほか、焼結助剤、成形助剤、物
性向上のための他の粉末等を適宜あらかじめ添加してお
くこともできる。添加の方法としては、単に混合しても
よいし粉末の表面にコーティングしてもよい。The metal powder used in the production method of the present invention includes metal powders of iron, aluminum, copper, titanium, molybdenum, zirconium, cobalt, nickel, chromium and alloy powders containing these metals as main components (for example, Stainless powder, high-speed steel powder, cemented carbide powder, magnetic material powder, etc.), and one or more of these may be appropriately mixed and used as necessary. Ceramic powder may be added to these metal powders in the range of 0 to 95% by weight. Such ceramic powders include oxides (aluminum oxide, silicon oxide, zirconia oxide, titanium oxide, mullite, cordierite, etc.), carbides (silicon carbide, boron carbide, zirconia carbide, etc.), nitrides (silicon nitride, aluminum nitride, boron nitride). , Titanium nitride, etc.) and other powders. In addition to the powders, sintering aids, molding aids, other powders for improving the physical properties, and the like can be appropriately added to these powders in advance. The addition method may be simple mixing or coating on the surface of the powder.
【0011】金属粉末およびセラミック粉末の平均粒径
は通常0.01μm〜50μm、好ましくは 0.1μ
m〜20μmである。粒径が0.01μmより小さい
と、焼結性は良くなるものの、かさ高くて取り扱い性が
悪くなったり、成形性が悪くなったりする。粒径が50
μmを超えると焼結性が悪くなる。本発明の製造方法に
おいて用いる粉末の組成物全体に占める量は、通常40
〜70体積%、好ましくは50〜60体積%である。粉
末量が70体積%を超えると、粉末とバインダーを均一
に混練することが難しくなり、かつ射出成形が困難とな
る。また、40体積%より少ないと脱脂時の成形体の変
形が大きくなる。The average particle size of the metal powder and the ceramic powder is usually 0.01 μm to 50 μm, preferably 0.1 μm.
It is m-20 micrometers. When the particle size is smaller than 0.01 μm, the sinterability is improved, but the bulkiness is high and the handleability is poor, and the moldability is poor. Particle size is 50
If it exceeds μm, the sinterability becomes poor. The amount of the powder used in the production method of the present invention in the whole composition is usually 40.
˜70% by volume, preferably 50-60% by volume. If the powder amount exceeds 70% by volume, it becomes difficult to uniformly knead the powder and the binder, and it becomes difficult to perform injection molding. Further, if it is less than 40% by volume, the deformation of the molded body during degreasing becomes large.
【0012】本発明の製造方法において用いる組成物
は、各成分を熔融混練し、冷却後粉砕(粗砕)あるいは
ペレット化することにより製造できる。上記において混
練はバンバリーミキサー、プラストミル、ニーダー、加
圧ニーダー、ロールミル、スクリュー式押出機などの通
常の混練機を用いて行うことができる。混練温度は通常
150〜350℃、好ましくは150〜250℃で、混
練時間は通常20分〜2時間、好ましくは30分〜1時
間である。混練を行う前に必要に応じて各成分あるいは
混合物を乾燥しておいてもよい。混練の方法は、全成分
を一度に仕込み混練する方法、バインダー成分のみをま
ず加えて混練し、ついでセラミック粉末や金属粉末を加
えて混練する方法、バインダー成分を後から加える方法
などがある。The composition used in the production method of the present invention can be produced by melt-kneading the respective components, cooling and pulverizing (coarse crushing) or pelletizing. In the above, the kneading can be carried out using an ordinary kneader such as a Banbury mixer, a plastomill, a kneader, a pressure kneader, a roll mill, a screw type extruder. The kneading temperature is usually 150 to 350 ° C., preferably 150 to 250 ° C., and the kneading time is usually 20 minutes to 2 hours, preferably 30 minutes to 1 hour. If necessary, each component or mixture may be dried before kneading. As a kneading method, there are a method in which all components are charged at once and kneaded, a binder component alone is first added and kneaded, and then ceramic powder or metal powder is added and kneaded, and a binder component is added later.
【0013】組成物を用いて射出成形する場合、通常の
プランジャー式、スクリュー式などの射出成形機を用い
ることができる。成形条件は金型形状や射出成形用組成
物によって異なるが、成形圧力は通常100〜3000
Kg/cm2、好ましくは200〜2000Kg/c
m2、成形温度は通常150〜350℃、好ましくは1
50〜250℃である。その他、押出成形、プレス成形
等を行うこともできる。加熱により熱分解しやすい組成
物については、減圧下あるいは不活性雰囲気中で混練、
成形する方法を採用してもよい。When injection molding is performed using the composition, an ordinary plunger type or screw type injection molding machine can be used. Molding conditions differ depending on the shape of the mold and the composition for injection molding, but the molding pressure is usually 100 to 3000.
Kg / cm 2 , preferably 200 to 2000 Kg / c
m 2 , the molding temperature is usually 150 to 350 ° C., preferably 1
It is 50 to 250 ° C. In addition, extrusion molding, press molding and the like can be performed. For compositions that are easily thermally decomposed by heating, kneading under reduced pressure or in an inert atmosphere,
A molding method may be adopted.
【0014】脱脂は酸化性、還元性または不活性ガス雰
囲気中、減圧、常圧または加圧下で、通常1〜60℃/
hr、好ましくは10〜40℃/hrの昇温速度で25
0〜500℃程度まで、好ましくは250〜350℃ま
で昇温し、その温度で通常0〜10時間、好ましくは1
〜5時間保持することにより行われる。本発明の製造方
法における成形体は、形を保持するために、粉末の中に
埋め込んだり、冶具で支えたりする必要はなく、そのま
ま脱脂炉中の棚板に並べて脱脂できる。ここで、成形体
を置く棚板として通風可能な構造のものを用い、成形体
の下面にも雰囲気ガスの流れをあてることによって脱脂
時間を短縮することができる。このような棚板としては
ステンレスなどの金網やセラミックなどを格子状に成形
したものなどが用いられる。Degreasing is carried out in an oxidizing, reducing or inert gas atmosphere under reduced pressure, normal pressure or increased pressure, usually at 1 to 60 ° C. /
hr, preferably 25 at a temperature rising rate of 10 to 40 ° C./hr
The temperature is raised to about 0 to 500 ° C, preferably 250 to 350 ° C, and the temperature is usually 0 to 10 hours, preferably 1
Hold for ~ 5 hours. The molded body in the manufacturing method of the present invention does not need to be embedded in the powder or supported by a jig in order to maintain the shape, and can be arranged and degreased on the shelf plate in the degreasing furnace as it is. Here, it is possible to shorten the degreasing time by using a shelf plate on which the molded body is placed and having a structure that allows ventilation, and by applying a flow of atmospheric gas to the lower surface of the molded body. As such a shelf plate, a wire mesh made of stainless steel or the like, a ceramic formed in a lattice shape, or the like is used.
【0015】焼結は通常、酸化性、還元性または不活性
ガス雰囲気中、真空、常圧または加圧下で、600〜2
000℃程度まで昇温して行う。昇温速度は通常50〜
1000℃/hrであり、最高温度で10分〜10時間
保持する。真空中で焼結を行う場合、真空度は通常10
-2torrまたはそれより高真空、好ましくは10-3t
orrまたはそれより高真空である。脱脂を粉末中に埋
め込んで行う従来法においては、焼結に移る前に脱脂体
の表面に付着している粉を払い落とす工程が必要であ
り、脱脂から焼結まで連続的に行うことが困難であった
が、本発明の組成物を使用することにより、そのような
工程は不要であり、同一の加熱炉で連続して焼結まで行
うことが可能である。Sintering is usually performed at 600 to 2 in an oxidizing, reducing or inert gas atmosphere under vacuum, atmospheric pressure or pressure.
The temperature is raised to about 000 ° C. The heating rate is usually 50-
The temperature is 1000 ° C./hr, and the maximum temperature is maintained for 10 minutes to 10 hours. When sintering in vacuum, the degree of vacuum is usually 10
-2 torr or higher vacuum, preferably 10 -3 t
Orr or higher vacuum. In the conventional method in which degreasing is embedded in the powder, it is necessary to remove the powder adhering to the surface of the degreasing body before proceeding to sintering, and it is difficult to continuously perform from degreasing to sintering. However, by using the composition of the present invention, such a step is unnecessary, and it is possible to continuously perform sintering in the same heating furnace.
【0016】[0016]
【実施例】以下、実施例により本発明をさらに説明する
が、本発明はこれに限定されるものではない。EXAMPLES The present invention will be further described below with reference to examples, but the present invention is not limited thereto.
【0017】[組成物の製造] 製造例1〜3 表1に示す組成割合の金属粉末と有機バインダーを、加
圧ニーダーを用いて150〜180℃で45分間混練
し、冷却しながら破砕して射出成形用組成物を得た。[Production of Composition] Production Examples 1 to 3 Metal powders having the composition ratios shown in Table 1 and an organic binder are kneaded at 150 to 180 ° C. for 45 minutes using a pressure kneader and crushed while cooling. An injection molding composition was obtained.
【0018】比較製造例1、2 表1に示す組成割合の金属粉末と有機バインダーを、加
圧ニーダーを用いて150℃で45分間混練し、冷却し
ながら破砕して射出成形用組成物を得た。Comparative Production Examples 1 and 2 Metal powders having the composition ratios shown in Table 1 and an organic binder were kneaded with a pressure kneader at 150 ° C. for 45 minutes and crushed while cooling to obtain an injection molding composition. It was
【0019】[0019]
【表1】 [Table 1]
【0020】表中の記号 FEN−8:平均粒径4μmの鉄粉92重量%と平均粒
径約10μmのニッケル粉8重量%の混合粉 SUS304:平均粒径10μmのステンレス粉 POM:ポリアセタールホモポリマー(熱変形温度17
0℃) CO−POM:ポリアセタールコポリマー(熱変形温度
158℃) PP:ポリプロピレン(熱変形温度110℃) PEG−4000:ポリエチレングリコール(平均分子
量4000、融点56℃) PW:パラフィンワックス(融点58℃)Symbols in the table FEN-8: Mixed powder of 92% by weight of iron powder having an average particle size of 4 μm and 8% by weight of nickel powder having an average particle size of about 10 μm SUS304: Stainless powder having an average particle size of 10 μm POM: Polyacetal homopolymer (Heat deformation temperature 17
0 ° C.) CO-POM: polyacetal copolymer (heat distortion temperature 158 ° C.) PP: polypropylene (heat distortion temperature 110 ° C.) PEG-4000: polyethylene glycol (average molecular weight 4000, melting point 56 ° C.) PW: paraffin wax (melting point 58 ° C.)
【0021】[脱脂体の製造]製造例1〜3の組成物
を、射出成形機を用い、加熱筒温度:150〜170
℃、金型温度:50℃、射出圧力:1500Kg/cm
2の条件で図1に示すような試験片(100mm×10
mm×4mm)に成形した。得られた成形体を観察した
ところ、すべて良好な外観を示していた。次いで、上記
成形体を、図2に示すように一定の間隔L(1、2、お
よび3cm)だけ離して設置した支持棒の上に載せ、循
風炉中で昇温速度20℃/hrで350℃まで上げてそ
の温度で2時間保持することによって脱脂を行った。脱
脂後図3に示すように変形量(h)を評価した。脱脂率
および変形量を表2に示す。[Production of Degreased Body] The compositions of Production Examples 1 to 3 were heated using an injection molding machine at a heating cylinder temperature of 150 to 170.
° C, mold temperature: 50 ° C, injection pressure: 1500 Kg / cm
Under the condition of 2, the test piece as shown in FIG. 1 (100 mm × 10
mm × 4 mm). Observation of the obtained moldings revealed that they all had a good appearance. Then, the above-mentioned molded body was placed on a support rod installed at a constant distance L (1, 2, and 3 cm) as shown in FIG. 2, and heated at a temperature rising rate of 20 ° C./hr in a circulating air oven at 350 ° C. Degreasing was performed by raising the temperature to 0 ° C and holding at that temperature for 2 hours. After degreasing, the deformation amount (h) was evaluated as shown in FIG. The degreasing rate and the amount of deformation are shown in Table 2.
【0022】[0022]
【図1】[Figure 1]
【0023】[0023]
【図2】FIG. 2
【0024】[0024]
【図3】FIG. 3
【0025】比較例1および2の組成物を、射出成形機
の加熱筒温度を 150℃、射出圧力を1000Kg/
cm2にした以外は、実施例1と同様に成形、脱脂を行
った。脱脂率および変形量を表2に示す。The compositions of Comparative Examples 1 and 2 were heated at a heating cylinder temperature of an injection molding machine of 150 ° C. and an injection pressure of 1000 Kg / g.
Molding and degreasing were performed in the same manner as in Example 1 except that the size was changed to cm 2 . The degreasing rate and the amount of deformation are shown in Table 2.
【0026】[0026]
【表2】 [Table 2]
【0027】本発明の製造方法において用いる製造例1
〜3の組成物の脱脂体は、表2に示すように全く変形し
ておらず、脱脂率も約98重量%であり、成形体の外観
も全て良好であった。一方、比較製造例1、2の組成物
の脱脂体は、表2に示すように脱脂率は約85重量%で
あり、変形量は支持棒の間隔が1cmと狭い場合でも若
干の変形が認められ、2cm以上では大きく変形した。Production Example 1 used in the production method of the present invention
The degreased bodies of the compositions Nos. 3 to 3 were not deformed at all as shown in Table 2, the degreasing rate was about 98% by weight, and the appearances of the molded articles were all good. On the other hand, the degreased bodies of the compositions of Comparative Production Examples 1 and 2 had a degreasing rate of about 85% by weight as shown in Table 2, and the deformation amount was slightly deformed even when the distance between the supporting rods was as narrow as 1 cm. And was deformed significantly at 2 cm or more.
【0028】実施例1 製造例3で得た脱脂体を10-3torrより高真空中で
1250℃×2hr焼結を行い、相対密度95%の焼結
体を得た。 実施例2 ステンレス粉として平均粒径が4.7μmのものを用い
た以外は製造例3と同様にして得た脱脂体を、実施例1
と同様に焼結し、相対密度98%の焼結体を得た。Example 1 The degreased body obtained in Production Example 3 was sintered at 1250 ° C. for 2 hours in a vacuum higher than 10 −3 torr to obtain a sintered body having a relative density of 95%. Example 2 A degreased body obtained in the same manner as in Production Example 3 except that stainless steel powder having an average particle diameter of 4.7 μm was used was used.
Sintering was performed in the same manner as above to obtain a sintered body having a relative density of 98%.
【0029】製造例1〜3、比較製造例1、2から判る
ように、有機バインダーがポリプロピレンとワックスの
ような場合は、脱脂時に自重による変形が起こりやす
い。一方、本発明の製造方法において用いる組成物によ
れば、バインダー成分として熱変形温度130℃以上で
かつ熱分解しやすいポリアセタールと、融点が30〜1
00℃でかつ熱分解しやすいポリアルキレングリコール
類を併用することにより、支持棒の間隔が広くなっても
(すなわち、成形品が大型になっても)、変形のない良
好な脱脂体を得ることができ、また比較的低温度で短時
間に脱脂を行うことができた。なお、上記製造例、比較
製造例では金属粉末について実施した結果のみを示した
が、金属粉末とセラミック粉末の混合物についても従来
組成に比べ脱脂体の変形がより少なくなる結果が得られ
ている。As can be seen from Production Examples 1 to 3 and Comparative Production Examples 1 and 2, when the organic binder is polypropylene and wax, deformation due to its own weight is likely to occur during degreasing. On the other hand, according to the composition used in the production method of the present invention, a polyacetal having a heat distortion temperature of 130 ° C. or more and easily thermally decomposed as a binder component, and a melting point of 30 to 1 are used.
Use of polyalkylene glycols that are easily decomposed by heat at 00 ° C to obtain a good degreased body that does not deform even if the distance between the supporting rods is wide (that is, the molded product is large). Moreover, degreasing could be performed at a relatively low temperature in a short time. In addition, in the above Production Examples and Comparative Production Examples, only the results obtained by performing the metal powder are shown. However, the results of the deformation of the degreased body being smaller than those of the conventional composition are obtained for the mixture of the metal powder and the ceramic powder.
【0030】[0030]
【発明の効果】本発明の製造方法は下記の効果を奏す
る。 脱脂時の自重による変形が防止されるため、従来、
脱脂の際必要だった粉体中への埋め込みや、保形用の冶
具などが不要となり、生産性および製品の精度があが
る。 複雑形状品や大型成形品のように、粉体中への埋め
込みや冶具による保形がやりにくいもの、およびステン
レス粉を用いた成形品のように脱脂時変形しやすいもの
でも、変形のない脱脂体を得ることができる。 脱脂体を粉体中から取り出す工程が不要となるた
め、脱脂から焼結まで連続生産することが可能となり、
生産性を上げることができる。 従来の組成物を用いたものよりも昇温速度を上げる
ことができ、したがって脱脂時間を短縮できる。The manufacturing method of the present invention has the following effects. Since it is prevented from being deformed by its own weight during degreasing,
It eliminates the need for embedding into powder and jigs for shape retention, which were required for degreasing, and improves productivity and product accuracy. Degreasing that does not deform, even if it is difficult to embed in powder or retain shape by a jig, such as complicated shaped products or large molded products, and that easily deforms during degreasing, such as molded products using stainless steel powder You can get the body. Since the step of removing the degreased body from the powder is unnecessary, continuous production from degreasing to sintering becomes possible.
Productivity can be increased. The temperature rising rate can be increased as compared with the conventional composition, and the degreasing time can be shortened.
【0031】[0031]
第1図は試験片の斜視図、第2図は試験片の変形の測定
方法を示す図、第3図は変形量の説明図である。FIG. 1 is a perspective view of a test piece, FIG. 2 is a view showing a method for measuring the deformation of the test piece, and FIG. 3 is an explanatory view of the amount of deformation.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 C04B 35/64 301 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location C04B 35/64 301
Claims (4)
末の混合粉と、熱変形温度130℃以上のポリアセター
ル(A成分)と融点30〜100℃のポリアルキレング
リコール類(B成分)からなる有機バインダーを熔融混
練して成形用組成物を作成し、この組成物を所望の形状
に成形し、次いでこの成形体から有機バインダーを加熱
除去し、得られた脱脂体を焼結することを特徴とする焼
結体の製造方法。1. An organic binder comprising a metal powder or a mixed powder of a metal powder and a ceramic powder, a polyacetal (A component) having a heat distortion temperature of 130 ° C. or more, and a polyalkylene glycol (B component) having a melting point of 30 to 100 ° C. Melt kneading to prepare a molding composition, molding the composition into a desired shape, heating and removing the organic binder from the molded body, and sintering the obtained degreased body. A method for producing a bound body.
量%を占めることを特徴とする請求項1記載の製造方
法。2. The method according to claim 1, wherein the component B accounts for 40 to 70% by weight of the organic binder.
可能な棚板上に置き、成形体の下面にも雰囲気ガスの流
れをあてるようにして行う請求項1または2記載の製造
方法。3. The method according to claim 1, wherein the removal of the organic binder is carried out by placing the molded body on a shelf plate through which the molded body can be ventilated, and applying a flow of atmospheric gas to the lower surface of the molded body.
機バインダーの除去を酸化雰囲気下で行い、焼結を10
-3torr以下の真空下で行う請求項1〜4のいずれか
記載の製造方法。4. Stainless steel powder is used as the metal powder, the organic binder is removed in an oxidizing atmosphere, and sintering is performed at 10
The method according to any one of claims 1 to 4, which is performed under a vacuum of -3 torr or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5315970A JPH0820803A (en) | 1993-11-22 | 1993-11-22 | Production of sintered compact |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5315970A JPH0820803A (en) | 1993-11-22 | 1993-11-22 | Production of sintered compact |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63297011A Division JPH0641601B2 (en) | 1988-02-18 | 1988-11-24 | Molding composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0820803A true JPH0820803A (en) | 1996-01-23 |
Family
ID=18071778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5315970A Pending JPH0820803A (en) | 1993-11-22 | 1993-11-22 | Production of sintered compact |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0820803A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001305970A (en) * | 2000-04-18 | 2001-11-02 | Silver Making Kk | Advertising device having internal illumination |
US6687474B2 (en) | 2001-06-08 | 2004-02-03 | Ricoh Company, Ltd. | Developing apparatus, image formation apparatus, and process cartridge |
JP2013524006A (en) * | 2010-04-01 | 2013-06-17 | テヒニーシェ ウニヴェルジテート ウィーン | Method for producing molded product of aluminum alloy |
WO2022215473A1 (en) * | 2021-04-07 | 2022-10-13 | 旭化成株式会社 | Molded body, method for producing molded body and method for producing sintered body |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59141458A (en) * | 1983-01-21 | 1984-08-14 | ヘキスト・セラニーズ・コーポレーション | Polyacetal binder for ceramic injection molding |
-
1993
- 1993-11-22 JP JP5315970A patent/JPH0820803A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59141458A (en) * | 1983-01-21 | 1984-08-14 | ヘキスト・セラニーズ・コーポレーション | Polyacetal binder for ceramic injection molding |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001305970A (en) * | 2000-04-18 | 2001-11-02 | Silver Making Kk | Advertising device having internal illumination |
US6687474B2 (en) | 2001-06-08 | 2004-02-03 | Ricoh Company, Ltd. | Developing apparatus, image formation apparatus, and process cartridge |
JP2013524006A (en) * | 2010-04-01 | 2013-06-17 | テヒニーシェ ウニヴェルジテート ウィーン | Method for producing molded product of aluminum alloy |
WO2022215473A1 (en) * | 2021-04-07 | 2022-10-13 | 旭化成株式会社 | Molded body, method for producing molded body and method for producing sintered body |
EP4321546A4 (en) * | 2021-04-07 | 2024-08-28 | Asahi Kasei Kabushiki Kaisha | MOLDED BODY, METHOD FOR PRODUCING A MOLDED BODY AND METHOD FOR PRODUCING A SINTERED BODY |
TWI867285B (en) * | 2021-04-07 | 2024-12-21 | 日商旭化成股份有限公司 | Formed body, method for producing formed body, and method for producing sintered body |
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