JPH08204292A - Electronic parts mounting board, electronic parts mounting jig, and electronic parts mounting method - Google Patents
Electronic parts mounting board, electronic parts mounting jig, and electronic parts mounting methodInfo
- Publication number
- JPH08204292A JPH08204292A JP7031593A JP3159395A JPH08204292A JP H08204292 A JPH08204292 A JP H08204292A JP 7031593 A JP7031593 A JP 7031593A JP 3159395 A JP3159395 A JP 3159395A JP H08204292 A JPH08204292 A JP H08204292A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- board
- electronic parts
- electronic component
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 abstract description 5
- 238000006073 displacement reaction Methods 0.000 abstract description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Structure Of Printed Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子機器用の実装基
板、及び実装基板に電子部品を実装するための実装治具
及び実装方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting board for electronic equipment, a mounting jig for mounting electronic components on the mounting board, and a mounting method.
【０００２】[0002]
【従来の技術】従来、電子機器における実装基板、及び
電子部品の実装方法は、一般には、次のように行われて
いる。電子部品がリード線を持っているものの場合、前
記実装基板は、基板上に形成された配線パターンの導体
に接続するスルーホールを設け、載置された電子部品の
リード線を通すようにしたものが使用されている。一
方、その実装方法は、前記実装基板のスルーホールに電
子部品のリード線を通してリフロー等により半田付け
し、その後、半田からはみ出たリード線を切断してい
た。2. Description of the Related Art Conventionally, a mounting board for electronic equipment and a method for mounting electronic components are generally performed as follows. In the case where the electronic component has a lead wire, the mounting board is provided with a through hole for connecting to a conductor of a wiring pattern formed on the board so that the lead wire of the mounted electronic component can pass through. Is used. On the other hand, in the mounting method, a lead wire of an electronic component is passed through a through hole of the mounting board for soldering by reflow or the like, and then the lead wire protruding from the solder is cut.
【０００３】しかし、前記リード線が変形していると、
装着作業の効率が悪く、自動化が困難である。又、該リ
ード線をスルーホールに挿入する時、リード線が曲がっ
てしまうことがある。その曲がった状態で半田される
と、部品間のショートや部品の配列の不ぞろいが起きる
という問題がある。これを解決するために、表面実装用
の端子を持った部品が実用化された。又、前記表面実装
用の端子を持った部品に使用する実装基板は、電子部品
の相互間で生じるノイズ等の干渉防止のために、該部品
の周囲にアース電位にあるスルーホールを設けているも
のが使用される。しかし、このスルーホールは、部品の
位置決めには、特に、寄与していない。一方、実装方法
は、基板の実装位置に前もって半田ペーストを塗布し、
その上に部品を載せ、リフロー等により半田付けしてい
た。However, if the lead wire is deformed,
The mounting work is inefficient and difficult to automate. Further, when the lead wire is inserted into the through hole, the lead wire may be bent. If soldering is performed in the bent state, there is a problem that short-circuiting between components or irregular arrangement of components occurs. In order to solve this, parts having terminals for surface mounting have been put into practical use. Further, in the mounting board used for the component having the surface mounting terminal, a through hole at a ground potential is provided around the component in order to prevent interference of noise or the like generated between electronic components. Stuff used. However, this through hole does not particularly contribute to the positioning of the component. On the other hand, the mounting method is to apply solder paste in advance to the mounting position on the board,
Parts were placed on it and soldered by reflow or the like.
【０００４】[0004]
【発明が解決しようとする課題】しかし、表面実装用端
子を持つ電子部品の場合、部品を所定の位置に配置し、
リフロー等の作業で固定する際、位置ずれを起こし易
い。又、自動化しても正確な位置に配置するためには、
高価な設備が必要となり、原価高となる。又、電子部品
を基板に固定するため、移動時に所定の位置からずれて
しまうという問題がある。その結果、実装された基板上
で部品が動作しなかったり、ショートしたりして、歩留
の低下と、信頼性を低下させてしまうという問題があっ
た。よって、本発明の課題は、前述の問題を解消して、
実装基板の所定の位置に電子部品を簡単に載置でき、か
つ電子部品を実装基板に固定、接続する際、例えば、リ
フロー等による半田付けの際、位置ずれがなく、確実に
所定の位置に固定、接続ができ、歩留が高く、安定した
品質の電子機器用実装済基板が得られる実装基板と、そ
の実装用治具及び実装方法を供することにある。However, in the case of an electronic component having terminals for surface mounting, the component is placed at a predetermined position,
When fixing by work such as reflow, misalignment easily occurs. In addition, even if it is automated, in order to place it in the correct position,
Expensive equipment is required, resulting in high cost. Further, since the electronic component is fixed to the substrate, there is a problem that the electronic component is displaced from a predetermined position during movement. As a result, there is a problem that a component does not operate on the mounted substrate or short-circuits, resulting in a decrease in yield and a decrease in reliability. Therefore, the object of the present invention is to solve the above-mentioned problems,
The electronic component can be easily placed at a predetermined position on the mounting board, and when the electronic component is fixed and connected to the mounting board, for example, when soldering by reflow or the like, there is no positional deviation, and the electronic component can be securely positioned An object of the present invention is to provide a mounting board that can be fixed and connected, has a high yield, and can obtain a stable mounted board for electronic equipment, a mounting jig, and a mounting method.
【０００５】[0005]
【課題を解決するための手段】本発明は、電子機器用
実装基板において、配置する電子部品の設置面の外周に
接するように、該実装基板に複数個のスルーホール及び
サイドカットスルーホールを設けたことを特徴とする実
装基板であり、上記の実装基板に電子部品を実装す
る際に用いる板状の実装治具において、前記基板の外形
に等しいか、それより大きい平面を持ち、かつ前記治具
の上面に前記基板を配置した時、該基板のスルーホール
及びサイドカットスルーホールの位置に、半田が付きに
くい材質からなるサイドピンが立設されたことを特徴と
する実装治具であり、電子機器に用いる実装基板に電
子部品を実装する実装方法において、上記の実装治具
を用いて、該実装治具上に、上記の実装基板を該実装
基板のスルーホール及びサイドカットスルーホールに、
上記の実装治具のガイドピンに合わせて装着し、その
後、該実装基板の上面に突き出したガイドピンを案内に
して、各電子部品を実装基板のパターン上に載置し、前
記ガイドピンで電子部品の移動を抑制した状態で、前記
電子部品を前記実装基板に固定することを特徴とする実
装方法である。According to the present invention, in a mounting board for electronic equipment, a plurality of through holes and side cut through holes are provided in the mounting board so as to be in contact with the outer periphery of the installation surface of the electronic component to be arranged. In a plate-shaped mounting jig used for mounting electronic components on the mounting board, the mounting board has a flat surface equal to or larger than the outer shape of the board, A mounting jig, characterized in that, when the substrate is arranged on the upper surface of the tool, side pins made of a material that is hard to attach solder are erected at positions of through holes and side cut through holes of the substrate, In a mounting method for mounting an electronic component on a mounting board used in an electronic device, the mounting jig is mounted on the mounting board, and the mounting board is mounted on the mounting board. In Tsu door through-hole,
The mounting jig is mounted according to the guide pins of the mounting jig, and then the guide pins protruding from the upper surface of the mounting board are used as guides to place the electronic components on the pattern of the mounting board, and the electronic pins are used to guide the electronic components. The mounting method is characterized in that the electronic component is fixed to the mounting substrate in a state where movement of the component is suppressed.
【０００６】[0006]
【作用】本発明は、実装基板にスルーホール及びサイド
カットスルーホールを持たせ、実装治具にガイドピンを
持たせることにより、電子部品を実装基板の所定の位置
に容易に配置でき、かつ該部品をリフロー等の方法で固
定、接続する場合でも、位置ずれがなく、速やかに、か
つ容易に固定でき、品質の安定と同時に、生産性の向上
も図れる。According to the present invention, the mounting board is provided with the through holes and the side cut through holes, and the mounting jig is provided with the guide pins, whereby the electronic component can be easily arranged at a predetermined position of the mounting board. Even when parts are fixed and connected by a method such as reflowing, there is no positional displacement and they can be fixed quickly and easily, quality is stabilized, and productivity is improved.
【０００７】[0007]
【実施例】以下、本発明の一実施例について、図１及び
図２を参照しながら説明する。図１は、本発明による実
装治具に装着した実装基板に電子部品を載置した状態を
示した斜視図であり、図２は、本発明による実装治具に
装着した実装基板上の電子部品の設置面の外周と、サイ
ドカットスルーホール、スルーホール、ガイドピンの各
位置関係を示す平面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a perspective view showing a state in which electronic components are mounted on a mounting board mounted on a mounting jig according to the present invention, and FIG. 2 is an electronic component on a mounting board mounted on a mounting jig according to the present invention. FIG. 3 is a plan view showing the positional relationship between the outer periphery of the installation surface and side cut through holes, through holes, and guide pins.
【０００８】図１及び図２において、実装基板３は、電
子部品４を載置する設置面の外周に接してスルーホール
７とサイドカットスルーホール６を設けている。又、実
装基板３には、該部品４を接続する配線パターン８が設
けられている。スルーホール７とサイドカットスルーホ
ール６は、内面に電極が施され、他の面の回路とも接続
できる。しかし、これらのサイドカットスルーホール６
やスルーホール７は、特に、アース電位を持たせる必要
がなく、位置決めの目的のみの場合は、ホール内の電極
がなく、ただの穴でよい。なお、サイドカットスルーホ
ール６は、図１、又は図２に示すように、主として、実
装基板３の端部に設けられるスルーホールで半円形のも
のである。実装治具１は、実装基板３と外形が同じ大き
さか、それより大きく、又、平面状の板で作業するのに
十分な厚みを持っている。実装治具１の上には、スルー
ホール７の直径より細い径のガイドピン２ａと、サイド
カットスルーホール６の直径よりも小さい径のガイドピ
ン２ｂが立設されている。又、該ガイドピン２は、実装
基板３に載置される電子部品４が所定の位置から動かな
いように、実装基板上の電子部品４が装着される設置面
の外周に接して植設され、所定の長さを持っており、形
状は問わない。更に、このガイドピン２は、半田が付き
にくいアルミニウムやステンレス等の材質でできてい
る。In FIGS. 1 and 2, the mounting substrate 3 is provided with through holes 7 and side cut through holes 6 in contact with the outer periphery of the installation surface on which the electronic component 4 is mounted. The mounting board 3 is provided with a wiring pattern 8 for connecting the component 4. The through holes 7 and the side cut through holes 6 are provided with electrodes on their inner surfaces and can be connected to circuits on other surfaces. However, these side cut through holes 6
The through hole 7 does not need to have a ground potential, and if it is only for the purpose of positioning, there is no electrode in the hole and it may be a simple hole. The side cut through hole 6 is, as shown in FIG. 1 or FIG. 2, mainly a through hole provided in an end portion of the mounting board 3 and is a semicircular shape. The mounting jig 1 has an outer shape that is the same as or larger than the outer shape of the mounting substrate 3, and has a thickness sufficient to work with a flat plate. On the mounting jig 1, a guide pin 2a having a diameter smaller than that of the through hole 7 and a guide pin 2b having a diameter smaller than that of the side cut through hole 6 are provided upright. Further, the guide pin 2 is planted in contact with the outer periphery of the installation surface on which the electronic component 4 is mounted on the mounting substrate so that the electronic component 4 mounted on the mounting substrate 3 does not move from a predetermined position. It has a predetermined length and its shape does not matter. Further, the guide pin 2 is made of a material such as aluminum or stainless steel which is hard to be soldered.
【０００９】実装治具１のガイドピン２と実装基板３の
各ホールとを合わせて、半田ペースト５を所定の接続箇
所に塗布した実装基板３を実装治具１の上に装着する。
その後、電子部品４を、ガイドピン２に沿って導き、配
線パターン８上に載置する。この状態で前記電子部品４
の半田付けをリフロー半田付けにより行う。なお、ガイ
ドピン２は、ステンレス製の半田が付着しにくい材質を
用いて作製したので、半田付けによって該ガイドピン２
に半田が付着したりして、実装基板３と実装治具が固着
することはなかった。The mounting pins 3 of the mounting jig 1 are aligned with the holes of the mounting substrate 3, and the mounting substrate 3 coated with the solder paste 5 at predetermined connection points is mounted on the mounting jig 1.
After that, the electronic component 4 is guided along the guide pins 2 and placed on the wiring pattern 8. In this state, the electronic component 4
Solder by reflow soldering. Since the guide pin 2 is made of a material made of stainless steel to which solder is unlikely to adhere, the guide pin 2 is soldered.
The mounting board 3 and the mounting jig were not fixed to each other due to solder being attached to the mounting board 3.
【００１０】[0010]
【発明の効果】以上、説明したように、本発明の電子機
器に用いられる実装基板、及び該実装基板に電子部品を
実装するための実装治具を使用することにより、実装基
板に電子部品を載置し易く、かつ電子部品を実装基板に
接続、固定する際、電子部品の位置ずれを防ぐことがで
き、信頼性を上げ、かつ生産性を向上させることができ
る。As described above, by using the mounting board used in the electronic device of the present invention and the mounting jig for mounting the electronic component on the mounting board, the electronic component can be mounted on the mounting board. The electronic component can be easily placed, and when the electronic component is connected and fixed to the mounting board, the electronic component can be prevented from being displaced, and the reliability can be improved and the productivity can be improved.
【図１】本発明による実装治具に装着した実装基板に電
子部品を載置した状態を示した斜視図。FIG. 1 is a perspective view showing a state in which electronic components are mounted on a mounting board mounted on a mounting jig according to the present invention.
【図２】本発明による実装治具に装着した実装基板上の
電子部品の設置面の外周と、サイドカットスルーホー
ル、スルーホール、ガイドピンの各位置関係を示す平面
図。FIG. 2 is a plan view showing an outer periphery of a mounting surface of an electronic component on a mounting board mounted on a mounting jig according to the present invention, and positional relationships among side cut through holes, through holes, and guide pins.
１ 実装治具 ２，２ａ，２ｂ ガイドピン ３ （実装）基板 ４ （電子）部品 ５ 半田ペースト ６ サイドカットスルーホール ７ スルーホール ８ 配線パターン 1 Mounting jig 2, 2a, 2b Guide pin 3 (Mounting) board 4 (Electronic) component 5 Solder paste 6 Side cut through hole 7 Through hole 8 Wiring pattern
Claims (3)
電子部品の設置面の外周に接するように、該実装基板に
複数個のスルーホール及びサイドカットスルーホールを
設けたことを特徴とする実装基板。1. A mounting board for an electronic device, wherein a plurality of through holes and side cut through holes are provided in the mounting board so as to be in contact with an outer periphery of an installation surface of an electronic component to be arranged. .
装する際に用いる板状の実装治具において、前記基板の
外形に等しいか、それより大きい平面を持ち、かつ前記
治具の上面に前記基板を配置した時、該基板のスルーホ
ール及びサイドカットスルーホールの位置に、半田が付
きにくい材質からなるサイドピンが立設されたことを特
徴とする実装治具。2. A plate-shaped mounting jig used for mounting an electronic component on the mounting board according to claim 1, which has a flat surface equal to or larger than the outer shape of the board, and has an upper surface of the jig. A mounting jig, characterized in that, when the substrate is placed in the substrate, side pins made of a material that does not easily attach solder are erected at the positions of the through holes and the side cut through holes of the substrate.
実装する実装方法において、請求項２記載の実装治具を
用いて、該実装治具上に、請求項１記載の実装基板を該
実装基板のスルーホール及びサイドカットスルーホール
に、請求項２記載の実装治具のガイドピンに合わせて装
着し、その後、該実装基板の上面に突き出したガイドピ
ンを案内にして、各電子部品を実装基板のパターン上に
載置し、前記ガイドピンで電子部品の移動を抑制した状
態で、前記電子部品を前記実装基板に固定することを特
徴とする実装方法。3. A mounting method for mounting an electronic component on a mounting board used for electronic equipment, wherein the mounting jig according to claim 2 is used, and the mounting board according to claim 1 is mounted on the mounting jig. The electronic component is mounted on the through hole and the side cut through hole of the board in accordance with the guide pin of the mounting jig according to claim 2, and then using the guide pin protruding on the upper surface of the mounting board as a guide. A mounting method, wherein the electronic component is mounted on a pattern of a substrate, and the electronic component is fixed to the mounting substrate while the movement of the electronic component is suppressed by the guide pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7031593A JPH08204292A (en) | 1995-01-26 | 1995-01-26 | Electronic parts mounting board, electronic parts mounting jig, and electronic parts mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7031593A JPH08204292A (en) | 1995-01-26 | 1995-01-26 | Electronic parts mounting board, electronic parts mounting jig, and electronic parts mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08204292A true JPH08204292A (en) | 1996-08-09 |
Family
ID=12335498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7031593A Pending JPH08204292A (en) | 1995-01-26 | 1995-01-26 | Electronic parts mounting board, electronic parts mounting jig, and electronic parts mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08204292A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011128719A (en) * | 2009-12-15 | 2011-06-30 | Renesas Electronics Corp | External storage device and method of manufacturing the same |
-
1995
- 1995-01-26 JP JP7031593A patent/JPH08204292A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011128719A (en) * | 2009-12-15 | 2011-06-30 | Renesas Electronics Corp | External storage device and method of manufacturing the same |
| US8705238B2 (en) | 2009-12-15 | 2014-04-22 | Renesas Electronics Corporation | External storage device and method of manufacturing external storage device |
| US9666659B2 (en) | 2009-12-15 | 2017-05-30 | Renesas Electronics Corporation | External storage device and method of manufacturing external storage device |
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