JPH08201429A - Probe card - Google Patents

Abstract

PURPOSE: To provide a probe card which can cope with electronic parts having a very large number of electrodes. CONSTITUTION: A prove card 19 is provided with many probe needles 16, 17, and 18 which are elastically brought into contact with the many external electrodes of electronic parts which are supported by an insulating block 15 one end of which is fixed to an insulating substrate 14 and the intermediate section of which is protruded from the substrate 14, extended in the inclined direction, and have free ends nearly arranged in a straight line. The many probe needles are divided into a plurality of groups and one-side ends of the needles 16, 17, and 18 of each divided group are arranged on the opposite side of the block 15. Therefore, the uneven deformation of a base substrate can be prevented and the contact pressures of the probe needles become nearly even. As a result, the contact resistances of the needles can be made almost even and the electrical characteristic of an object can be measured accurately.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card used for inspecting electrical characteristics of electronic parts, and more particularly to a probe card which can be applied to electronic parts having a large number of electrodes.

[0002]

2. Description of the Related Art TA is an electronic component capable of high-density mounting.
B type semiconductor devices are generally used. An example of this will be described with reference to FIGS. 3 and 4. In the figure, 1 is a long insulating film, and feed holes 1a and 1a are provided along both sides.
Rectangular through holes 1b are formed in the middle of the width direction at predetermined intervals in the longitudinal direction of the insulating film. Reference numeral 2 denotes a conductive pattern formed by etching a conductive foil laminated on the insulating film 1, and includes an inner lead 2a extending in the through hole 1b and an outer lead 2b externally connected. A conductive pattern 2 is laminated on the insulating film 1 to form a TAB tape 3. Reference numeral 4 is a semiconductor pellet having a large number of electrodes (not shown) formed on the surface thereof, which is arranged in the through hole 1b of the TAB tape 3 and is electrically connected to the inner lead 2a by superimposing the electrode on the TAB tape. The semiconductor device intermediate structure 5 is configured. In the manufacture of this electronic component, the TAB tape 3 wound on a reel (not shown) is unwound from the reel and supplied to the manufacturing process, and after the work is completed, the TAB tape 3 is rewound on the reel for storage and movement between processes.

The intermediate structure 5 in which the semiconductor pellets 4 are connected to the TAB tape 3 is subjected to an electrical inspection in the subsequent step to inspect the connection state between the conductive patterns 2 and the semiconductor pellets 4 and the quality of the characteristics of the semiconductor pellets 4, and the inspection result The defective part is cut and removed and only the non-defective part is reconnected, followed by the resin coating process, aging process, appearance inspection process, etc., and the product is shipped in a state of being wound on a reel, and a predetermined position of the TAB tape 3 is formed in a predetermined pattern. By punching, the semiconductor device is separated into individual semiconductor devices and mounted on an electronic circuit device. As an example of this type of electronic component, in a semiconductor device for driving a liquid crystal display device, one having more than 200 electronic components with one electrode is used in response to the increase in size and high definition of the liquid crystal display device. In order to meet the demand for more and more electrodes, more electrodes have been demanded, and the width and interval of the electrodes have been narrowed to meet the demand. On the other hand, in the electrical inspection process of this electronic component, a probe connected to a power source or a measuring device is elastically and electrically contacted with the outer lead 2b portion of the conductive pattern 2 to perform the inspection, and the result is judged as good or bad. Is done.

5 and 6 show an external power source and a measuring device
An example of a probe card for connecting to the AB type semiconductor device 5 is shown. In the figure, 6 is a base substrate made of, for example, glass epoxy resin and having a thickness of 3.5 mm and a diameter of about 200 mm, and a through hole 6a is formed at a predetermined position. 7 are arranged on one surface (upper surface) 6b of the base substrate 6 and
a is a fixed number of probe needles, which are made of a material such as a tungsten wire having excellent wear resistance and elastic force, and are formed in a taper shape toward the tip (free end) 7b,
The free ends 7b are arranged in a substantially straight line in a plan view and are inclined with respect to the base substrate 6. The free end 7b of the probe needle 7 is seen through the through hole 6a. Reference numeral 8 is a support block that is fixed to the base substrate 6 to support the intermediate portion of the probe needle 7 and to fix it with an adhesive (not shown) in order to stabilize the inclination angle of the probe needle 7 and accurately position the free end of the probe needle 7. The base substrate 6 to which the needle 7 is fixed is called a probe card 9. Reference numeral 10 is a base block that supports the peripheral edge portion of the probe card 9 with the projecting wall 10a, and 11 is a contactor that is erected inside the projecting wall 10a of the base block 10, and is the other surface (lower surface) of the base substrate 6.
The probe needle 7 is elastically contacted with the base plate 6 and is electrically connected to the probe needle 7 through conductive patterns (not shown) formed on the front and back surfaces 6b and 6c of the base substrate 6. Further, the contactor 11 is connected to an external power source for measurement and a measuring device.

The probe card 9 is arranged below a predetermined position in the moving path of the semiconductor device intermediate structure 5 which is guided and moved by a guide mechanism (not shown).
It moves up and down relatively with respect to and separates from each other. Further, above the intermediate structure 5, there is provided a pressing block 12 for pressing the intermediate structure 5 with the electrode (conductive pattern) and the free end 7b of the probe needle 7 positioned and superposed to sink the probe needle 7 to a predetermined depth. It is arranged. The operation of the probe card 9 will be described below. First, the semiconductor pellet 4 of the intermediate structure 5 is stopped at a predetermined position, the free end 7b of the probe needle 7 of the probe card 9 is brought close to the electrode of the intermediate structure 5, and the TV camera (see FIG. Outer lead 2b and free end 7b
Position of the probe needle 9 is accurately positioned by a positioning mechanism (not shown), the probe card 9 and the intermediate structure 5 are brought closer to each other, and the probe needle free end 7b is connected to the outer lead 2b.
Contact. Then, from this contact surface, for example, 100 μ
It is pushed down by a pressing block 12 having a predetermined depth of about m to generate an elastic force on the probe needle 7, and the outer lead 2b
Ensure contact with, and make contact resistance as low as possible.

In this way, with the electrical connection between the external measuring device and the intermediate structure 5 completed, the measuring device is operated to perform measurement, and the quality of the intermediate structure 5 is determined based on the result. When the measurement is completed, raise the pressing block 12,
The probe needle 7 is separated from the intermediate structure 5, the intermediate structure 5 is moved by a predetermined pitch, the next semiconductor pellet is positioned at a predetermined position, and the above operation is repeated. In this probe card 9, the probe needle 7 is prepared in accordance with the arrangement structure and the size and shape of the conductive pattern of the intermediate structure 5, and the probe card 9 corresponding to the intermediate structure 5 to be measured is selected and exchanged and attached to the base block 10. , Corresponding to various intermediate structures 5. As an example, in the case of a semiconductor device for driving a liquid crystal display device, 30 to 40 lines are provided on the input side and about 2 lines are provided on the output side.
00 conductive patterns are formed, and from the viewpoint of mountability to a liquid crystal display device, the input / output outer leads are, for example, 6
They are arranged on parallel straight lines separated by 0 mm. Such a probe card for a semiconductor device has a probe needle 7
The probe needles 7 on the output side, which have a large number, are arranged with the free ends 7a in a staggered manner so that adjacent probe needles 7, 7 are not short-circuited.

[0007]

By the way, this probe card 9 generates elastic force by further pressing the probe needle 7 from the contact surface with the intermediate structure 5.
Although the contact pressure is increased and the contact resistance is lowered, if the contact pressure per probe needle 7 is several tens to 100 g, in the case of the semiconductor device for liquid crystal display device, the input side probe needle has 300 to 1,000 g. A pressure of 2 Kg to 20 Kg is applied to the output side probe needle, and these forces are applied to the probe needle fixing portion of the base substrate 5, that is, in the vicinity of the support block 8. A large number of probe needles 7 are divided into two groups and are arranged in parallel with each other. However, when the number of probe needles in each group increases, the pressing force unevenly presses the base substrate 6 and the center of the base substrate 6 is pressed. The part of the probe needle 7 and the electrode of the intermediate structure 5 are varied by inclining and deforming the part,
There is a problem that the base substrate 6 remains deformed by repeated use.

Therefore, in the case where the number of probe needles 7 is large and the probe needles 7 are unevenly arranged on the base substrate 6,
As shown in FIG. 7, a reinforcing plate 13 as a reinforcing member is fixed to the back surface of the base substrate 6. The reinforcing plate 13 is made of high-tensile stainless steel having a thickness of about 5 mm.
A through hole 13a is formed in the through hole 6a of the base substrate 6, and is fixed to the central portion of the base substrate 6 by screwing or the like so as not to hinder the contact 10. This allows
The amount of deformation with respect to the peripheral portion of the central portion of the base substrate 6 is 10
Although it was possible to reduce the size from about 0 μm to about 20 to 30 μm and the effect as a reinforcing member was confirmed, the deformation was large on the output side where the number of probes was large, and therefore the output side probe needle 7
The contact pressure may decrease and the contact resistance may increase, and since the current flowing through the probe needle on the output side is large, the voltage drop due to the contact resistance may affect the measurement results. Was wanted.

[0009]

SUMMARY OF THE INVENTION The present invention has been proposed for the purpose of solving the above-mentioned problems. One end is fixed to an insulating substrate and an intermediate portion is supported by an insulating block projecting on the insulating substrate so as to be tilted. In a probe card having a large number of probe needles whose extended ends are elastically contacted with a large number of external electrodes arranged substantially on a straight line of an electronic component, the plurality of probe needles are divided into a plurality of sets, and each set of probe needles is divided. There is provided a probe card characterized in that one end of is disposed on the opposite side to the insulating block. This probe card can divide a plurality of probe needles corresponding to the external electrodes having a large number of electrodes into an electronic component having at least two sets of external electrodes arranged on substantially parallel straight lines. Also, in this probe card, the free ends of the probe needles divided into a plurality of sets can be arranged in a substantially straight line.

[0010]

According to the present invention, by the above means for solving the problems, it is possible to disperse the base portion of the probe needle whose arrangement of the free ends is restricted by the electronic component on the base substrate, and to make the distribution of power on the base substrate uniform. The deformation of the base substrate can be alleviated and the measurement can be performed accurately.

[0011]

Embodiments of the present invention will be described below with reference to FIGS. 1 and 2. In the figure, 14 is a base substrate, which is composed of an insulating substrate such as glass epoxy resin having a thickness of 3.5 mm and a diameter of about 200 mm. The base substrate 14 has a through hole 14a formed at a predetermined position in the center thereof. Reference numeral 15 is a support block fixed to one surface (upper surface) 14b of the base substrate 14, and is composed of a ceramic member formed in a letter shape in the illustrated example. A plurality of probe needles 16, 17 and 18 each have one end fixed to the base substrate 14 and an intermediate portion supported and fixed to the support block 15, and extend in a slanting manner. It is made of a member having excellent elasticity and is formed in a taper shape toward each tip (free end), and the free ends are arranged in a substantially straight line when seen in a plan view.

The probe needles 16, 17 and 18 are arranged on the pace substrate 14 so as to correspond to the electrode arrangement of the electronic component, and constitute a probe card 19. Reference numeral 20 is a base block that supports the peripheral edge portion of the probe card 19 with the projecting wall 20a, and 21 is a contactor that is set up inside the projecting wall 20a of the base block 20, and is the other surface (lower surface) of the base substrate 14.
14c is elastically contacted and penetrates the base substrate 14 and is electrically connected to the probe needles 16, 17 and 18 through conductive patterns (not shown) formed on the front and back surfaces 14b and 14c thereof. The contactor 21 is connected to an external power source for measurement and a measuring device. The probe card 19 is arranged below a predetermined position of the moving path of the semiconductor device intermediate structure 5 shown in FIG. 3, which is guided and moved by a guide mechanism (not shown), and moves up and down relatively to the intermediate structure 5. And approach and separate. Further, above the intermediate structure 5, an electrode (conductive pattern), a probe needle 16,
A pressing block (not shown) is arranged to press the intermediate structure 5 in a state in which the free ends of 17 and 18 are positioned and overlapped with each other to sink the probe needle to a predetermined depth.

For example, in the case of an electronic component having 20 input electrodes and 200 output electrodes, the probe needles 16, 17, 18 are probe needles 17, 1 corresponding to the output electrodes.
Each of 8 is divided into 100 groups and arranged alternately in the arrangement direction of the output electrodes. That is, one set of probe needles 16 for input electrodes and one set of probe needles 18 for output electrodes are supported from the outside of the protruding walls 15a, 15b on both sides of the support block 15 with their free ends facing inward, and each intermediate portion is supported. The protruding walls 15 a and 15 b of the block 15 are supported, and one end of another set of probe needles 17 for the output electrode is supported by the supporting block 15.
Fixed on the base substrate 14 exposed between the protruding wall 15a and the intermediate protruding wall 15c, the intermediate portion is supported by the intermediate protruding wall 15c, and the free end is between the free ends of the probe needles 18 of one set. It is located. As a result, the output-side probe needles 17, 18 having a large number are distributed and arranged on the base substrate, so that the load applied to each probe needle 16, 17, 18 is dispersed on the base substrate 14, and the load is applied. In this state, the displacements of the base portions of the probe needles 16, 17, and 18 can be made substantially uniform, and the local deformation of the base substrate 14 can be suppressed.

As a result, each probe needle 16, 1
Since the contact pressure between the free ends of 7 and 18 and the electrode of the electronic component can be made substantially equal, the contact resistance is stable and accurate electrical measurement can be performed. When a frame-shaped support member 15 is used, the support member 15 itself also serves as a reinforcing member for the base substrate 14, and the portions connected to the probe needles 16, 17, and 18 are connected to each other by the frame body. The load applied from the probe needle is dispersed by the support block 15 and applied to the base substrate 14,
Can be suppressed more effectively. The present invention is not limited to the above-described embodiment, and for example, the grouping of probe needles having a large number of pieces is not only divided equally, but also arbitrarily divided as long as the load can be dispersed on the base substrate 14. You can In addition, the support block 15 can be modified in various ways such as not only the letter "Sun" but also the letter "T" and the letter "Yo". Further, the ends of the probe needles 17 and 18 may be arranged not only in a straight line when seen in a plan view but also in a staggered arrangement, or in such a manner that the free ends are in contact with the same external electrode. However, in this case, the contact resistance in the power supply line or the ground line through which the main current flows can be sufficiently reduced, and more accurate measurement can be performed.

[0015]

As described above, according to the present invention, in a probe card in which a plurality of sets of probe needles having different numbers are arranged and the sets are arranged to face each other, the probe needles having a large number are divided into a plurality of sets, Since the bases of the probe needles are distributed and arranged on the base substrate, uneven deformation of the base substrate can be prevented, the contact pressure of the probe needles can be made almost uniform, and as a result, the contact resistance can be made almost uniform and the electrical characteristics can be improved. You can make accurate measurements.

[Brief description of drawings]

FIG. 1 is a plan view showing a probe card according to the present invention.

FIG. 2 is a side sectional view of the probe card shown in FIG.

FIG. 3 is a partial perspective view showing an example of a TAB semiconductor device.

FIG. 4 is a side sectional view of the semiconductor device shown in FIG.

FIG. 5 is a plan view of a probe card used for inspecting a semiconductor device.

FIG. 6 is a side sectional view of the probe card shown in FIG.

FIG. 7 is a side sectional view of a probe card including a reinforcing member.

[Explanation of symbols]

 14 base substrate 15 support block 16 probe needle 17 probe needle 18 probe needle 19 probe card

Claims (3)

[Claims] 1. An end portion is fixed to an insulating substrate and an intermediate portion is supported by an insulating block protruding on the insulating substrate and extends in an inclined direction, and free ends are elastic to a large number of external electrodes arranged in a substantially straight line of an electronic component. In a probe card having a large number of contacting probe needles, the large number of probe needles are divided into a plurality of sets, and one end of each set of probe needles is arranged on the opposite side to the insulating block. . 2. An electronic component having at least two sets of external electrodes arranged on substantially parallel straight lines, wherein probe needles corresponding to the sets of external electrodes having a large number of electrodes are divided into a plurality of sets. The probe card according to claim 1. 3. The probe needle according to claim 1, wherein the free ends of the probe needles divided into a plurality of sets are arranged along a substantially straight line.