JPH08195373A - Cleaning device and its method - Google Patents

Abstract

PURPOSE: To enable a treating tank not only to be lessened in size but also to be enhanced in cleaning efficiency. CONSTITUTION: A wafer holder 3 which holds 50 wafers W at a pitch half the arrangement pitch is a cassette C is used, and the wafers W containable in two cassettes C are transferred onto the wafer holder 3 by the cooperation of a pushing member 52 and a wafer chuck 6 and dipped into a treating tank. The wafers W are cleaned with circulating cleaning solution first in the treating tank, then cleaning solution is stopped from circulating, and rinsing liquid is supplied through the base of the treating tank to replace cleaning solution and to rinse the works W. Cleaning and rinsing are carried out in the same treating tank, and the wafer holder 3 is narrow in wafer arrangement pitch, so that a treating tank can be lessened in size, and a cleaning device of this constitution is also lessened in size as a whole.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning apparatus and method for cleaning a substrate to be processed.

[0002]

2. Description of the Related Art In the process of manufacturing semiconductor devices, particles on the surface of a semiconductor wafer (hereinafter referred to as "wafer"),
Cleaning equipment is used to remove contaminants such as organic contaminants and metallic impurities. Among them, the wet cleaning equipment can effectively remove the contamination, and batch processing is also possible with good throughput. Therefore, it is widely used.

In this type of cleaning apparatus, a wafer is subjected to a chemical treatment with ammonia, hydrofluoric acid, hydrochloric acid or the like in a chemical bath, and then rinsed in the rinse bath with, for example, pure water. With respect to the apparatus configuration, a set of a chemical solution tank and a rinse tank is arranged in series for each chemical solution, and a transfer system for sequentially transferring, for example, 50 wafers collectively to each tank is provided. FIG. 10 is a diagram showing a main part of a conventional cleaning apparatus. In this cleaning apparatus, for example, 50 wafers W are collectively held from both sides by a wafer chuck 11, and firstly, a wafer boat 12 in a chemical tank 1A is held. The wafer W is transferred and immersed in a chemical solution, and a cleaning process such as etching is performed while circulating the chemical solution. Then, the wafer W on the wafer boat 12 is held by the wafer chuck 11, transferred to the wafer boat 13 in the rinse tank 1B and immersed. For example, rinsing is performed while supplying pure water from the bottom of the rinse tank 1B.

[0004]

By the way, when the wafers are carried into the cleaning apparatus, usually 25 wafers are arranged and stored in a wafer cassette, which is a container made of resin.
In the case of batch processing of 0 wafers, the wafer chuck 11 holds wafers for two cassettes. Here, the wafer cassette is configured to hold the wafer at a uniform pitch, for example, 6.35 mm for an 8-inch diameter wafer and 4.76 mm for a 6-inch diameter wafer in order to enhance versatility, and is held by the wafer chuck 11. The front and rear lengths of the formed wafer row are the sum of the thickness of the wafer and the total pitch. Therefore, the front and rear dimensions (dimensions in the wafer arrangement direction) of each tank are long, and since the space in which the wafer chuck can move in and out is required on both sides of the wafer in each tank, the left and right dimensions are also long, and the chemical solution tank and the rinse tank are long. Both require a large tank.

Further, in the so-called carrierless system in which the wafer chuck is used to transfer the wafer to the wafer boat and the cleaning process is performed, the wafer chuck grips and releases the wafer every time the wafer is transferred. For,
There is a high possibility that particle contamination will occur due to contact between the wafer and the chuck, and the wafer chuck (wafer transfer unit) must be made with high accuracy, resulting in an increase in cost. There is also a method of cleaning the wafer while the wafer is stored in the wafer cassette, but in this case as well, each tank becomes large in order to secure a space for loading the wafer cassette. On the other hand, this type of cleaning device usually has a configuration in which a set of the chemical solution tank and the rinse tank is arranged in a plurality of series in order to perform the cleaning process with a plurality of kinds of chemical solutions, so that the size of the entire apparatus is increased and the cost is increased. It will be up.

The present invention has been made under these circumstances, and an object thereof is to provide a cleaning device which can be downsized.

[0007]

According to a first aspect of the present invention, there is provided a cleaning apparatus for taking out and cleaning a substrate to be processed from a container for storing a plurality of substrates to be processed, wherein A holder in which a holding groove is formed so as to hold the substrates to be processed in parallel at a narrow pitch, a transfer means for taking out the substrates to be processed from the storage container and transferring them to the holder, and the substrate to be processed. A treatment tank for cleaning with the cleaning treatment liquid and then a rinse treatment liquid, a cleaning treatment liquid supply unit for supplying the cleaning treatment liquid into the treatment bath, and a rinse liquid for supplying into the treatment bath. A rinse liquid supply unit, and a carrier unit for immersing the holder holding the substrate to be processed in the cleaning treatment liquid in the processing tank, after cleaning the substrate to be treated with the cleaning treatment liquid, Use of the rinse liquid By introducing rinse liquid into the processing tank from the parts, characterized in that to replace the cleaning liquid with the rinse liquid.

The invention of claim 2 is characterized in that, in the invention of claim 1, the pitch of the holding grooves of the holder is 2 mm or more.

According to a third aspect of the present invention, the substrate to be processed is taken out from a container for storing a plurality of substrates to be processed, and is transferred to a holder at a pitch narrower than the arrangement pitch of the substrates to be processed in the container. A step of supplying a cleaning treatment liquid into the treatment tank; a step of immersing the holder holding the substrate to be treated in the cleaning treatment liquid in the treatment tank to perform a cleaning treatment on the substrate to be treated; After cleaning the processed substrate,
A step of supplying a rinse liquid into the processing bath, replacing the cleaning liquid with the rinse liquid, and rinsing the substrate to be processed.

[0010]

The object to be processed is taken out from the storage container by the transfer means and transferred to the holder. In this holder, the object to be processed is held at a pitch that is narrower than the arrangement pitch of the objects to be processed in the storage container, for example, half the pitch. The object to be treated is immersed in the cleaning treatment liquid in the treatment tank while being held by the holder, and after the cleaning treatment, the rinse liquid is supplied into the treatment tank to replace the inside of the treatment tank with the rinse liquid to remove the object to be treated. Rinse.

Since the arrangement pitch of the objects to be treated in the treatment tank is small as described above, the treatment tank can be small, and since the cleaning treatment and the rinsing are performed in the same treatment tank, even if the arrangement pitch is small ( Although the reason will be described later), there is no risk of particle contamination, and the overall size of the device can be reduced.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Before describing the main parts of a cleaning apparatus according to an embodiment of the present invention, the entire apparatus including a transport system will be briefly described with reference to FIG. A carry-in section A for accommodating processed substrates such as wafers in cassette units, and a cleaning processing section B for cleaning the wafers.
And a carry-out section C for taking out the wafer after cleaning processing in cassette units.

In the carry-in section A, a cassette C containing, for example, 25 wafers is once carried into the standby section 21 from the outside by the cassette carrying means 20 and then carried to the loader section 22, which is not visible in the figure. The wafer chuck transfers the wafers in the cassette C to a dedicated wafer holder. In the cleaning processing section B, for example, three wafer transfer mechanisms R1 to R3 are provided along a line connecting the carry-in section A and the carry-out section C.
The wafer transfer mechanisms R1 to R3 are provided with a holder transfer means for transferring a wafer holder holding a wafer into the apparatus. Further, in order from the loading section A side, a cleaning / drying tank T1 for cleaning and drying the holder transporting means 23 of the wafer transporting mechanism R1, three processing tanks T2 to T4, and a holder transporting means 24 of the wafer transporting mechanism R3 are provided. Cleaning / drying tank T5 for cleaning and drying, and wafer drying tank T for steam-drying wafers
6 is provided.

The processing tanks T2 to T4 are constructed so as to be cleaned with a cleaning processing solution and rinsed with, for example, pure water. For example, 50 wafers are collectively held by a dedicated holder described later, and the wafers are held. A cleaning process is sequentially performed in the processing tanks T2 to T4 by the transport mechanisms R1 to R3. A cleaning / drying line 25 for cleaning and drying the empty cassette C after the wafer is taken out by the wafer chuck is provided above the cleaning processing section B. The cassette C to the cleaning / drying line is provided. Is supplied by the loader unit 22 and the elevating mechanism 26.

2 shows an overview of the above-mentioned dedicated wafer holder and apparatus, the wafer holder 3 includes a holder body 30 for holding the lower end of the wafer W, and a wafer W. Holding bars 32 and 33 for holding both lower sides are provided, and these holding bars 31 to 33 are narrower than the arrangement pitch of the wafers W in the wafer cassette C, for example, a half arrangement pitch (in the case of an 8-inch wafer, 6.35 mm
For example, 50 holding grooves 34 for holding the wafer W are formed with (× 1/2 = 3.175 mm).

As shown by the reference numeral 61 in FIGS. 2 and 3, the holder transporting means is provided, for example, on the lower surfaces of the supported portions 30a, 30b which are horizontally bent forward and backward at the upper part of the wafer holder 3, respectively. It is composed of a pair of supporting arms 61a and 61b, and is between a later-described moving table 35 and the inside of the processing tank 4 (in the example of FIG. 1, between the invisible moving table and the processing tank T4 and the invisible transfer table). At) it plays a role of transporting the wafer holder 3.

The three processing tanks T2 to T4 may have the same structure, and an example of each processing tank 3 (T2 to T4) and the apparatus configuration related thereto will be described in detail with reference to FIGS. 2 to 5. I will describe. The processing tank 4 is formed, for example, in a rectangular shape, and a triangular notch 41 for overflow is formed at the upper edge portion, and the overflowed liquid is received outside the upper edge portion of the processing tank 3. A receiving tank 42 is provided.

As shown in FIG. 3, a wafer push-up member 52 is arranged in the loader section 22 below the mounting table 51 of the wafer cassette C.
2 includes a holding groove 53 for holding one cassette of wafers, for example, 25 wafers, and is raised by an elevating unit 54 from the lower side of the cassette C (a mounting table 51 has a passage space for a push-up member 52 formed therein). 25 wafers W) are collectively pushed up and held.

A wafer chuck 6 for transferring a wafer from the cassette C to the wafer holder 3 (the wafer chuck in FIG. 1 is represented by reference numeral "6") is opened / closed to the left and right as shown in FIG. 25 wafers W pushed up from inside the wafer cassette C by the push-up member 52 are collectively held at the same pitch P as the arrangement pitch P of the wafers W in the cassette C. Then, it is transferred into the wafer holder 3. At this time, since the pitch of the holding grooves 34 of the wafer holder 3 is, for example, ½ pitch (P / 2), the wafers W are held in the holding grooves 34 every other one.

On the other hand, the wafer holder 3 is placed on a movable table 35 which is movable back and forth (in the direction of the arrow in FIG. 3), and this movable table 35 is half the arrangement pitch P of the wafers W (half pitch P). / 2) is accurately moved, and after 25 wafers W (one cassette worth of wafers) have been transferred from the wafer chuck 6, a half pitch P / 2 is applied to the front side, for example. It will be moved. Therefore, the next 25 wafers W held by the wafer chuck 6 enter between the 25 wafers W already held in the wafer holder 3 and the holding grooves 34 are vacant every other wafer. Will be held in. Since the space 63 is formed between the adjacent chuck portions 62, 62 of the wafer chuck 6, it does not interfere with the previous wafer W. In this example, the transfer means for taking out the wafers W in the cassettes C arranged at the pitch P and transferring the wafers W to the wafer holder 3 that holds the wafers at the half pitch P / 2 are the push-up member 52, the wafer chuck 6, and the wafer chuck 6. It is composed of a moving table 35 and the like. However, from the wafer chuck 6 to the wafer holder 3
In order to transfer 50 wafers, the wafer chuck 6 side may be moved instead of the wafer holder 3 side.

A rinsing liquid supply pipe 43 for supplying a rinsing liquid such as pure water is connected to the bottom of the processing bath 4, and a rectifying means is provided between the bottom of the processing bath 4 and the wafer holder 3. 7 is provided. The rinse liquid supply pipe 43 also serves as a part of the circulation passage 44 for the cleaning treatment liquid, and the valve V1
Is connected to a pure water supply source (not shown). The circulation path 44 is provided between the bottom of the receiving tank 42 and the bottom of the processing tank 4, and has a valve V2, a pump P, a filter F, and a valve V3 interposed therebetween. Further, the receiving tank 42 is connected to a discharge pipe 45 which discharges pure water at the time of rinsing and is equipped with a valve V4.

The rectifying means 7 is, for example, a diffusion plate 71 provided facing the supply port of the rinse liquid supply pipe 43 and having a diameter substantially the same as that of the supply port, and a supporting leg (not shown) above the diffusion plate 71. And a rectifying plate 72 provided along the bottom surface of the processing tank 4, and the rectifying plate 72 is more than the holding rods 31 to 33 of the wafer holder 3 as shown in FIG. 5, for example. A slightly long plate-like body is formed with slits 73 extending in parallel in the front-rear direction and hole portions 74 arranged in the front-rear direction. Further, a cleaning processing liquid supply unit 8 is provided above the processing tank 4 at a position where it does not interfere with the wafer chuck 6.

Next, the operation of the above embodiment will be described. First, for example, in the loader unit 22 shown in FIG.
As shown in FIG. 5, the push-up member 52 is raised from below the cassette C, and the 25 wafers W in the cassette C are pushed up collectively. Then, as already described in detail, as shown in FIG. 6B, the wafer chuck 6 holds these wafers W and transfers them to the wafer holder 3, and the 25 wafers W in the next cassette C are similarly processed, The wafer holder 3 is shifted by a half pitch P / 2 in the arrangement direction of the wafers W and transferred from the wafer chuck 6 to the wafer holder 3. Thus, the wafer holder 3 holds 50 wafers W at a pitch P / 2 which is half the arrangement pitch P of the wafers W in the cassette C.

On the other hand, a cleaning treatment liquid, such as a hydrofluoric acid solution, is supplied from the cleaning treatment liquid supply unit 8 into the treatment tank 3, and the valve V is used.
2, V3 is opened and the cleaning treatment liquid is circulated by the pump P. Then, the holder transfer means 61 of the wafer transfer mechanism
The wafer holder 3 is transferred into the processing bath 3 by means of the above, and as shown in FIG. 6C, for example, 50 wafers W are immersed in the cleaning processing liquid, and the surface of the wafer W is oxidized by the hydrofluoric acid solution. Etch the film. Then, the circulation of the cleaning treatment liquid is stopped, and pure water is supplied from the bottom of the treatment tank 4 through the rinse liquid supply pipe 43 as shown in FIG. The pure water supplied from the rinse liquid supply port is first diffused by the diffusion plate 71, rectified by the rectification plate 72 and rises from the lower side of the wafer W, and as a result, the cleaning treatment liquid is expelled and the inside of the treatment tank 4 is emptied. Replaced by pure water. Thereafter, the pure water is continuously rinsed from the rinse liquid supply pipe 43 until the specific resistance is recovered, and the rinse treatment is completed.

According to the above-described embodiment, since the cleaning process and the rinsing are performed in a common processing tank in a so-called 1-bath system, the apparatus can be downsized, and especially when the cleaning process is performed with a plurality of chemicals. The size can be greatly reduced compared to the conventional device in which the tank and the rinse tank are combined into one set. The wafers W are held side by side on the wafer holder 3 at a pitch smaller than the arrangement pitch in the wafer cassette C, for example, a half pitch, and the wafers W are immersed in the processing bath 3 by the wafer holder 3. The size of the processing tank 3 becomes smaller than the size determined by the arrangement pitch of the wafer cassettes C.

Here, the configuration in which the arrangement pitch of the wafer holders 3 is narrowed is significant to be adopted in the 1-bus system. That is, the present inventor has found that in the conventional apparatus using the cleaning processing tank and the rinse tank, when the pitch of the wafer W is narrowed, a large amount of particles adhere after the completion of a series of cleaning processing. It has been found that there is no problem of particle adhesion, and it is understood that this difference is remarkable when the cleaning treatment liquid is hydrophobic, for example, when the cleaning treatment liquid is a hydrofluoric acid-based solution. Although the reason for this is not clear, when the wafer W is transferred from the cleaning processing liquid to the rinse liquid, if the arrangement pitch of the wafers W is narrow, particles on the back surface side of the wafer W adhere to the front surface of the opposing wafer W. It is considered to be a thing.

Further, since the wafer W is held by the dedicated wafer holder 3 and immersed in the processing bath, the wafer W is immersed in the cleaning treatment liquid while being stored in the cassette C, or the wafer is chucked by the wafer chuck. Compared with the case where W is gripped and transferred to the wafer boat in the processing tank 3, the processing tank 3 can be made smaller by the space for loading the cassette C or the space for loading and unloading the wafer chuck. Furthermore, the risk of particle contamination is less than in the case where wafers are sequentially transferred to each processing tank by a wafer chuck. Furthermore, the wafer holder 3
Since the holder itself is also reduced by narrowing the pitch of the holding grooves 34, the holder transfer means is downsized, and since the wafer is not gripped, it does not have to be manufactured with high precision, and thus the cost can be reduced.

Since the processing tank 3 can be downsized in this way, the apparatus can be downsized and the cost can be reduced, and the consumption of the cleaning processing liquid and pure water can be reduced, and the cleaning processing liquid can be converted into pure water. Since the time required for replacement is short, the rinse efficiency is high. As a result, the rinse time can be shortened to improve the throughput, and the tact time (the time from the processing of one wafer to the processing of the next wafer)
Can be shortened.

In the above, the pitch of the holding grooves 34 in the wafer holder 3, that is, the wafer arrangement pitch is not limited to half of the wafer arrangement pitch P of the cassette C, but a half pitch P.
It may be larger or smaller than / 2, but if it is too small, the wafers may be attracted to each other due to the surface tension and contact with each other.

Further, the means for transferring the wafer from the cassette C to the wafer holder 3 is not limited to that of the previous embodiment, and for example, the wafer gripping groove of the wafer chuck is extended to the lower side and is moved downward from a certain position. The wafer gripping grooves are configured to approach each other as they go toward each other (when the gripping groove array is viewed from the side, the gripping groove group is narrowed as it goes down). When gripping the wafer in the cassette, the pitch in the cassette is set. The wafers are lined up, and when the wafer chuck is raised with respect to the cassette, the wafers descend along the gripping grooves,
The pitch conversion may be performed so that the wafer chuck is stopped at a predetermined position and is held by a wafer chuck in a narrow pitch state (the pitch of the lower side of the gripping groove is narrow).

To further change the pitch, for example, 50 holding groove forming members for forming the holding grooves are independently prepared, and these members are movable in the wafer arranging direction so that the distance between the holding grooves is changed. Prepared intermediate holding mechanism, the wafer in the cassette is taken out by the wafer chuck and once held by the intermediate holding mechanism, the holding groove forming member is moved to narrow the pitch, and then another wafer chuck having a narrow pitch is used. The wafer on the intermediate holding mechanism may be gripped and transferred to the wafer holder.

Here, when the cleaning treatment liquid is supplied into the treatment tank 4, it is preferable that the cleaning treatment liquid is diluted between the factory-side cleaning treatment liquid supply system and the treatment tank 4. . For example, the normal hydrofluoric acid solution is 1:99 (50% hydrofluoric acid: pure water) from the supply system on the factory side.
Is supplied to the processing tank 4 at a fixed concentration such as
In this case, the oxide film on the wafer W is etched by about 30 Å in 1 minute.

In the case of the one-bath system, pure water is supplied into the treatment tank 4 filled with the cleaning treatment liquid to replace the pure water for rinsing, so that the pure water flow rate is increased to, for example, about 50 liters per minute. Even so, it takes a certain amount of time to completely replace with pure water. Therefore, unless the flow of the rinse liquid in the processing tank 4 and the processing sequence are carefully devised, the etching on the wafer surface can be performed. Is less uniform,
Alternatively, there is a possibility that the film may be etched to a predetermined thickness or more.

Therefore, regarding the supply of the cleaning treatment liquid, FIG.
As shown in (a), the cleaning treatment liquid weighing tank 8 is provided on the way from the cleaning treatment liquid supply system (not shown) to the treatment tank 4.
1 and a pure water weighing tank 82 is provided in the middle of the pure water supply path, and a predetermined amount of each of the cleaning processing liquid and the pure water supplied into the processing tank 4 is weighed to perform the cleaning processing in the processing tank 4. It is desirable to dilute the concentration of the liquid such as hydrofluoric acid solution from 0.5% by volume to, for example, 0.2% by volume. By doing so, the etching rate is reduced, so that the effect of etching during the replacement of the cleaning treatment liquid with the rinse liquid is reduced, and therefore, etching can be performed with high uniformity up to a predetermined film thickness, and consumption of pure water is reduced. The amount can also be reduced.

Further, in order to dilute the cleaning treatment liquid in this way, instead of weighing pure water in the weighing tank 81, FIG.
As shown in (b), a weighing sensor 83 is provided in the treatment tank 4, pure water is weighed by the weighing sensor 83, and then the cleaning treatment liquid weighed in the weighing tank 81 is supplied into the treatment tank 4. Good. In this case, as the weighing sensor 83, for example, a sensor which can weigh pure water in the processing tank by blowing nitrogen gas and knowing that the head pressure exceeds a predetermined value with a nitrogen gas pressure gauge can be used.

On the other hand, in order to improve the uniformity of the cleaning process such as etching, the following method may be adopted. That is, in the above-described embodiment, pure water is supplied from the bottom of the treatment tank 4 when the cleaning treatment is changed to the rinse treatment, and the liquid flow in the treatment tank 4 is rectified by the rectifying means 7. As shown in the drawing, the cleaning treatment liquid, for example, the concentration of hydrofluoric acid gradually decreases from the lower side of the treatment tank 4 and is replaced with pure water. Therefore, in this replacement process, the etching amount is smaller on the lower side of the wafer W and the etching is not performed uniformly.

Therefore, when immersing the wafer W in the cleaning treatment liquid, it is preferable to introduce the wafer W so as to cancel the nonuniformity of etching in the replacement process. If the wafer W is loaded quickly, the replacement process will be affected. However, if the loading speed of the wafer W is slightly slowed down, the lower the wafer W is in the loading process, the longer the immersion time is, so that the etching amount is reduced. Will increase. Therefore, by optimizing the wafer loading speed, specifically, by optimizing the lowering speed of the holder transporting means 61 described above, the nonuniformity of the etching amount in the replacement process and the loading process is offset. As a result, a uniform cleaning process such as etching can be performed.

In order to investigate the relationship between the wafer loading speed and the etching uniformity, the wafer loading speed was 2.6 cm.
/ Sec, 4.4 cm / sec, and 5.4 cm / sec, the oxide film is etched, and the difference between the maximum value and the minimum value of the wafer film thickness in each case (that is, the difference between the peaks and valleys) ), The smallest value was 4.4 cm / sec, and the etching uniformity was high. However, a hydrofluoric acid solution of 0.5% was used as the cleaning treatment liquid, and the flow rate of pure water was set to 15 liters per minute. As can be seen from this experiment, the uniformity of etching depends on the wafer loading speed depending on the type and concentration of the cleaning processing liquid. Therefore, it is preferable to load the wafer into the cleaning processing liquid at the optimum loading speed.

Further, in the one-bath cleaning apparatus, since the cleaning treatment liquid is disposable, a new liquid is always supplied to the wafer, and therefore the cleaning treatment liquid has a high degree of cleanliness. Therefore, as shown in FIG. 9, the cleaning treatment including the filter is performed. A liquid circulation path may not be provided, and the cost can be reduced by doing so. However, in this case, a means for stirring the cleaning treatment liquid, for example, bubbling means 91, 92 such as an inert gas is provided in the treatment bath 4, and the treatment bath 4 is used to control the temperature of the cleaning treatment liquid.
It is preferable to provide the heater 93 inside or outside.

In the above, the present invention is not limited to the case of etching an oxide film with a hydrofluoric acid solution, for example, the case of etching a nitride film with a phosphoric acid solution or the case of etching aluminum with a mixed solution of phosphoric acid, acetic acid and nitric acid. Can also be applied to. In addition, as other cleaning processing,
When removing particles with APM solution (ammonia + hydrogen peroxide solution + pure water), when cleaning metal contamination with HPM solution (hydrochloric acid + hydrogen peroxide solution + pure water), or with SPM solution (sulfuric acid + peroxide) For example, the organic matter of the resist film may be removed with (hydrogen water). The substrate to be processed may be a liquid crystal substrate or a printed circuit board.

[0041]

According to the present invention, the cleaning process and the rinsing process are performed in a common processing tank, and a plurality of objects to be processed are provided on a dedicated holder at a pitch narrower than the arrangement pitch of the objects to be processed in the storage container. Hold the body, dipping in the treatment tank,
I try to take it out. Therefore, the number of processing tanks is small, and the processing tanks can be made smaller, so that the cleaning device can be downsized, and the cleaning processing liquid can be quickly replaced with the rinse liquid by downsizing the processing tanks. ,
Higher processing efficiency.

[Brief description of drawings]

FIG. 1 is a perspective view schematically showing an overall configuration of a cleaning device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a processing tank and a wafer holder.

FIG. 3 is a perspective view showing a wafer cassette, a wafer transfer unit, and a wafer holder.

FIG. 4 is a cross-sectional view showing an example of a processing tank used in an embodiment of the present invention.

FIG. 5 is a perspective view showing an example of a current plate.

FIG. 6 is an explanatory view showing the operation of the embodiment of the present invention.

FIG. 7 is an explanatory diagram showing an example of a method for supplying a cleaning treatment liquid.

FIG. 8 is an explanatory diagram showing how the cleaning treatment liquid is replaced with a rinse liquid.

FIG. 9 is a cross-sectional view showing another example of the processing tank used in the embodiment of the present invention.

FIG. 10 is an explanatory diagram showing a conventional cleaning device.

[Explanation of symbols]

 3 Wafer Holders 31 to 33 Holding Rods 34 Holding Grooves 35 Moving Stands 4 Processing Tanks 43 Rinsing Liquid Supply Pipes 52 Push-up Members 53 Holding Grooves 6 Wafer Chucks 61 Holding Tools Conveying Means 7 Rectifying Means 8 Cleaning Processing Liquid Supplying Units 81, 82 Weighing Tank 91, 92 Bubbling means 93 Heater

Claims (3)

[Claims] 1. A cleaning device for removing a substrate to be processed from a storage container that stores a plurality of substrates to be processed and holding the substrates in parallel at a pitch narrower than the arrangement pitch of the substrates to be processed in the storage container. A holding tool having a holding groove formed therein, a transfer means for taking out the substrate to be processed from the storage container and transferring it to the holder, and cleaning the substrate to be processed with a cleaning treatment liquid, and then using a rinse liquid. A treatment bath for rinsing, a cleaning treatment liquid supply unit for supplying a cleaning treatment liquid into the treatment bath, a rinse liquid supply unit for supplying a rinse liquid into the treatment bath, and the substrate to be treated. And a holder transporting means for immersing the held holder in the cleaning treatment liquid in the processing tank, and after cleaning the substrate to be processed with the cleaning treatment liquid, rinse liquid from the rinse liquid supply unit is supplied. place Cleaning apparatus, characterized in that to replace the cleaning liquid is introduced into the tank with a rinsing liquid. 2. The cleaning device according to claim 1, wherein the pitch of the holding groove of the holder is 2 mm or more. 3. A process of taking out a substrate to be processed from a storage container for storing a plurality of substrates to be processed and transferring the substrate to a holder at a pitch narrower than an arrangement pitch of the substrates to be processed in the storage container; A step of supplying a cleaning treatment liquid to the substrate, a step of cleaning the substrate to be treated by immersing the holder holding the substrate to be treated in the cleaning treatment liquid in the treatment tank, and a cleaning treatment of the substrate to be treated. After that, a step of supplying a rinsing liquid into the processing tank, substituting the rinsing liquid for the rinsing liquid, and rinsing the substrate to be processed, is carried out.