JPH08195371A - Cleaning device and method - Google Patents

Abstract

PURPOSE: To provide a method of replacing cleaning solution with rinsings more quickly by a method wherein cleaning solution present around the joint of the flow paths of cleaning solution and rinsings is prevented from flowing into a processing tank when the flow path of cleaning solution is stopped to supply rinsings into a processing tank, wherein substrates as works are cleaned with cleaning solution and then rinsed in the same processing tank. CONSTITUTION: A two-way valve V1 provided with two flow paths, one is small and the other is large in diameter, is placed in a cleaning solution flow path 5, the flow path of large diameter is opened while cleaning is performed, and rinsing is made to flow through the flow path of small diameter and a discharge path 51 to discharge out cleaning solution present around a joint 60 while rinsing is carried out. A usual valve is used as a valve V1 and set larger in diameter than the length of piping in a dead zone so as to quickly replace cleaning solution around it with rinsings, or an integrated valve possessed of three flow paths may be used at the joint.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning apparatus and method for cleaning a substrate to be processed.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, a cleaning apparatus is used to remove contaminants such as particles, organic contaminants and metal impurities on the surface of a semiconductor wafer (hereinafter simply referred to as "wafer"). Among them, the wet cleaning apparatus is widely used because it can effectively remove the contamination and can perform batch processing and has good throughput.

In this type of cleaning apparatus, a wafer is subjected to chemical treatment with, for example, ammonia, hydrofluoric acid, hydrochloric acid or the like in a chemical bath, and then rinsed with pure water or the like in a rinse bath. Regarding the apparatus configuration, a set of a chemical solution tank and a rinse tank is arranged in series for each chemical solution, and for example, a transfer system for transferring about 50 wafers in a batch to each tank sequentially is provided. It is provided. The chemical solution tank or the rinse tank is configured such that the chemical solution or the rinse solution is supplied from the bottom, passes through the straightening plate, and then rises along the plate surface of the wafer group. In order to achieve the improvement, a so-called one-bath type cleaning device in which the chemical bath and the rinse layer are shared is being studied.

FIG. 8 is a sectional view of an essential part showing an example of a one-bath cleaning device. In FIG. 8, reference numeral 1 is a processing tank, a receiving tank 10 for receiving an overflowed liquid is provided at an upper peripheral edge of the processing tank 1, and a bottom of the processing tank 1 also serves as a part of a chemical liquid circulation path. The rinse liquid supply pipe 11 is connected to, for example, two places. A diffusion plate 12a is attached to the rinse liquid supply port 12 of the processing tank 1, and a rectifying plate 13 having a plurality of flow holes 13a is arranged above the diffusion plate 12a.

A cleaning process using this apparatus will be described. First, a chemical solution such as hydrofluoric acid is supplied and circulated into the processing tank 1 from a cleaning processing solution supply unit (not shown), and then, for example, about 50 sheets. The wafers W are vertically arrayed and held by the holder 14 and immersed in a chemical solution, and after a cleaning process, a rinse solution, for example, pure water, is supplied from the rinse solution supply pipe 11 into the processing tank 1, and the rinse solution is used. The rinsing process was performed by replacing

FIG. 9 is a schematic diagram for explaining the liquid circulation system of the cleaning apparatus in FIG. In FIG. 9, 15 is a cleaning treatment liquid flow path that serves as a circulation passage of the cleaning treatment liquid, 16 is a rinse liquid supply passage for supplying the rinse liquid, 17 is a common passage connected to the treatment tank 1, P is a pump, F is a filter, and Va to Vc are valves.

In the above structure, during the cleaning process of the wafer W, the valves Va and Vc are closed and the valve Vb is opened, and the cleaning process liquid is pumped by the pump P through the cleaning process liquid flow path 15 and the common flow path 17. The oxide film on the surface of the wafer W is etched by being circulated in the processing bath 1 via the via. On the other hand, during the rinse process, the valve Vb is closed and the valves Va and Vc are opened.
The rinse liquid is supplied into the processing tank 1 through the rinse liquid supply passage 16 and the common flow passage 17, and the cleaning treatment liquid is stored in the receiving tank 10 due to overflow and is discharged through the cleaning treatment liquid passage 15 and the valve Va. To be done.

[0008]

However, in the cleaning apparatus shown in FIG. 9, when the cleaning treatment liquid is replaced with the rinse liquid, the valve Vb is closed and the valve Vb is closed.
Since the rinse liquid is supplied with the valve a and the valve Vc opened, there are problems as described below. That is, between the branch point T, which is a connection portion with the common flow path 17 existing between the valve Vb and the valve Vc, and the valve main body of the valve Vb, there is a so-called dead zone, which is a pool of the cleaning treatment liquid, and the rinse liquid. When the cleaning treatment liquid staying in the dead zone is gradually mixed into the rinse liquid when the cleaning liquid is supplied into the treatment tank 1 through the rinse liquid supply passage 16, the replacement time with the rinse liquid during the rinse treatment ( Specifically, it has been a factor of increasing the specific resistance recovery time), consuming a large amount of rinse liquid, and reducing rinse efficiency.

The present invention has been made under the circumstances as described above, and an object thereof is to perform a cleaning process and a rinsing process in the same processing tank so that the recovery time of the specific resistance is short and the throughput is high. Another object of the present invention is to provide a cleaning device that uses a small amount of rinse liquid.

[0010]

According to a first aspect of the present invention, there is provided a cleaning treatment liquid flow path for introducing a cleaning treatment liquid into a treatment tank, and a cleaning treatment liquid flow path connected in the middle of the cleaning treatment liquid flow path and from a connecting portion thereof. The downstream side is also used as a cleaning treatment liquid flow path, and a rinse liquid supply passage for supplying a rinse liquid into the treatment tank is provided, and a plurality of substrates to be processed are arranged in the treatment tank to be cleaned by the cleaning treatment liquid. In a cleaning device for cleaning and then supplying the rinse liquid from the rinse liquid supply path into the treatment tank to perform the rinse treatment, a passage switching valve is provided in the vicinity of the connection portion in the cleaning treatment liquid passage, and this valve is used. A flow path in which a large-diameter first flow path and a second flow path having a smaller diameter than the first flow path are arranged in parallel, and a valve body that opens and closes each of these flow paths,
On the upstream side of the valve, a discharge path provided with a discharge valve is branched so that the first flow path is opened and the second flow path and the discharge valve are closed when the cleaning treatment liquid flows in. During the rinsing process, the first flow path is closed and the second flow path and the discharge valve are opened to allow the rinse liquid to flow the cleaning process liquid in the cleaning process liquid flow path near the connection portion through the discharge path. It is characterized in that a control unit for controlling each valve so as to discharge is provided.

According to a second aspect of the present invention, there is provided a cleaning treatment liquid channel for flowing the cleaning treatment liquid into the treatment tank, and a cleaning treatment liquid which is connected in the middle of the cleaning treatment liquid passage and has a downstream side from the connecting portion. And a rinse liquid supply path for supplying a rinse liquid into the processing bath in common with the flow passage, and arranging a plurality of substrates to be processed in the processing bath and cleaning with a cleaning treatment liquid, and then a rinse liquid In a cleaning device that supplies a rinse liquid from a supply path into a processing tank to perform a rinse process, a flow path switching valve is provided near the connection portion in the cleaning process liquid flow path, and discharge is performed on the upstream side of this valve. The discharge path with the valve for the flow path is branched, and at least one of these valves is configured to adjust the flow rate.The flow path switching valve and the discharge valve are opened during the rinsing process, and at the same time, the number of these valves is reduced. A control unit is provided for controlling each valve so that the flow path is narrowed by one side, and the cleaning processing liquid in the cleaning processing liquid flow path near the connection portion is discharged through the discharge path by the rinse liquid. .

According to a third aspect of the present invention, there is provided a cleaning treatment liquid channel for flowing the cleaning treatment liquid into the treatment tank, and a cleaning treatment liquid which is connected in the middle of the cleaning treatment liquid passage and has a downstream side from the connection portion. And a rinse liquid supply path for supplying a rinse liquid into the processing bath in common with the flow passage, and arranging a plurality of substrates to be processed in the processing bath and cleaning with a cleaning treatment liquid, and then a rinse liquid In a cleaning device that supplies a rinse liquid from a supply path into a processing tank to perform a rinse process, in the vicinity of the connection part in the cleaning process liquid flow path, a flow path is slightly left even when closed. A flow path switching valve is provided, and a discharge path in which a discharge valve is provided is branched on the upstream side of this valve, and the flow path switching valve is closed and the discharge valve is opened at the time of rinsing processing. Cleaning solution near the connection Characterized in that a control unit for controlling the valves so the cleaning liquid in the road is discharged through the flow path switching valve and the discharge passage by the rinse liquid.

According to a fourth aspect of the present invention, there is provided a cleaning treatment liquid channel for flowing the cleaning treatment liquid into the treatment tank, and a cleaning treatment liquid which is connected to the middle of the cleaning treatment liquid passage and has a downstream side from the connection portion. And a rinse liquid supply path for supplying a rinse liquid into the processing bath in common with the flow passage, and arranging a plurality of substrates to be processed in the processing bath and cleaning with a cleaning treatment liquid, and then a rinse liquid In a cleaning device that supplies a rinse liquid from the supply path into the processing tank to perform a rinse process, the discharge path is branched from the cleaning process liquid channel, and after the cleaning process is completed by the cleaning process liquid, the rinse liquid is supplied from the rinse liquid supply path. While supplying the rinse liquid into the treatment tank, the rinse liquid is discharged from the rinse liquid supply passage through the connection portion, the cleaning treatment liquid passage and the discharge passage, and during the discharging process, from the connection portion to the outlet of the discharge passage. At least part of the Characterized in that it is a rinse liquid fine flow path to an extent not to interfere with the supply of.

According to a fifth aspect of the present invention, there is provided a cleaning treatment liquid flow path for introducing the cleaning treatment liquid into the treatment tank, and the cleaning treatment liquid flow path is connected in the middle of the cleaning treatment liquid flow path and the downstream side from the connection portion. And a rinse liquid supply path for supplying a rinse liquid into the processing bath in common with the flow passage, and arranging a plurality of substrates to be processed in the processing bath and cleaning with a cleaning treatment liquid, and then a rinse liquid In a cleaning device that supplies a rinse liquid from a supply path into the processing tank to perform a rinse process, a flow path switching valve is provided near the connection portion in the cleaning process liquid flow path,
The length of the flow path from the connection portion to the valve body of the flow path switching valve is set to be shorter than the diameter of the flow path.

According to a sixth aspect of the present invention, there is provided a cleaning treatment liquid flow path for introducing the cleaning treatment liquid into the processing tank, and the cleaning treatment liquid flow path is connected in the middle of the cleaning treatment liquid flow path and the downstream side from the connection portion. And a rinse liquid supply path for supplying a rinse liquid into the processing bath in common with the flow passage, and arranging a plurality of substrates to be processed in the processing bath and cleaning with a cleaning treatment liquid, and then a rinse liquid In a cleaning device that supplies a rinse liquid from a supply path into a processing tank to perform a rinse process, the connection part is connected to a valve body, and a cleaning process liquid, a rinse liquid flow path, and a shared flow path for these are provided on three sides. It is characterized in that a valve having connection pipes connected to each other is provided, and a valve body for opening and closing the cleaning treatment liquid flow path is provided in the valve body.

[0016]

In the invention of claim 1, after the cleaning process is completed,
When performing the rinse treatment, the rinse liquid flows through the small-diameter second flow passage and the discharge passage in the flow passage switching valve, so that the cleaning treatment liquid staying in the dead zone is discharged, and thus the treatment tank It is possible to prevent the cleaning treatment liquid from entering the inside. Further, since the small-diameter second flow path is opened for discharging the cleaning treatment liquid, the cleaning treatment liquid in the processing tank is also prevented from flowing out through the second flow passage. In the invention of claim 2, 3 or 4, since the rinse liquid is discharged through, for example, the flow path switching valve and the discharge valve, and the flow rate is reduced by adjusting the valves, the cleaning process in the processing tank is also performed. While preventing the mixing of the liquid, the outflow of the cleaning processing liquid in the processing tank is also prevented.

According to the fifth aspect of the invention, since the diameter of the flow path is made larger than the length of the dead zone, when the rinse liquid is supplied into the processing tank, the cleaning treatment liquid remaining in the dead zone is rinsed. The liquid is easily replaced by the liquid, and mixing of the cleaning liquid into the processing tank is suppressed. Further, in the invention of claim 6, since the dead zone is extremely short, it is possible to suppress the mixing of the cleaning treatment liquid into the treatment tank.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Before describing the main parts of a cleaning apparatus according to an embodiment of the present invention, the entire apparatus including a transport system will be briefly described with reference to FIG. A carry-in section A for accommodating processed substrates such as wafers in cassette units, and a cleaning processing section B for cleaning the wafers.
And a carry-out section C for taking out the wafer after cleaning processing in cassette units.

In the carry-in section A, a cassette C containing, for example, 25 wafers is once carried into the standby section 21 by the cassette carrying means 20 from the outside and then carried to the loader section 22, which is not visible in the figure. The wafer chuck transfers the wafers in the cassette C to a dedicated wafer holder. In the cleaning processing section B, for example, three wafer transfer mechanisms R1 to R3 are provided along a line connecting the carry-in section A and the carry-out section C.
The wafer transfer mechanisms R1 to R3 are provided with a holder transfer means for transferring a wafer holder holding a wafer into the apparatus. Further, in order from the loading section A side, a cleaning / drying tank T1 for cleaning and drying the holder transporting means 23 of the wafer transporting mechanism R1, three processing tanks T2 to T4, and a holder transporting means 24 of the wafer transporting mechanism R3 are provided. Cleaning / drying tank T5 for cleaning and drying, and wafer drying tank T for steam-drying wafers
6 is provided.

The processing tanks T2 to T4 are configured to be cleaned with a cleaning processing solution and rinsed with, for example, pure water. For example, 50 wafers are collectively held by a dedicated holder described later and the wafers are held. A cleaning process is sequentially performed in the processing tanks T2 to T4 by the transport mechanisms R1 to R3. A cleaning / drying line 25 for cleaning and drying the empty cassette C after the wafer is taken out by the wafer chuck is provided above the cleaning processing section B. The cassette C to the cleaning / drying line is provided. Is supplied by the loader unit 22 and the elevating mechanism 26.

FIG. 2 shows an overview of the above-mentioned dedicated wafer holder and processing tank apparatus. The wafer holder 3 includes a holder main body 30 and a holding rod 31 for holding the lower end of the wafer W.
And holding rods 32 and 33 for holding both sides of the lower part of the wafer W, and holding grooves 34 for holding the wafer W are formed on these holding rods 31 to 33 at a predetermined pitch, for example, 50.
The book is formed. The holder transporting means is composed of, for example, a pair of arms 61a and 61b that respectively support the lower surfaces of the supported portions 30a and 30b that are horizontally bent back and forth above the wafer holder 3, respectively.

The three processing tanks T2 to T4 have the same structure, and an example of the structure of each processing tank 3 (T2 to T4) and its related apparatus will be described in detail with reference to FIGS. 2 and 3. The processing tank 4 is formed, for example, in a rectangular shape, and a triangular notch 41 for overflow is formed at the upper edge portion, and the overflowed liquid is received outside the upper edge portion of the processing tank 3. A receiving tank 42 is provided.

To the outside of the processing tank 4, the cleaning processing liquid in the receiving tank 42 is supplied to the bottom of the processing tank 4, that is, the cleaning processing liquid overflowing from the processing tank 4 is passed through the outside of the processing tank 4 to the processing tank 4. A cleaning treatment liquid flow path 5 is provided between the bottom of the receiving tank 42 and the bottom of the processing tank 4 so as to circulate at the bottom of the processing tank 4. A rinsing liquid supply passage 6 is connected in the middle of the cleaning treatment liquid flow passage 5 near the bottom of the treatment bath 4, and the cleaning treatment liquid flow is provided from the connection portion 60 to the downstream side, that is, the bottom of the treatment bath 4. The path 5 and the rinse liquid supply path 6 are shared. In the vicinity of the connection portion 60 in the cleaning treatment liquid flow path 5 and the rinse liquid supply path 6, flow path switching valves V1 and V2 for switching the flow paths are provided respectively.

On the upstream side of the valve V1 in the cleaning treatment liquid flow path 5, there is branched a first discharge path 51 in which a discharge valve V3 is interposed, and from the branch point to a valve further upstream. A V4, a filter F and a pump P are provided. On the upstream side of the pump P in the cleaning treatment liquid flow path 5, a second discharge path 52 in which a valve V5 is provided is branched.

The flow path switching valve V1 is called a parent-child valve and has a large diameter, for example, 3 /.
A 4-inch first flow path 71 (the first flow path may have any flow path shape as long as a cleaning liquid having a flow rate of 10 liters / minute or more can pass therethrough) and a diameter smaller than that of the first flow path 71. For example, the second channel 72 of 1/8 inch (the second channel has a flow rate of 2
Any flow passage shape may be used as long as it can pass a cleaning liquid or a rinse liquid at a rate of 1 / min or less. ) And a valve body 73 for opening and closing the channels 71, 72, respectively.
And 74. Further, the apparatus of this embodiment has a control section 61 for controlling the above-mentioned valves V1 to V5 in a predetermined sequence. Each of the above-mentioned flow paths is, for example, PFA.
Composed of tubes.

A diffusion plate 43 is provided in the processing tank 4 near the outlet of the cleaning treatment liquid flow path 5, and above the wafer (below the position where the wafer holder 3 is supported), for example, a wafer. A current plate 44 having slits and holes along the W arrangement direction is provided. In addition, processing tank 4
A cleaning treatment liquid supply unit 45 is disposed above the above, at a position where it does not interfere with the transportation of the holder 3.

Next, the operation of the above embodiment will be described. First, the cleaning treatment liquid is supplied from the cleaning treatment liquid supply unit 45, for example, 0.5%.
The hydrofluoric acid solution is supplied into the processing tank 4, the first flow path 71 of the valve V1 and the valve V4 are opened, and the cleaning processing solution is circulated by the pump P as shown in FIG. 5A. At this time, the second flow path 72 of the valve V1 and the valves V2, V3,
Keep V5 closed. Then, the wafer holder 3 in which, for example, 50 wafers W are arranged in parallel is loaded into the processing tank 4 by the arms 35a and 35b of the holder transfer means, and the wafer W is held.
Is immersed in a cleaning treatment liquid, and cleaning treatment such as etching is performed for a predetermined time. The wafer holder 3 is supported by a support portion (not shown) in the processing tank 4. Then, the pump P is stopped and the valve V is turned off as shown in FIG.
1, the first flow path 71 and the valve V4 are closed, and the valve V1
The second flow path 72 and the valves V2, V3, and V5 are opened, and a rinse liquid, for example, pure water, is supplied to the rinse liquid supply passage 6 from a rinse liquid supply source (not shown). The rinse liquid is supplied from the connecting portion 60 into the processing bath 4 through the bottom of the processing bath 4, and at the same time, flows into the cleaning processing liquid flow path 5 and the valve V
It is discharged from the first discharge path 51 through the first second flow path 72. Then, for example, after rinsing the cleaning liquid in the second flow passage 72 sufficiently so as not to affect the specific resistance in the post-treatment tank 4 with the valve V2 opened, that is, the connection portion 60 or the connection portion of the second flow passage 72. After the cleaning solution is sufficiently replaced with the rinse solution, the second flow path 72 of the valve V1 is closed, for example, 30 seconds later, and all of the rinse solution flowing through the rinse solution supply path 6 is supplied into the processing tank 4.

In the processing tank 4, the rinsing liquid is diffused by the diffusion plate 43, rectified by the rectifying plate 44, and rises.
The cleaning treatment liquid in the inside is replaced with pure water to perform the rinse treatment. After the specific resistance of the liquid in the processing tank 4 becomes the specific resistance of pure water, the supply of the rinse liquid is stopped and the rinse process is completed. In addition, the liquid overflowing from the processing tank 4 is the second discharge path 5
After being discharged from the wafer holder 3, the liquid in the processing bath 4 is discharged through the second channel 71 of the valve V1, for example.
And is discharged through the first discharge path 51. The series of opening / closing operations of the valve is performed based on a control signal from the control unit 61.

According to the above-described embodiment, after closing the first flow passage 71 of the valve V1 to stop the circulation of the cleaning treatment liquid, the second flow passage 72 of the valve V1 is opened so that the cleaning treatment liquid passage Since the rinse liquid is discharged by backflowing the rinse liquid, the cleaning treatment liquid in the cleaning treatment liquid passage 5 between the connection portion 60 and the valve V1 is replaced by the rinse liquid and mixed with the rinse liquid to be stored in the treatment tank 4. There is no danger of getting in. Therefore, the time until the liquid in the processing tank 4 is replaced with the rinse liquid, that is, the rise of the specific resistance can be accelerated, the time of the rinse treatment can be shortened, and the consumption amount of the rinse liquid can be reduced. When the rinse liquid flows back through the cleaning treatment liquid flow path 5, it passes through the small-diameter second flow passage 72 in the valve V1, so that the rinse liquid is substantially supplied from the rinse liquid supply passage 6 into the processing tank 4. There is no effect.

When the rinse liquid is made to flow backward in the cleaning treatment liquid flow path 5, at least one portion from the connection portion 60 to the discharge port of the discharge passage 51 should be made small in diameter so that the flow rate of the rinse liquid flowing backward is not increased. It is necessary to do so, but instead of using the parent-child valve as the valve V1 as described above, at least one of the valves V1 and V3 can be adjusted in flow rate, or a separate flow rate adjustment valve is provided to allow the reverse flow of the rinse liquid. At the time of (backflow in the cleaning treatment liquid flow path 5), the valve may be throttled by the control signal from the controller 61 to reduce the flow rate. Alternatively, even if the valve V1 is closed, the flow passage is not completely lost.
It is also possible to use a valve that leaves a slight flow path, open the valve V3 and close the valve V1 during the rinse process, and allow the rinse liquid to flow backward through the slight flow path of the valve V1.

Here, when discharging the rinse liquid through the cleaning treatment liquid flow path 5 at a small flow rate during the rinse treatment, P
The diameter of the FA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer) tube is 3/4 inch, the flow rate of the rinse liquid in the rinse liquid supply passage 6 is about 15 liters / minute, and the volume of the processing tank 4 is 12. In the case of ~ 20 liter, the reverse flow rate of the rinse liquid is 0.4-0.5 liter /
It is preferably minutes. This is because at a flow rate of about 0.2 to 0.3 liters / minute, the cleaning treatment liquid between the valve V1 and the connection portion 60 is mixed into the flow of the rinse liquid into the treatment tank 4 to raise the specific resistance. When 0.5 liter / min or more is generated, conversely, most of the rinse liquid from the rinse liquid supply passage 6 is discharged through the discharge passage 51, which rather deteriorates the rise of the specific resistance. Is.

Further, according to the present invention, as shown in FIG. 6, a valve having a normal opening / closing function is used as the valve V1, and the connecting pipe 63 protruding from the valve body 62 of the valve V1 and the connecting portion 60 side. Let L be the total length with the pipe 64 (length of the dead zone), that is, the length from the downstream end of the valve body 62 to the connecting portion 60, and let the pipe diameter be D, D is larger than L. Even if it is configured to be. The present inventor has set L to 1/2 inch and D to 3/4
When set to inch, L is 9/4 inch, D is 3 /
When the recovery of the specific resistance was measured for each of the case of setting to 4 inches, the recovery time of the latter was significantly shorter than that of the former, and therefore when the pipe diameter D was the length L of the dead zone or more. It is understood that when the rinse liquid is supplied to the rinse liquid supply pipe 6 after the circulation of the cleaning liquid is stopped, the cleaning liquid remaining in the dead zone is promptly replaced by the rinse liquid.

Furthermore, in the present invention, as shown in FIG. 7, at the connecting portion 60 between the cleaning treatment liquid flow path 5 and the rinse liquid supply passage 6, the cleaning treatment liquid flow passage 5, the rinse liquid supply passage 6 and the common flow passage 80 are provided. Is provided with a valve 8 having connection pipes 81a to 81c respectively connected thereto, and one of the cleaning treatment liquid passage 5 and the rinse liquid supply passage 6 is connected to the common passage in the valve body 82 of the valve 8. A valve body for switching the flow path may be provided. However, the valve 8 may have only a valve body that opens and closes the cleaning treatment liquid passage 5, and a separate valve may be provided in the rinse liquid supply passage 6 for opening and closing the rinse liquid supply passage 6. In other words, if an integrated valve is provided in the connecting portion 60, the dead zone is almost eliminated, so that the effect of increasing the specific resistance quickly can be obtained. In the embodiment of FIG. 7, in order to discharge the liquid in the treatment tank 4, a second discharge passage may be provided as in the previous embodiment, or a separate discharge passage may be connected to the treatment tank 4. You may.

In the above, the present invention can also be applied to an apparatus in which the cleaning treatment liquid is supplied from the cleaning treatment liquid supply source into the processing tank through the cleaning treatment liquid flow path and the cleaning treatment liquid is not circulated. Further, the invention is not limited to the case of etching an oxide film with a hydrofluoric acid solution, but can be applied to the case of etching a nitride film with a phosphoric acid solution or the case of etching aluminum with a mixed solution of phosphoric acid, acetic acid, and nitric acid. Other cleaning treatments include APM solution (ammonia + hydrogen peroxide solution + pure water) for removing particles, HPM solution (hydrochloric acid + hydrogen peroxide solution + pure water) for cleaning metal contamination, or SPM solution. For example, the organic matter of the resist film may be removed with (sulfuric acid + hydrogen peroxide solution). The substrate to be processed may be a liquid crystal substrate or a pudding and substrate.

[0035]

As described above, according to the present invention, when the rinse liquid is supplied from the rinse liquid supply passage into the processing tank after the treatment with the cleaning treatment liquid, the cleaning treatment liquid in the cleaning treatment liquid passage is provided. Can be prevented from gradually mixing into the processing tank, and as a result, the time for replacement with the rinse liquid can be shortened, the rinse treatment can be performed in a short time, and the consumption amount of the rinse liquid can be reduced.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an overall configuration of a cleaning device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a processing tank and a wafer holder used in one embodiment of the present invention.

FIG. 3 is an explanatory diagram showing a processing tank and a piping system according to an embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view showing the internal structure of a flow path switching valve used in an embodiment of the present invention.

FIG. 5 is an explanatory diagram showing an operation of one embodiment of the present invention.

FIG. 6 is an enlarged view showing the vicinity of a connecting portion according to another embodiment of the present invention.

FIG. 7 is an explanatory view showing a processing tank and a piping system according to still another embodiment of the present invention.

FIG. 8 is a sectional view showing a main part of a conventional cleaning device.

FIG. 9 is an explanatory diagram showing a processing tank and a piping system of a conventional cleaning device.

[Explanation of symbols]

 3 Wafer Holder 4 Processing Tank 42 Receiving Tank 5 Cleaning Processing Liquid Channel 51 First Discharging Channel 52 Second Discharging Channel 6 Rinsing Liquid Supply Channel 60 Connection Part 71 Large First Channel 72 Small Diameter Second Channel 8 Integrated valve

Claims (6)

[Claims] 1. A cleaning treatment liquid flow path for introducing a cleaning treatment liquid into a treatment tank, and a cleaning treatment liquid flow passage connected to an intermediate part of the cleaning treatment liquid flow passage and sharing the downstream side from the connection portion with the cleaning treatment liquid flow passage. ,
A rinse liquid supply path for supplying a rinse liquid into the processing tank, and arranging a plurality of substrates to be processed in the processing tank to wash them with a cleaning processing liquid; and then from the rinse liquid supply path into the processing tank. In a cleaning device for supplying a rinse liquid to the rinse treatment device, a flow passage switching valve is provided in the vicinity of the connection portion in the cleaning treatment liquid flow passage, and the valve is provided with a large-diameter first flow passage and this A configuration is provided that includes a flow passage in which a second flow passage having a diameter smaller than that of the first flow passage is arranged in parallel, and a valve body that opens and closes each of these flow passages. An exhaust valve is provided upstream of the valve. The discharge path provided is branched so that the first flow path is opened and the second flow path is opened when the cleaning treatment liquid flows in.
Of the cleaning treatment liquid flow in the vicinity of the connection portion with the rinse liquid by closing the first flow passage and the second flow passage and the discharge valve at the time of the rinsing process. A cleaning device comprising a control unit for controlling each valve so that the cleaning liquid in the passage is discharged through the discharge passage. 2. A cleaning treatment liquid flow channel for flowing a cleaning treatment liquid into a treatment tank, and a cleaning treatment liquid flow passage connected to an intermediate portion of the cleaning treatment liquid flow passage and sharing the downstream side from the connection portion with the cleaning treatment liquid flow passage. ,
A rinse liquid supply path for supplying a rinse liquid into the processing tank, and arranging a plurality of substrates to be processed in the processing tank to wash them with a cleaning processing liquid; and then from the rinse liquid supply path into the processing tank. In a cleaning device for supplying a rinse liquid to the rinse processing device, a flow path switching valve is provided near the connection portion in the cleaning processing liquid flow path, and an exhaust valve is provided upstream of this valve. The discharge path is branched, and at least one of these valves is configured to adjust the flow rate.The flow path switching valve and the discharge valve are opened during the rinse process, and the flow path is throttled by at least one of these valves. A control unit is provided to control each valve so that the rinse liquid in the rinse liquid passage in the vicinity of the connection portion is discharged through the discharge passage by a rinse liquid. Cleaning device. 3. A cleaning treatment liquid flow channel for flowing a cleaning treatment liquid into a treatment tank, and a cleaning treatment liquid flow passage connected to an intermediate part of the cleaning treatment liquid flow passage and sharing the downstream side from the connection portion with the cleaning treatment liquid flow passage. ,
A rinse liquid supply path for supplying a rinse liquid into the processing tank, and arranging a plurality of substrates to be processed in the processing tank to wash them with a cleaning processing liquid; and then from the rinse liquid supply path into the processing tank. In a cleaning device for supplying a rinse liquid to the rinse treatment device, in the vicinity of the connection part in the cleaning treatment liquid flow passage, a passage switching valve configured to leave a slight passage even when closed. Is provided, and the discharge path in which the discharge valve is provided is branched on the upstream side of this valve, and the flow path switching valve is closed and the discharge valve is opened during the rinsing process, thereby cleaning the vicinity of the connection part. A cleaning apparatus comprising a control unit for controlling each valve so that the cleaning processing liquid in the processing liquid flow path is discharged by a rinse liquid through the flow path switching valve and the discharge path. 4. A cleaning treatment liquid flow channel for flowing a cleaning treatment liquid into a treatment tank, and a cleaning treatment liquid flow passage connected to an intermediate part of the cleaning treatment liquid flow passage and sharing the downstream side from the connection portion with the cleaning treatment liquid flow passage. ,
A rinse liquid supply path for supplying a rinse liquid into the processing tank, and arranging a plurality of substrates to be processed in the processing tank to wash them with a cleaning processing liquid; and then from the rinse liquid supply path into the processing tank. In a cleaning device for supplying a rinse liquid to the rinse treatment device, the discharge passage is branched from the cleaning treatment liquid passage, and after the cleaning treatment is completed by the cleaning treatment liquid, the rinse liquid is supplied from the rinse liquid supply passage into the treatment tank. Meanwhile, the rinse liquid is discharged from the rinse liquid supply passage through the connection portion, the cleaning treatment liquid passage and the discharge passage, and at the time of this discharge step, at least a part from the connection portion to the outlet of the discharge passage, A cleaning method characterized in that the flow path is thin enough not to hinder the supply of the rinse liquid into the processing tank. 5. A cleaning treatment liquid flow channel for flowing a cleaning treatment liquid into a treatment tank, and a cleaning treatment liquid flow passage connected to an intermediate portion of the cleaning treatment liquid flow passage and sharing the downstream side from the connection portion with the cleaning treatment liquid flow passage. ,
A rinse liquid supply path for supplying a rinse liquid into the processing tank, and arranging a plurality of substrates to be processed in the processing tank to wash them with a cleaning processing liquid; and then from the rinse liquid supply path into the processing tank. In a cleaning device for supplying a rinse liquid to the rinse processing device, a flow path switching valve is provided in the vicinity of the connection portion in the cleaning processing liquid flow path, and from the connection portion to the valve body of the flow path switching valve. The cleaning device is characterized in that the length of the channel is set shorter than the diameter of the channel. 6. A cleaning treatment liquid flow channel for flowing a cleaning treatment liquid into a treatment tank, and a cleaning treatment liquid flow passage connected to an intermediate part of the cleaning treatment liquid flow passage and sharing the downstream side from the connection portion with the cleaning treatment liquid flow passage. ,
A rinse liquid supply path for supplying a rinse liquid into the processing tank, and arranging a plurality of substrates to be processed in the processing tank to wash them with a cleaning processing liquid; and then from the rinse liquid supply path into the processing tank. In the cleaning device for supplying a rinse liquid to the rinse device, the connecting portion is connected to the valve body, and the connection pipes are connected to the cleaning process liquid, the rinse liquid flow path, and the shared flow path of these, respectively. A cleaning device, wherein a valve having a valve formed therein is provided, and a valve body that opens and closes a cleaning treatment liquid flow path is provided in the valve body.