JPH0819499B2 - Copper alloy for flexible printing - Google Patents
Copper alloy for flexible printingInfo
- Publication number
- JPH0819499B2 JPH0819499B2 JP62144598A JP14459887A JPH0819499B2 JP H0819499 B2 JPH0819499 B2 JP H0819499B2 JP 62144598 A JP62144598 A JP 62144598A JP 14459887 A JP14459887 A JP 14459887A JP H0819499 B2 JPH0819499 B2 JP H0819499B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible printing
- copper alloy
- flexibility
- alloy
- tensile strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title description 6
- 239000010949 copper Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000012535 impurity Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229910052787 antimony Inorganic materials 0.000 description 4
- 229910052797 bismuth Inorganic materials 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052790 beryllium Inorganic materials 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910052714 tellurium Inorganic materials 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000003009 desulfurizing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はフレキシブルプリント用銅合金に関し、さら
に詳しくは抗張力や可撓性に優れ、導電率も良好なフレ
キシブルプリント用およびICテープキャリア用などに好
適な銅合金に係るものである。Description: TECHNICAL FIELD The present invention relates to a copper alloy for flexible printing, more specifically, for flexible printing and IC tape carrier having excellent tensile strength and flexibility and good conductivity. It relates to a suitable copper alloy.
フレキシブルプリント配線板は、プリント配線板にお
いて比較的新しい部品であって、その大きな特色は可撓
性を利用することである。このフレキシブルプリント配
線板は、初めは電線、ケーブルにおける可撓性が必要な
場合の代替品として使用されたもので、現在でも主とし
て電線、ケーブルの代替品として使用されている。フレ
キシブルプリント配線板は可撓性を利用し、曲げたり、
捩ったりしてカメラ、電卓および電話機等の機器内立体
配線材料として、また可撓性の優れていることからプリ
ンタヘッド等の電子機器の可動部への配線にも使用され
ている。Flexible printed wiring boards are relatively new components in printed wiring boards, and their major feature is to utilize flexibility. This flexible printed wiring board was originally used as a substitute for a wire or cable that requires flexibility, and is still mainly used as a substitute for electric wires and cables. Flexible printed wiring boards use flexibility to bend,
It is twisted and used as a three-dimensional wiring material in devices such as cameras, calculators and telephones, and also used for wiring to movable parts of electronic devices such as printer heads due to its excellent flexibility.
さらに集積回路の分野では、最近の軽薄短小化に伴
い、ICのパッケージも種々変化しつつあるが、この中で
今後需要が増えると考えられるTAB方式（Tape Automate
d Bonding）のパッケージに適した材料が望まれてい
る。Furthermore, in the field of integrated circuits, the IC package is undergoing various changes due to the recent trend toward lighter, thinner, shorter, and smaller devices. Among these, the TAB method (Tape Automate
Materials suitable for d Bonding) packages are desired.
従来、これらの用途には主にタフピッチ銅が使用され
ていたが、導電率は約100％IACSと良好であるものの抗
張力が不充分である問題があった。Conventionally, tough pitch copper has been mainly used for these applications, but there is a problem that the tensile strength is insufficient although the conductivity is good at about 100% IACS.
本発明は上記の問題について検討の結果、導電率がタ
フピッチ銅と略同等であり、抗張力および可撓性がタフ
ピッチ銅より格段に優れたフレキシブルプリント用銅合
金を開発したものである。As a result of studying the above problems, the present invention has developed a copper alloy for flexible printing, which has substantially the same conductivity as that of tough pitch copper and has significantly higher tensile strength and flexibility than tough pitch copper.
本発明は、Mg0.0001〜0.5wt％、残部Cuおよび不可避
不純物とからなるフレキシブルプリント用銅合金を第１
発明とし、またMg0.0001〜0.5wt％、さらにBe、Ca、T
i、Ｖ、Cr、Mn、Fe、Ｙ、Zr、Nb、Co、Ni、Ag、Zn、C
d、Al、Ｂ、Ga、In、Si、Ge、Ｐ、As、Sb、Bi、Teなど
の１種または２種以上を単独で0.0001〜0.3wt％、総計
で、0.0001〜0.5wt％含み、残部がCuと不可避不純物と
からなるフレキシブルプリント用銅合金を第２発明とす
るものである。The present invention provides a copper alloy for flexible printing, which comprises Mg 0.0001 to 0.5 wt% and the balance Cu and unavoidable impurities.
Invented, Mg 0.0001-0.5wt%, Be, Ca, T
i, V, Cr, Mn, Fe, Y, Zr, Nb, Co, Ni, Ag, Zn, C
One or more of d, Al, B, Ga, In, Si, Ge, P, As, Sb, Bi, Te, etc. is contained 0.0001 to 0.3 wt% by itself, and 0.0001 to 0.5 wt% in total, A second invention is a copper alloy for flexible printing, the balance of which is Cu and inevitable impurities.
すなわち本発明はCuに微量のMgを添加して導電率をあ
まり低下させずに抗張力および可撓性を格段に向上させ
たものであり、またCuに微量のMgを添加し、さらに副成
分としてBe、Ca、Ti、Ｖ、Cr、Mn、Fe、Ｙ、Zr、Nb、C
o、Ni、Ag、Zn、Cd、Al、Ｂ、Ga、In、Si、Ge、Ｐ、A
s、Sb、Bi、Teなどを微量添加することにより、その特
性をさらに向上せしめたものである。That is, the present invention is to improve the tensile strength and flexibility without significantly lowering the conductivity by adding a trace amount of Mg to Cu, and also adding a trace amount of Mg to Cu, and further as a sub-component. Be, Ca, Ti, V, Cr, Mn, Fe, Y, Zr, Nb, C
o, Ni, Ag, Zn, Cd, Al, B, Ga, In, Si, Ge, P, A
The characteristics are further improved by adding a small amount of s, Sb, Bi, Te and the like.
本発明において合金組成を上記のように限定したの
は、Mgを0.0001〜0.5wt％としたのはMgは導電率もあま
り低下させることなく、可撓性、抗張力を向上させる元
素であるが、0.0001wt％未満ではその効果が少なく、0.
5wt％を越えると鋳造性を悪化させ、また熱間加工性が
低下するからである。またBe以下の副成分は脱酸、脱硫
元素として、樹脂との密着性や熱間加工性を向上させ、
抗張力や可撓性をより一層向上させる作用をなすもので
あるが0.0001％未満では、その効果が少なく、単独で0.
3wt％、総計で0.5wt％を越えると導電性や生産性を低下
させるためである。In the present invention, the alloy composition is limited as described above.Mg of 0.0001 to 0.5 wt% is an element that improves flexibility and tensile strength without significantly reducing conductivity. If less than 0.0001 wt%, the effect is small, and
This is because if it exceeds 5 wt%, the castability is deteriorated and the hot workability is deteriorated. In addition, the sub-components of Be and below serve as deoxidizing and desulfurizing elements to improve the adhesion to the resin and hot workability,
It acts to further improve tensile strength and flexibility, but if it is less than 0.0001%, its effect is small, and it is 0.
This is because if it exceeds 3 wt%, or 0.5 wt% in total, the conductivity and productivity are reduced.
また本発明における不可避不純物とは、通常の地金中
に含まれるもの或いは製造工程中に入る不純物を云うも
ので例えばAs、Sb、Bi、Pb、Ｓ、Fe、O2などであるが、
この中特にO2量、Ｓ量について規定したもので、O2を50
0ppm以下としたのは、これを越えるとCrの粗大酸化物が
生成し易くなり、抗張力および可撓性を低下させ、また
表面粗化処理後の樹脂との密着性を悪くするからであ
る。Ｓ量を10ppmとしたのは、これを越えるとＳは結晶
粒界に濃化し易く、熱間圧延性を害し生産性を低下さ
せ、またCrとも粗大化合物を形成し易く特性が悪くなる
ためである。なおO2、Ｐ以外の不純物については通常含
まれる程度であれば何等差支えなく、As、Sb、Bi、Feな
どの本発明の副成分と重複するものは、上記の組成範囲
で合せて含有せしめれば副成分としての効果を発揮する
ものである。Further, the unavoidable impurities in the present invention refer to impurities contained in ordinary metal or impurities entering the manufacturing process, and examples thereof include As, Sb, Bi, Pb, S, Fe and O 2 .
Of these, the O 2 amount and S amount are specified, and O 2 of 50
The reason for setting the content to 0 ppm or less is that a coarse Cr oxide is likely to be formed, the tensile strength and flexibility are lowered, and the adhesion to the resin after the surface roughening treatment is deteriorated. The amount of S is set to 10 ppm because if it exceeds this amount, S is likely to be concentrated in the grain boundaries, impairing the hot rolling property and lowering the productivity, and also Cr is likely to form a coarse compound, resulting in poor properties. is there. It should be noted that impurities other than O 2 and P may be contained in any amount as long as they are normally contained, and those which overlap with the sub-components of the present invention such as As, Sb, Bi and Fe should be contained together in the above composition range. Then, the effect as an accessory ingredient is exhibited.
以下の本発明の一実施例について説明する。 An example of the present invention will be described below.
実施例１ 第１表に示す本発明合金を溶解鋳造し、巾480mm、厚
さ130mm、長さ2200mmの鋳塊を得た後850〜930℃の温度
で熱間圧延し厚さ12mmとし、冷却水により室温付近まで
直ちに冷却し、その後上下面を0.5mm面削後、0.5mm厚さ
まで冷間圧延を行ない、非酸化性雰囲気中において480
℃３時間焼鈍し、さら厚さ0.035mmに冷間圧延して供試
材とした。Example 1 The alloy of the present invention shown in Table 1 was melt cast to obtain an ingot having a width of 480 mm, a thickness of 130 mm and a length of 2200 mm, and then hot-rolled at a temperature of 850 to 930 ° C. to a thickness of 12 mm and cooled. Immediately cool to near room temperature with water, then cut the upper and lower surfaces by 0.5 mm and then cold-roll to a thickness of 0.5 mm, and perform 480 in a non-oxidizing atmosphere.
It was annealed at ℃ for 3 hours and cold-rolled to a thickness of 0.035 mm to obtain a test material.
また比較合金としてタフピッチ銅の巾480mm、厚さ130
mm、長さ2200の鋳塊を860℃の温度で熱間圧延し、その
後上下面を0.5mm面削し、0.5mmまで冷間圧延を行ない非
酸化性雰囲気中で420℃３時間焼鈍し、0.0035mまで冷間
圧延して供試材とした。As a comparative alloy, tough pitch copper has a width of 480 mm and a thickness of 130.
mm, length 2200 ingots are hot-rolled at a temperature of 860 ° C, then the upper and lower surfaces are chamfered by 0.5mm, cold-rolled to 0.5mm, and annealed at 420 ° C for 3 hours in a non-oxidizing atmosphere, It was cold-rolled to 0.0035 m and used as a test material.
上記の各供試材を本発明合金では500℃で、比較材は2
70℃で焼鈍して焼鈍材とし、可撓性、抗張力、伸び、導
電率、密着性などの特性について測定した。可撓性につ
いては耐折強さ試験を、JIS P8115の方法により巾15mm
の供試材を用い500gfの荷重、曲率半径ｒ＝0.38mm、ｎ
＝10として行ないその平均値を採用した。抗張力、導電
率については巾10mmの短冊状サンプルにより引張試験と
電気抵抗を測定して求めた。また樹脂との密着性につい
ては供試材表面をエッチングにより粗化した後、フェノ
ール基材と接着したものの、引き剥し強さを求めた。こ
れらを結果を第２表に示した。なお表には試験片の採取
方向を圧延方向に平行に採取したものおよび圧延方向に
直角に採取したものを併記した。 Each of the above test materials was 500 ° C. in the alloy of the present invention, and 2 in the comparative material.
Annealing was performed at 70 ° C. to obtain an annealed material, and the characteristics such as flexibility, tensile strength, elongation, conductivity, and adhesion were measured. For flexibility, the folding endurance test is performed by the method of JIS P8115, and the width is 15 mm.
Load of 500gf, radius of curvature r = 0.38mm, n
= 10 and adopted the average value. The tensile strength and the electrical conductivity were obtained by measuring the tensile test and the electrical resistance using a strip sample having a width of 10 mm. Regarding the adhesiveness to the resin, the peel strength was determined after the test material surface was roughened by etching and then adhered to the phenol substrate. The results are shown in Table 2. In the table, the specimens sampled in the direction parallel to the rolling direction and those sampled at right angles to the rolling direction are also shown.
第１表および第２表から明らかなように本発明合金N
o.1〜４は従来のタフピッチ銅No.5,6に比較して、導電
率が僅かに低下するが、抗張力、可撓性において格段に
優れ、引き剥し強さも著しく大きく、フレキシブルプリ
ント用として適していることが判る。それに対し比較材
No.7はO2量が多いため特性が低下している。 As is clear from Tables 1 and 2, the alloy N of the present invention
Compared with the conventional tough pitch copper Nos. 5 and 6, o.1 to 4 have a slightly lower conductivity, but are significantly superior in tensile strength and flexibility, and also have extremely large peel strength, making them suitable for flexible printing. It turns out to be suitable. On the other hand, comparison material
No. 7 has a large amount of O 2, so the characteristics are deteriorated.
なお試料の採取方向は圧延方向に直角方向が平行方向
と比べ若干低目であるが上記の特性の傾向は全く同じで
ある。The direction of sampling the sample is slightly lower in the direction perpendicular to the rolling direction than in the direction parallel to it, but the tendency of the above characteristics is exactly the same.
実施例２ 第３表に示す組成の本発明合金および比較合金を実施
例１と同様にして供試材を作製し、これを実施例１と同
様にして各特性を調べた。その結果を第４表に示す。Example 2 Using the alloy of the present invention and the comparative alloy having the compositions shown in Table 3 as in Example 1, a sample material was prepared, and in the same manner as in Example 1, each property was examined. Table 4 shows the results.
第３表および第４表から明らかなように本発明合金N
o.1〜５は従来のタフピッチ銅No.6,7に比較して導電率
が僅かに低下するが、抗張力、可撓性において格段に優
れ、引き剥し強さも著しく大きく、フレキシブルプリン
ト用として適していることが判る。それに対し比較材N
o.8はO2量が多いため特性が低下している。なお試料の
採取方向は圧延方向に直角方向が平行方向に比べ若干低
目であるが、上記特性の傾向は全く同じである。 As apparent from Tables 3 and 4, the alloy N of the present invention
Although o.1 to 5 have a slightly lower conductivity than conventional tough pitch copper Nos. 6 and 7, they are remarkably excellent in tensile strength and flexibility, and also have extremely large peel strength, making them suitable for flexible printing. You can see that On the other hand, comparative material N
The characteristics of o.8 are degraded due to the large amount of O 2 . Although the direction of sampling the sample is slightly lower in the direction perpendicular to the rolling direction than in the direction parallel to it, the tendency of the above characteristics is exactly the same.
以上に説明したように本発明によれば、可撓性、導電
性、抗張力、密着性などに優れ、フレキシブルプリント
用として、またICテープキャリヤー用の基材としても適
するなど可撓性が要求される用途に適するもので、また
リジットプリント用としても有効であり、工業上顕著な
効果を発揮するものである。As described above, according to the present invention, flexibility is required, which is excellent in flexibility, conductivity, tensile strength, adhesion, etc. and is suitable for flexible printing and also as a base material for an IC tape carrier. It is also suitable for rigid printing and is also effective for rigid printing, and exhibits remarkable industrial effects.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 寺下 道明 栃木県日光市清滝町500 古河電気工業株 式会社日光電気精銅所内 (72)発明者 北里 敬輔 栃木県日光市清滝町500 古河電気工業株 式会社日光電気精銅所内 審査官 三宅 正之 (56)参考文献 特開 昭59−78592（ＪＰ，Ａ) ─────────────────────────────────────────────────── --- Continuation of the front page (72) Inventor Michiaki Terashita 500 Kiyotaki-cho, Nikko City, Tochigi Prefecture Furukawa Electric Co., Ltd.Nikko Denki Copper Works (72) Inventor Keisuke Kitasato 500 Kiyotaki-cho, Nikko City, Tochigi Prefecture Furukawa Electric Co., Ltd. Masayuki Miyake (56) Referencer, Inspector of Nikko Denki Copper Works, a ceremony company Reference JP-A-59-78592 (JP, A)
Claims (4)
不純物とからなるフレキシブルプリント用銅合金。1. A copper alloy for flexible printing, which comprises Mg 0.0001 to 0.5 wt% and the balance Cu and unavoidable impurities.
10ppm以下であることを特徴とする特許請求の範囲第１
項記載のフレキシブルプリント用銅合金。2. The inevitable impurities have an O 2 content of 500 ppm or less and an S content of
Claim 1 characterized in that it is 10ppm or less
The copper alloy for flexible printing according to the item.
r,Mn,Fe,Y,Zr,Nb,Co,Ni,Ag,Zn,Cd,Al,B,Ga,In,Si,Ge,P,
As,Sb,Bi,Teなどの１種または２種以上を単独で0.0001
〜0.3wt％、総計で0.0001〜0.5wt％含み、残部がCuと不
可避不純物とからなるフレキシブルプリント用銅合金。3. Mg 0.0001 to 0.5 wt%, and Be, Ca, Ti, V, C
r, Mn, Fe, Y, Zr, Nb, Co, Ni, Ag, Zn, Cd, Al, B, Ga, In, Si, Ge, P,
One or more of As, Sb, Bi, Te, etc. alone 0.0001
~ 0.3wt%, 0.0001 ~ 0.5wt% in total, the balance is Cu and inevitable impurities for flexible printing copper alloy.
10ppm以下であることを特徴とする特許請求の範囲第３
項記載のフレキシブルプリント用銅合金。4. The inevitable impurities have an O 2 amount of 500 ppm or less and an S amount of
Claim 3 which is less than 10 ppm
The copper alloy for flexible printing according to the item.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62144598A JPH0819499B2 (en) | 1987-06-10 | 1987-06-10 | Copper alloy for flexible printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62144598A JPH0819499B2 (en) | 1987-06-10 | 1987-06-10 | Copper alloy for flexible printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63310929A JPS63310929A (en) | 1988-12-19 |
| JPH0819499B2 true JPH0819499B2 (en) | 1996-02-28 |
Family
ID=15365772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62144598A Expired - Fee Related JPH0819499B2 (en) | 1987-06-10 | 1987-06-10 | Copper alloy for flexible printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0819499B2 (en) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR920006826B1 (en) * | 1990-09-18 | 1992-08-20 | 주식회사 풍산 | Copper alloy for high conductivity electric and electronic parts and manufacturing method |
| DE19611531A1 (en) * | 1996-03-23 | 1997-09-25 | Berkenhoff Gmbh | Copper alloy for control lines and connectors |
| KR100628542B1 (en) * | 1998-10-13 | 2006-09-27 | 도소 가부시키가이샤 | The sinter of metal oxide compound and use thereof |
| JP2003027162A (en) * | 2001-07-13 | 2003-01-29 | Nippon Mining & Metals Co Ltd | Copper alloy foil for laminates |
| KR20030014168A (en) * | 2001-08-10 | 2003-02-15 | 닛코 킨조쿠 가부시키가이샤 | Copper alloy foil for laminated sheet |
| JP2005213629A (en) * | 2004-02-02 | 2005-08-11 | Nikko Metal Manufacturing Co Ltd | Method for heat treatment of copper alloy, and copper alloy and material |
| JP5055088B2 (en) * | 2007-10-31 | 2012-10-24 | Ｊｘ日鉱日石金属株式会社 | Copper foil and flexible printed circuit board using the same |
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Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62146231A (en) * | 1985-12-20 | 1987-06-30 | Kobe Steel Ltd | High conductivity copper alloy superior in migration resistance |
| JPS63140052A (en) * | 1986-12-01 | 1988-06-11 | Hitachi Cable Ltd | Oxygen-free copper-base dilute alloy having low-temperature softening characteristic and its use |
-
1987
- 1987-06-10 JP JP62144598A patent/JPH0819499B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63310929A (en) | 1988-12-19 |
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| LAPS | Cancellation because of no payment of annual fees |