JPH08186216A - Structure and formation of electronic part device - Google Patents

Abstract

PURPOSE: To modify only a shape of a lead terminal without modifying a shape of a package body excepting a lead terminal even if a mounting method of an electronic component device is changed. CONSTITUTION: An electronic component device of an insertion mounting type is formed by forming only an electronic component device of a surface mounting type before forming a lead terminal, by punching an end part of a lead part 1b of an electronic component device to such a shape as to fit to a lead terminal 2b when a dam bar part 1e is cut by punching by a die by a dam bar cut device, by bending it below by a forming device and by fitting it to the lead terminal 2b of a terminal member 2 formed separately in a formation process of an electronic component device. The terminal member 2 is comprised of the lead terminal 2b for insertion mounting and a resin part 2a for fixing the lead terminal, and is formed to hold the lead 2b inside the resin part 2a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure and a method for forming an electronic component device, and more particularly to a structure and a method for forming an electronic component device having lead terminals for insertion mounting formed by using a surface mounting type package. .

[0002]

2. Description of the Related Art Conventionally, as a type of a general electronic component device viewed from a mounting form, a DIP in which a lead terminal of an electronic component is inserted into a connection hole provided in a substrate on which circuit wiring is formed and fixed by soldering or the like. (Dual In-line P
and an SMD (Surface Mount D) that attaches electronic components onto a board on which circuit wiring is formed and fixes them by soldering or the like.
device) and a surface-mount type electronic component device.
Insertion type electronic components are easy to use and can be assembled without expensive boards or assembly equipment. Has become. On the other hand, the surface-mounting type electronic component generally requires a small mounting area and enables high-density mounting, and is therefore widely used mainly in portable devices. Each mounting form will be used depending on the application in the future, but in any case, one electronic component device can handle only one mounting method.

FIG. 4 is an explanatory view showing a method of forming a conventional insertion mounting type electronic component device, and shows a method of forming a so-called optical sensor device. A method of forming the insertion-mounting type electronic component device will be briefly described with reference to FIGS. still,
Since various kinds of manufacturing apparatuses used in each process may be general apparatuses, only the intended use and apparatus name are shown in this description, and detailed description of the manufacturing apparatuses is omitted.

FIG. 4 (a) schematically shows the shape of a lead frame used in an insertion mounting type optical sensor device, and shows an island portion 3d for mounting the optical sensor element by die bonding and an optical sensor device. A lead frame for one optical sensor device, including a lead portion 3b serving as a lead terminal and a dam bar (also referred to as a tie bar) portion 3e for fixing the lead terminal and stopping the flow of resin when the optical sensor element is sealed with resin. 3 is formed, and is formed in a band shape so as to connect a plurality of lead frames 3.

The manufacturing procedure will be described. An optical sensor element is attached to the island portion 3d at a position indicated by a dotted line 3f by a die bonding device, the lead portion 3b and the optical sensor element are connected by a wire bonding device, and then the package body and the lens portion 3c are halved by a molding device. The transparent resin is integrally formed, the unnecessary resin (referred to as resin burr) is removed by a deburring device, and the lead terminals are plated with solder or the like by a plating device to obtain the shape shown in FIG. 4 (b).

Subsequently, the dam bar portion 3e is punched and cut by a die with a dam bar cutting device to obtain a lead portion 3b.
By cutting the end portion of, the individual photosensor device as shown in FIG. 4C is formed. After that, the lead terminals 3b of the individual optical sensor devices can be bent or cut by a forming device to be processed into a required terminal shape according to the usage state, and the shape of the optical sensor device as shown in FIG. 4D can be obtained. become. Finally, the electrical characteristics are individually measured by the measuring device and the non-defective products are selected to obtain finished products.

FIG. 5 shows a side view of an example of the terminal shape in the insertion mounting type optical sensor device. 5A shows a straight type standard type having a stopper 3b 'in the middle of the lead terminal for positioning the optical sensor device at a predetermined height from the substrate, and FIG. 5B shows the optical sensor device on the substrate. Fig. 5 (c) shows an L-shaped standard type in which the lead terminals are bent in the middle to be attached in parallel with Fig. 5 (c). There is. Various combinations of lead terminal shapes are made according to the size and structure of the product used, depending on the position of the stopper, the length of the lead terminal, and the like.

[0008]

In the structure of the conventional optical sensor device, in performing the series of steps as shown in FIG. 4, whether the mounting form is the insertion mounting type or the surface mounting type, and further, Depending on the shape of the insertion mounting type terminal shown in FIG. 5, etc., the die bonding apparatus, wire bonding apparatus, molding apparatus, deburring apparatus, plating apparatus, dam bar cutting apparatus used in the above-described manufacturing process, It has been necessary to prepare a plurality of manufacturing lines in which the respective manufacturing devices such as the forming device and the measuring device are arranged, or to replace the devices according to the shape requirements and use them.

Therefore, when each manufacturing apparatus is prepared and a plurality of manufacturing lines are prepared, the purchase cost of the manufacturing apparatus becomes high and the occupied area of the apparatus becomes large, and the production quantity is shortened. There is a problem that it is difficult to increase or decrease, and there is a problem that it takes time and labor to set up when replacing the manufacturing apparatus according to the situation.

Therefore, according to the present invention, in order to solve these problems, even if the mounting method of the electronic component device is changed, only the shape of the lead terminal is changed and the shape of the package body other than the lead terminal is not changed. By doing so, the manufacturing equipment can be made common to the intermediate steps, and the cost and installation place of the manufacturing equipment can be reduced, and
An object of the present invention is to provide a structure of an electronic component device and a method for forming the same, which can save the labor of replacing the manufacturing device.

[0011]

In order to solve the above-mentioned problems, in an electronic component device according to a first aspect of the present invention, a part of a plurality of first lead terminals is integrally inserted with resin. An electronic component device having a mounting terminal member, and a surface mount type resin portion having a fitting portion formed at the end of the flat plate-shaped second lead terminal so as to be fitted to the first lead terminal, It is characterized in that the fitting portion is fitted and formed on the first lead terminal.

In the electronic component device according to the second aspect of the present invention, the fitting portion is fitted to the first lead terminal, and the fitting portion is fixed by solder. In the electronic component device according to claim 3,
The fitting portion is fitted to the first lead terminal, and the fitting portion is fixed with an adhesive. Claim 4
In the electronic component device according to the above item, the fitting portion is fitted to the first lead terminal, and the surface mount resin portion and the resin portion of the terminal member are fixed by an adhesive. To do.

According to a fifth aspect of the present invention, there is provided a method of forming an electronic component device, wherein a part of a plurality of first lead terminals is integrally assembled with a resin to form a terminal member for insertion mounting, and surface mounting is performed. Type electronic component device, an insertion portion is formed at an end portion of the second lead terminal so as to be fitted with the first lead terminal, and the insertion portion is attached to the first lead terminal. The electronic component device is formed.

[0014]

By using the structure of the electronic component device and the method of forming the same according to the present invention, the manufacturing apparatus can be standardized in the manufacturing process.

[0015]

Embodiments of the present invention will be described in detail below with reference to FIGS. Throughout the drawings, the same or similar components are denoted by the same reference numerals throughout this specification. FIG. 1 is an explanatory view showing a method for forming an electronic component device according to the present invention, showing a so-called semiconductor optical sensor device forming method. A method of forming the optical sensor device will be briefly described with reference to the drawings of FIG. Since various manufacturing apparatuses used in each step may use general apparatuses shown in literatures and the like, only the apparatus names to be used are shown in this description.
Detailed description of the manufacturing apparatus is omitted.

FIG. 1 (a) is a schematic view of a lead frame formed by etching or punching, which is made of metal such as iron or alloy called 42 alloy or copper used in an insertion mounting type optical sensor device. An example is shown, and an island portion 1d for mounting a semiconductor optical sensor element such as an infrared phototransistor by die bonding
And a lead portion 1b on a flat plate which serves as a lead terminal of the optical sensor device, and a dam bar (also referred to as a tie bar) portion 1e for fixing the lead portion 1b and stopping the flow of resin when the optical sensor element is sealed with resin. Therefore, the lead frame 1 for one optical sensor device is formed, and the lead frame 1 is formed in a band shape so as to connect the plurality of lead frames 1.

The manufacturing procedure will be described. The optical sensor element is attached to the island portion 1d at a position indicated by a dotted line 1f by a die bonding device, the lead portion 1b and the optical sensor element are connected by a wire bonding device with a gold wire or an aluminum wire, and then the package body is attached by a molding device. 1a and the lens portion 1c are integrally formed of a semitransparent resin such as epoxy, unnecessary resin (called resin burr) is removed by a deburring device, and a lead portion 1b is formed by a plating device.
1 (b) by plating or immersing the
It becomes the shape shown in.

Subsequently, the dam bar portion 1e is punched and cut by a die with a dam bar cutting device to obtain a lead portion 1b.
As shown by the solid line in FIG.
2B is punched into a shape that sandwiches it, bent downward by a forming device as shown in the optical sensor device 1 of FIG. 2A, and fitted into the lead terminals 2b of the separately formed terminal member 2. For example, an insertion mounting type optical sensor device can be formed. The terminal member 2 is composed of a lead terminal 2b for insertion mounting and a resin portion 2a for fixing the lead terminal, and the resin portion 2a has an optical sensor device 1
A hole-shaped fitting portion 2c is provided at a position where the fitting portion 1d of FIG. 1 is fitted to the lead terminal 2b, and a cylindrical lead wire (referred to as CP wire) 2b is sandwiched between the resin portions 2a. There is. The lead wire 2b is formed upon request.

In some cases, the strength against pulling may not be sufficient just by fitting the fitting portion 1d to the lead terminal 2b. In that case, the fitting portion is reinforced with solder or adhesive. Better Preferably, if the resin portion 1a of the optical sensor device 1 and the resin portion 2a of the terminal member 2 are bonded with an adhesive instead of reinforcing only the fitting portion, the fitting strength is further improved, and external factors This prevents the fitting portion from coming off.

On the other hand, when the dam bar portion 1e is punched and cut by a die with a dam bar cutting device, the end portion of the lead portion 1b is cut in a direction perpendicular to the lead terminal 1b as shown by the dotted line in FIG. 1 (c). However, as shown in FIG. 2B, by performing only forming for surface mounting by the forming device, a surface mounting type optical sensor device can be formed.

Finally, the electrical characteristics are individually measured by the measuring device and the non-defective products are selected to complete the insertion mounting type and surface mounting type optical sensor devices. Thus, by forming the optical sensor device by the method as described above,
Regardless of the insertion mounting type or the surface mounting type, it is possible to perform the process before forming the lead terminals shown in FIG. 1C in one manufacturing line.

Although only the three-terminal optical sensor device has been described with reference to FIG. 1, if it has two or more terminals, various semiconductor sensors including a single or composite body of diodes and transistors, and a semiconductor integrated circuit device or the like. It can be applied to electronic parts having surface mounting and insertion mounting. FIG.
Shows an application example of the present invention, and shows an example of the shape of a resin that puts together the fitting portion at the tip of the lead terminal 1b of the electronic component device 1 and a part of the lead terminal 2b of the terminal member 2.

The fitting portion 1d formed in the electronic component device of FIG. 3 (a) uses about half the width of the flat lead terminal 1b, and has a hook shape in the same direction of all the lead terminals 1b. The electronic component of the insertion mounting type is formed by fitting the lead terminal 2b of the terminal member 2 so as to be hooked. It is preferable to fix the fitting portion with solder or an adhesive so as to reinforce the strength of the fitting portion. The terminal member 2 has a shape in which only the outer side of the lead terminal 2b where the lead terminal of the electronic component device 1 is fitted is fixed in a rod shape with a resin such as epoxy with a width of several mm.

The fitting portion 1d formed in the electronic component device of FIG. 3B uses about half the width of the flat lead terminal 1b so as to oppose to the outside of each lead terminal 1b. Is formed into a hook shape, and is fitted so as to be sandwiched between the lead terminals 2b of the terminal member 2 to form an insertion mounting type electronic component. The terminal member 2 has a shape in which only the outer side of the lead terminal 2b where the lead terminal of the electronic component device 1 is fitted and the side surface of the lead terminal are fixed by a resin such as epoxy with a width of several mm.

The fitting portion 1d formed in the electronic component device of FIG. 3 (c) uses about half the width of the flat lead terminal 1b so as to face the inside of each lead terminal 1b. Is formed into a hook shape, and is fitted so as to sandwich the lead terminal 2b of the terminal member 2 to form an insertion mounting type electronic component. The terminal member 2 has a shape in which a portion other than the lead terminal 2b in which the lead terminal of the electronic component device 1 is fitted is fixed with a resin such as epoxy, and the outside of the fitting portion is opened. Are doing

In the above description, only the columnar rod-shaped lead wire is shown as the lead terminal 2b, but a square pole rod-shaped lead terminal used in a semiconductor device or the like may be used. Furthermore, the above-described embodiments can be used in any combination.

[0027]

As described above, by using the structure and forming method of the electronic component device of the present invention, it becomes possible to standardize the device in the manufacturing process. Therefore, it is necessary to prepare a plurality of manufacturing lines. In addition to the effect that the cost of the equipment can be reduced, the labor for replacing the device according to the mounting form is also unnecessary, and therefore, there is an effect that the electronic component device of the required mounting form can be quickly supplied.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a method for forming an electronic component device according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a structure of an electronic component device according to an embodiment of the present invention.

FIG. 3 is an explanatory view showing an example of another fitting method used in the present invention.

FIG. 4 is an explanatory diagram showing a method of forming a conventional optical sensor device.

FIG. 5 is an explanatory diagram showing a side view of an example of a forming shape of a lead terminal of a conventional optical sensor device.

[Explanation of symbols]

 1: electronic component (optical sensor) device 1a: resin portion 1b: lead (terminal) portion 1d: (electronic component side) fitting portion 2: terminal member 2a: resin portion 2b: lead (terminal) portion 2c: (terminal member Side) Fitting part

Claims (5)

[Claims] 1. A terminal member for insertion mounting in which a part of a plurality of first lead terminals is integrally assembled with a resin, and the first lead terminal at an end of a flat plate-shaped second lead terminal. An electronic component device having a surface mount type resin part having a fitting part formed so as to be fitted, wherein the fitting part is fitted to the first lead terminal. Insertion type electronic component device. 2. The electronic component device according to claim 1, wherein the fitting portion is fitted to the first lead terminal, and the fitting portion is fixed by solder. 3. The electronic component device according to claim 1, wherein the fitting portion is fitted to the first lead terminal, and the fitting portion is fixed with an adhesive. 4. The mounting part is mounted on the first lead terminal, and the surface mount type resin part and the resin part of the terminal member are fixed by an adhesive. 3. The electronic component device according to item 3. 5. A part of a plurality of first lead terminals is integrally assembled with a resin to form a terminal member for insertion mounting, and an end portion of a second lead terminal of a surface mounting type electronic component device. And a fitting portion that is fitted to the first lead terminal is formed on the first lead terminal, and the fitting portion is fitted to the first lead terminal to form an insertion mounting type electronic component device. Method for forming electronic component device.