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JPH08116148A - Connection structure of circuit board and fpc - Google Patents

Connection structure of circuit board and fpc

Info

Publication number
JPH08116148A
JPH08116148A JP6246565A JP24656594A JPH08116148A JP H08116148 A JPH08116148 A JP H08116148A JP 6246565 A JP6246565 A JP 6246565A JP 24656594 A JP24656594 A JP 24656594A JP H08116148 A JPH08116148 A JP H08116148A
Authority
JP
Japan
Prior art keywords
circuit board
fpc
connection structure
view
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6246565A
Other languages
Japanese (ja)
Inventor
Hiroshi Niimi
浩 新美
Kazuhiko Miyazaki
一彦 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP6246565A priority Critical patent/JPH08116148A/en
Publication of JPH08116148A publication Critical patent/JPH08116148A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE: To provide a connection structure of an inexpensive and simple constitution. CONSTITUTION: A circuit board 1 is arranged in an upper surface 32b of a lower part 32a of a right wall part 32 wherein a through hole 33 communicating with an inside and an outside of a synthetic resin case 3. A plurality of electrodes 4 are formed in an upper surface 1c of the right end part 1b of the circuit board 1. A tip part 5a of an FPC 5 is arranged in the upper surface 1c of the right end part 1b of the circuit board 1. A plurality of electrodes 6 which enable contact corresponding to a plurality of electrodes 4 of the circuit board 1 separately are formed in the tip part 5a of the FPC 5. A synthetic resin slider 7 is forced between an upper surface 5b of the tip part 5a of the FPC 5 and a lower surface 32d of an upper part 32c of the right wall part 32 of the case 3 for bringing a plurality of electrodes 4 of the circuit board 1 and a plurality of electrodes 6 of the FPC 5 into close contact with each other.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、剛性を有する回路基板
とFPC(フレキシブルプリント配線板)との電気的接
続構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical connection structure between a rigid circuit board and an FPC (flexible printed wiring board).

【0002】[0002]

【従来の技術】従来、剛性を有し、各種電子部品が実装
される回路基板1と、FPC5との間を電気的に導通さ
せるために、図27に示すようなコネクタ50が用いら
れていた。図27に示すコネクタ50は、ケース3に固
定された回路基板1の適宜位置に固定配置され、スライ
ダ51をハウジング52内部に圧入することにより、ハ
ウジング52内のターミナル53とFPC5の先端部5
aの電極とを電気的に導通させる構成をとっている。
2. Description of the Related Art Conventionally, a connector 50 as shown in FIG. 27 has been used to electrically connect a circuit board 1 having rigidity and mounting various electronic parts and an FPC 5 to each other. . The connector 50 shown in FIG. 27 is fixedly arranged at an appropriate position on the circuit board 1 fixed to the case 3, and the terminal 51 in the housing 52 and the tip portion 5 of the FPC 5 are inserted by press-fitting the slider 51 into the housing 52.
It is configured to be electrically connected to the electrode a.

【0003】[0003]

【発明が解決しようとする課題】しかし、上記のような
コネクタ50は、高価であるため、安価で簡素な構成の
接続構造が要請されている。
However, since the connector 50 as described above is expensive, an inexpensive and simple connection structure is required.

【0004】本発明は、上記要請に応え、安価で簡素な
構成の接続構造を提供することを目的とする。
An object of the present invention is to provide an inexpensive and simple connection structure in response to the above demand.

【0005】[0005]

【課題を解決するための手段】請求項1では、剛性を有
しケースに収納固定される回路基板と、前記ケースに沿
って配置されるFPCとの電気的接続構造であって、前
記ケースに形成された貫通孔に前記FPCの電極と前記
回路基板の電極とを略平行に配置し、前記貫通孔にスラ
イダを圧入することにより、前記FPCの電極と前記回
路基板の電極とを互いに接触させることを特徴とする回
路基板とFPCとの接続構造を採用する。
According to a first aspect of the present invention, there is provided an electrical connection structure for a circuit board having rigidity and being housed and fixed in a case, and an FPC arranged along the case, wherein The electrode of the FPC and the electrode of the circuit board are arranged substantially parallel to each other in the formed through hole, and the slider of the FPC is pressed into the through hole to bring the electrode of the FPC and the electrode of the circuit board into contact with each other. The connection structure between the circuit board and the FPC is adopted.

【0006】請求項2では、前記回路基板の電極上に導
電性素子を設けたことを特徴とする請求項1に記載の回
路基板とFPCとの接続構造を採用する。
According to a second aspect of the present invention, there is adopted the connection structure between the circuit board and the FPC according to the first aspect, wherein a conductive element is provided on the electrode of the circuit board.

【0007】請求項3では、前記導電性素子は導電性チ
ップであることを特徴とする請求項2に記載の回路基板
とFPCとの接続構造を採用する。
According to a third aspect of the invention, the connection structure between the circuit board and the FPC according to the second aspect is adopted, wherein the conductive element is a conductive chip.

【0008】請求項4では、前記導電性素子は導電性ワ
イヤであることを特徴とする請求項2に記載の回路基板
とFPCとの接続構造を採用する。
According to a fourth aspect of the invention, the connection structure between the circuit board and the FPC according to the second aspect is adopted, wherein the conductive element is a conductive wire.

【0009】請求項5では、剛性を有しケースに収納固
定される回路基板と、前記ケースに沿って配置されるF
PCとの電気的接続構造であって、前記ケースに形成さ
れた貫通孔に前記FPCの電極と前記回路基板の電極と
を略平行に配置し、前記回路基板と前記FPCとの間に
コネクタを配設することにより、前記FPCの電極と前
記回路基板の電極とを前記コネクタを介して電気的に導
通させることを特徴とする回路基板とFPCとの接続構
造を採用する。
According to a fifth aspect of the present invention, a circuit board having rigidity and housed and fixed in a case, and an F arranged along the case.
In the electrical connection structure with a PC, the electrodes of the FPC and the electrodes of the circuit board are arranged substantially parallel to each other in a through hole formed in the case, and a connector is provided between the circuit board and the FPC. By arranging the electrodes, the electrode of the FPC and the electrode of the circuit board are electrically connected to each other through the connector, and a connection structure between the circuit board and the FPC is adopted.

【0010】請求項6では、前記コネクタは、予め前記
回路基板に固定されていることを特徴とする請求項5に
記載の回路基板とFPCとの接続構造を採用する。
According to a sixth aspect of the present invention, the connector is preliminarily fixed to the circuit board, and the circuit board-FPC connection structure according to the fifth aspect is adopted.

【0011】請求項7では、前記コネクタは、予め前記
ケースに固定されていることを特徴とする請求項5に記
載の回路基板とFPCとの接続構造を採用する。
According to a seventh aspect of the present invention, the connection structure between the circuit board and the FPC according to the fifth aspect is adopted, wherein the connector is fixed to the case in advance.

【0012】請求項8では、前記コネクタは、ターミナ
ル部のみからなることを特徴とする請求項5ないし7の
いずれかに記載の回路基板とFPCとの接続構造を採用
する。
According to an eighth aspect of the present invention, the connection structure of the circuit board and the FPC according to any one of the fifth to seventh aspects is adopted, wherein the connector is composed of only a terminal portion.

【0013】請求項9では、前記コネクタのターミナル
部は、弾性を有することを特徴とする請求項5ないし8
のいずれかに記載の回路基板とFPCとの接続構造を採
用する。
According to a ninth aspect of the present invention, the terminal portion of the connector has elasticity.
The connection structure between the circuit board and the FPC as described in any one of 1 above is adopted.

【0014】請求項10では、前記コネクタに位置決め
部が形成されていることを特徴とする請求項5ないし9
のいずれかに記載の回路基板とFPCとの接続構造を採
用する。
According to a tenth aspect of the present invention, a positioning portion is formed on the connector.
The connection structure between the circuit board and the FPC as described in any one of 1 above is adopted.

【0015】[0015]

【発明の作用効果】請求項1に係る回路基板とFPCと
の接続構造は、ケースの貫通孔に回路基板の電極とFP
Cの電極とを略平行に配置し、この貫通孔にスライダを
圧入することによって、両電極間を互いに接触させてい
る。このため、従来技術のようなコネクタと比べ、簡素
で安価な接続構造を提供し得る。
According to the connection structure of the circuit board and the FPC according to claim 1, the circuit board electrode and the FP are provided in the through hole of the case.
The electrodes of C are arranged substantially parallel to each other, and the sliders are press-fitted into the through holes to bring the electrodes into contact with each other. Therefore, it is possible to provide a simple and inexpensive connection structure as compared with the connector of the related art.

【0016】請求項2に係る回路基板とFPCとの接続
構造において、導電性素子は、両電極間を電気的に導通
させるとともに、両電極間の密着度を高める作用を発揮
し得る。
In the connection structure between the circuit board and the FPC according to the second aspect, the conductive element can exert an effect of electrically connecting both electrodes and enhancing the degree of adhesion between both electrodes.

【0017】請求項3に係る回路基板とFPCとの接続
構造は、導電性素子として導電性チップを用いた例であ
る。
The connection structure between the circuit board and the FPC according to claim 3 is an example in which a conductive chip is used as a conductive element.

【0018】請求項4に係る回路基板とFPCとの接続
構造は、導電性素子として導電性ワイヤを用いた例であ
る。
The connection structure between the circuit board and the FPC according to claim 4 is an example in which a conductive wire is used as the conductive element.

【0019】請求項5に係る回路基板とFPCとの接続
構造は、ケースの貫通孔に回路基板の電極とFPCの電
極とを略平行に配置し、両電極間にコネクタを介在させ
ることによって、両電極間をコネクタを介して電気的に
導通させている。このため、従来技術のようなコネクタ
と比べ、簡素で安価な接続構造を提供し得る。
In the connection structure between the circuit board and the FPC according to the fifth aspect, the electrodes of the circuit board and the electrodes of the FPC are arranged substantially parallel to each other in the through hole of the case, and the connector is interposed between both electrodes. Both electrodes are electrically connected via a connector. Therefore, it is possible to provide a simple and inexpensive connection structure as compared with the connector of the related art.

【0020】請求項6に係る回路基板とFPCとの接続
構造は、コネクタを回路基板に予め設けた例である。
The connection structure between the circuit board and the FPC according to claim 6 is an example in which a connector is provided in advance on the circuit board.

【0021】請求項7に係る回路基板とFPCとの接続
構造は、コネクタをケースに予め設けた例である。
The connection structure between the circuit board and the FPC according to claim 7 is an example in which the connector is provided in advance in the case.

【0022】請求項8に係る回路基板とFPCとの接続
構造は、コネクタをターミナル部のみからなる簡素な構
造とした例である。
The connection structure between the circuit board and the FPC according to claim 8 is an example in which the connector has a simple structure including only a terminal portion.

【0023】請求項9に係る回路基板とFPCとの接続
構造は、ターミナル部の弾性力を利用してターミナル部
と両電極との間の密着度を高めている。
In the connection structure between the circuit board and the FPC according to the ninth aspect, the degree of adhesion between the terminal portion and both electrodes is enhanced by utilizing the elastic force of the terminal portion.

【0024】請求項10に係る回路基板とFPCとの接
続構造によると、コネクタの位置決め部により、コネク
タと両電極との良好な位置関係を得ることができる。
According to the connection structure of the circuit board and the FPC according to the tenth aspect, a good positional relationship between the connector and both electrodes can be obtained by the positioning portion of the connector.

【0025】[0025]

【実施例】以下、本発明の実施例を図面に基づいて説明
する。
Embodiments of the present invention will be described below with reference to the drawings.

【0026】(1) 第1実施例(図1〜図3) 図1は、第1実施例に係る回路基板とFPCとの接続構
造を示す正面断面図、図2は、回路基板とFPCの概略
斜視図、図3(A) は、スライダの正面図、図3(B) は、
スライダの右側面図、図3(C) は、スライダの底面図で
ある。
(1) First Embodiment (FIGS. 1 to 3) FIG. 1 is a front sectional view showing a connection structure between a circuit board and an FPC according to the first embodiment, and FIG. 2 shows a circuit board and an FPC. A schematic perspective view, FIG. 3 (A) is a front view of the slider, and FIG. 3 (B) is
A right side view of the slider and FIG. 3C are bottom views of the slider.

【0027】図1〜図3において、1は、電子部品2が
実装された回路基板を表している。回路基板1は、図1
図示の左端部1aが、合成樹脂製ケース3の左壁部31
の内面に形成された凹部31aに挿入され、また、右端
部1bが、ケース3の右壁部32の下部32aの上面3
2b、すなわち、ケース3の右壁部32の上部32cの
下面32dなどとともにケース3の内と外を連通する貫
通孔33を形成する右壁部32の下部32aの上面32
b、に配されている。そして、回路基板1の右端部1b
の上面1cには、複数の電極4が形成されている。
1 to 3, reference numeral 1 denotes a circuit board on which the electronic component 2 is mounted. The circuit board 1 is shown in FIG.
The illustrated left end portion 1a is the left wall portion 31 of the synthetic resin case 3.
Is inserted into a recess 31a formed on the inner surface of the case 3, and the right end 1b is the upper surface 3 of the lower portion 32a of the right wall 32 of the case 3.
2b, that is, the upper surface 32 of the lower portion 32a of the right wall portion 32 that forms the through hole 33 that communicates the inside and the outside of the case 3 with the lower surface 32d of the upper portion 32c of the right wall portion 32 of the case 3 and the like.
b. Then, the right end portion 1b of the circuit board 1
A plurality of electrodes 4 are formed on the upper surface 1c of the.

【0028】回路基板1の右端部1bの上面1cには、
FPC5の先端部5aが配されている。FPC5の先端
部5aには、回路基板1の複数の電極4と1対1に対応
して接触可能な複数の電極6が形成されている。
On the upper surface 1c of the right end 1b of the circuit board 1,
The tip portion 5a of the FPC 5 is arranged. A plurality of electrodes 6 that can come into contact with the plurality of electrodes 4 of the circuit board 1 in a one-to-one correspondence are formed on the tip portion 5a of the FPC 5.

【0029】FPC5の先端部5aの上面5bとケース
3の右壁部32の上部32cの下面32dとの間には、
合成樹脂製スライダ7が図1図示矢印a方向から圧入さ
れ、回路基板1の複数の電極4とFPC5の複数の電極
6とを互いに密着させている。スライダ7は、図3に示
すように、その下面7aの所定位置、すなわち、回路基
板1の複数の電極4及びFPC5の複数の電極6に対応
する位置に、複数の突起部8が部分的に突出して形成さ
れている。これらの突起部8は、回路基板1の複数の電
極4とFPC5の複数の電極6とを互いに密着させる作
用を発揮するものである。なお、図3に示すように、ス
ライダ7の上面7b及びケース3の右壁部32の上部3
2cの下面32dには、互いに嵌合し合う凹部7c及び
突起部32eが適宜形成され、スライダ7が抜けないよ
うにしている。
Between the upper surface 5b of the tip portion 5a of the FPC 5 and the lower surface 32d of the upper portion 32c of the right wall portion 32 of the case 3,
A synthetic resin slider 7 is press-fitted in the direction of arrow a in FIG. 1 to bring the plurality of electrodes 4 of the circuit board 1 and the plurality of electrodes 6 of the FPC 5 into close contact with each other. As shown in FIG. 3, the slider 7 has a plurality of protrusions 8 partially at predetermined positions on its lower surface 7a, that is, at positions corresponding to the plurality of electrodes 4 of the circuit board 1 and the plurality of electrodes 6 of the FPC 5. It is formed to project. These protrusions 8 serve to bring the plurality of electrodes 4 of the circuit board 1 and the plurality of electrodes 6 of the FPC 5 into close contact with each other. As shown in FIG. 3, the upper surface 7 b of the slider 7 and the upper portion 3 of the right wall portion 32 of the case 3 are arranged.
On the lower surface 32d of 2c, a concave portion 7c and a protruding portion 32e which are fitted with each other are appropriately formed to prevent the slider 7 from coming off.

【0030】第1実施例に係る回路基板1とFPC5と
の接続構造は、上記のように構成されるため、ケース3
の貫通孔33を利用して簡単な構成のスライダ7で、回
路基板1の複数の電極4とFPC5の複数の電極6とを
電気的に導通させることができる。
Since the connection structure between the circuit board 1 and the FPC 5 according to the first embodiment is configured as described above, the case 3
The slider 7 having a simple structure can be electrically connected to the plurality of electrodes 4 of the circuit board 1 and the plurality of electrodes 6 of the FPC 5 by utilizing the through holes 33.

【0031】(2) 第2実施例(図4) 図4は、第2実施例に係る回路基板1とFPC5との接
続構造に用いられるスライダの底面図である。
(2) Second Embodiment (FIG. 4) FIG. 4 is a bottom view of a slider used in the connection structure between the circuit board 1 and the FPC 5 according to the second embodiment.

【0032】このスライダ7は、突起部8を線状の突起
部で構成している。その他の構成は、第1実施例と同様
である。
In the slider 7, the protrusion 8 is composed of a linear protrusion. Other configurations are the same as those of the first embodiment.

【0033】この接続構造によると、スライダ7の線状
突起部8により、各電極4,6の長手方向における接触
距離の増大を図ることができる。
According to this connection structure, the linear projection 8 of the slider 7 can increase the contact distance between the electrodes 4 and 6 in the longitudinal direction.

【0034】(3) 第3実施例(図5) 図5は、第3実施例に係る回路基板1とFPC5との接
続構造の正面断面図である。
(3) Third Embodiment (FIG. 5) FIG. 5 is a front sectional view of a connection structure between the circuit board 1 and the FPC 5 according to the third embodiment.

【0035】この接続構造に用いられるスライダ7は、
上下に二分割されており、下側スライダ71をFPC5
の先端部5aの上面5bに配した後、下側スライダ71
の上面71aとケース3の右壁部32の上部32cの下
面32dとの間に上側スライダ72を圧入して構成され
る。
The slider 7 used in this connection structure is
It is divided into upper and lower parts, and the lower slider 71 is attached to the FPC5.
Of the lower slider 71 after being placed on the upper surface 5b of the tip 5a of the
The upper slider 72 is press-fitted between the upper surface 71a of the above and the lower surface 32d of the upper portion 32c of the right wall portion 32 of the case 3.

【0036】この接続構造によると、スライダ7が上下
二分割され、スライダ71の突起部とFPC5とは固定
されているので、FPC5に傷つけることなくスライダ
72をケース3の貫通孔33へ圧入することができる。
According to this connection structure, the slider 7 is divided into upper and lower parts, and the protrusion of the slider 71 and the FPC 5 are fixed, so that the slider 72 can be pressed into the through hole 33 of the case 3 without damaging the FPC 5. You can

【0037】(4) 第4実施例(図6、図7) 図6は、第4実施例に係る回路基板1とFPC5との接
続構造の正面及び側面断面図、図7は、スライダ7をそ
の下面7a側から見たときの斜視図である。
(4) Fourth Embodiment (FIGS. 6 and 7) FIG. 6 is a front and side sectional view of the connection structure between the circuit board 1 and the FPC 5 according to the fourth embodiment, and FIG. It is a perspective view when it sees from the lower surface 7a side.

【0038】このスライダ7は、スライダ7の挿入方向
に伸びたスリット9を、各突起部8を挟むように形成し
ている。そして、下側のスライダ7は、FPC5の導体
面に、また、上側のスライダ7は、ケース上部32cに
接し、スライダ7全体として、千鳥構造となるので、内
部の応力の発生を低減させ、接触部の安定化を図り、自
身の弾性力を高め、スライダ7の圧入作業が容易にな
る。
The slider 7 is formed with a slit 9 extending in the insertion direction of the slider 7 so as to sandwich each protrusion 8. The lower slider 7 is in contact with the conductor surface of the FPC 5, and the upper slider 7 is in contact with the case upper portion 32c, and the slider 7 as a whole has a staggered structure. By stabilizing the portion, increasing the elastic force of itself, the press-fitting operation of the slider 7 becomes easy.

【0039】(5) 第5実施例(図8、図9) 図8は、第5実施例に係る回路基板1とFPC5との接
続構造の正面断面図、図9は、回路基板1の概略斜視図
である。
(5) Fifth Embodiment (FIGS. 8 and 9) FIG. 8 is a front sectional view of a connection structure between the circuit board 1 and the FPC 5 according to the fifth embodiment, and FIG. 9 is a schematic view of the circuit board 1. It is a perspective view.

【0040】この回路基板1は、各電極4の上に、導電
性素子としての導電性チップ10をハンダ付け等により
接着させ、これらの導電性チップ10を介して、回路基
板1の複数の電極4とFPC5の複数の電極6とを電気
的に導通させている。FPC5は、ケース3の右壁部3
2の上部32cの下面32dに配され、また、スライダ
7は、回路基板1の右端部1bの下面1dとケース3の
右壁部32の下部32aの上面32bとの間に圧入され
ている。
In this circuit board 1, a conductive chip 10 as a conductive element is adhered onto each electrode 4 by soldering or the like, and a plurality of electrodes of the circuit board 1 are connected through these conductive chips 10. 4 and a plurality of electrodes 6 of the FPC 5 are electrically connected. The FPC 5 is the right wall portion 3 of the case 3.
The slider 7 is press-fitted between the lower surface 1d of the right end portion 1b of the circuit board 1 and the upper surface 32b of the lower portion 32a of the right wall portion 32 of the case 3.

【0041】この導電性チップ10により、両電極4,
6間の密着度を高めることができる。
With this conductive tip 10, both electrodes 4,
It is possible to increase the degree of adhesion between the six.

【0042】(6) 第6実施例(図10) 図10(A) は、第5実施例における導電性チップ10の
変形例の平面図、図10(B) は、その正面断面図であ
る。
(6) Sixth Embodiment (FIG. 10) FIG. 10A is a plan view of a modification of the conductive chip 10 in the fifth embodiment, and FIG. 10B is a front sectional view thereof. .

【0043】この導電性チップ10は、上部10aと下
部10bからなり、上部10aが下部10bよりも小さ
な二段構造をしている。
This conductive chip 10 is composed of an upper part 10a and a lower part 10b, and has a two-step structure in which the upper part 10a is smaller than the lower part 10b.

【0044】(7) 第7実施例(図11) 図11(A) は、第5実施例における導電性チップ10の
他の変形例の平面図、図11(B) は、その正面断面図で
ある。
(7) Seventh Embodiment (FIG. 11) FIG. 11 (A) is a plan view of another modified example of the conductive chip 10 in the fifth embodiment, and FIG. 11 (B) is a front sectional view thereof. Is.

【0045】この導電性チップ10は、第6実施例と同
様、上部10aと下部10bからなり、上部10aが下
部10bよりも小さな二段構造をしている。ただし、上
部10aは、略半球形状をしている。
Similar to the sixth embodiment, the conductive chip 10 has an upper portion 10a and a lower portion 10b, and the upper portion 10a has a two-step structure smaller than the lower portion 10b. However, the upper portion 10a has a substantially hemispherical shape.

【0046】(8) 第8実施例(図12、図13) 図12は、第8実施例に係る回路基板1とFPC5との
接続構造の正面断面図、図13は、回路基板1の概略斜
視図である。
(8) Eighth Embodiment (FIGS. 12 and 13) FIG. 12 is a front sectional view of a connection structure between the circuit board 1 and the FPC 5 according to the eighth embodiment, and FIG. 13 is a schematic view of the circuit board 1. It is a perspective view.

【0047】この回路基板1は、各電極4の上に、導電
性素子としての導電性ワイヤ11をハンダ付け等により
接着させ、これらの導電性ワイヤ11を介して、回路基
板1の複数の電極4とFPC5の複数の電極6とを電気
的に導通させている。
In this circuit board 1, a conductive wire 11 as a conductive element is adhered onto each electrode 4 by soldering or the like, and a plurality of electrodes of the circuit board 1 are connected through these conductive wires 11. 4 and a plurality of electrodes 6 of the FPC 5 are electrically connected.

【0048】(9) 第9実施例(図14) 図14は、第8実施例における導電性ワイヤ11の変形
例の正面図である。
(9) Ninth Embodiment (FIG. 14) FIG. 14 is a front view of a modified example of the conductive wire 11 in the eighth embodiment.

【0049】この導電性ワイヤ11は、中央部11aを
上方へ湾曲させた形状をしている。
The conductive wire 11 has a shape in which the central portion 11a is curved upward.

【0050】(10)第10実施例(図15) 図15は、第8実施例における導電性ワイヤ11の他の
変形例の正面図である。
(10) Tenth Embodiment (FIG. 15) FIG. 15 is a front view of another modification of the conductive wire 11 in the eighth embodiment.

【0051】この導電性ワイヤ11は、中央部11aを
1回巻きした形状をしている。
The conductive wire 11 has a shape in which the central portion 11a is wound once.

【0052】(11)第11実施例(図16) 図16(A) は、第11実施例に係る回路基板1とFPC
5との接続構造における回路基板1の概略斜視図、図1
6(B) は、導電性素子の正面図である。
(11) Eleventh Embodiment (FIG. 16) FIG. 16A shows a circuit board 1 and an FPC according to the eleventh embodiment.
1 is a schematic perspective view of the circuit board 1 in the connection structure with FIG.
6 (B) is a front view of the conductive element.

【0053】この導電性素子は、導電性ワイヤ11の中
央部に導電性端子12を固着して形成されている。
This conductive element is formed by fixing the conductive terminal 12 to the central portion of the conductive wire 11.

【0054】(12)第12実施例(図17) 図17(A) は、第12実施例に係る回路基板1とFPC
5との接続構造における回路基板1の概略斜視図、図1
7(B) は、導電性素子の平面図、図17(C) は、導電性
素子の正面断面図である。
(12) Twelfth Embodiment (FIG. 17) FIG. 17A shows a circuit board 1 and an FPC according to the twelfth embodiment.
1 is a schematic perspective view of the circuit board 1 in the connection structure with FIG.
7 (B) is a plan view of the conductive element, and FIG. 17 (C) is a front sectional view of the conductive element.

【0055】この導電性素子は、回路基板1の電極4に
ハンダ13付けして形成されている。
This conductive element is formed by soldering 13 to the electrode 4 of the circuit board 1.

【0056】(13)第13実施例(図18〜図20) 図18は、第13実施例に係る回路基板1とFPC5と
の接続構造を示す正面断面図、図19は、回路基板1と
コネクタ14の概略斜視図、図20は、コネクタ14の
側面図である。
(13) Thirteenth Embodiment (FIGS. 18 to 20) FIG. 18 is a front sectional view showing a connection structure between the circuit board 1 and the FPC 5 according to the thirteenth embodiment, and FIG. 20 is a side view of the connector 14. FIG.

【0057】図18〜図20において、ケース3の右壁
部32の上部32cの下面32dには、FPC5の先端
部5aが配されている。そして、FPC5の先端部5a
の下面5cと回路基板1の右端部1bの上面1cとの間
には、コネクタ14が配設されている。
18 to 20, the tip portion 5a of the FPC 5 is arranged on the lower surface 32d of the upper portion 32c of the right wall portion 32 of the case 3. Then, the tip portion 5a of the FPC 5
A connector 14 is disposed between the lower surface 5c of the above and the upper surface 1c of the right end portion 1b of the circuit board 1.

【0058】コネクタ14は、合成樹脂製ハウジング部
15と、複数の略V字形状をした可撓性ターミナル部1
6とから構成されている。ハウジング部15には、下方
に突出して複数の位置決め用の係止ピン部15aが形成
されており、これらの係止ピン15aが、回路基板1に
形成されている係止孔1eに圧入される。また、ハウジ
ング部15には、各ターミナル部16が配される縦溝1
7が形成されている。各ターミナル部16は、抜け防止
用の係止爪16aが形成されている基部16bを有し、
この基部16bがハウジング部15に埋設されている。
そして、各ターミナル部16は、一方の接触部16cが
FPC5の先端部5aの電極6と弾性的に密着し、他方
の接触部16dが回路基板1の右端部1bの電極4と弾
性的に密着している。
The connector 14 comprises a synthetic resin housing portion 15 and a plurality of substantially V-shaped flexible terminal portions 1.
6 is comprised. The housing portion 15 is formed with a plurality of positioning locking pin portions 15a protruding downward, and these locking pins 15a are press-fitted into the locking holes 1e formed in the circuit board 1. . Further, the housing portion 15 has a vertical groove 1 in which each terminal portion 16 is arranged.
7 are formed. Each terminal portion 16 has a base portion 16b in which a locking claw 16a for preventing slippage is formed,
The base portion 16b is embedded in the housing portion 15.
Then, in each terminal portion 16, one contact portion 16c elastically adheres to the electrode 6 of the tip end portion 5a of the FPC 5, and the other contact portion 16d elastically adheres to the electrode 4 of the right end portion 1b of the circuit board 1. are doing.

【0059】図18に示すような接続構造は、回路基板
1にコネクタ14を固定し、ケース3の右壁部32の上
部32cの下面32dにFPC5の先端部5aを配した
状態で、回路基板1を貫通孔33に挿入することによっ
て得ることができる。
In the connection structure as shown in FIG. 18, the connector 14 is fixed to the circuit board 1, and the tip portion 5a of the FPC 5 is arranged on the lower surface 32d of the upper portion 32c of the right wall portion 32 of the case 3 in the circuit board. It can be obtained by inserting 1 into the through hole 33.

【0060】第13実施例に係る回路基板1とFPC5
との接続構造は、上記のように構成されるため、ケース
3の貫通孔33を利用して簡単な構成のコネクタ14
で、回路基板1の複数の電極4とFPC5の複数の電極
6とを電気的に導通させることができる。
Circuit board 1 and FPC 5 according to the thirteenth embodiment
Since the connection structure with the connector is configured as described above, the connector 14 having a simple configuration using the through hole 33 of the case 3 is used.
Thus, the plurality of electrodes 4 of the circuit board 1 and the plurality of electrodes 6 of the FPC 5 can be electrically connected.

【0061】(14)第14実施例(図21) 図21は、第14実施例に係る回路基板1とFPC5と
の接続構造の分解斜視図である。
(14) Fourteenth Embodiment (FIG. 21) FIG. 21 is an exploded perspective view of the connection structure between the circuit board 1 and the FPC 5 according to the fourteenth embodiment.

【0062】この接続構造において、合成樹脂製ケース
3には、互いに平行な2条の溝18,19が形成されて
いる。そして、右側の溝18には、回路基板1が配さ
れ、左側の溝19の左側面19aには、FPC5の先端
部5aが配されている。回路基板1とFPC5の先端部
5aとの間には、コネクタ14が配される。
In this connection structure, the synthetic resin case 3 is provided with two parallel grooves 18 and 19. The circuit board 1 is arranged in the groove 18 on the right side, and the tip portion 5a of the FPC 5 is arranged on the left side surface 19a of the groove 19 on the left side. A connector 14 is arranged between the circuit board 1 and the tip portion 5a of the FPC 5.

【0063】コネクタ14は、合成樹脂製ハウジング部
15と、複数の可撓性ターミナル部16とから構成され
ている。ハウジング部15には、下方に突出して位置決
め用の複数の係止ピン15aが形成されており、これら
の係止ピン15aが、ケース3の取付壁部20の上面2
0aに形成されている係止孔20bに圧入される。各タ
ーミナル部16は、ハウジング部15に埋設された基部
16bと、この基部16bから左右に伸びる略V字形状
の左右の接触部16c,16dとから構成されている。
コネクタ14をケース3の取り付けた際、左側の接触部
16cは、FPC5の先端部5aの電極6と弾性的に密
着し、右側の接触部16dは、回路基板1の電極4と弾
性的に密着する。なお、係止ピン15aをケース3の取
付壁部20に、係止孔20bをコネクタ14にそれぞれ
形成するようにしてもよい。
The connector 14 comprises a synthetic resin housing portion 15 and a plurality of flexible terminal portions 16. The housing portion 15 is formed with a plurality of locking pins 15a for projecting downward and positioned, and these locking pins 15a are attached to the upper surface 2 of the mounting wall portion 20 of the case 3.
It is press-fitted into the locking hole 20b formed in 0a. Each terminal portion 16 is composed of a base portion 16b embedded in the housing portion 15 and substantially V-shaped left and right contact portions 16c and 16d extending from the base portion 16b to the left and right.
When the connector 14 is attached to the case 3, the left contact portion 16c elastically adheres to the electrode 6 of the tip portion 5a of the FPC 5, and the right contact portion 16d elastically adheres to the electrode 4 of the circuit board 1. To do. The locking pin 15a may be formed in the mounting wall portion 20 of the case 3, and the locking hole 20b may be formed in the connector 14.

【0064】(15)第15実施例(図22) 図22は、第15実施例に係る回路基板1とFPC5と
の接続構造の分解斜視図である。
(15) Fifteenth Embodiment (FIG. 22) FIG. 22 is an exploded perspective view of the connection structure between the circuit board 1 and the FPC 5 according to the fifteenth embodiment.

【0065】この接続構造において、コネクタ14は、
上述した第14実施例のコネクタ14からハウジング部
15を取り除き、複数のターミナル部16のみで構成さ
れている。そして、各ターミナル部16の基部16bに
は、位置決め用の切欠部16eが形成され、また、ケー
ス3の取付壁部20の上面20aには、上記切欠部16
eに圧入される突起部20cが形成されている。
In this connection structure, the connector 14 is
The housing portion 15 is removed from the connector 14 of the fourteenth embodiment described above, and is composed of only a plurality of terminal portions 16. A notch 16e for positioning is formed on the base 16b of each terminal portion 16, and the notch 16 is provided on the upper surface 20a of the mounting wall 20 of the case 3.
A protrusion 20c that is press-fitted into e is formed.

【0066】このコネクタ14は、ターミナル部16の
みからなるため、構造が簡素になる。
Since this connector 14 comprises only the terminal portion 16, the structure is simplified.

【0067】(16)第16実施例(図23〜図25) 図23は、第16実施例に係る回路基板1とFPC5と
の接続構造の正面断面図、図24は、図23における左
側面図、図25は、図23における平面図である。
(16) Sixteenth embodiment (FIGS. 23 to 25) FIG. 23 is a front sectional view of a connection structure between the circuit board 1 and the FPC 5 according to the sixteenth embodiment, and FIG. 24 is a left side view in FIG. FIG. 25 and FIG. 25 are plan views of FIG.

【0068】この接続構造において、合成樹脂製ケース
3には、回路基板1が配される溝21が形成されてい
る。そして、この溝21の底面には、回路基板1の係止
孔22に弾性的に係止される係止爪23が上方へ突出し
て形成されている。回路基板1には、その複数の電極4
と接触して、複数のターミナル部16がかしめ又はハン
ダ付けにより配設されている。各ターミナル部16は、
溝21の左側面21aに配されたFPC5の先端部5a
の電極6と弾性的に密着している。回路基板1は、その
左右端部1f,1gがケース3の凹部24,25に挿入
され、かつ、係止孔22に係止爪23が係止されること
により、ケース3に固定されている。
In this connection structure, a groove 21 in which the circuit board 1 is arranged is formed in the synthetic resin case 3. A locking claw 23 elastically locked in the locking hole 22 of the circuit board 1 is formed on the bottom surface of the groove 21 so as to project upward. The circuit board 1 has a plurality of electrodes 4
The plurality of terminal portions 16 are arranged in contact with each other by caulking or soldering. Each terminal part 16
The tip portion 5a of the FPC 5 arranged on the left side surface 21a of the groove 21
It is in elastic contact with the electrode 6. The circuit board 1 is fixed to the case 3 by inserting the left and right ends 1f and 1g into the recesses 24 and 25 of the case 3 and locking the locking claws 23 into the locking holes 22. .

【0069】(17)第17実施例(図26) 図26は、第17実施例に係る回路基板1とFPC5と
の接続構造の断面図である。
(17) Seventeenth Embodiment (FIG. 26) FIG. 26 is a sectional view of a connection structure between the circuit board 1 and the FPC 5 according to the seventeenth embodiment.

【0070】この接続構造は、上述した第16実施例の
ターミナル部16が回路基板1に固定されているのに対
し、ターミナル部16をケース3側に設けている。な
お、回路基板1は、ケース3にねじ26で固定されてい
る。
In this connection structure, the terminal portion 16 of the 16th embodiment described above is fixed to the circuit board 1, while the terminal portion 16 is provided on the case 3 side. The circuit board 1 is fixed to the case 3 with screws 26.

【図面の簡単な説明】[Brief description of drawings]

図26は、第17実施例に係る回路基板1とFPC5と
の接続構造の断面図である。
FIG. 26 is a sectional view of the connection structure between the circuit board 1 and the FPC 5 according to the seventeenth embodiment.

【図1】第1実施例に係る回路基板1とFPC5との接
続構造を示す正面断面図
FIG. 1 is a front sectional view showing a connection structure between a circuit board 1 and an FPC 5 according to a first embodiment.

【図2】回路基板1とFPC5の概略斜視図FIG. 2 is a schematic perspective view of a circuit board 1 and an FPC 5.

【図3】図3(A) は、スライダ7の正面図、図3(B)
は、スライダ7の右側面図、図3(C) は、スライダ7の
底面図
FIG. 3 (A) is a front view of the slider 7, FIG. 3 (B).
Is a right side view of the slider 7, and FIG. 3C is a bottom view of the slider 7.

【図4】第2実施例に係る回路基板1とFPC5との接
続構造に用いられるスライダ7の底面図
FIG. 4 is a bottom view of the slider 7 used in the connection structure between the circuit board 1 and the FPC 5 according to the second embodiment.

【図5】第3実施例に係る回路基板1とFPC5との接
続構造の正面断面図
FIG. 5 is a front sectional view of a connection structure between a circuit board 1 and an FPC 5 according to a third embodiment.

【図6】第4実施例に係る回路基板1とFPC5との接
続構造の正面及び側面断面図
FIG. 6 is a front and side sectional view of a connection structure between a circuit board 1 and an FPC 5 according to a fourth embodiment.

【図7】スライダ7をその下面7a側から見たときの斜
視図
FIG. 7 is a perspective view of the slider 7 when viewed from the lower surface 7a side thereof.

【図8】第5実施例に係る回路基板1とFPC5との接
続構造の正面断面図
FIG. 8 is a front sectional view of a connection structure between a circuit board 1 and an FPC 5 according to a fifth embodiment.

【図9】回路基板1の概略斜視図FIG. 9 is a schematic perspective view of the circuit board 1.

【図10】図10(A) は、第5実施例における導電性チ
ップ10の変形例の平面図、図10(B) は、その正面断
面図
FIG. 10 (A) is a plan view of a modified example of the conductive chip 10 in the fifth embodiment, and FIG. 10 (B) is a front sectional view thereof.

【図11】図11(A) は、第5実施例における導電性チ
ップ10の他の変形例の平面図、図11(B) は、その正
面断面図
11 (A) is a plan view of another modified example of the conductive chip 10 in the fifth embodiment, and FIG. 11 (B) is a front sectional view thereof.

【図12】第8実施例に係る回路基板1とFPC5との
接続構造の正面断面図
FIG. 12 is a front sectional view of a connection structure between a circuit board 1 and an FPC 5 according to an eighth embodiment.

【図13】回路基板1の概略斜視図FIG. 13 is a schematic perspective view of the circuit board 1.

【図14】第8実施例における導電性ワイヤ11の変形
例の正面図
FIG. 14 is a front view of a modified example of the conductive wire 11 according to the eighth embodiment.

【図15】第8実施例における導電性ワイヤ11の他の
変形例の正面図
FIG. 15 is a front view of another modification of the conductive wire 11 according to the eighth embodiment.

【図16】図16(A) は、第11実施例に係る回路基板
1とFPC5との接続構造における回路基板1の概略斜
視図、図16(B) は、導電性素子の正面図
16 (A) is a schematic perspective view of the circuit board 1 in the connection structure between the circuit board 1 and the FPC 5 according to the eleventh embodiment, and FIG. 16 (B) is a front view of a conductive element.

【図17】図17(A) は、第12実施例に係る回路基板
1とFPC5との接続構造における回路基板1の概略斜
視図、図17(B) は、導電性素子の平面図、図17(C)
は、導電性素子の正面断面図
17 (A) is a schematic perspective view of the circuit board 1 in the connection structure of the circuit board 1 and the FPC 5 according to the twelfth embodiment, and FIG. 17 (B) is a plan view of the conductive element. 17 (C)
Is a front sectional view of the conductive element

【図18】図18は、第13実施例に係る回路基板1と
FPC5との接続構造を示す正面断面図
FIG. 18 is a front sectional view showing a connection structure between a circuit board 1 and an FPC 5 according to a thirteenth embodiment.

【図19】回路基板1とコネクタ14の概略斜視図FIG. 19 is a schematic perspective view of the circuit board 1 and the connector 14.

【図20】コネクタ14の側面図FIG. 20 is a side view of the connector 14.

【図21】第14実施例に係る回路基板1とFPC5と
の接続構造の分解斜視図
FIG. 21 is an exploded perspective view of the connection structure between the circuit board 1 and the FPC 5 according to the 14th embodiment.

【図22】第15実施例に係る回路基板1とFPC5と
の接続構造の分解斜視図
FIG. 22 is an exploded perspective view of the connection structure between the circuit board 1 and the FPC 5 according to the fifteenth embodiment.

【図23】第16実施例に係る回路基板1とFPC5と
の接続構造の正面断面図
FIG. 23 is a front cross-sectional view of the connection structure between the circuit board 1 and the FPC 5 according to the 16th embodiment.

【図24】図23における左側面図FIG. 24 is a left side view of FIG. 23.

【図25】図23における平面図FIG. 25 is a plan view of FIG. 23.

【図26】第17実施例に係る回路基板1とFPC5と
の接続構造の断面図
FIG. 26 is a sectional view of the connection structure between the circuit board 1 and the FPC 5 according to the 17th embodiment.

【図27】従来の接続構造の断面図FIG. 27 is a cross-sectional view of a conventional connection structure.

【符号の説明】[Explanation of symbols]

1 回路基板 3 ケース 4 回路基板1の電極 5 FPC 6 FPC5の電極 7 スライダ 10 導電性チップ 11 導電性ワイヤ 14 コネクタ 15a 係止ピン(位置決め部) 16 ターミナル部 16e 切欠部(位置決め部) 33 貫通孔 DESCRIPTION OF SYMBOLS 1 Circuit board 3 Case 4 Electrode of circuit board 1 5 FPC 6 FPC5 electrode 7 Slider 10 Conductive chip 11 Conductive wire 14 Connector 15a Locking pin (positioning part) 16 Terminal part 16e Notch part (positioning part) 33 Through hole

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成7年2月2日[Submission date] February 2, 1995

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】図面の簡単な説明[Name of item to be corrected] Brief description of the drawing

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【図面の簡単な説明】[Brief description of drawings]

【図1】第1実施例に係る回路基板1とFPC5との接
続構造を示す正面断面図
FIG. 1 is a front sectional view showing a connection structure between a circuit board 1 and an FPC 5 according to a first embodiment.

【図2】回路基板1とFPC5の概略斜視図FIG. 2 is a schematic perspective view of a circuit board 1 and an FPC 5.

【図3】図3(A)は、スライダ7の正面図、図3
(B)は、スライダ7の右側面図、図3(C)は、スラ
イダ7の底面図
FIG. 3 (A) is a front view of the slider 7, FIG.
3B is a right side view of the slider 7, and FIG. 3C is a bottom view of the slider 7.

【図4】第2実施例に係る回路基板1とFPC5との接
続構造に用いられるスライグ7の底面図
FIG. 4 is a bottom view of the slig 7 used in the connection structure between the circuit board 1 and the FPC 5 according to the second embodiment.

【図5】第3実施例に係る回路基板1とFPC5との接
続構造の正面断面図
FIG. 5 is a front sectional view of a connection structure between a circuit board 1 and an FPC 5 according to a third embodiment.

【図6】第4実施例に係る回路基板1とFPC5との接
続構造の正面及び側面断面図
FIG. 6 is a front and side sectional view of a connection structure between a circuit board 1 and an FPC 5 according to a fourth embodiment.

【図7】スライダ7をその下面7a側から見たときの斜
視図
FIG. 7 is a perspective view of the slider 7 when viewed from the lower surface 7a side thereof.

【図8】第5実施例に係る回路基板1とFPC5との接
続構造の正面断面図
FIG. 8 is a front sectional view of a connection structure between a circuit board 1 and an FPC 5 according to a fifth embodiment.

【図9】回路基板1の概略斜視図FIG. 9 is a schematic perspective view of the circuit board 1.

【図10】図10(A)は、第5実施例における導電性
チップ10の変形例の平面図、図10(B)は、その正
面断面図
FIG. 10 (A) is a plan view of a modified example of the conductive chip 10 in the fifth embodiment, and FIG. 10 (B) is a front sectional view thereof.

【図11】図11(A)は、第5実施例における導電性
チップ10の他の変形例の平面図、図11(B)は、そ
の正面断面図
11A is a plan view of another modification of the conductive chip 10 according to the fifth embodiment, and FIG. 11B is a front sectional view thereof.

【図12】第8実施例に係る回路基板1とFPC5との
接続構造の正面断面図
FIG. 12 is a front sectional view of a connection structure between a circuit board 1 and an FPC 5 according to an eighth embodiment.

【図13】回路基板1の概略斜視図FIG. 13 is a schematic perspective view of the circuit board 1.

【図14】第8実施例における導電性ワイヤ11の変形
例の正面図
FIG. 14 is a front view of a modified example of the conductive wire 11 according to the eighth embodiment.

【図15】第8実施例における導電性ワイヤ11の他の
変形例の正面図
FIG. 15 is a front view of another modification of the conductive wire 11 according to the eighth embodiment.

【図16】図16(A)は、第11実施例に係る回路基
板1とFPC5との接続構造における回路基板1の概略
斜視図、図16(B)は、導電性素子の正面図
16 (A) is a schematic perspective view of the circuit board 1 in the connection structure of the circuit board 1 and the FPC 5 according to the eleventh embodiment, and FIG. 16 (B) is a front view of a conductive element.

【図17】図17(A)は、第12実施例に係る回路基
板1とFPC5との接続構造における回路基板1の概略
斜視図、図17(B)は、導電性素子の平面図、図17
(C)は、導電性素子の正面断面図
17 (A) is a schematic perspective view of the circuit board 1 in the connection structure of the circuit board 1 and the FPC 5 according to the twelfth embodiment, and FIG. 17 (B) is a plan view of the conductive element. 17
(C) is a front sectional view of the conductive element.

【図18】図18は、第13実施例に係る回路基板1と
FPC5との接続構造を示す正面断面図
FIG. 18 is a front sectional view showing a connection structure between a circuit board 1 and an FPC 5 according to a thirteenth embodiment.

【図19】回路基板1とコネクタ14の概略斜視図FIG. 19 is a schematic perspective view of the circuit board 1 and the connector 14.

【図20】コネクタ14の側面図FIG. 20 is a side view of the connector 14.

【図21】第14実施例に係る回路基板1とFPC5と
の接続構造の分解斜視図
FIG. 21 is an exploded perspective view of the connection structure between the circuit board 1 and the FPC 5 according to the 14th embodiment.

【図22】第15実施例に係る回路基板1とFPC5と
の接続構造の分解斜視図
FIG. 22 is an exploded perspective view of the connection structure between the circuit board 1 and the FPC 5 according to the fifteenth embodiment.

【図23】第16実施例に係る回路基板1とFPC5と
の接続構造の正面断面図
FIG. 23 is a front cross-sectional view of the connection structure between the circuit board 1 and the FPC 5 according to the 16th embodiment.

【図24】図23における左側面図FIG. 24 is a left side view of FIG. 23.

【図25】図23における平面図FIG. 25 is a plan view of FIG. 23.

【図26】第17実施例に係る回路基板1とFPC5と
の接続構造の断面図
FIG. 26 is a sectional view of the connection structure between the circuit board 1 and the FPC 5 according to the 17th embodiment.

【図27】従来の接続構造の断面図FIG. 27 is a cross-sectional view of a conventional connection structure.

【符号の説明】 1 回路基板 3 ケース 4 回路基板1の電極 5 FPC 6 FPC5の電極 7 スライダ 10 導電性チップ 11 導電性ワイヤ 14 コネクタ 15a 係止ピン(位置決め部) 16 ターミナル部 16e 切欠部(位置決め部) 33 貫通孔[Explanation of reference numerals] 1 circuit board 3 case 4 electrode of circuit board 1 5 FPC 6 electrode of FPC 5 7 slider 10 conductive chip 11 conductive wire 14 connector 15a locking pin (positioning part) 16 terminal part 16e notch (positioning) Part) 33 through hole

Claims (10)

【特許請求の範囲】[Claims] 【請求項1】 剛性を有しケースに収納固定される回路
基板と、前記ケースに沿って配置されるFPCとの電気
的接続構造であって、 前記ケースに形成された貫通孔に前記FPCの電極と前
記回路基板の電極とを略平行に配置し、前記貫通孔にス
ライダを圧入することにより、前記FPCの電極と前記
回路基板の電極とを互いに接触させることを特徴とする
回路基板とFPCとの接続構造。
1. A structure for electrically connecting a circuit board, which has rigidity and is housed and fixed in a case, and an FPC arranged along the case, wherein the FPC is provided in a through hole formed in the case. An electrode and an electrode of the circuit board are arranged substantially parallel to each other, and a slider is press-fitted into the through hole to bring the electrode of the FPC and the electrode of the circuit board into contact with each other. Connection structure with.
【請求項2】 前記回路基板の電極上に導電性素子を設
けたことを特徴とする請求項1に記載の回路基板とFP
Cとの接続構造。
2. The circuit board and the FP according to claim 1, wherein a conductive element is provided on the electrode of the circuit board.
Connection structure with C.
【請求項3】 前記導電性素子は導電性チップであるこ
とを特徴とする請求項2に記載の回路基板とFPCとの
接続構造。
3. The connection structure between a circuit board and an FPC according to claim 2, wherein the conductive element is a conductive chip.
【請求項4】 前記導電性素子は導電性ワイヤであるこ
とを特徴とする請求項2に記載の回路基板とFPCとの
接続構造。
4. The connection structure between a circuit board and an FPC according to claim 2, wherein the conductive element is a conductive wire.
【請求項5】 剛性を有しケースに収納固定される回路
基板と、前記ケースに沿って配置されるFPCとの電気
的接続構造であって、 前記ケースに形成された貫通孔に前記FPCの電極と前
記回路基板の電極とを略平行に配置し、前記回路基板と
前記FPCとの間にコネクタを配設することにより、前
記FPCの電極と前記回路基板の電極とを前記コネクタ
を介して電気的に導通させることを特徴とする回路基板
とFPCとの接続構造。
5. A structure for electrically connecting a circuit board, which has rigidity and is housed and fixed in a case, and an FPC arranged along the case, wherein the FPC is provided in a through hole formed in the case. The electrodes and the electrodes of the circuit board are arranged substantially parallel to each other, and a connector is provided between the circuit board and the FPC, so that the electrodes of the FPC and the electrodes of the circuit board are connected via the connector. A connection structure between a circuit board and an FPC, which is electrically connected.
【請求項6】 前記コネクタは、予め前記回路基板に固
定されていることを特徴とする請求項5に記載の回路基
板とFPCとの接続構造。
6. The connection structure between a circuit board and an FPC according to claim 5, wherein the connector is fixed to the circuit board in advance.
【請求項7】 前記コネクタは、予め前記ケースに固定
されていることを特徴とする請求項5に記載の回路基板
とFPCとの接続構造。
7. The connection structure between a circuit board and an FPC according to claim 5, wherein the connector is fixed to the case in advance.
【請求項8】 前記コネクタは、ターミナル部のみから
なることを特徴とする請求項5ないし7のいずれかに記
載の回路基板とFPCとの接続構造。
8. The connection structure between a circuit board and an FPC according to claim 5, wherein the connector includes only a terminal portion.
【請求項9】 前記コネクタのターミナル部は、弾性を
有することを特徴とする請求項5ないし8のいずれかに
記載の回路基板とFPCとの接続構造。
9. The connection structure between a circuit board and an FPC according to claim 5, wherein the terminal portion of the connector has elasticity.
【請求項10】 前記コネクタに位置決め部が形成され
ていることを特徴とする請求項5ないし9のいずれかに
記載の回路基板とFPCとの接続構造。
10. The connection structure between a circuit board and an FPC according to claim 5, wherein a positioning portion is formed on the connector.
JP6246565A 1994-10-12 1994-10-12 Connection structure of circuit board and fpc Pending JPH08116148A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6246565A JPH08116148A (en) 1994-10-12 1994-10-12 Connection structure of circuit board and fpc

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6246565A JPH08116148A (en) 1994-10-12 1994-10-12 Connection structure of circuit board and fpc

Publications (1)

Publication Number Publication Date
JPH08116148A true JPH08116148A (en) 1996-05-07

Family

ID=17150309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6246565A Pending JPH08116148A (en) 1994-10-12 1994-10-12 Connection structure of circuit board and fpc

Country Status (1)

Country Link
JP (1) JPH08116148A (en)

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