JPH0794668A - Integrated circuit device - Google Patents

Abstract

PURPOSE:To provide an integrated circuit device provided with means preventing the integrated circuit itself from being rejected even if any one of a large number of memory chips is mounted incorrectly thereon. CONSTITUTION:The integrated circuit comprises a frame body 3 provided with connecting pads 7 on the outer periphery thereof, and memory modules 1, 2 bonded tightly through the frame body 3. Each of the memory modules 1, 2 is provided, on the wiring board 4, with a memory chip 5 and an alternative memory chip 5a connected each other through a signal switching pad 6a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit device having a memory module having a memory chip mounted on a wiring board.

[0002]

2. Description of the Related Art FIG. 4 is an exploded perspective view showing a conventional integrated circuit device. As shown in FIG. 4, the integrated circuit device includes a frame body 2.
1 and two memory modules 22 that are closely bonded to each other via the frame 21. The frame body 21 is provided with a step portion 23 in which the inside of the outer peripheral surface is depressed and a guide portion 24 formed above and below the step portion 23 and serving as an outer peripheral wall.
A part of 4 is removed to form the spacer part 25.
Each memory module 22 includes a wiring board 26, and two memory chips 27 provided in the central portion on the surface of the wiring board 26 facing each other via the frame 21 of the wiring board 26.
And a plurality of connection pads 28 provided outside the memory chip 27, and the connection pad 28 and the memory chip 27 are electrically connected by the wiring 29. This wiring board 26 is fitted along the guide portion 24 and is closely fitted to the step portion 23 so as to be adhered.
The memory chips 27 of No. 6 face each other via the frame 21.

[0003]

However, in the above-described conventional configuration, the upper and lower wiring boards 26 are fixed to the frame body 21 with the memory chip 27 side thereof facing inward. Even if an operation failure that seems to be caused by a mounting failure of 27 occurs, it is difficult to remove the wiring board 26 from the frame body 21. As a result, the integrated circuit device itself becomes defective, and an integrated circuit on which a large number of memory chips are mounted is mounted. This has been a cause of a decrease in yield in manufacturing the device.

The present invention solves the above-mentioned problems, and prevents an integrated circuit device itself from becoming defective even if a defective mounting of the memory chip occurs in the integrated circuit device having a large number of memory chips mounted thereon. Is intended.

[0005]

In order to achieve the above object, in the integrated circuit device of the present invention, an alternative memory chip is mounted on the surface of the wiring board, and the alternative memory chip is provided with a signal switching pad. It is connected to the memory chip.

[0006]

With the above structure, even if the memory chip in the memory module of the integrated circuit device is defectively mounted, the defective memory chip is connected to the alternative memory chip through the signal switching pad. By electrically connecting the defective memory chip and the alternative memory chip by the pad, it is possible to eliminate the occurrence of a defect in the integrated circuit device.

[0007]

(Embodiment 1) A first embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is an exploded perspective view of an integrated circuit device according to a first embodiment of the present invention, and FIG. 2 is an explanatory view of a signal switching means of the integrated circuit device. As shown in FIG. 1, the laminated integrated circuit device is configured by laminating two sets of an integrated circuit device 10 including a frame body 3 and a memory module 1 and a memory module 2 which are closely bonded to each other via the frame body 3. ing.
The memory modules 1 and 2 are provided in the central portion of the wiring board 4 facing the wiring board 4 and the frame body 3 with each other.
It has individual memory chips 5, connection pads 6 provided on the outer periphery of the memory chips 5, and wires 9 that electrically connect the memory chips 5 and the connection pads 6. The connection pad 6 of the memory module 1 and the connection pad 6 of the memory module 2 are brought into contact with the connection pad 7 of the frame body 3, so that the integrated circuit device 10 including the memory module 1, the memory module 2 and the frame body 3 can be electrically connected. Making a physical connection. Further, one of the two wiring boards 4 of the integrated circuit device 10 has a card edge connector 8 on the outside of the connection pad 6 on the wiring board 4, and two sets of the integrated circuit devices 1 are provided.
Two wiring boards 4 with 0 card edge connector 8
Are closely joined to each other, and the card edge connectors 8 of the two wiring boards 4 are brought into contact with each other to electrically connect the two sets of integrated circuit devices 10. Further, at least one alternative memory chip 5a is mounted on the wiring boards 4 of the two sets of integrated circuit devices 10, and the alternative memory chip 5a and the plurality of memory chips 5 are connected via the signal switching pad 6a in the open state. Are connected.

The operation of the laminated integrated circuit device configured as described above will be described below. Normally, in a laminated integrated circuit device, an initial connection that occurs during manufacturing is performed by inspecting the integrated circuit device 10 in which the memory module 1 and the memory module 2 are electrically connected via the connection pads 7 of the frame body 3. Wash out the defects.

At this time, when the memory chip 5 mounted on the integrated circuit device 10 has a mounting failure, the signal line switching pad in an open state connected to the signal line 13 which is divided from the wiring 9 of the memory chip 5 having the mounting failure. 6a is short-circuited by soldering to electrically connect the connection pad 6 on the wiring board 4 and the alternative memory chip 5a, thereby preventing the integrated circuit device 10 from being defective, and The occurrence of defects can be suppressed.

As described above, according to this embodiment, even if the memory chip 5 of the integrated circuit device 10 is defectively mounted,
The alternative memory chip 5a can prevent the laminated integrated circuit device itself from becoming defective. The signal line switching pad 6a is formed on the end surface of the wiring board 4 exposed to the outside of the frame body 3, and the surface other than the one shorted signal line switching pad 6a is thereafter covered with an insulating resin or the like.

Further, without providing a signal line switching pad on the signal line 13, the alternative memory chip and the memory chip 5 are short-circuited in advance, and the defective memory chip 5 is mounted.
Even if the signal lines 13 other than the signal line 13 that is branched from the wiring 9 are disconnected, the same effect as described above can be obtained.

(Second Embodiment) A second embodiment of the present invention will be described below with reference to FIG. The basic structure is the same as that of the laminated integrated circuit device shown in the first embodiment, but in this embodiment, in addition to the structure of the first embodiment, the wiring board 4 surface side opposite to the mounting side of the memory chip 5 is provided. A conductor layer 11 is provided. The conductor layer 11 provided on the wiring board 4 of the two memory modules 1 and the two memory modules 2
One conductor layer 11 of the conductor layers 11 provided on the wiring board 4
Is connected to a ground line, the other conductor layer 11 is connected to a power supply line, and a dielectric film 12 is sandwiched between two stacked sets of integrated circuit devices 10.

According to the above configuration, the integrated circuit device itself constitutes a capacitor, and noise superimposed on the power supply line can be absorbed.

Further, since the conductor layer 11 forms the outer surface of the integrated circuit device 10, noise from the outside can be absorbed.

As described above, according to this embodiment, in addition to the effects of the first embodiment, noise superimposed on the power supply line in the integrated circuit device 10 and noise from the outside of the integrated circuit device 10 can be absorbed. It produces an effect.

[0017]

As described above, according to the present invention, even if a memory chip in an integrated circuit device has a mounting failure, an alternative memory chip can be used in place of the defective mounting memory chip. It is possible to prevent the integrated circuit device itself from becoming defective.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an integrated circuit device according to a first embodiment of the present invention.

FIG. 2 is an explanatory view showing a signal switching means of a memory chip of the integrated circuit device.

FIG. 3 is an exploded perspective view showing an integrated circuit device according to a second embodiment of the present invention.

FIG. 4 is an exploded perspective view showing a conventional integrated circuit device.

[Explanation of symbols]

 1 Memory Module 2 Memory Module 3 Frame 4 Wiring Board 5 Memory Chip 5a Alternative Memory Chip 6 Connection Pad 6a Signal Line Switching Pad 7 Connection Pad 8 Card Edge Connector 9 Wiring 10 Integrated Circuit Device 11 Conductor Layer 12 Dielectric Film 13 Signal Line

Claims (2)

[Claims] 1. A frame body and two memory modules that are closely bonded to each other via the frame body, the frame body having a connection pad on the outer periphery thereof, the memory module having a wiring board, and the wiring board. Connection of the frame body, which has a memory chip and a substitute memory chip respectively provided on the wiring board surface facing each other through the frame body of the substrate, and a connection pad electrically connected to the memory chip by wiring. An integrated circuit device in which a pad and a connection pad of the memory module are brought into contact with each other, and the memory chip and the alternative memory chip are connected via a signal switching pad. 2. The integrated circuit device according to claim 1, wherein a conductor layer is provided on a side surface of the wiring board opposite to the memory chip mounting surface.