JPH079138Y2 - Structure of wiring pattern of LCD panel - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a wiring pattern structure for mounting a plurality of semiconductor elements on a liquid crystal display panel.

[Outline of device]

In recent years, flat type display panels typified by liquid crystal display panels have been made thinner and smaller, and the pixel density has been increasing. The higher density requires a larger number of driver ICs in the liquid crystal display board, and the number of methods of mounting this driver IC on the liquid crystal display board is increasing due to the thinness and miniaturization. The present invention is intended to easily connect a signal source such as a driving signal or a power source to each driver IC when the driver IC is mounted on a liquid crystal display board.

[Conventional technology]

Conventionally, as means for connecting a signal source such as a driving signal and a power source to a driver IC on a liquid crystal display plate, as shown in FIGS. 5 and 6, the external connection pattern 8a on the liquid crystal display plate is opposed to the external connection pattern 8a. The connection patterns 8a 'of the connection board 9 to be connected are aligned, and a zebra type conductive rubber connector or an anisotropic conductive film in which a conductor is dispersed in an adhesive is used between the external connection pattern 8a and the connection pattern 8a'. Or, they were electrically connected by soldering or the like.

[Problems to be solved by the invention]

In the conventional structure, since a large number of ICs 7 are mounted on the glass substrate 4, it is necessary to use the double-sided substrate or the single-sided double-layered substrate as the connection substrate 9 as shown in FIG. Also, the conductive connection by the conductive rubber connector has a structure that always applies pressure,
The structure was complicated and the conductivity was unstable. Further, the method using the anisotropic conductive film has a drawback that the conduction becomes unstable due to the deterioration of the adhesive in the anisotropic conductive film. The soldering method has excellent stability of conduction, but the conventional method
There was a drawback that it was difficult to see the solder connectivity from the outside.

[Means for solving problems]

In order to solve the above problems, the present invention causes the conductor pattern 2 of the connection board 9 to meander as shown in FIG. 1 and forms a hole 3 in the insulator of the connection board 9 facing the external connection pattern 8 of the glass substrate 4. , The exposed conductor pattern 2 of the connection substrate 9 and the external connection pattern 8 on the glass substrate 4 are joined by soldering, and the electrical signal input to the external connection lead 10 is applied to the glass substrate 4 of the liquid crystal panel. An electric signal was applied to the installed IC7.

[Action]

Since the connection board 9 is configured as described above, the connection board 9 can be formed by single-sided wiring, and since the opening holes 3 are provided in the connection board 9, the conductor pattern 2 for connection to the glass board 4 is exposed. , You can observe the connection status,
It is easy to ensure the stability of the connection.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic view showing an assembled plane of the present invention, and FIG.
1 is an enlarged schematic view of FIG. 1, and FIGS. 3 and 4 are schematic views showing cross sections AA ′ and BB ′ of FIG. FIG. 5 is a schematic view showing a plane of a conventional liquid crystal display plate, and FIG. 6 is a schematic view showing a plane of a connection substrate for connecting to the conventional liquid crystal display plate.

On the glass substrate 4 of the liquid crystal panel in which the liquid crystal is injected and sealed, a plurality of ICs 7 for driving the liquid crystal panel are mounted face down using the solder 6, and a plurality of ICs 7 are mounted on the glass substrate 4, and a chip coating agent (not shown) is used. Coated and heat cured. Although the IC7 is a solder bump IC, other metal bumps such as copper, nickel or gold are used to form bumps, the bumps of the glass substrate 4 and the bumps are made to face each other, and a conductive film is formed between the glass substrate 4 and the bumps of the IC. Chip coating may be performed by electrically and mechanically bonding via an adhesive or an anisotropic conductive film. Alternatively, the aluminum pad IC may be placed face up on the glass substrate without using metal bumps, and may be electrically bonded by wire bonding with an aluminum wire or a gold wire, and then chip coated.

Next, flux is applied to the IC input conductor pattern 1 portion of the glass substrate 4 on which a plurality of ICs 7 are mounted, the glass substrate 4 is immersed in a molten solder bath, and solder 5 is attached to the IC input conductor pattern 1. The flux was removed with a solvent such as alcohol.

The polymer insulating side of the solder-plated connection substrate 9 is brought into contact with the glass substrate 4 so that the conductor pattern 2 of the hole 3 and the IC input conductor pattern 1 on the glass substrate 4 face each other.
Apply a steel tool heated to 00 ℃ for a few seconds to
The solder 5 on the input conductor pattern 1 and the solder plating on the conductor pattern 2 were melted and joined. The steel tool may be one that is constantly heated to 200 to 300 ° C, or pulse heat that is heated when energized. After the connection to a plurality of ICs 7 was completed in this way, the joints were mechanically reinforced with silicone resin or epoxy resin. For display on the liquid crystal panel, signals and power may be connected to the external connection leads 10 of the connection board 10.

[Effect of device]

Since the present invention is configured as described above, since the IC input conductor pattern 1 and the conductor pattern 2 are connected by the solder 5, the stability of conduction is high, or the conductor pattern 2 at the joint portion of the ditch 5 has the connection board 9 Since the polymer insulator of 1 is opened, the joint state of the conductor pattern 2 and the solder 5 of the IC input conductor pattern 1 can be easily discerned from the outside, and stable product manufacturing is possible. By comparison, the reliability of the connection device is improved.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing an assembled state of the present invention, FIG. 2 is an enlarged schematic view of FIG. 1, and FIGS. 3 and 4 are sectional views taken along line AA 'and BB' of FIG. FIG. 5 is a schematic view showing a plane of a conventional liquid crystal display plate, and FIG. 6 is a schematic view showing a plane of a connection substrate for connecting to the conventional liquid crystal display plate. 1 ... IC input conductor pattern 2 ... conductor pattern 3 ... open hole 4 ... glass substrate 5 ... solder 6 ... solder 7 ... IC 8 ... external connection pattern 9 ... connection substrate 10 ... external connection Reed

Claims (1)

[Scope of utility model registration request] 1. A signal board, in which a plurality of semiconductor devices are mounted on a liquid crystal display board and a conductor pattern is formed on a flexible polymer film, is arranged on a liquid crystal display board, and the conductor pattern of the signal board and the liquid crystal display are arranged. In a structure in which a conductor pattern on a plate is electrically connected and a drive signal is applied to a semiconductor device on a liquid crystal display plate, the conductor pattern of the signal substrate is meandered in parallel with the arrangement direction of the semiconductor device, and the polymer film A part of the polymer film of the signal substrate on which a conductor pattern is formed with a conductor on one side, the opposite side of the conductive pattern of the polymer film, the conductor pattern side on the liquid crystal display plate And electrically connect the conductor pattern on the liquid crystal display panel and the conductor pattern on the opening portion of the signal substrate to the same input signal and the same voltage to the semiconductor device. Structure of the wiring pattern of the liquid crystal display panel, characterized in that you allow the supply.